Electrosurgical electrode and method of manufacturing same

Information

  • Patent Grant
  • 11246645
  • Patent Number
    11,246,645
  • Date Filed
    Thursday, October 10, 2019
    5 years ago
  • Date Issued
    Tuesday, February 15, 2022
    2 years ago
Abstract
An electrosurgical device coated an epoxy modified rigid silicone powder coating. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue (i.e., eschar) on the surfaces of the electrosurgical device.
Description
BACKGROUND

Electrosurgery refers to surgical procedures that pass high frequency, alternating electrical current through body tissues to cut or coagulate the tissues. Electrosurgical instruments or tools such as electrosurgical electrodes are used in these surgical operations to cut, coagulate and cauterize the tissue of a patient. The electrodes conduct the high frequency alternating electrical current from a generator to the patient to perform these operations. The generator is the source of the electricity for the surgical procedure. Because standard electrical current alternates at a frequency of sixty cycles per second (60 Hz), which could cause excessive neuromuscular stimulation and possibly electrocution if used, the generator takes sixty cycle current and increases the frequency to over 300,000 cycles per second (300,000 Hz). At this frequency, the electrical energy can pass through the patient with minimal neuromuscular stimulation and no risk of electrocution. Additionally, the generators are able to produce a variety of electrical waveforms. A constant waveform, which produces heat very rapidly, is generally used to vaporize or cut body tissue. An intermittent waveform produces less heat and is generally used to coagulate body tissue. Several different waveforms may used in an electrosurgical procedure to achieve different effects.


As described above, electrosurgical electrodes are used to cut or coagulate the body tissue in an electrosurgical procedure. Many sizes and shapes of electrosurgical electrodes such as blades, scalpels, needles, wire forms, balls and probes are available. Most electrosurgical electrodes are made of metal, typically stainless steel. Generally, a portion of the electrode is sheathed or encapsulated with an insulative material such as a plastic material. The electrodes are typically inserted into and connected to a handpiece for manipulating the electrode during surgery.


The working surface of the electrosurgical electrode or the exposed end of the electrode is not encapsulated with plastic or any type of electrically insulative material. The working surface generates heat and therefore is subject to high temperatures during use. The high temperature causes the body tissues to tend to stick to the working surface of the electrode. Specifically, the elevated temperature of the electrode causes charred tissue, commonly called “eschar,” to adhere or stick to the working surface of the electrode. The buildup of tissue or eschar on the working surface of the electrode negatively affects the performance of the electrode during surgery. In particular, a buildup of tissue on the electrode reduces the transfer of energy to and from the electrode which decreases the cutting effectiveness of the electrode. Additionally, the tissue buildup may obscure the vision of the surgeon and therefore make it more difficult to perform the surgery.


As a result, efforts are made during surgery to keep the working surface of the electrode clean. Such cleaning methods include rubbing, brushing or scraping the electrode surface against a scouring pad or other suitable cleaning device. The continuous cleaning of the surface of the electrode, however, prolongs the surgical procedure which is not desirable. Therefore, the surgeon is left with the options of replacing the electrode during surgery, accepting reduced performance of the electrode, or expending valuable time and energy in an attempt to thoroughly clean the surface of the electrode with an abrasive pad. If the surgeon must clean the surface of the electrode with an abrasive pad, as while scouring the coated surface of the blade, the surgeon must spend additional time and attention to not damage or wear through the protective coating.


One method used to solve the problem of tissue or eschar buildup on the surface of the electrode is to coat the surface of the electrode with a non-stick or surface release coating. The non-stick or release coating minimizes the sticking or adherence of the tissue on the surface of the electrode and enables the built up tissue to be removed more easily and efficiently from the surface.


Several different types of non-stick coatings have been used or suggested for application to electrosurgical electrodes. Some of the different non-stick coatings or materials include fluorinated hydrocarbon materials, polytetrafluoroethylene, perfluoro-alkoxy, flexible silicone elastomers, ceramic composites, paralyene silane polymers and other suitable non-stick coatings. Different methods exist for applying the non-stick coating to the surface of the electrosurgical electrodes. However, the non-stick or release coatings have varying degrees of electrically insulative qualities, and therefore, may change and/or impair the electrical conductivity of the surface of the electrodes. Some of such coatings are thinner (due to their inherent technical limitations and/or cost of production reasons) and thus posses less than optimum electrical and/or insulative properties. Other coatings provide discontinuous protection of the underlying metal blade and may contain micro fractures, holes and/or “holidays.” It should be appreciated that coating areas of reduced thickness and areas wherein the coating is missing alter the electrical insulative or surface characteristics of the electrical energy emitted from the surface of the coating, thus affecting the quality and consistency of the use of the blade. Such altered electrical insulative properties present an erratic and potential inconsistent function of the use of the electrosurgical device as a surgical tool.


Moreover, certain of these non-stick coatings, particularly the flouropolymers, may break down and emit harmful byproducts as the coated portion or portions of the electrosurgical electrode are heated to temperatures above 500° F. (260° C.). In addition to breaking down at temperatures above 500° F. (260° C.), as certain of these non-stick coatings approach 500° F. (260° C.), micro-fractures or fissures in the coating surface take place. These micro-fractures provide additional areas for eschar or carbonized organic matter to adhere to the electrosurgical device. As the coating breaks down due to thermal overheating of specific areas of the blade, particularly the edges and tip of the blade, the electrical insulative quality of the original coating is diminished and eventually destroyed. Accordingly, the user will need to change the electrical settings of the electrical generator or need to change to a new blade to achieve consistent end use results.


Another issue associated with surgical instruments such as electrosurgical electrodes is the cleanliness of the working surface and other surfaces of the electrode as the electrode contacts tissue and other parts of the body. The tissue or eschar buildup on the working surface of the electrode creates an environment where bacteria and other harmful organisms may cultivate and be introduced into the body during the surgical process. Furthermore, any gaps between the plastic sheath and the electrode or any fractures, fissures or other defects in the plastic sheath enables bacteria and other organisms to get underneath the plastic sheath and also into and grow in the fractures, fissures and defects or other interstices in the plastic sheath. This warm environment also promotes organism and bacteria growth. This further promotes the growth of the bacteria and the harmful organisms which may migrate to the surface of the electrode or to the patient. Bacteria forming on the eschar which in turn enters a patient's body during a surgical procedure can cause significant difficulties and complications for the patient after the surgical procedure is complete. As a result, minimizing the buildup of tissue or eschar and thus minimizing the growth of bacteria and other organisms on the electrode surface (and between the insulating sheath and the electrode shaft) is desirable to enable the electrode to be used multiple times to minimize and/or prevent infections or other related complications from developing in a patient following surgery.


Accordingly, there is a need for an improved electrosurgical device such as a single use or multi-use electrosurgical electrode and method of manufacturing same which minimizes the buildup of tissue on the substrate or working surface of the electrode during storage, use or pauses in the use of the electrode. Additionally, there is a need for an improved electrosurgical device which has superior easy-to-clean characteristics if the user desires to or must clean the electrosurgical device for multiple uses and/or store the previously used blades for future uses.


SUMMARY

The present disclosure relates in general to an electrosurgical electrode, and, specifically to an electrosurgical electrode coated with a specifically formulated epoxy modified rigid silicone powder non-stick coating and a method of manufacturing the same.


In one embodiment, an epoxy modified rigid silicone powder non-stick coating is applied to an electrosurgical device such as an electrosurgical blade, knife, wire, ball or other shape. In one embodiment, the electrosurgical device includes an electrode including a conductive substrate or conductive material where at least a portion of the electrode is encapsulated in a substantially electrically insulative material such as plastic, a handle connected to one end of the electrode and electrical conductors which are attached inside the handle to conduct electricity from an electrical source and deliver or transfer the electrical energy to the electrode. In one embodiment, the electrode conducts electrical energy to generate heat and cut, coagulate and/or cauterize tissue during a surgical procedure.


In one embodiment, the epoxy modified rigid silicone powder coating is applied uniformly and evenly to the surface or surfaces of the electrode to completely coat the exposed distal end or portion and a portion of the plastic encapsulated portion of the electrosurgical device. The epoxy modified rigid silicone powder has both high temperature capabilities and non-stick properties. The high temperature resistance of the epoxy modified rigid silicone powder enables the electrosurgical electrode to be heated to temperatures above which other non-stick coatings may break down and emit harmful byproducts. Accordingly, after multiple uses, the epoxy modified rigid silicone powder coating retains its hardness, surface toughness and non-stick properties on the electrode and the buildup of tissue or eschar on the working surface of the electrode is reduced or prevented.


In one embodiment, the electrosurgical device is coated with a silicone powder coating that is modified with an epoxy, which when applied to the electrosurgical device, forms a rigid or relatively hard silicone non-stick coating. In one embodiment, the epoxy modified rigid silicone powder coating includes a solid silicone resin and a polysiloxane additive. The silicone resin may be selected from the group including a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone and a phenyl alkyl polysiloxane powder resin. The siloxane additive may be selected from the group including a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. It should be appreciated that any suitable epoxy or organic resin base combined with a suitable silicone powder with high temperature capabilities and non-stick properties (and possibly further modified with suitable organic materials and resins) may be implemented to advance or improve the end use high temperature and non stick properties of the disclosed powder coating technology.


In one embodiment, the epoxy modified rigid silicone powder coating includes:


(a) SY-430 in the range of about 40% to about 60% parts per weight of the powder coating;


(b) Wollastonite in the range of about 20% to about 40% parts per weight of the powder coating;


(c) ECN 9699 in the range of about 5% to about 15% parts per weight of the powder coating;


(d) Modarez MSL in the range of about 3% to about 7% parts per weight of the powder coating;


(e) HT 9690 in the range of about 0.5% to about 3% parts per weight of the powder coating; and


(f) Modaflow III in the range of about 0.5% to about 3% parts per weight of the powder coating.


In this embodiment, SY-430 is a resin made by Wacker-Chemie GmbH of Munich, Germany. According to the manufacturer, this product is a solvent-free hydroxyl functional solid phenyl silicone resin delivered in flake form.


Wollastonite is a naturally occurring calcium metasilicate (i.e., CaSiO3). The particular Wollastonite product used in this embodiment is made by Nyco of Willsboro, N.Y., and is identified by that company as NYAD® 400 Wollastonite. According to the manufacturer, the deposit of calcium metasilicate came from Nyco's deposit in Lewis, Essex County, N.Y.


The ECN (“epoxy cresol novolac”) 9699 is an epoxy cresol novalac resin made by Ciba-Geigy. According to the manufacturer, this novolac epoxy resin is derived from an ortho cresolformaldehyde novolac which is then reacted with epichlorohydrin to form a polyepoxide.


The Modarez MSL is made by Synthron, Inc., Morganton, N.C. According to the manufacturer, this component is a 60% active powder version of the methyl alkyl polysiloxane for powder coatings.


The HT 9690 is a curing agent made by Ciba-Geigy. According to the manufacturer, this curing agent is an o-cresol novolac resin (hydroxyl-type).


The Modaflow® Powder III is made by the Chemical Group of Monsanto Company, St. Louis, Mo. This powder is an acrylate copolymer. According to the manufacturer, this powder is a resin modifier.


In alternative embodiments, in addition to the components described above, the epoxy modified rigid silicone powder coating may also include one or more the following pigments:


Micro-Mica C-300 in the range of about 0% to about 10% parts per weight of the powder coating;


(ii) Ferro F-6331 in the range of about 0% to about 10% parts per weight of the powder coating;


(I) Silvet 320-205 in the range of about 0% to about 6% parts per weight of the powder coating; and


(iv) Ferro UMB-5008 Blue in the range of about 0% to about 10% parts per weight of the powder coating.


In this embodiment, the Micro-Mica® C-3000 is an ultra-fine air micronized functional pigment consisting of pure muscovite mica distributed by Kraft Chemical Co. of Melrose Park, Ill.


The Ferro F-6331 is made by Ferro Corporation, Cleveland Ohio. It is a high temperature calcination of coprecipitated compound with manganese-copper-iron. According to the manufacturer, F-6331 is a black inorganic pigment. The CAS Number is 68186-94-7.


The Silvet 320-205 is made by Silberline World Headquarters of Tamaqua, Pa. It is a silvet pigment. According to the manufacturer, 320-205 is a small particle size bright leafing aluminum pigment based on cornflake geometry.


The Ferro UMB-5008 Blue is made by Ferro Corporation, Cleveland Ohio. It is an untramarine Blue inorganic pigment.


In one embodiment, the epoxy modified rigid silicone powder particles in the coating enable the electrosurgical device to reach a desired temperature quicker than conventional electrosurgical devices because the formulation of the rigid epoxy/silicone powder coating can be formulated with special pigments and additives to increase the thermal conductivity of the coated electrode surface compared to conventional polytetrafluoroethylene (PTFE) or elastomeric silicone coated electrode surfaces. As a result, electricity, electrical energy or heat is more effectively controlled and efficiently conducted or transferred to the electrode surface. Moreover, compared to elastomeric silicone coatings, in one embodiment, the epoxy modified rigid silicone powder may be ground to a finer mesh size for purposes of applying a thinner coating, thereby improving the thermal conductivity and coating flexibility without resulting in pinholes or fissures in the coating. In another embodiment, a thicker coating of the epoxy modified rigid silicone powder is applied to the electrosurgical device. Depending on the specific end use characteristics desired, such a thicker coating may be achieved by either formulating and manufacturing different particle sizes of the powder coating or through suitable coating application techniques.


