This application is a continuation of International Application No. PCT/CN2021/079537 filed on Mar. 8, 2021, which claims priority to China Patent Application No. 202010224088.0 filed on Mar. 26, 2020. The disclosures of these applications are hereby incorporated by reference in their entirety.
With more and more advanced semiconductor manufacturing processes, semiconductor devices have less junction depths and thinner oxide layers and become smaller and smaller, bringing huge challenges to the reliability of semiconductor integrated circuits. Therefore, electrostatic protection becomes more and more important. Statistics show that many of semiconductor product failures are caused by electrostatic damage. Thus, in order to better protect an integrated circuit from electrostatic damage, an electrostatic discharge protection circuit is required to protect the integrated circuit.
The present disclosure relates generally to the technical field of integrated circuits, and more specifically to an electrostatic discharge protection circuit.
In an aspect of the present disclosure, there is provided an electrostatic discharge protection circuit, the electrostatic discharge protection circuit includes a pulse detection unit, a delay unit, a control unit and a discharge unit.
The pulse detection unit is configured to detect an electrostatic pulse signal, the pulse detection unit has a first end connected to a first voltage, a second end connected to a second voltage, and a third end outputting a pulse detection signal.
The delay unit is configured to delay or enhance driving capability of the pulse detection signal, the delay unit has a first end connected to the first voltage, a second end connected to the second voltage, a third end connected to the third end of the pulse detection unit, a fourth end outputting a first delay signal, and a fifth end outputting a second delay signal.
The control unit is configured to generate a control signal based on the first delay signal and the second delay signal, the control unit has a first end connected to the first voltage, a second end connected to the second voltage, a third end connected to the fifth end of the delay unit, a fourth end connected to the fourth end of the delay unit, and a fifth end outputting the control signal.
The discharge unit is configured to open or close an electrostatic charge discharge passage based on the control signal, the discharge unit has a first end connected to the first voltage, a second end connected to the second voltage, and a third end connected to the fifth end of the control unit.
In the technical solutions of the present disclosure, the electrostatic discharge protection circuit can achieve a desired electrostatic protection in a case of a small RC time constant, and the electrostatic discharge protection circuit also has a small area and would take up a small design space. Moreover, noise influences can be avoided and the performance of the electrostatic protection circuit can be improved. In addition, the abovementioned electrostatic discharge protection circuit can provide electrostatic protection of two electrostatic discharge modes, such that the electrostatic protection capability of a product can be improved effectively.
Embodiments of the present disclosure are described below with reference to one or more accompanying drawings for better description and illustration. However, additional details or examples for description of the accompanying drawings should not be construed as limiting the scope of any one of the invention, embodiments described herein, or preferred modes of the present disclosure.
In order to facilitate understanding of the disclosure, the disclosure will now be described more fully below with reference to accompanying drawings. Preferred embodiments of the present disclosure are illustrated in the accompanying drawings. However, the present disclosure may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the content of the present disclosure will be more thorough and complete.
It should be noted that when an element is referred to being “connected” to the other element, the element may be directly connected to and integrated with the other element, or there may be an intermediate element between them. The terms used herein such as “mounted”, “one end”, and “another end” are only for the purpose of illustration.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. The terms used in the specification of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit of the present disclosure. The term “and/or” used herein comprises any and all combinations of the one or more listed items.
Generally, an integrated circuit product has an electrostatic protection, and each lead-out pad has a corresponding electrostatic protection circuit. These protection circuits are able to ensure that all the lead out pads can implement quick electrostatic discharge (ESD) when the ESD is occurred, such that the integrated circuit product can be protected from the ESD damage. In order to ensure that an electrostatic current is able to be fully discharged during a duration of occurrence of static electricity, resistance and capacitance of an existing electrostatic discharge protection circuit would take up a relatively large design space. In other words, the existing electrostatic discharge protection circuit requires a large resistance-capacitance (RC) time constant to achieve a better electrostatic protection, which would lead to a large area of the electrostatic discharge protection circuit. In addition, the existing electrostatic protection circuit is also sensitive to noise.
In some embodiments, as illustrated in
The electrostatic discharge protection circuit described above can achieve a desired electrostatic protection in a case of a small RC time constant, and the electrostatic discharge protection circuit also has a small area and would take up a small design space. Moreover, noise influences can be avoided and the performance of the electrostatic protection circuit can be improved. In addition, the abovementioned electrostatic discharge protection circuit can provide electrostatic protection of two electrostatic discharge modes, such that the electrostatic protection capability of a product can be improved effectively.
In an example, the pulse detection unit 10 may include a resistor R and a capacitor C. The resistor R has a first end used as the first end of the pulse detection unit 10 and connected to the first voltage VDD, and the resistor R has a second end used as the third end of the pulse detection unit 10. The capacitor C has a first end connected to the second end of the resistor R, and the capacitor C has a second end used as the second end of the pulse detection unit 10 and connected to the second voltage VSS.
Specifically, the resistor R may include, but not limited to, a polysilicon resistor or a doped resistor.
Specifically, the capacitor C may include, but not limited to, a metal-dielectric layer-metal capacitor or a Metal-Oxide-Semiconductor (MOS) capacitor.