In one aspect of this embodiment, the amount and density of epoxy modified rigid silicone powder particles (and additives, if any, used in a particular formulation) applied to the surfaces of the electrode is increased or decreased based on the desired electrical and heat conductivity of the electrosurgical device. The electrical and thermal conductivity can be altered when more epoxy modified rigid silicone powder particles are included in the coating, when less epoxy modified rigid silicone powder particles are included in the coating or when special pigments or additives are used to enhance one or more specific characteristics to further optimize the desired end use of the device. Additionally, the density and particle size of the epoxy modified rigid silicone powder particles applied to the surface of the electrode may be adjusted to increase or decrease the electrical conductivity. When the electrical conductivity of the electrode is increased, the temperature of the surface of the electrode is changed. This enables the coating mixture to be adjusted to optimize the desired end use of the device.


It should be appreciated that one or more combinations of different shaped epoxy modified rigid silicone powder particles may be used on the working surface of the electrosurgical electrode. Additionally, the density or thickness ranges of the epoxy modified rigid silicone powder particles may vary depending on the design specifications of an end product or final product. The density or distribution of the epoxy modified rigid silicone powder particles may vary from covering or adhering to approximately ten percent of the surface of the electrosurgical electrode to approximately sixty percent or more of the surface. Similarly, the density of the epoxy modified rigid silicone powder particles may vary depending on the end use criteria.


In another embodiment, one or more additional epoxy modified rigid silicone powder layers are applied to the first or primary epoxy modified rigid silicone powder layer applied to the surface of the electrosurgical device to meet specific design specifications or coating requirements of a manufacturer. The additional bonding material layers may be the same or different than the first epoxy modified rigid silicone powder layer and are applied to the first rigid silicone powder layer until a predetermined thickness is achieved. Additionally, different materials may be added to the bonding material layer or layers, based on specific design specifications. In another embodiment, different liquid bonding agents may be introduced to the top of the first layer of the epoxy modified rigid silicone powder before a second layer of the epoxy modified rigid silicone powder is attached to the first layer. This process may be repeated to build thicker layers of epoxy modified rigid silicone powder on all or a selective or individual portion of an electrosurgical device.


In one embodiment, prior to applying the epoxy modified rigid silicone powder to one or more surfaces of the electrosurgical device, the electrosurgical electrode is positioned on a support. Initially, the surface of the electrosurgical electrode is cleaned with a cleaner to remove impurities which may be present on the surface of the electrosurgical electrode. The cleaner such as a solvent may be manually applied or mechanically applied to the electrosurgical electrode. In one embodiment, grit blasting or sandblasting is used to clean the surface of the electrosurgical electrode. Alternatively, the electrosurgical electrode may be pre-cleaned or the method may be performed in a “clean room” where the cleaned part is manufactured and the step is not necessary. In another embodiment, the electrode is heated to a temperature, depending on the metal alloy of the electrode, in excess of 700° F. (371° C.) for a period of time sufficient to thermally degrade surface impurities. In another embodiment, the electrosurgical device may be cleaned in a batch or bulk cleaning method, thereby cleaning all of the surfaces of the electrosurgical device.


In one embodiment, the epoxy modified rigid silicone powder has self-adhesive properties. In this embodiment, when applied to the surfaces of the electrosurgical device, the epoxy modified rigid silicone powder particles will adhere. Thus, in this embodiment, no bonding layer is necessary to be applied to the electrode.


In another embodiment, the epoxy modified rigid silicone powder particles must be affixed to one or more surfaces of the electrosurgical device using one or more wet bonding materials. In this embodiment, after the surface of the electrosurgical electrode is cleaned, a layer of a wet bonding material such as a primer is applied to one or more surfaces of the electrosurgical device. The layer of wet bonding material is preferably applied uniformly so as to avoid forming a thick layer, which is thicker than what is necessary or required, and avoid drippings which may detract from the bonding ability to the electrosurgical device.


In one embodiment, the bonding material layer may be formulated to improve the bonding capabilities of the subsequent epoxy modified rigid silicone powder coating layer or layers applied to the surface of the electrosurgical electrode. In this embodiment, the wet bonding material may include one or more additives which change or enhance one or more characteristics of the wet bonding material. For example, in one embodiment, the wet bonding material includes an ultraviolet light cure resin to semi or fully cure the bonding layer. In another embodiment, the wet bonding material includes an electron beam cure resin. It should also be appreciated that the bonding material may be any suitable bonding material or agent. For example, a thin layer of any suitable epoxy may be utilized as the bonding layer to coat the surface of the electrode prior to the application of the epoxy modified rigid silicone powder.


In one embodiment, while the bonding material layer is still wet, a single layer of epoxy modified rigid silicone powder is sprayed over the wet bonding material. In one embodiment, a substantially uniform layer of epoxy modified rigid silicone powder is applied to the wet bonding material. The epoxy modified rigid silicone powder particles adhere to the wet surface area of the bonding material in an even manner. In this embodiment, when the wet bonding material is completely coated with one layer of the uniform epoxy modified rigid silicone powder mixture of particles, additional epoxy modified rigid silicone powder particles cannot stick to the bonding material layer because the insulative qualities of the adhered epoxy modified rigid silicone powder particles attached to the bonding material layer act as a barrier to other particles attaching to the wet bonding material layer. Therefore, the epoxy modified rigid silicone powder particles do not build up or form an uneven surface area on the surface of the electrosurgical electrode. Additionally, the wet bonding material layer may be a thick layer where the uniform epoxy modified rigid silicone powder particles sink into and are completely covered by the wet bonding material layer. In another embodiment, the wet bonding material layer is a substantially thin layer on the surface of the electrosurgical device and a substantial portion of the epoxy modified rigid silicone powder particles are exposed on the wet bonding material layer.


In another embodiment, an electrostatic, tribo-charged or opposite electrostatic charged powder spray method is used to apply the epoxy modified rigid silicone powder particles to either a dry electrosurgical device or an electrostatic device coated with the wet bonding adhesion promoting material. In one embodiment, the wet bonding agent is from the epoxy resin family. The electrostatically charged particle powder spray enables an operator to better control the application uniformity of the epoxy modified rigid silicone powder particles and thereby enhance the uniformity, density and application of the epoxy modified rigid silicone powder particles to the wet bonding material on the electrosurgical device. It should be appreciated that the epoxy modified rigid silicone powder particles may have one or more surface characteristics altered to allow for more efficient electrostatic, tribo-charged or opposite electrostatic charged powder spray techniques to be used to apply the epoxy modified rigid silicone powder particles to an electrosurgical device.


Moreover, the above-described “tribo-charge” application technique alters the edge coverage thickness of the applied powder based on any design requirements which require a more uniformly applied epoxy modified silicone nonstick powder to all surfaces of the device, whether the configuration has sharp or round edges. This technique results in optimizing the different edge coverage thicknesses of the applied epoxy modified rigid silicone powder, whether the electrosurgical device is a blade, ball, wire or a different shape.


It should be appreciated that an electrosurgical device manufactured with an epoxy modified rigid silicone powder coating exhibits improved uniformity of coating thickness and coverage of the critical edge or tip characteristics. In one embodiment, due at least in part to the “Farraday” effect of applying increased amounts of coatings to a sharp corner or edge, electrostatically applied epoxy modified rigid silicone powder particles are more easily applied to and attach to the thin or sharp edges of the electrosurgical device. In this embodiment, by altering the electrostatic powder coating equipment or techniques of application, such as by changing the power settings, waveforms and/or other electrical characteristics of the application equipment, the edges of the electrosurgical device are selectively more or less heavily coated with the epoxy modified rigid silicone powder.


After the epoxy modified rigid silicone powder coatings are applied to the surfaces of the electrode, the coatings are cured in a suitable device, such as an oven or furnace, or by using a suitable curing method or process. The curing process hardens the coatings and promotes the adherence of the coatings to the electrode. The coated electrode, therefore, minimizes the build up of eschar on the surfaces of the coated electrosurgical device.


In one embodiment, in addition to the epoxy modified rigid silicone powder particles, a plurality of anti-microbial particles such as silver, silver ceramic, silver oxide or silver compounds or any suitably anti-microbial agent are applied to one or more of the surfaces of the electrosurgical device to reduce and kill bacteria and other potential germs that may be located on the surface(s) of the electrosurgical device. In one aspect of this embodiment, the anti-microbial particles are interspersed with the epoxy modified rigid silicone powder particles and a layer of anti-microbial material is applied to the electrosurgical device along with the epoxy modified rigid silicone powder particles. The above process can be repeated as necessary to maintain the effectiveness of the anti-microbial surface. The addition of the anti-microbial material tends to kill bacteria or other harmful organisms that contact the surface of the electrode during and after the surgical procedure. This coated electrode may be used multiple times in different surgical procedures without requiring sterilization (even though sterilization is preferred) because the anti-microbial particles are capable of killing the bacteria and other harmful organisms which contact the surfaces of the electrode. The coated electrosurgical device therefore minimizes or reduces the chance of infections or other complications in the body after the surgical procedure is complete.


It is therefore an advantage of the present apparatus and method to provide an epoxy modified rigid silicone powder coating to the surface of an electrosurgical device to prevent the build up of tissue on the device.


A further advantage of the present apparatus and method is to provide a epoxy modified rigid silicone powder coating to the surface of an electrosurgical device to enable the device to be used multiple times in different surgical procedures.


Another advantage of the present apparatus and method is to provide an electrosurgical device that is coated with a epoxy modified rigid silicone powder to enable the device to be heated to temperatures at which other non-stick coatings break down and lose their non-stick properties, wherein in the process of decomposing, such other non-stick coatings generate toxic and noxious gasses and harmful airborne particles.


Another advantage of the present apparatus and method is to provide an electrosurgical device coated with a powder coating which includes a silicone resin and siloxane additive without any fluoropolymers.


Additional features and advantages of the present apparatus and method are described in and will be apparent from, the following Detailed Description and the Figures.





BRIEF DESCRIPTION OF THE FIGURES

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the U.S. Patent and Trademark Office upon request and payment of the necessary fee.



FIG. 1 is a front perspective view of one embodiment of a coated electrosurgical instrument.



FIG. 2A is a cross-section view of the embodiment of FIG. 1 taken generally along the line 2A-2A.



FIG. 2B is a cross-section view of the embodiment of FIG. 1 taken generally along the line 2B-2B.



FIG. 3A is a cross-section view of another embodiment of the electrosurgical instrument of FIG. 1 taken generally along the line 3A-3A where a primer or base coating is applied to the surfaces of the instrument.



FIG. 3B is a cross-section view illustrating the embodiment of FIG. 3A, including a layer of epoxy modified rigid silicone powder particles.



FIG. 3C is a cross-section view of FIG. 3B, including a top coating applied to the layer of epoxy modified rigid silicone powder particles.



FIG. 3D is a cross-section view of the embodiment of FIG. 3C taken generally along the line 3D-3D.



FIGS. 4A and 4B are color photographs illustrating stages of degradation of an electrosurgical device coated with polytetrafluoroethylene compared to an electrosurgical device coated with an epoxy modified rigid silicone powder.



FIGS. 5 to 8 are color photographs illustrating the results of a comparative wear test between laparoscopic blades coated with PTFE DuPont Teflon and laparoscopic blades coated with epoxy modified rigid silicone powder particles.



FIGS. 9 to 12 are color photographs illustrating the results of a comparative “liver cutting test” between laparoscopic blades coated with PTFE DuPont Teflon and laparoscopic blades coated with epoxy modified rigid silicone powder particles.



FIGS. 13 and 14 are color photographs illustrating the results of a surgical gauze pad wiping after a comparative “liver cutting test” between laparoscopic blades coated with PTFE DuPont Teflon and laparoscopic blades coated with epoxy modified rigid silicone powder particles.



FIG. 15A is a table (shown as Table 1) illustrating the results of a total of 50 test blades, organized into groups of five blades, which were “pull” tested to determine the average weight loss.



FIG. 15B is a graph (shown as Graph 1) illustrating the results of the total of 50 test blades, organized into groups of five blades, which were “pull” tested to determine the average weight loss of Table 1.



FIG. 16A is a table (shown as Table 2) illustrating the average wear (in inches) of the 851-204 Teflon®-coated blade and the rigid epoxy silicone material coated blade after fifty withdrawals through the scratch pad.



FIG. 16B is a graph (shown as Graph 2) illustrating the average wear (in inches) of the 851-204 Teflon®-coated blade and the rigid epoxy silicone material coated blade after fifty withdrawals through the scratch pad of Table 2.



FIG. 17 is a table (shown as Table 3) illustrating the results of a comparative “liver cutting test” (i.e., a simulated medical procedure) which showed the eschar buildup on the 851-204 Teflon®-coated blade after the test and the eschar buildup on the rigid epoxy silicone material coated blade after the test.





DETAILED DESCRIPTION

Referring now to FIG. 1, one embodiment is illustrated where a coating of epoxy modified rigid silicone powder is applied to an electrosurgical device such as an electrosurgical instrument, blade or knife 100. In this embodiment, the coated electrosurgical instrument 100 includes an electrode 102 and a holding device such as handle 104 or other suitable holding device which is connected to the electrode 102 and enables the electrode to be manipulated in a surgical procedure. The electrode includes a conductive substrate or conductive material which enables the electrode to conduct electrical energy or electricity. In one embodiment, a portion of the electrode 102 is coated, encapsulated or over-molded with an electrically insulative material 103 such as a suitable plastic. The coated electrode 102 includes a distal end or working end 106 and a proximal end or connection end 107 which may be bare metal and is not coated with any coating material. The exposed distal end 106 of the electrode is used to cut, coagulate and/or cauterize tissue in a body during a surgical procedure. Specifically, electrical energy such as electricity is transferred from a suitable electrical source through suitable wiring to electrical conductors (not shown) inside the handle 104. The electrical energy is then transferred from the conductors (not shown) in the handle 104 to the proximal end 107 of the electrode 102, which is electrically connected to the conductors in the handle, and energizes the electrode 102. Once energized, the electrical and thermal energy produced by the electrically charged electrode generates an elevated temperature which enables the distal end 106 of the electrode to cut, coagulate and/or cauterize tissue in a body.


In one embodiment, an epoxy modified rigid silicone powder coating is evenly applied to the entire surface of the electrode to minimize the buildup of tissue or eschar on the working surface of the electrode. The epoxy modified rigid silicone powder coating has high temperature capabilities (i.e., a melting temperature of approximately 900° F. (482° C.)) and non-stick properties such that the electrosurgical electrode may be heated to temperatures above which other fluoropolymer based non-stick coatings may break down and emit harmful and toxic ganeous byproducts. Accordingly, the rigid silicone coating minimizes the buildup of tissue or eschar on the surface of the electrode by minimizing the adherence of the tissue on the surface of the electrode. Specifically, the epoxy modified rigid silicone powder coating forms a non-stick surface which reduces or prevents eschar from adhering to the surface coated with the epoxy modified rigid silicone powder. This enables a user such as a surgeon to continue a surgical procedure without having to continuously clean, scrape or brush off adhered charred tissue from the surface of the electrode.


In one embodiment, the epoxy modified rigid silicone powder coating includes a silicone resin and a polysiloxane additive. The silicone resins may be selected from the group including a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl polysiloxane powder resin, a phenyl alkyl polysiloxane powder resin, a methyl phenyl polysiloxane powder resin, a phenyl silicone powder and a methyl phenyl silicone. The siloxane additive includes a polysiloxane additive selected from the group consisting of a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. It should be appreciated that any suitable epoxy modified rigid silicone powder with high temperature capabilities and non-stick properties may be implemented.


In one embodiment, the polysiloxane additive is between about 0.5% to about 10% parts per weight of the powder coating. In one embodiment, the silicone resin is from about 5% to 75% parts per weight of the powder coating. In another embodiment, the powder coating includes epoxy cresol novolac. In this embodiment, the epoxy cresol novolac is from about 1% to about 50% parts per weight of the powder coating. In another embodiment, the powder coating includes o-cresol novolac. In this embodiment, the o-cresol novolac is from about 1% to about 40% parts per weight of the powder coating. In another embodiment, the powder coating includes a solid bisphenol-A/epichlorohydrin epoxy resin. In this embodiment, solid bisphenol-A/epichlorohydrin epoxy resin is from about 1% to about 50% parts per weight of the powder coating.


In one embodiment, the epoxy modified rigid silicone powder coating includes:


(a) SY-430 in the range of about 40% to about 60% parts per weight of the powder coating;


(b) Wollastonite in the range of about 20% to about 40% parts per weight of the powder coating;


(c) ECN 9699 in the range of about 5% to about 15% parts per weight of the powder coating;


(d) Modarez MSL in the range of about 3% to about 7% parts per weight of the powder coating;


(e) HT 9690 in the range of about 0.5% to about 3% parts per weight of the powder coating; and


Modaflow® Powder III in the range of about 0.5% to about 3% parts per weight of the powder coating.


In this embodiment, SY-430 is a resin made by Wacker-Chemie GmbH of Munich, Germany. According to the manufacturer, this product is a solvent-free hydroxyl functional solid phenyl silicone resin delivered in flake form.


Wollastonite is a naturally occurring calcium metasilicate (i.e., CaSiO3). The particular Wollastonite product used in this embodiment is made by Nyco of Willsboro, N.Y., and is identified by that company as NYAD® 400 Wollastonite. According to the manufacturer, the deposit of calcium metasilicate came from Nyco's deposit in Lewis, Essex County, N.Y.


The ECN (“epoxy cresol novolac”) 9699 is an epoxy cresol novalac resin made by Ciba-Geigy. According to the manufacturer, this novolac epoxy resin is derived from an ortho cresolformaldehyde novolac which is then reacted with epichlorohydrin to form a polyepoxide.


The Modarez MSL is made by Synthron, Inc., Morganton, N.C. According to the manufacturer, this component is a 60% active powder version of the methyl alkyl polysiloxane for powder coatings.


The HT 9690 is a curing agent made by Ciba-Geigy. According to the manufacturer, this curing agent is an o-cresol novolac resin (hydroxyl-type).


The Modaflow® Powder III is made by the Chemical Group of Monsanto Company, St. Louis, Mo. This powder is an acrylate copolymer. According to the manufacturer, this powder is a resin modifier.


In alternative embodiments, in addition to the components described above, the epoxy modified rigid silicone powder coating may also include one or more the following pigments:


(i) Micro-Mica C-300 in the range of about 0% to about 10% parts per weight of the powder coating;


(ii) Ferro F-6331 in the range of about 0% to about 10% parts per weight of the powder coating;


(I) Silvet 320-205 in the range of about 0% to about 6% parts per weight of the powder coating; and


(iv) Ferro UMB-5008 Blue in the range of about 0% to about 10% parts per weight of the powder coating.


In this embodiment, the Micro-Mica® C-3000 is an ultra-fine air micronized functional pigment consisting of pure muscovite mica distributed by Kraft Chemical Co. of Melrose Park, Ill.


The Ferro F-6331 is made by Ferro Corporation, Cleveland Ohio. It is a high temperature calcination of coprecipitated compound with manganese-copper-iron. According to the manufacturer, F-6331 is a black inorganic pigment. The CAS Number is 68186-94-7.


The Silvet 320-205 is made by Silberline World Headquarters of Tamaqua, Pa. It is a silvet pigment. According to the manufacturer, 320-205 is a small particle size bright leafing aluminum pigment based on cornflake geometry.


The Ferro UMB-5008 Blue is made by Ferro Corporation, Cleveland Ohio. It is an untramarine Blue inorganic pigment.


It should be appreciated that in addition to or as a substitution for any of the pigments described above, any suitable pigment may be implemented in accordance with the epoxy modified rigid silicone powder coated electrosurgical device disclosed herein. In another alternative embodiment, hydroxyl functional methyl phenyl polysiloxane may be used in place of the SY-430 described above.


In one specific, designated embodiment, the epoxy modified rigid silicone powder coating includes:


(a) about 50% parts per weight of SY-430;


(b) about 23.5% parts per weight of Wollastonite;


(c) about 10% parts per weight of ECN 9699;


(d) about 5% parts per weight of Micro-Mica® C-3000;


(e) about 5% parts per weight of Modarez MSL;


(f) about 4% parts per weight of Ferro F-6331;


(g) about 1.5% parts per weight of HT 9690; and


(h) about 1% parts per weight of Modaflow® Powder III.


It should be appreciated that the epoxy modified rigid silicone powder coating may include any suitable or equivalent chemical composition, including the chemical compositions described in U.S. Pat. No. 5,691,067 (which relates to powder coatings for cookware and bake ware and not an electrosurgical electrode) which is incorporated herein by reference.


In one alternative embodiment, the epoxy modified rigid silicone powder coating includes C.I. Pigment 50 green in the range of about 1% to about 15% parts per weight of the powder coating. In this embodiment, the C.I. Pigment 50 green is a green pigment produced by The Shepherd Color Company, Cincinnati, Ohio. The C. I. Pigment 50 green is a complex inorganic colored pigment manufactured from crystals of metal oxide and is Food Contact Approved. In another alternative embodiment, the epoxy modified silicone powder coating includes a blending in about 1-15% by weight of TiO2 (titanium dioxide) as a white pigment in combination with green pigment, Ferro Geode V-11633 within a range of from 1 to 15% by weight of Green Ferro Geode V-11633 pigment.


As the properly formulated and/or reformulated epoxy modified rigid silicone coating has an optimized or altered electrical conductivity, the epoxy modified rigid silicone powder particles applied to the surface of the electrode more evenly distributes the temperature and electrical energy transferred to the electrode while increasing the electrical conductivity of the electrode. The increase and relatively even distribution of electrical energy or electricity to the electrode enables the electrode to minimize “hot spots” or portions of the electrode which have a higher temperature due a disproportionate or non-uniform distribution of the electrical energy to the electrode. As a result, a surgeon can make more precise cuts or coagulate or cauterize discrete or specific parts of the tissue in the body with more accuracy. This improves the surgical procedure and also minimizes the time of the surgical procedure. The amount of or density of the epoxy modified rigid silicone powder particles or compounds included in the coating can be adjusted to increase or decrease the conductivity of the coating applied to the surface of the electrode. In another embodiment, electrically conductive pigments may be blended into the formulation to further enhance electrical energy transmission from the electrode thru the rigid silicone coating.


In one embodiment, the size of the epoxy modified rigid silicone powder particles may be changed as desired to accommodate different technical and coating requirements or specifications. In one embodiment, the epoxy modified rigid silicone powder particles include at least one relatively large particle and at least one relatively small particle. In another embodiment, the epoxy modified rigid silicone powder particles range in size such as from a sub-micron to approximately 125-150 microns. the epoxy modified rigid silicone particle layers are substantially spherical particles, which creates a softer, less abrasive surface on the electrosurgical device.


In another embodiment, the uniform particle layer includes different sized epoxy modified rigid silicone powder particles applied to the surface of the electrosurgical device. In one example, hard abrasion resistant larger size particles and smaller electrically conductive particles are applied to create an abrasion resistant and electrically conductive surface of the electrosurgical device. It should be appreciated that any suitably sized and shaped epoxy modified rigid silicone powder particles may be applied to the surface of the substrate.


In one embodiment, prior to applying the epoxy modified rigid silicone powder to one or more surfaces of the electrosurgical device, the electrosurgical electrode is positioned on a support. Initially, the surface of the electrosurgical electrode is cleaned with a cleaner to remove impurities which may be present on the surface of the electrosurgical electrode. The cleaner such as a solvent may be manually applied or mechanically applied to the electrosurgical electrode. In one embodiment, grit blasting or sandblasting is used to clean the surface of the electrosurgical electrode. In one alternative embodiment, rather than grit blasting, an ultrasonic liquid cleaner is used to clean the electrosurgical electrode. In this embodiment, the ultrasonic liquid cleaner strips a microscopic layer off the top surface of the electrode. In another embodiment, the electrosurgical electrode may be thermally cleaned by heating the electrode to a temperature, depending on the metal alloy of the electrode, in excess of 700° F. (371° C.) for a period of time sufficient to thermally degrade surface impurities. In another alternative embodiment, the electrosurgical electrode may be pre-cleaned or the method may be performed in a “clean room” where the cleaned part is manufactured and this cleaning step is not necessary. In another embodiment, the electrosurgical device may be cleaned in a batch or bulk cleaning method, thereby cleaning all of the surfaces of the electrosurgical device.


In one embodiment, the epoxy modified silicone powder coating mixture formulation has self-adhesive properties. In this embodiment, when applied to the surfaces of the electrosurgical device, the epoxy modified rigid silicone powder particles will adhere. Thus, in this embodiment, no bonding layer is necessary to be applied to the electrode after the electrode is cleaned. In another embodiment, a silane coupling agent which is only a few molecules thick is used prior to the application of the epoxy modified rigid silicone powder. In this embodiment, the silane coupling or adhesion promoting agent remains wet on the electrode surface, the dry epoxy modified rigid silicone powder is applied directly to it and the electrode is cured once. One or more suitable powder topcoats may then be applied to the cured electrode, with or without suitable liquid coupling or bonding agents.


In one embodiment, a very thin liquid epoxy-based material is applied to the electrosurgical device after the electrode surface is cleaned but prior to the application of the epoxy modified rigid silicone powder particles. In another embodiment, prior to the application of the epoxy modified rigid silicone powder particles, a very thin liquid epoxy-based material is applied to the cleaned electrode surface and the electrode surface is semi-dried or semi-cured. The liquid layer of epoxy remains wet during the application of the dry powder particles. These embodiments provide increased adhesion of the epoxy modified rigid silicone powder particles to the electrosurgical device by creating a linking or bonding agent between the electrosurgical device and the subsequently applied epoxy modified rigid silicone powder particles.


In an alternative embodiment, the liquid epoxy-based material includes one or more colored pigments, such as a red pigment color or a yellow pigment color. The subsequently applied epoxy modified rigid silicone powder particles include a different colored pigment, such as a black pigment color. In this embodiment, as a surgeon sanded the blade with a scratch pad (in order to remove the adhered eschar) and eventually wore thru the epoxy modified rigid silicone powder topcoat (i.e., the black colored layer), the surgeon would see the underlying red colored layer and thus be notified that it was time to change the blade as the non-stick layer is at least partially worn off or worn thru.


In another embodiment, the epoxy modified rigid silicone powder particles must be affixed to one or more surfaces of the electrosurgical device using one or more bonding materials. In this embodiment, after the electrosurgical device is cleaned or is clean, a layer of a substantially wet bonding material is applied to the electrosurgical device. The bonding material provides a wet or moist surface for the subsequent substantially uniform rigid silicone particle layer to adhere to. The wet bonding material may be any suitable bonding material, which meets the specific design specifications of the particular electrosurgical device. In one embodiment, it is important that the bonding material remain wet prior to the application of the rigid silicone particle layer so that the epoxy modified rigid silicone powder particles stick to or adhere to the wet bonding material. In this embodiment, a single layer of substantially uniform epoxy modified rigid silicone powder particles are applied or powder sprayed onto the wet bonding material layer until the wet bonding material layer is completely coated with the dry uniform particles and a desired thickness is achieved. The thickness of the coatings or coating layers is dependent on the specifications for the particular product, the amount of bonding material applied and the size and shape of the epoxy modified rigid silicone powder particles. It should be further appreciated that the epoxy modified rigid silicone powder particles may be applied to the electrosurgical device utilizing any of the processes described in published U.S. Patent Application No. 2004/0116792 which is incorporated herein by reference.