Specifically, a product of resistance of the resistor R and capacitance of the capacitor C may be a constant. More specifically, the product of the resistance of the resistor R and the capacitance of the capacitor C may have a value from 0.01 us (i.e., microsecond) to 1 us.
In an example, the delay unit 11 may include a first inverter 111 and a second inverter 121. The first inverter 111 has a first end used as the third end of the delay unit 11 and connected to the third end of the pulse detection unit 10, the first inverter 111 has a second end connected to the first voltage VDD, the first inverter 111 has a third end connected to the second voltage VSS, and the first inverter 111 has a fourth end used as the fourth end of the delay unit 11. The second inverter 121 has a first end connected to the fourth end of the first inverter 111, the second inverter 121 has a second end connected to the first voltage VDD, the second inverter 121 has a third end connected to the second voltage VSS, and the second inverter 121 has a fourth end used as the fifth end of the delay unit 11.
In an example, the first inverter 111 may include a first P-channel MOS
(PMOS) transistor MP1 and a first N-channel MOS (NMOS) transistor MN1. A gate of the first PMOS transistor MP1 and a gate of the first NMOS transistor MN1 are connected together and used as the first end of the first inverter 111. A source of the first PMOS transistor MP1 is used as the second end of the first inverter 111 and connected to the first voltage VDD. A drain of the first PMOS transistor MP1 and a drain of the first NMOS transistor MN1 are connected together and used as the fourth end of the first inverter 111. A source of the first NMOS transistor MN1 is used as the third end of the first inverter 111 and connected to the second voltage VSS.
In an example, the second inverter 121 may include a second PMOS transistor MP2 and a second NMOS transistor MN2. A gate of the second PMOS transistor MP2 and a gate of the second NMOS transistor MN2 are connected together to use as the first end of the second inverter 121 and connected to the fourth end of the first inverter. A source of the second PMOS transistor MP2 is used as the second end of the second inverter 121 and connected to the first voltage VDD. A drain of the second PMOS transistor MP2 and a drain of the second NMOS transistor MN2 are connected together and used as the fourth end of the second inverter 121. A source of the second NMOS transistor MN2 is used as the third end of the second inverter 121 and connected to the second voltage VSS.
In an example, the control unit 12 may include a third PMOS transistor MP3, a third NMOS transistor MN3, a fourth PMOS transistor MP4 and a fourth NMOS transistor MN4. A source of the third PMOS transistor MP3 is connected to the first voltage VDD. A gate of the third NMOS transistor MN3 is used as the fourth end of the control unit 12 and connected to the fourth end of the first inverter 111, a drain of the third NMOS transistor MN3 is connected to a drain of the third PMOS transistor MP3, and a source of the third NMOS transistor MN3 is used as the second end of the control unit 12 and connected to the second voltage VSS. A gate of the fourth PMOS transistor MP4 is connected to the drain of the third PMOS transistor MP3 and the drain of the third NMOS transistor MN3, and a source of the fourth PMOS transistor MP4 is connected to the first voltage VDD. A gate of the fourth NMOS transistor MN4 is used as the third end of the control unit 12 and connected to the fourth end of the second inverter 121, a drain of the fourth NMOS transistor MN4 is connected to a drain of the fourth PMOS transistor MP4 and a gate of the third PMOS transistor MP3 and used as the fifth end of the control unit 12.
In an example, the discharge unit 13 may include a discharge transistor MESD. Specifically, the discharge transistor MESD may be an NMOS transistor. A drain of the discharge transistor MESD is used as the first end of the discharge unit 13 and connected to the first voltage VDD; a source of the discharge transistor MESD is used as the second end of the discharge unit 13 and connected to the second voltage VSS; and a gate of the discharge transistor MESD is used as the third end of the discharge unit 13 and connected to the fifth end of the control unit 12.
The operation principle of the electrostatic discharge protection circuit illustrated in
In a case of normal operation, the third end (i.e., an end a in
When static electricity occurs in a positive-to-VSS (PS) mode (VSS is grounded and a positive electrostatic pulse is generated at VDD), the third end (i.e., the end a in
When static electricity occurs in a NS mode (VSS is grounded and a negative pulse is generated at VDD), as illustrated in
Various technical features described in the foregoing embodiments may be combined in any way. In order to provide a concise description, not all possible combinations of the various technical features in the foregoing embodiments are described. However, theses combinations of the technical features should be regarded as falling within the scope of the present specification as long as these combinations do not contradict.
The foregoing embodiments only describe several implementation modes of the present disclosure specifically and in detail, but these embodiments should not be construed as limiting the scope of the present disclosure. It should be noted that various variations and improvements made by those of ordinary skill in the art without departing from the conception of the present disclosure shall be regarded as falling within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the appended claims.
Number | Date | Country | Kind |
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202010224088.0 | Mar 2020 | CN | national |
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Number | Date | Country | |
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20210343702 A1 | Nov 2021 | US |
Number | Date | Country | |
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Parent | PCT/CN2021/079537 | Mar 2021 | WO |
Child | 17376112 | US |