It should be appreciated that due to the manner that PTFE is applied to a blade (i.e., via one or more liquid coatings), a PTFE coated blade includes a number of small holes in the PTFE coating. Such holes or inconsistencies may disrupt the non-stick characteristics of a PTFE coated blade. On the other hand, because the epoxy modified rigid silicone powder particles are applied, as described above, as a dry powder, a greater portion of the coating adheres to the blade and no small holes are present in the coating. It should be further appreciated that a thicker layer of coating may be applied to an epoxy modified rigid silicone coated blade than a PTFE coated blade at substantially the same cost. That is, PTFE can only be applied to a certain level of thickness because any thickness over that level and the PTFE coating develops “mud” cracks. On the other hand, epoxy modified rigid silicone is mechanically stronger than PTFE and thus a thicker layer of epoxy modified rigid silicone may be applied to a blade without cracking. It should also be appreciated that the epoxy modified rigid silicone composition described above is recyclable.


In one embodiment, the epoxy modified rigid silicone powder particles are sprayed or applied onto the wet bonding material as a single substantially uniform and substantially even layer which adheres to the sticky or wet surface of the bonding material. In another embodiment, the electrosurgical device is electrically grounded using a suitable grounding method. Electrically grounding the electrosurgical device thereby grounds the wet bonding material layer, which is formulated to include solvents and/or liquids that conduct electrical energy. The substantially uniform epoxy modified rigid silicone powder particle layer has or will have an opposite electrical charge to that of the bonding material layer and therefore is electrically or electrostatically attracted to the wet bonding material layer as the epoxy modified rigid silicone powder particles are applied to that layer. In a further embodiment, an applicator such as a sifter or electrostatic fluidized bed is used to uniformly apply the epoxy modified rigid silicone powder particles to the wet bonding material layer. The sifter is similar to a conventional flour sifter or a drum sifter and is used in certain applications depending on the required application of the uniform particles. The electrostatic fluidized bed contains a porous membrane made of porous polyethylene or any suitable electrically non-conductive material which allows the aeration of the powder with pressurized air that is charged to approximately 60,000 volts with a metal grid under the porous membrane, thereby charging the epoxy modified rigid silicone powder particles. Charging the epoxy modified rigid silicone powder particles cause the particle to adhere to the grounded electrosurgical device placed above or in the fluidized bed.


After the substantially uniform epoxy modified rigid silicone particle layer is applied to the wet bonding material layer, the layer is cured to strengthen the bond between the uniform rigid silicone particle layer and the wet primer layer on the surface of electrosurgical device. The curing process may be performed by heating the layers at a predetermined temperature or temperatures, air-drying the layers or by utilizing any suitable internal or external curing process. When the substantially uniform epoxy modified rigid silicone powder particle layer has completed adhered or bonded to the bonding material layer, a suitable coating layer may be applied to the uniform epoxy modified rigid silicone powder particle layer. In this embodiment, the epoxy modified rigid silicone powder coating may be undercured in an oven or suitable device, thus creating a semi-cured layer to which subsequent liquid or epoxy modified rigid silicone powder layers may be attached with a final cure which will consolidate the multiple layers. The coating may be any suitable coating such as a topcoat or final coat material. Examples include corrosive or abrasive resistant coatings, non-stick coatings or low friction coatings, anti-microbial coatings and electrically insulative or conductive coatings or combinations thereof. It should be appreciated that areas of the electrosurgical device in which epoxy modified rigid silicone powder is not required can be vacuumed or mechanically wiped from the electrosurgical device prior to the oven curing of the coating. This saves much production time and further reduces production costs.


In one embodiment, the metal electrosurgical blade or device is heated to a temperature in excess of 500° F. (260° C.) using induction heating or other suitable heating methods. A portion of the electrosurgical device that is to be powder coated is immersed into a non-electrostatic fluidized bed up to the point where the coating is not required and held there for a period of time between one half second to approximately 10 seconds. A layer of epoxy modified rigid silicone powder particles will adhere to the portion of the electrosurgical device that has been immersed into the fluidized bed of the powder. The electrosurgical blade or device is then placed into a fixture or onto a conveyor device and passed through a heating chamber to finish cure the layer of epoxy modified rigid silicone powder particles. It should be appreciated that this technique reduces the amount of masking or fixturing required for powder spraying the same type of parts, particularly if the parts have complex shapes and/or blind cavities or recesses.



FIGS. 2A and 2B illustrate one embodiment of the electrosurgical blade 100 of FIG. 1 wherein a single even layer of epoxy modified rigid silicone powder particles 112 with self-adhesive properties is applied directly to the surface of the electrode 102 without the use of any bonding material layer. The electrode 102 includes major surfaces 108 and minor surfaces 110. The rigid silicone particle coating is uniformly and evenly applied to the major surfaces 108 and minor surfaces 110 of the electrode as shown in FIG. 2A. In this embodiment, the rigid silicone coating enables the electricity or electrical energy to be evenly conducted and displaced across the surfaces of the electrode. This provides substantial benefits in a surgical process by minimizing the buildup of tissue or eschar on the surface of the electrode thus reducing surgical time and possibly minimizing the likelihood of complications arising during surgery.



FIGS. 3A, 3B and 3C illustrate another embodiment of the electrosurgical blade 100 of FIG. 1 wherein a single even layer of epoxy modified rigid silicone powder particles 112 is applied to the surface of the electrode 102 with the use of any suitable bonding material layer 114. In this embodiment the major surfaces 108 and minor surfaces 110 of the electrode are initially roughened to promote the adherence of the coatings to the surfaces. After the surfaces are roughened or suitably cleaned, a wet bonding material such as a primer 114 is applied to the major surfaces 108 and minor surfaces 110 of the electrode. The wet bonding material is applied evenly and uniformly to the surface of the electrode. While the wet bonding material is still substantially wet, a plurality of epoxy modified rigid silicone powder particles 112 are applied to the wet bonding material 114 as shown in FIG. 3B and as disclosed above. The dry epoxy modified rigid silicone powder particles engage, adhere to and are at least partially embedded in the wet bonding material 114. The wet bonding material 114 therefore causes the epoxy modified rigid silicone powder particles 112 to adhere to and enhance the adhesion of the epoxy modified rigid silicone powder particles to the surface of the electrode 102.


In one embodiment, a top coating 116 is applied over the layer of epoxy modified rigid silicone powder particles 112 so that the top coating completely and fully coats the layer of epoxy modified rigid silicone powder particles on the surface of the electrode. This top coating may be applied to a semi-cured epoxy modified rigid silicone powder prior to the final bake. As shown in FIG. 3C, the top coating 116 is applied so that the epoxy modified rigid silicone powder particles are exposed at the surfaces of the electrode. Therefore, the electrosurgical electrode retains the benefits of minimizing the buildup of tissue or eschar on the surface of the electrode. In this embodiment, the top coating is not applied to the surfaces of the electrode covered by the insulative or plastic material 103 as shown in FIG. 3D. This fully exposes the maximum amount of epoxy modified rigid silicone powder particles underneath at least a portion of the insulative material 103.


Referring now to FIGS. 4A and 4B, as described above, the high temperature resistance of the epoxy modified rigid silicone powder enables the electrosurgical electrode to be heated to temperatures above 500° F. (260° C.) which other non-stick coatings may break down, emit harmful and toxic gaseous byproducts and may micro-fracture during the decomposition. For example, FIGS. 4A to 4B illustrate the results of an experimental comparison between an electrosurgical device coated with polytetrafluoroethylene (PTFE), sold under the trade name DuPont Teflon® 851 204 (the left blade in FIGS. 4A and 4B) and an electrosurgical device coated with an epoxy modified rigid silicone powder (the black colored right blade in FIGS. 4A and 4B) after the two blades are each subjected to a “power” setting of between 5.0 and 9.0 kv and a “Coag” setting between 70 and 150 for a period of between 10 and 30 seconds using a ValleyLab generator, model Force 40S-20. It should be appreciated that the shown blades were not cleaned after a test cutting the same piece of calves liver (which is a common medical industry substitute for human flesh for electrosurgical testing). As seen in these figures, while the black colored epoxy modified rigid silicone powder coated blade substantially retains the epoxy modified rigid silicone powder coating (as seen as the shiny black color in the color photographs submitted to the U.S. Patent and Trademark Office), the PTFE coated blade exhibits substantial decomposition and discoloring of the green color PTFE, wherein the separate bands of discoloration of the green color on portion of the blade show the effect of elevated temperatures on the PTFE coated blade. Accordingly, unlike the PTFE coated blade, except at the tip or edge of the blade, there is substantially no deterioration or discoloration of the epoxy modified rigid silicone powder coating.


As described above, surgeons often utilize a scratch pad to periodically remove the built-up eschar from the used blade by scraping the residue with a scratch pad which resembles medium coarse sandpaper bonded to a layer of resilent foam. In performing this abrasive function, surgeons often sand thru the eschar and start to erode the protective finish on the blade. That is, the surgeon may sand thru the coating which provides the blade with non-stick properties, removing part of or all of the non-stick surface applied to the blade. Accordingly, a comparative abrasion test was performed with laparoscopic blades coated with PTFE DuPont Teflon and laparoscopic blades coated with the epoxy modified rigid silicone powder particles described above to demonstrate the relative weakness when subjected to mechanical abrasion of the PTFE DuPont Teflon coated blade when compared to the rigid epoxy silicone coated blade described above. It should be appreciated that the below-described tests were performed using a rigid epoxy silicone coated blade with the chemical composition of the specific, designated embodiment described above.


The comparative abrasion test included repeatedly withdrawing a laparoscopic blade from between two facing layers of a scratch pad material, wherein a weight was placed on the upper scratch pad. Each scratch pad was constructed of foam between the abrasive on one side and the adhesive on the bottom. Specifically, the test included configuring two face-to-face scratch pads in a sandwich configuration with one abrasive pad facing the other abrasive pad. The bottom pad was held in place with an adhesive on the bottom of the pad and the top pad was held in place directly above the bottom pad by a suitable device. A 500-gram weight was placed on the top pad (to add pressure) and attached to the top of the top scratch pad with an adhesive. The test included separating the two pads, putting a blade in completely to the coated section (before the narrowing of the blade), lowering the weighted top pad and manually withdrawing at a slow speed of approximately one inch per second. This procedure was repeated 50 times with the individual group of blades weighed every ten cycles. Both groups of blades were separate. The test blades had an attached two inch long tape handle to reduce the vertical loading of the manual withdrawal motion.


The test included weighing each coated blade individually with a tenth-milligram (0.0001 gram resolution) scale prior to the testing and every ten cycles of “pulls”. Table 1 of FIG. 15A and Graph 1 of FIG. 15B illustrate the results of a total of 50 test blades, organized into groups of five blades, which were “pull” tested to determine the average weight loss. As illustrated in Table 1, Column A, the average weight loss of the Teflon 851-204 was 0.0021 grams. As seen in FIGS. 5 to 8, such a weight loss resulted in the bare stainless blade showing on 85% of the surface of the 851-204 Teflon®-coated blade (i.e., the green colored blades on the right side of each pair of blades) after the abrasion test. Column B of Table 1 demonstrates the average weight loss of the rigid epoxy silicone material coated blade undergoing the very same “pull” test was 0.0011 grams. As seen in FIGS. 5 to 8, such a weight loss resulted in the bare stainless blade showing on 5% of the surface of the rigid epoxy silicone material coated blade (i.e., the black colored blades on the left side of each pair of blades) after the abrasion test.


As illustrated in Table 1 and Graph 1, the average milligram weight lost at fifty withdrawals through the scratch pad test, when comparing the 851-204 Teflon®-coated blade or the rigid epoxy silicone material coated blade, in all cases, showed essentially double the weight loss of the 851-204 Teflon®-coated blade compared to the rigid epoxy silicone material coated blade. The average milligram weight loss of the rigid epoxy silicone material coated blade was 0.0011 grams or one milligram. The average weight loss of the 851-204 Teflon®-coated blade was 0.0021 milligrams.


Table 2 of FIG. 16A and Graph 2 of FIG. 16B, show the average wear (in inches) of the 851-204 Teflon®-coated blade and the rigid epoxy silicone material coated blade after fifty withdrawals through the scratch pad. These results show that by initially applying a thicker coating of the rigid epoxy silicone material than the 851-204 Teflon® coating, a significantly thicker layer of the rigid epoxy silicone material remains on the blade than the 851-204 Teflon®-coating. It should be appreciated that, as described above, the physical properties of the 851-204 Teflon®-coating prevent a thicker coating to be initially applied, while the rigid epoxy silicone material has no such restrictions. As mentioned above, a thicker coating of the rigid epoxy silicone material may be applied to a blade at substantially the same cost as a thinner coating of the 851-204 Teflon®. Such a thicker coating at substantially the same cost provides another benefit (in addition to the various performance benefits described below) of a rigid epoxy silicone material coated blade when compared to 851-204 Teflon® coated blade.


It should be appreciated that one of the visual observations with the 851-204 Teflon®-coated blade was that, after a series of tests but before the 30th cycle was undertaken, the blade showed the underlayment stainless steel, which is much harder than the 851-204 Teflon®-coating. As seen in FIGS. 5 to 8, this distorted the actual wear of the 851-204 Teflon®-coating as once the coating was worn thru, the weight loss declined. Accordingly, the 851-204 Teflon®-coating was essentially missing from the test surface after 30 pulls, which reduced the apparent weight loss of the 851-204 Teflon®-coating. Thus, the 851-204 Teflon®-coated blade wore much more visibly than the rigid epoxy silicone material coated blade which had a visible and measurable amount of material still protecting the stainless steel blade and maintained non-stick properties due to the coating not being removed.


Moreover, this test does not take into consideration the poor function of the 851-204 Teflon®-coated blade after the test. As described above, the 851-204 Teflon®-coating is absent from the blade surface which results in an unprotected blade when the 851-204 Teflon®-coated blade is used for laparoscopy. On the other hand, since the rigid epoxy silicone coated blade retained more than half of the thickness of the rigid epoxy silicone coating after the fifty pull test, the rigid epoxy silicone coated blade retains the non-stick properties described above.


The relatively unchanged non-stick function of the rigid epoxy silicone coated blade was further demonstrated by a comparative “liver cutting test” (i.e., a simulated medical procedure) which showed the eschar buildup on the 851-204 Teflon®-coated blade after the test and the eschar buildup on the rigid epoxy silicone material coated blade after the test. This test consisted of electronically connecting new blades to a ValleyLab generator (model Force 40S-20) with machine settings of: a “power” setting of 9.0 kv and a “Coag” setting of 150. The new blades are used to cut calves' liver meat to a depth of one half inch (½″) for a distance of one inch (1″). The results of this test, as seen in FIGS. 9 to 12 and as illustrated in Table 3 of FIG. 17, show that 0.005 grams of eschar built up on the 851-204 Teflon®-coated blade (the right-hand side partially green colored blades in FIGS. 9 and 10 and the blades in FIG. 12), while 0.003 grams of eschar built up on the rigid epoxy silicone material coated blade (the left-hand side black colored blades in FIGS. 9 and 10 and the blades in FIG. 11) after each blade was subjected to the exact same abrasion test followed by the exact same “liver cutting test” as is known in the art.


After the cutting test, the blades were manually cleaned as recommended by manufacturers of laparoscopic blades that apply nonstick coatings to blades. To clean each blade while in the pencil, a surgical gauze pad is used to wipe the burned and adhered eschar from the blade surface by pinching the blade between the thumb and forefinger with the gauze between the thumb and forefinger on both sides of the cutting blade. The blades are then withdrawn five times from the pinched position, thus replicating approximately 10 seconds worth of time of cleaning the blade manually.


The results of this cleaning, as seen in FIGS. 13 and 14 and as illustrated in Table 3, show that even after being wiped down with a surgical gauze pad, 0.003 grams of eschar built up on the 851-204 Teflon®-coated blade (the blades in FIG. 14), while only 0.001 grams of eschar built up on the rigid epoxy silicone material coated blade (the blades in FIG. 13) after each blade was subjected to the exact same “liver cutting test” and then manually wiped clean with a surgical gauze pad.


Accordingly, it can be concluded that rigid epoxy silicone-coated blades exhibited better nonstick characteristics in three critical areas. Based on the initially adhered eschar, removed eschar, and retained eschar after the cleaning procedure, as measured by increase in weight to the total weight of the five-blade sample, the rigid epoxy silicone-coated blade showed superior nonstick characteristics. The comparison of 0.003 grams of the eschar buildup, prior to cleaning of the rigid epoxy silicone-coated blade, versus 0.005 grams of the 851-204 Teflon®-coated blade shows a 66% improvement in the basic nonstick characteristics of the eschar not adhering or accumulating on the rigid epoxy silicone-coated blade.


Moreover, after cleaning with a surgical gauze pad, the amount of eschar remaining on the blade's surface indicates that the rigid epoxy silicone coated-blade was less contaminated because less eschar, by weight, was accumulated on the average of the five-blade sample. The retained eschar was 50% less with the rigid epoxy silicone coated blade. The ease of cleaning shows that both types of coated blades did release the eschar that was accumulated after the initial tests. However, it appears that the rigid epoxy silicone coated blade accumulated less initial eschar and, therefore, less eschar could be potentially removed through the gauze wipe test. The nonstick characteristics provided by either nonstick coating showed the percentage of eschar removed by the wiping test was greater with the rigid epoxy silicone coated-blade.


Furthermore, the total retained weight of the eschar accumulating on the surface (which contaminates the blade prior to the next surgical procedure using the blade) showed an improvement by the rigid epoxy silicone-coated blade versus the PTFE-coated Teflon® 851-204 blade. That is, an amount of eschar weight retained by the Teflon® 851-204 blade (0.002 grams) was twice as much versus the eschar weight retained by the rigid epoxy silicone blade (0.001 grams). This fifty percent reduction in the amount accumulated eschar, in favor of the rigid epoxy silicone coated blade, correlates to improved surgical procedures by providing a user with a cleaner blade with well-defined, cleaner cutting and better coagulation properties. That is, the Teflon® 851-204 coated blades showed extensive adherence of eschar requiring extensive abrasive pad scraping to remove the adhered eschar, which would extend the surgical procedure due to the adhered eschar or requiring a new blade to be fitted. The eschar buildup on blades causes increased electrical resistance, which requires increasing the current settings during the surgical procedure and also increases the risk of misdirected current. The cleaning of the blades during a procedure adds time and causes interruptions in the procedure. Without continual cleaning of the eschar, the blade provides a less precise surgical incision.


In one embodiment, in addition to the epoxy modified rigid silicone powder particles, a plurality of anti-microbial particles such as silver or silver compounds are applied to one or more of the surfaces of the electrosurgical device to reduce and kill bacteria and other potential germs that may be located on the surface(s) of the electrosurgical device. In one aspect of this embodiment, the anti-microbial particles are interspersed with the epoxy modified rigid silicone powder particles and a layer of anti-microbial material is applied to the electrosurgical device along with the epoxy modified rigid silicone powder particles. The above process can be repeated as necessary to maintain the effectiveness of the anti-microbial surface. The addition of the anti-microbial material tends to kill bacteria or other harmful organisms that contact the surface of the electrode during and after the surgical procedure. This coated electrode can be used multiple times in different surgical procedures without requiring sterilization (even though sterilization is preferred) because the anti-microbial particles kill the bacteria and other harmful organisms which contact the surfaces of the electrode. The coated electrosurgical device therefore minimizes the chance of infections or other complications in the body after the surgical procedure is complete.


In another embodiment, one or more additional epoxy modified rigid silicone powder layers are applied to the first or primary epoxy modified rigid silicone powder layer applied to the surface of the electrosurgical device to meet specific design specifications or coating requirements of a manufacturer. In this embodiment, the epoxy modified rigid silicone powder may be applied selectively to the electrosurgical device. For example, the epoxy modified rigid silicone powder may be applied to a long shank of a very long electrosurgical blade wherein the round shank is coated with two or more layers of the epoxy modified rigid silicone powder to create a thicker coating than a blade portion which is coated with one coat. In different embodiments, the additional bonding material layers may be the same or different than the first epoxy modified rigid silicone powder layer and are applied to the first epoxy modified rigid silicone powder layer until a predetermined thickness is achieved. Additionally, different materials may be added to the bonding material layer or layers, based on specific design specifications.


It should be understood that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications can be made without departing from the spirit and scope of the present invention and without diminishing its intended advantages. It is therefore intended that such changes and modifications be covered by the appended claims.

Claims
  • 1. A method of coating a medical device, the method comprising: applying a non-stick coating to a first portion of a surface of a conductive substrate of the medical device, wherein the non-stick coating includes a plurality of epoxy modified rigid silicone particles each having a size of no greater than one-hundred-fifty microns, and wherein the non-stick coating retains nonstick properties after being heated to up to 850° F.; andat least partially curing the applied non-stick coating.
  • 2. The method of claim 1, wherein the epoxy modified rigid silicone particles at least include: (a) a solvent-free hydroxyl functional solid phenyl silicone resin;(b) a calcium metasilicate;(c) an epoxy cresol novalac resin;(d) a 60% active powder version of a methyl alkyl polysiloxane;(e) an o-cresol novolac resin; and(f) an acrylate copolymer.
  • 3. The method of claim 2, wherein: (a) the solvent-free hydroxyl functional solid phenyl silicone resin is in the range of about 40% to about 60% parts per weight of the coating;(b) the calcium metasilicate is in the range of about 20% to about 40% parts per weight of the coating;(c) the epoxy cresol novalac resin is in the range of about 5% to about 15% parts per weight of the coating;(d) the 60% active powder version of a methyl alkyl polysiloxane is in the range of about 3% to about 7% parts per weight of the coating;(e) the o-cresol novolac resin is in the range of about 0.5% to about 3% parts per weight of the coating; and(f) the acrylate copolymer is in the range of about 0.5% to about 3% parts per weight of the coating.
  • 4. The method of claim 1, wherein the conductive substrate comprises a metal.
  • 5. The method of claim 1, wherein a plurality of anti-microbial particles are interspersed in said non-stick coating.
  • 6. The method of claim 5, wherein the anti-microbial particles comprise particles selected from the group consisting of: silver particles and ceramic particles.
  • 7. The method of claim 1, wherein a plurality of electrically conductive particles are interspersed in said non-stick coating.
  • 8. The method of claim 1, wherein at least part of the conductive substrate forms a shape selected from the group consisting of: a blade, a knife, a wire, a needle, a probe and a ball.
  • 9. The method of claim 1, wherein the medical device comprises an electrosurgical electrode.
  • 10. A method of coating a medical device, the method comprising: applying a coating to a first portion of a surface of a substrate of the medical device, wherein: the coating includes a plurality of particles each having a size of no greater than one-hundred-fifty microns, andthe coating includes: a solvent-free hydroxyl functional solid phenyl silicone resin;a calcium metasilicate;an epoxy cresol novalac resin;a 60% active powder version of a methyl alkyl polysiloxane;an o-cresol novolac resin; andan acrylate copolymer; andat least partially curing the applied coating.
  • 11. The method of claim 10, wherein: (a) the solvent-free hydroxyl functional solid phenyl silicone resin is in the range of about 40% to about 60% parts per weight of the coating;(b) the calcium metasilicate is in the range of about 20% to about 40% parts per weight of the coating;(c) the epoxy cresol novalac resin is in the range of about 5% to about 15% parts per weight of the coating;(d) the 60% active powder version of a methyl alkyl polysiloxane is in the range of about 3% to about 7% parts per weight of the coating;(e) the o-cresol novolac resin is in the range of about 0.5% to about 3% parts per weight of the coating; and(f) the acrylate copolymer is in the range of about 0.5% to about 3% parts per weight of the coating.
  • 12. The method of claim 10, wherein the substrate comprises a metal.
  • 13. The method of claim 10, wherein a plurality of anti-microbial particles are interspersed in said coating.
  • 14. The method of claim 13, wherein the anti-microbial particles comprise particles selected from the group consisting of: silver particles and ceramic particles.
  • 15. The method of claim 10, wherein a plurality of electrically conductive particles are interspersed in said coating.
  • 16. The method of claim 10, further comprising applying a top coat to the at least partially cured coating.
  • 17. The method of claim 16, wherein the top coat is selected from the group consisting of: an abrasive resistant coating, a non-stick coating, an anti- microbial coating and an electrically conductive coating.
  • 18. The method of claim 10, wherein at least part of the substrate forms a shape selected from the group consisting of: a blade, a knife, a wire, a needle, a probe and a ball.
PRIORITY CLAIM

This application is a continuation of, claims priority to and the benefit of U.S. patent application Ser. No. 15/486,012, filed on Apr. 12, 2017, now U.S. Pat. No. 10,463,420, which is a continuation of, claims priority to and the benefit of U.S. patent application Ser. No. 14/444,603, filed on Jul. 28, 2014, now U.S. Pat. No. 9,630,206, which is a continuation of, claims priority to and the benefit of U.S. patent application Ser. No. 11/330,499, filed on Jan. 11, 2006, now U.S. Pat. No. 8,814,861, which is a continuation-in-part of, claims priority to and the benefit of U.S. patent application Ser. No. 11/127,545, filed on May 12, 2005, now U.S. Pat. No. 7,147,634, the entire contents of each are incorporated by reference herein.

US Referenced Citations (764)
Number Name Date Kind
3990998 DeLuca et al. Nov 1976 A
4023912 Mahler et al. May 1977 A
4031286 Seymus Jun 1977 A
4038234 Birchall et al. Jul 1977 A
4043966 Edwards et al. Aug 1977 A
4049863 Vassiliou Sep 1977 A
4054705 Vassiliou Oct 1977 A
4056650 Dates et al. Nov 1977 A
4063068 Johnson et al. Dec 1977 A
4066817 De Rossi Jan 1978 A
4070525 Vassiliou et al. Jan 1978 A
4074718 Morrison, Jr. Feb 1978 A
4083756 Tajkowski Apr 1978 A
4087394 Concannon May 1978 A
4090993 Attwood et al. May 1978 A
4098756 Miller et al. Jul 1978 A
4103076 Ulam Jul 1978 A
4105616 Patton Aug 1978 A
4118537 Vary et al. Oct 1978 A
4120608 Vassiliou Oct 1978 A
4121000 Wald Oct 1978 A
4122226 Vassiliou Oct 1978 A
4123401 Berghmans et al. Oct 1978 A
4126728 Holleran et al. Nov 1978 A
4130675 Vassiliou et al. Dec 1978 A
4131711 Attwood Dec 1978 A
4139576 Yoshimura et al. Feb 1979 A
4147684 Patton Apr 1979 A
4147819 Hukumoto et al. Apr 1979 A
4149455 Ross Apr 1979 A
4150008 Vassiliou et al. Apr 1979 A
4155788 Crandall et al. May 1979 A
4158080 Wexell Jun 1979 A
4158081 Wexell Jun 1979 A
4167606 Ulam Sep 1979 A
4168334 Crandall et al. Sep 1979 A
4176222 Cinderey et al. Nov 1979 A
4177320 Yoshimura et al. Dec 1979 A
4180609 Vassiliou Dec 1979 A
4181686 Vassiliou Jan 1980 A
4194042 Dates et al. Mar 1980 A
4204021 Becker May 1980 A
4223069 Berghmans Sep 1980 A
4226646 Vassiliou Oct 1980 A
4228219 Hoy et al. Oct 1980 A
4230758 Nagai et al. Oct 1980 A
4244802 Pohto et al. Jan 1981 A
4252702 Wald Feb 1981 A
4252859 Concannon et al. Feb 1981 A
4259375 Vassiliou Mar 1981 A
4262043 Wald Apr 1981 A
4264337 Fenster et al. Apr 1981 A
4276350 Franz Jun 1981 A
4277522 Dorfeld Jul 1981 A
4285728 Babcock et al. Aug 1981 A
4287112 Berghmans Sep 1981 A
4296217 Stuart-Webb Oct 1981 A
4301213 Davies Nov 1981 A
4311634 Vassiliou Jan 1982 A
4311755 Rummel Jan 1982 A
4314559 Allen Feb 1982 A
4316070 Prosise et al. Feb 1982 A
4320699 Binks Mar 1982 A
4321174 Hoy et al. Mar 1982 A
4324715 Emerick Apr 1982 A
4324836 Patton Apr 1982 A
4325860 Johnson Apr 1982 A
4330453 Patton May 1982 A
4331798 Staniland May 1982 A
4338360 Cavanagh et al. Jul 1982 A
4347722 Ulam Sep 1982 A
4350259 Cartossi Sep 1982 A
4351882 Concannon Sep 1982 A
4352905 Patton Oct 1982 A
4353950 Vassiliou Oct 1982 A
4360567 Guillevic Nov 1982 A
4361622 Theisen et al. Nov 1982 A
4369346 Hart et al. Jan 1983 A
4371451 Scotti et al. Feb 1983 A
4383067 Patton May 1983 A
RE31448 Attwood et al. Nov 1983 E
4413767 Hellinger Nov 1983 A
4425164 Bliznak et al. Jan 1984 A
4425448 Concannon et al. Jan 1984 A
4434197 Petriello et al. Feb 1984 A
4443574 Coq et al. Apr 1984 A
4469596 Kantor Sep 1984 A
4470688 Inagaki et al. Sep 1984 A
4477517 Rummel Oct 1984 A
4478965 Concannon et al. Oct 1984 A
4481251 Vratny Nov 1984 A
4486508 Coughlin et al. Dec 1984 A
4503168 Hartsing, Jr. Mar 1985 A
4507338 Freundlich Mar 1985 A
4512215 Krauchick Apr 1985 A
4514492 LeStrange et al. Apr 1985 A
4515703 Haq May 1985 A
4517975 Garito et al. May 1985 A
4524751 Hoglund Jun 1985 A
4537800 Kuziemka Aug 1985 A
4541411 Woolf Sep 1985 A
4544692 Kuziemka Oct 1985 A
4547923 DeVries et al. Oct 1985 A
4554025 Burke et al. Nov 1985 A
4575429 Jacobson Mar 1986 A
4576842 Hartsing et al. Mar 1986 A
4585705 Broderick et al. Apr 1986 A
4589925 Young May 1986 A
4596236 Eide Jun 1986 A
4598003 Renholts Jul 1986 A
4610918 Effenberger et al. Sep 1986 A
4623546 Holay et al. Nov 1986 A
4623565 Huybrechts et al. Nov 1986 A
4635538 Polster Jan 1987 A
4646935 Ulam Mar 1987 A
4653468 Lemme et al. Mar 1987 A
4664978 Wu et al. May 1987 A
4673468 Myers et al. Jun 1987 A
4676151 Gorsuch et al. Jun 1987 A
4677147 Swihart et al. Jun 1987 A
4681908 Broderick et al. Jul 1987 A
4683168 Hares et al. Jul 1987 A
4684577 Coq Aug 1987 A
4701585 Stewart Oct 1987 A
4711802 Tannenbaum Dec 1987 A
4720941 Belieff et al. Jan 1988 A
4737389 Hartsing, Jr. et al. Apr 1988 A
4743300 Brinduse et al. May 1988 A
4744994 Bernacchi et al. May 1988 A
4747683 Doane May 1988 A
4753742 Wilhelm, Jr. Jun 1988 A
4753848 Sugerman et al. Jun 1988 A
4781970 Barbee et al. Nov 1988 A
4785807 Blanch Nov 1988 A
4786513 Monforton et al. Nov 1988 A
4797521 Liwski Jan 1989 A
4830910 Larson May 1989 A
4848337 Shaw et al. Jul 1989 A
4851287 Hartsing, Jr. Jul 1989 A
4853278 Batzar Aug 1989 A
4864089 Tighe et al. Sep 1989 A
4873140 McIntyre Oct 1989 A
4876110 Blanch Oct 1989 A
4876423 Tighe et al. Oct 1989 A
4880951 Levinson Nov 1989 A
4895766 Saad Jan 1990 A
4900594 Quick et al. Feb 1990 A
4900710 Soukiassian et al. Feb 1990 A
4910086 Kawakami et al. Mar 1990 A
4923755 Witucki May 1990 A
4929691 Fillmore et al. May 1990 A
4929703 Narula et al. May 1990 A
4940635 Andrieu et al. Jul 1990 A
4943389 Weete et al. Jul 1990 A
4948603 Bernacchi et al. Aug 1990 A
4959516 Tighe et al. Sep 1990 A
4961996 Carre et al. Oct 1990 A
4983555 Roy et al. Jan 1991 A
4987157 Smart et al. Jan 1991 A
4992212 Corring et al. Feb 1991 A
5004034 Park et al. Apr 1991 A
5008121 Bernacchi et al. Apr 1991 A
5016401 Mangus May 1991 A
5021373 Mitchell et al. Jun 1991 A
5026620 Masaki et al. Jun 1991 A
5030218 Alexander Jul 1991 A
5037701 Carre et al. Aug 1991 A
5048688 Hicks, Jr. Sep 1991 A
5049437 Tannenbaum Sep 1991 A
5066767 Matzner et al. Nov 1991 A
5069937 Wall Dec 1991 A
5071695 Tannenbaum Dec 1991 A
5076952 Ahmed et al. Dec 1991 A
5078082 Van Dyk Soerewyn Jan 1992 A
5078791 Singh et al. Jan 1992 A
5079073 Tannenbaum Jan 1992 A
5079289 Layton et al. Jan 1992 A
5079397 Keefer Jan 1992 A
5089594 Stern et al. Feb 1992 A
5100402 Fan Mar 1992 A
5110681 Satake et al. May 1992 A
5122484 Beall et al. Jun 1992 A
5130510 Zeigler et al. Jul 1992 A
5137956 Trivett Aug 1992 A
5141800 Effenberger et al. Aug 1992 A
5143750 Yamagata et al. Sep 1992 A
5145898 Narula et al. Sep 1992 A
5147967 Stern et al. Sep 1992 A
5152809 Mattesky Oct 1992 A
5160791 Tannenbaum Nov 1992 A
5166000 Singh et al. Nov 1992 A
5168013 Tannenbaum Dec 1992 A
5168107 Tannenbaum Dec 1992 A
5169675 Bartoszek-Loza et al. Dec 1992 A
5176418 Niu Jan 1993 A
5177126 Moore et al. Jan 1993 A
5185184 Koran et al. Feb 1993 A
5197962 Sansom et al. Mar 1993 A
5204126 Singh et al. Apr 1993 A
5211991 Bullock May 1993 A
5216092 Huspeni et al. Jun 1993 A
5225274 Ogawa et al. Jul 1993 A
5230961 Tannenbaum Jul 1993 A
5232609 Badinier et al. Aug 1993 A
5234718 Mino et al. Aug 1993 A
5238045 Park et al. Aug 1993 A
5238746 Soga et al. Aug 1993 A
5238985 O'Lenick, Jr. Aug 1993 A
5240774 Ogawa et al. Aug 1993 A
5240775 Tannenbaum Aug 1993 A
5246782 Kennedy et al. Sep 1993 A
5246890 Aitken et al. Sep 1993 A
5250356 Batzar Oct 1993 A
5262241 Huggins Nov 1993 A
5270080 Mino et al. Dec 1993 A
5270269 Hares et al. Dec 1993 A
5273827 Francis Dec 1993 A
5312858 Folsom May 1994 A
5315083 Green May 1994 A
5320879 Bullock Jun 1994 A
5324566 Ogawa et al. Jun 1994 A
5338579 Ogawa et al. Aug 1994 A
5351608 Muchin et al. Oct 1994 A
5380320 Morris Jan 1995 A
5380557 Spiro Jan 1995 A
5382247 Cimino et al. Jan 1995 A
5385785 Lovell Jan 1995 A
5388732 Greger Feb 1995 A
5389767 Dobry Feb 1995 A
5391594 Romenesko et al. Feb 1995 A
5393568 Valente et al. Feb 1995 A
5396052 Petcavich et al. Mar 1995 A
5407598 Olson et al. Apr 1995 A
5411014 Paul May 1995 A
5411771 Tsai May 1995 A
5415626 Goodman et al. May 1995 A
5423247 Rodrigues-Ely Jun 1995 A
5435839 Ogawa Jul 1995 A
5440973 Welhouse Aug 1995 A
5441169 Petty Aug 1995 A
5460661 Maynard, Jr. Oct 1995 A
5462769 Tsai Oct 1995 A
5466486 Ogawa et al. Nov 1995 A
5468798 Leech Nov 1995 A
5471731 Welhouse Dec 1995 A
5473018 Namura et al. Dec 1995 A
5476552 Tucker et al. Dec 1995 A
5478651 Tannenbaum Dec 1995 A
5480930 Gentle et al. Jan 1996 A
5484467 Nass et al. Jan 1996 A
5486683 Shimizu et al. Jan 1996 A
5491116 Beall et al. Feb 1996 A
5492729 Tufty-Wisniewski et al. Feb 1996 A
5492769 Pryor et al. Feb 1996 A
5496270 Nettekoven Mar 1996 A
5496315 Weaver et al. Mar 1996 A
5499597 Kronberg Mar 1996 A
5518543 Pietrowski et al. May 1996 A
5519196 Xu May 1996 A
5531743 Nettekoven et al. Jul 1996 A
5532460 Okato et al. Jul 1996 A
5535904 Tucker Jul 1996 A
5544568 Potgieter Aug 1996 A
5545255 Ogawa Aug 1996 A
5545439 Deng et al. Aug 1996 A
5552112 Schiffmann et al. Sep 1996 A
5554415 Turchan et al. Sep 1996 A
5554681 Patel Sep 1996 A
5557927 Chiang et al. Sep 1996 A
5560978 Leech Oct 1996 A
5562659 Morris Oct 1996 A
5562991 Tannenbaum Oct 1996 A
5572846 Sosa Nov 1996 A
5575012 Fox et al. Nov 1996 A
5578136 Taylor et al. Nov 1996 A
5579725 Boshears Dec 1996 A
5588634 Nettekoven Dec 1996 A
D377524 Lipp Jan 1997 S
5591141 Nettekoven Jan 1997 A
5605660 Buongiorno et al. Feb 1997 A
5609431 Carroll Mar 1997 A
5620754 Turchan et al. Apr 1997 A
5626907 Hagiwara et al. May 1997 A
5628426 Doyle et al. May 1997 A
5632924 Gics et al. May 1997 A
5633090 Rodek et al. May 1997 A
5637641 Becker et al. Jun 1997 A
5643256 Urueta Jul 1997 A
5643485 Potter et al. Jul 1997 A
5645748 Schiffmann et al. Jul 1997 A
5662026 Prakasa Sep 1997 A
5667846 Thomas Sep 1997 A
5667891 Batzar et al. Sep 1997 A
5670010 Hagiwara et al. Sep 1997 A
5679273 Petetin Oct 1997 A
5686160 Yamada et al. Nov 1997 A
5691067 Patel Nov 1997 A
5691756 Rise et al. Nov 1997 A
5693050 Speiser Dec 1997 A
5693052 Weaver Dec 1997 A
5697926 Weaver Dec 1997 A
5702387 Arts et al. Dec 1997 A
5703030 Perkins et al. Dec 1997 A
5703034 Offshack et al. Dec 1997 A
5705464 Scheper et al. Jan 1998 A
5707688 Batzar et al. Jan 1998 A
5711995 Batzar Jan 1998 A
5713895 Lontine et al. Feb 1998 A
5718963 Batzar Feb 1998 A
5721053 Thomas Feb 1998 A
5723945 Schermerhorn Mar 1998 A
5726247 Michalczyk et al. Mar 1998 A
5728455 Batzar Mar 1998 A
5730922 Babb et al. Mar 1998 A
5731046 Mistry et al. Mar 1998 A
5752951 Yanik May 1998 A
5753313 Tsai May 1998 A
5766698 Singh et al. Jun 1998 A
5770640 Ogawa Jun 1998 A
5789083 Thomas Aug 1998 A
5792109 Ladd Aug 1998 A
5792544 Klein Aug 1998 A
5792570 Ishikawa et al. Aug 1998 A
5798326 Goldstein et al. Aug 1998 A
5804542 Scheper et al. Sep 1998 A
5814392 You et al. Sep 1998 A
D399561 Ellingson Oct 1998 S
5817419 Fryd et al. Oct 1998 A
5823204 Todd Oct 1998 A
5827573 Tsai Oct 1998 A
5830529 Ross Nov 1998 A
5832636 Lyden et al. Nov 1998 A
D402030 Roberts et al. Dec 1998 S
D402031 Roberts et al. Dec 1998 S
5843080 Fleenor et al. Dec 1998 A
5846237 Nettekoven Dec 1998 A
5849369 Ogawa Dec 1998 A
5849829 Buegman Dec 1998 A
5858941 Oakes et al. Jan 1999 A
5863608 Swisher et al. Jan 1999 A
5872168 Katoot Feb 1999 A
5880205 Tannenbaum Mar 1999 A
5885280 Nettekoven et al. Mar 1999 A
5885281 Urueta Mar 1999 A
5893849 Weaver Apr 1999 A
5900459 Selley et al. May 1999 A
5902301 Olig May 1999 A
5902781 Painter May 1999 A
5906871 Takebe et al. May 1999 A
5910459 Beall et al. Jun 1999 A
5913315 Todd Jun 1999 A
5916952 Romenesko et al. Jun 1999 A
5921173 Grycan et al. Jul 1999 A
5922271 Semar et al. Jul 1999 A
5922468 Huesmann et al. Jul 1999 A
5924592 Hieronymus Jul 1999 A
5925039 Landingham Jul 1999 A
5925043 Kumar et al. Jul 1999 A
5947808 Adams Sep 1999 A
5951494 Wang et al. Sep 1999 A
5955149 Kuziemka Sep 1999 A
5968881 Haeggberg et al. Oct 1999 A
5972494 Janssens Oct 1999 A
5988385 Stephens Nov 1999 A
5997517 Whitbourne Dec 1999 A
6001205 Mauro Dec 1999 A
6004317 Speiser Dec 1999 A
6004318 Garito et al. Dec 1999 A
6007735 Creed Dec 1999 A
6013331 Ogawa Jan 2000 A
6020294 Getty et al. Feb 2000 A
6030381 Jones et al. Feb 2000 A
6039735 Greep Mar 2000 A
6045592 Paquin Apr 2000 A
6053178 Todd Apr 2000 A
6053910 Fleenor Apr 2000 A
6060167 Morgan et al. May 2000 A
6063207 Yu et al. May 2000 A
6066137 Greep May 2000 A
6070444 Lontine et al. Jun 2000 A
6071283 Nardella et al. Jun 2000 A
6073635 Todd Jun 2000 A
6080496 Hupf et al. Jun 2000 A
6083221 Fleenor et al. Jul 2000 A
6090107 Borgmeier et al. Jul 2000 A
6092459 Zhang Jul 2000 A
6103361 Batzar et al. Aug 2000 A
6110532 Causton et al. Aug 2000 A
6114028 Muchin et al. Sep 2000 A
6115539 Cohn Sep 2000 A
6123999 Felix et al. Sep 2000 A
6124223 Beall et al. Sep 2000 A
6124575 Black Sep 2000 A
6132427 Jones et al. Oct 2000 A
6133359 Bate et al. Oct 2000 A
6143707 Trinh et al. Nov 2000 A
6146556 Katoot Nov 2000 A
6159412 Fletcher et al. Dec 2000 A
6171652 Singh et al. Jan 2001 B1
6173839 Dieter et al. Jan 2001 B1
6174309 Wrublewski et al. Jan 2001 B1
6177655 Toman Jan 2001 B1
6189722 Ason Feb 2001 B1
6197438 Faulkner Mar 2001 B1
6207631 Kasturi et al. Mar 2001 B1
6214000 Fleenor et al. Apr 2001 B1
6217656 Spiering et al. Apr 2001 B1
6220617 Hunger Apr 2001 B1
6221739 Gorelik Apr 2001 B1
6227955 Custer et al. May 2001 B1
6228753 Lo et al. May 2001 B1
6232372 Brothers et al. May 2001 B1
6238798 Kang et al. May 2001 B1
6244483 McLemore et al. Jun 2001 B1
6245431 Griswold et al. Jun 2001 B1
6245833 Kang et al. Jun 2001 B1
6248435 Leck Jun 2001 B1
6254699 Hermanek Jul 2001 B1
6257752 Browne Jul 2001 B1
6258201 Krech Jul 2001 B1
6258418 Rudder et al. Jul 2001 B1
6258758 Greer Jul 2001 B1
6261985 Hsu Jul 2001 B1
6267047 Mosher, II et al. Jul 2001 B1
6270831 Kumar et al. Aug 2001 B2
6270836 Holman Aug 2001 B1
6270903 Feng et al. Aug 2001 B1
6277811 Kasturi et al. Aug 2001 B1
6287632 Nishio et al. Sep 2001 B1
6291054 Thomas et al. Sep 2001 B1
6291084 Darolia et al. Sep 2001 B1
6297564 Chung Oct 2001 B1
6306176 Whitbourne Oct 2001 B1
6309583 Feldstein Oct 2001 B1
6312814 Kolouch Nov 2001 B1
6320169 Clothier Nov 2001 B1
6331328 Cheng Dec 2001 B1
6332490 Griggs Dec 2001 B1
6349632 Beck, Jr. Feb 2002 B1
6360423 Groll Mar 2002 B1
6360654 Cornfield Mar 2002 B1
6364130 Wright Apr 2002 B2
6371012 Sawyer Apr 2002 B2
6372708 Kasturi et al. Apr 2002 B1
6376450 Ghosh et al. Apr 2002 B1
6382454 Buffard et al. May 2002 B1
6398060 Apostolides Jun 2002 B1
6399924 Cai Jun 2002 B1
6402636 Chang Jun 2002 B1
6403164 Jonschker et al. Jun 2002 B1
6403213 Huesmann Jun 2002 B1
6409725 Khandkar et al. Jun 2002 B1
6427904 Groll Aug 2002 B1
6429161 Souchard et al. Aug 2002 B1
6444257 Kutt et al. Sep 2002 B1
6446814 King Sep 2002 B1
6454456 Browne Sep 2002 B2
6454764 Fleenor et al. Sep 2002 B1
6468642 Bray et al. Oct 2002 B1
6475253 Culler et al. Nov 2002 B2
6475939 Souchard et al. Nov 2002 B1
6479581 Ireland et al. Nov 2002 B1
6488971 Choy et al. Dec 2002 B1
6491195 McLemore et al. Dec 2002 B1
6491762 Bundy et al. Dec 2002 B1
6511479 Gentelia et al. Jan 2003 B2
6511931 Baldwin Jan 2003 B1
6515263 Mitra et al. Feb 2003 B2
6518337 Baker et al. Feb 2003 B1
6518349 Felix et al. Feb 2003 B1
6526876 Kahler et al. Mar 2003 B2
6528476 Bodet et al. Mar 2003 B1
6528768 Simic-Glavaski et al. Mar 2003 B1
6531557 Hosokawa et al. Mar 2003 B1
6536109 Berthelet et al. Mar 2003 B2
6544258 Fleenor et al. Apr 2003 B2
6544669 Groll Apr 2003 B2
6557732 Van Rompuy et al. May 2003 B2
6566289 Aronica et al. May 2003 B2
6573234 Sivik et al. Jun 2003 B1
6576038 Rao Jun 2003 B1
6582424 Fleenor et al. Jun 2003 B2
6596380 Buffard et al. Jul 2003 B1
6606988 Clark Aug 2003 B2
6607528 Quick et al. Aug 2003 B1
6607614 Richardson et al. Aug 2003 B1
6610386 Williams et al. Aug 2003 B2
6613860 Dams et al. Sep 2003 B1
6620463 Stay Sep 2003 B2
6626901 Treat et al. Sep 2003 B1
6630650 Bassill et al. Oct 2003 B2
6638600 Gazo et al. Oct 2003 B2
6648983 Cardola et al. Nov 2003 B1
6649891 Kitko et al. Nov 2003 B1
6656258 Elsbernd et al. Dec 2003 B2
6656897 Cardola et al. Dec 2003 B1
6670314 Smith et al. Dec 2003 B2
6677563 Lai Jan 2004 B2
6683036 Foley et al. Jan 2004 B2
6685704 Greep Feb 2004 B2
6693071 Ghosh et al. Feb 2004 B2
6712497 Jersey et al. Mar 2004 B2
6715631 Kim Apr 2004 B2
6723692 Foley et al. Apr 2004 B2
6725505 Willat Apr 2004 B2
6729479 Morgan May 2004 B2
6733697 Rhodes et al. May 2004 B2
6737164 Araki et al. May 2004 B2
6737489 Linert et al. May 2004 B2
6740628 Bennie et al. May 2004 B2
6749081 Cheng Jun 2004 B2
6750187 Alam et al. Jun 2004 B2
6752303 McLemore et al. Jun 2004 B2
6758914 Kool et al. Jul 2004 B2
6761645 Weber Jul 2004 B1
6761964 Tannenbaum Jul 2004 B2
6770287 Sun et al. Aug 2004 B1
6780227 DuBose et al. Aug 2004 B2
6783525 Greep et al. Aug 2004 B2
6787515 Foley et al. Sep 2004 B2
6793093 Tsai Sep 2004 B2
6794550 Hintzer et al. Sep 2004 B2
6797223 Beale et al. Sep 2004 B2
6808806 Phillips et al. Oct 2004 B2
6818299 Phillips et al. Nov 2004 B2
6820541 Siegel et al. Nov 2004 B2
6821940 Bullock et al. Nov 2004 B2
6822059 Buckanin et al. Nov 2004 B2
6828527 Simic-Glavaski et al. Dec 2004 B2
6830221 Janson et al. Dec 2004 B1
6831027 Gazo Dec 2004 B2
6831053 Ghosh et al. Dec 2004 B1
6833328 Kool et al. Dec 2004 B1
6833418 Tan et al. Dec 2004 B2
6838166 Phillips et al. Jan 2005 B2
6841594 Jones et al. Jan 2005 B2
6846570 Leech et al. Jan 2005 B2
6846760 Siebers et al. Jan 2005 B2
6863738 Kool et al. Mar 2005 B2
6863974 Shah et al. Mar 2005 B2
6864314 Yeung et al. Mar 2005 B1
6884459 Caballero et al. Apr 2005 B2
6885306 Holzman et al. Apr 2005 B2
6887578 Gleason et al. May 2005 B2
6893724 Lin et al. May 2005 B2
6896934 Aronica et al. May 2005 B2
6899923 Kimbrell, Jr. et al. May 2005 B2
6901687 Krings et al. Jun 2005 B2
6905722 Liu Jun 2005 B2
6906295 Ge Jun 2005 B2
6911512 Jing et al. Jun 2005 B2
6913255 Porchia et al. Jul 2005 B2
6914223 Krause et al. Jul 2005 B2
6919012 Bucar Jul 2005 B1
6919422 Gallucci et al. Jul 2005 B2
6920820 Meggison et al. Jul 2005 B2
6921546 Albach Jul 2005 B2
6921787 Bate Jul 2005 B2
6933053 Alger Aug 2005 B2
6942935 Ge Sep 2005 B2
6949178 Tennakoon et al. Sep 2005 B2
6949721 Simic-Glavaski et al. Sep 2005 B2
6951559 Greep Oct 2005 B1
6952530 Helvajian et al. Oct 2005 B2
6956016 Speed et al. Oct 2005 B2
6956078 Cavanaugh et al. Oct 2005 B2
6979667 Kaiser et al. Dec 2005 B1
6998375 Kapur et al. Feb 2006 B2
7005396 Espargilliere et al. Feb 2006 B2
7007808 Morgan Mar 2006 B2
7008553 Wustman et al. Mar 2006 B2
7018727 Dzick Mar 2006 B2
7024147 Sugawara et al. Apr 2006 B2
7026036 Leech et al. Apr 2006 B2
7037550 Liu et al. May 2006 B2
7041728 Zipplies et al. May 2006 B2
7041773 Gallucci et al. May 2006 B2
7045571 Tan et al. May 2006 B2
7083613 Treat Aug 2006 B2
7083856 Rajagopalan et al. Aug 2006 B2
7093340 Groll Aug 2006 B2
7104409 Morgan Sep 2006 B2
7112764 Garcia Sep 2006 B2
7119155 Chow et al. Oct 2006 B2
7121413 Morgan Oct 2006 B2
7125828 Catlin et al. Oct 2006 B2
7126755 Moon et al. Oct 2006 B2
7129310 Greene et al. Oct 2006 B2
7132377 Borgonjon et al. Nov 2006 B2
7135122 Park Nov 2006 B2
7147634 Nesbitt Dec 2006 B2
7160297 Nesbitt Jan 2007 B2
7168148 Groll Jan 2007 B2
7169472 Raksha et al. Jan 2007 B2
7176158 Chow et al. Feb 2007 B2
7217907 El-Raghy et al. May 2007 B2
7229600 Yadav Jun 2007 B2
7246406 Yarbrough et al. Jul 2007 B2
7250009 Weber Jul 2007 B2
7251944 Holtzapple et al. Aug 2007 B2
7258747 Vago et al. Aug 2007 B2
7271209 Li et al. Sep 2007 B2
7288091 Nesbitt Oct 2007 B2
7309412 Minevski et al. Dec 2007 B2
7312300 Mitchell Dec 2007 B2
7319083 Jin et al. Jan 2008 B2
7337518 Cheng Mar 2008 B2
7342066 Dadalas et al. Mar 2008 B2
7342081 Chandler et al. Mar 2008 B2
7354979 Brant et al. Apr 2008 B2
7365860 Price Apr 2008 B2
7380288 Duncan Jun 2008 B1
7390326 Nesbitt Jun 2008 B2
7393924 Vitaliano et al. Jul 2008 B2
7412922 McLemore Aug 2008 B2
7413684 Fishburn et al. Aug 2008 B2
7416619 Lei Aug 2008 B2
7435774 Williams et al. Oct 2008 B2
7449507 Fishburn Nov 2008 B2
7468333 Kimbrell, Jr. et al. Dec 2008 B2
7469703 France et al. Dec 2008 B2
7479327 Domine Jan 2009 B2
7488511 Caballero et al. Feb 2009 B2
7488515 Groll Feb 2009 B2
7531594 Lin et al. May 2009 B2
7541102 Klippe et al. Jun 2009 B2
7544420 Domine et al. Jun 2009 B2
7563517 Raffy et al. Jul 2009 B2
7569132 Dolan Aug 2009 B2
7578921 Dolan Aug 2009 B2
7578950 Kirchner et al. Aug 2009 B2
7594594 Troost et al. Sep 2009 B2
7622523 Li et al. Nov 2009 B2
7629400 Hyman Dec 2009 B2
7629416 Li et al. Dec 2009 B2
7635522 Cnossen et al. Dec 2009 B2
7652115 Dams et al. Jan 2010 B2
7661387 Poullos Feb 2010 B2
7678465 Sambasivan et al. Mar 2010 B2
7718212 Nesbitt May 2010 B2
7733008 Ke et al. Jun 2010 B2
7737200 Jabar, Jr. et al. Jun 2010 B2
7765919 Siegel et al. Aug 2010 B2
7784638 Kishbaugh et al. Aug 2010 B2
20010021848 Fleenor et al. Sep 2001 A1
20010031964 Gentelia et al. Oct 2001 A1
20010033083 Kaposi Oct 2001 A1
20010041665 Severns et al. Nov 2001 A1
20010044019 Huesmann Nov 2001 A1
20010047968 Wright Dec 2001 A1
20020003749 Browne Jan 2002 A1
20020009541 Clayton Jan 2002 A1
20020037817 Foley et al. Mar 2002 A1
20020037822 Foley et al. Mar 2002 A1
20020068014 Haught et al. Jun 2002 A1
20020093210 Sassone et al. Jul 2002 A1
20020100493 Kool et al. Aug 2002 A1
20020111622 Khandkar et al. Aug 2002 A1
20020113066 Stark et al. Aug 2002 A1
20020137648 Sharma et al. Sep 2002 A1
20020142931 DeNome et al. Oct 2002 A1
20020151398 Campbell Oct 2002 A1
20020160194 Phillips et al. Oct 2002 A1
20020160930 Emmerson et al. Oct 2002 A1
20020163285 Vanlandingham Nov 2002 A1
20020169090 Foley et al. Nov 2002 A1
20020182449 Neal et al. Dec 2002 A1
20030008944 Jones et al. Jan 2003 A1
20030045437 Ward Mar 2003 A1
20030049485 Brupbacher et al. Mar 2003 A1
20030064874 Eckmann et al. Apr 2003 A1
20030096457 Gottschalk et al. May 2003 A1
20030109864 Greep et al. Jun 2003 A1
20030109865 Greep Jun 2003 A1
20030119689 Hutton et al. Jun 2003 A1
20030121421 Wey Jul 2003 A1
20030121921 Burton et al. Jul 2003 A1
20030125421 Bladel et al. Jul 2003 A1
20030126996 Cheng Jul 2003 A1
20030138661 Souchard et al. Jul 2003 A1
20030163125 Greep Aug 2003 A1
20030168416 Morgan Sep 2003 A1
20030169801 Chilton Sep 2003 A1
20030184101 Nelson Oct 2003 A1
20030211618 Patel Nov 2003 A1
20030226882 Porchia et al. Dec 2003 A1
20040011245 Sambasivan et al. Jan 2004 A1
20040011350 Dowst et al. Jan 2004 A1
20040011795 Porchia et al. Jan 2004 A1
20040018932 Yuriditsky et al. Jan 2004 A1
20040036061 Rhodes et al. Feb 2004 A1
20040040160 Cohen et al. Mar 2004 A1
20040051208 Creekmore Mar 2004 A1
20040063601 Denome et al. Apr 2004 A1
20040067861 Denome et al. Apr 2004 A1
20040071987 Bate Apr 2004 A1
20040076846 Domine et al. Apr 2004 A1
20040079755 Graus Apr 2004 A1
20040110443 Pelham, Sr. Jun 2004 A1
20040115477 Nesbitt Jun 2004 A1
20040116792 Nesbitt Jun 2004 A1
20040118837 Samuels et al. Jun 2004 A1
20040137818 Kimbrell, Jr. et al. Jul 2004 A1
20040138083 Kimbrell, Jr. et al. Jul 2004 A1
20040143052 Epsch et al. Jul 2004 A1
20040144065 Smith et al. Jul 2004 A1
20040147425 Castro et al. Jul 2004 A1
20040149142 Groll Aug 2004 A1
20040149311 Foley et al. Aug 2004 A1
20040152591 Jin et al. Aug 2004 A1
20040161623 Domine et al. Aug 2004 A1
20040169013 Kool et al. Sep 2004 A1
20040226850 Behnke et al. Nov 2004 A1
20040229079 Groll Nov 2004 A1
20040253387 Cavero Dec 2004 A1
20040255792 Parker Dec 2004 A1
20040259749 Braeckman et al. Dec 2004 A1
20050025900 Cavero Feb 2005 A1
20050035086 Chen et al. Feb 2005 A1
20050065294 Cramer Mar 2005 A1
20050066996 France et al. Mar 2005 A1
20050070659 Shiow-Ling et al. Mar 2005 A1
20050076795 Riddle Apr 2005 A1
20050107282 Ford et al. May 2005 A1
20050133522 Son Jun 2005 A1
20050160543 Catalfamo et al. Jul 2005 A1
20050167435 Whitmer Aug 2005 A1
20050175786 Singh et al. Aug 2005 A1
20050181195 Dubrow Aug 2005 A1
20050191432 Hofmans Sep 2005 A1
20050192397 Dadalas et al. Sep 2005 A1
20050193901 Buehler Sep 2005 A1
20050199133 Narula et al. Sep 2005 A1
20050211105 Hanson Sep 2005 A1
20050217496 Dodgen Oct 2005 A1
20050218004 Charles Oct 2005 A1
20050228491 Snyder et al. Oct 2005 A1
20050241089 Brunner et al. Nov 2005 A1
20050242090 Cantu Nov 2005 A1
20050249886 Ge Nov 2005 A1
20060008643 Lin et al. Jan 2006 A1
20060014876 Bushelman et al. Jan 2006 A1
20060081235 Lundh et al. Apr 2006 A1
20060081236 Johnston et al. Apr 2006 A1
20060081639 Lazaroff et al. Apr 2006 A1
20060127699 Moelle et al. Jun 2006 A1
20060135341 Ellison et al. Jun 2006 A1
20060179594 Yeung Aug 2006 A1
20060201497 Lee Sep 2006 A1
20060207289 Hale Sep 2006 A1
20060216395 Franklin Sep 2006 A1
20060225725 Rinaldo Oct 2006 A1
20060246149 Buchholz Nov 2006 A1
20060281653 Hutton Dec 2006 A1
20070003712 Domine Jan 2007 A1
20070054139 Domine Mar 2007 A1
20070093811 Nesbitt Apr 2007 A1
20070107821 Ness May 2007 A1
20070219333 Shimono et al. Sep 2007 A1
20070267958 Kitazawa et al. Nov 2007 A1
20070292477 Kumar Dec 2007 A1
20070292706 Spring et al. Dec 2007 A1
20080237241 Buffard et al. Oct 2008 A1
20100215834 Nesbitt Aug 2010 A1
Foreign Referenced Citations (220)
Number Date Country
0003760 Sep 1979 EP
0010868 May 1980 EP
0015720 Sep 1980 EP
0022256 Jan 1981 EP
0064348 Nov 1982 EP
0064374 Nov 1982 EP
0068695 Jan 1983 EP
0084771 Aug 1983 EP
0132078 Jan 1985 EP
0166243 Jan 1986 EP
0188065 Jul 1986 EP
0190926 Aug 1986 EP
0195229 Sep 1986 EP
0201268 Nov 1986 EP
0232441 Aug 1987 EP
0236517 Sep 1987 EP
0318204 May 1989 EP
0325779 Aug 1989 EP
0386379 Sep 1990 EP
0386380 Sep 1990 EP
0390994 Oct 1990 EP
0395186 Oct 1990 EP
0424072 Apr 1991 EP
0429222 May 1991 EP
0444821 Sep 1991 EP
0 479 482 Apr 1992 EP
0484001 May 1992 EP
0484746 May 1992 EP
0500361 Aug 1992 EP
0565743 Oct 1993 EP
0577951 Jan 1994 EP
0594374 Apr 1994 EP
0607934 Jul 1994 EP
0629673 Dec 1994 EP
0659853 Jun 1995 EP
0681013 Nov 1995 EP
0692316 Jan 1996 EP
0707031 Apr 1996 EP
0719593 Jul 1996 EP
0 761 174 Mar 1997 EP
0 779 060 Jun 1997 EP
0801899 Oct 1997 EP
0826748 Mar 1998 EP
0867490 Sep 1998 EP
0928587 Jul 1999 EP
0928588 Jul 1999 EP
0928837 Jul 1999 EP
0936001 Aug 1999 EP
0966910 Dec 1999 EP
1001013 May 2000 EP
1006177 Jun 2000 EP
1031385 Aug 2000 EP
1083195 Mar 2001 EP
1084822 Mar 2001 EP
1123904 Aug 2001 EP
1132147 Sep 2001 EP
1197268 Apr 2002 EP
1221469 Jul 2002 EP
1224983 Jul 2002 EP
1245668 Oct 2002 EP
1253118 Oct 2002 EP
1331207 Jul 2003 EP
1334779 Aug 2003 EP
1398367 Mar 2004 EP
1452242 Sep 2004 EP
1464631 Oct 2004 EP
1479756 Nov 2004 EP
1493803 Jan 2005 EP
1518883 Mar 2005 EP
1518922 Mar 2005 EP
WO1981000972 Apr 1981 WO
WO1981001409 May 1981 WO
WO1985003243 Aug 1985 WO
WO1987006927 Nov 1987 WO
WO1988004529 Jun 1988 WO
WO1989009246 Oct 1989 WO
WO1990002774 Mar 1990 WO
WO1990003992 Apr 1990 WO
WO1990004001 Apr 1990 WO
WO1990008651 Aug 1990 WO
WO1991002773 Mar 1991 WO
WO1991003326 Mar 1991 WO
WO1991015610 Oct 1991 WO
WO1992003357 Mar 1992 WO
WO1992003358 Mar 1992 WO
WO1992010309 Jun 1992 WO
WO1992010549 Jun 1992 WO
WO1992020634 Nov 1992 WO
WO1993003919 Mar 1993 WO
WO1993007224 Apr 1993 WO
WO1994014904 Jul 1994 WO
WO1994026422 Nov 1994 WO
WO1995005748 Mar 1995 WO
WO1995011794 May 1995 WO
WO1995020253 Jul 1995 WO
WO1995021216 Aug 1995 WO
WO1995031584 Nov 1995 WO
WO1996002144 Feb 1996 WO
WO1996009362 Mar 1996 WO
WO1996013556 May 1996 WO
WO1996016526 May 1996 WO
WO1996023860 Aug 1996 WO
WO1996026671 Sep 1996 WO
WO1996037529 Nov 1996 WO
WO1997001599 Jan 1997 WO
WO1997003140 Jan 1997 WO
WO1997003141 Jan 1997 WO
WO1997006208 Feb 1997 WO
WO1997010289 Mar 1997 WO
WO1997013600 Apr 1997 WO
WO1997024469 Jul 1997 WO
WO1997039073 Oct 1997 WO
WO1998011159 Mar 1998 WO
WO 9818396 May 1998 WO
WO1998031197 Jul 1998 WO
WO1998038935 Sep 1998 WO
WO1999004665 Feb 1999 WO
WO1999012392 Mar 1999 WO
WO1999015019 Apr 1999 WO
WO1999018030 Apr 1999 WO
WO1999020723 Apr 1999 WO
WO1999020727 Apr 1999 WO
WO1999020807 Apr 1999 WO
WO1999027053 Jun 1999 WO
WO1999027054 Jun 1999 WO
WO1999027057 Jun 1999 WO
WO1999027058 Jun 1999 WO
WO1999029477 Jun 1999 WO
WO1999032234 Jul 1999 WO
WO1999037477 Jul 1999 WO
WO1999038642 Aug 1999 WO
WO1999051134 Oct 1999 WO
WO1999053251 Oct 1999 WO
WO1999055766 Nov 1999 WO
WO1999057205 Nov 1999 WO
WO1999061184 Dec 1999 WO
WO1999063972 Dec 1999 WO
WO2000006674 Feb 2000 WO
WO2000015180 Mar 2000 WO
WO2000016672 Mar 2000 WO
WO2000029538 May 2000 WO
WO2000041522 Jul 2000 WO
WO2000043324 Jul 2000 WO
WO2000047402 Aug 2000 WO
WO2000050545 Aug 2000 WO
WO2000050552 Aug 2000 WO
WO2000055288 Sep 2000 WO
WO2000056537 Sep 2000 WO
WO2000058389 Oct 2000 WO
WO2000069984 Nov 2000 WO
WO2000071651 Nov 2000 WO
WO2000073706 Dec 2000 WO
WO2001012090 Feb 2001 WO
WO2001018102 Mar 2001 WO
WO2001023274 Apr 2001 WO
WO2001023516 Apr 2001 WO
WO2001051096 Jul 2001 WO
WO2001060157 Aug 2001 WO
WO2001073431 Oct 2001 WO
WO2001079332 Oct 2001 WO
WO2001085827 Nov 2001 WO
WO2001086210 Nov 2001 WO
WO2001086289 Nov 2001 WO
WO2001089820 Nov 2001 WO
WO2001094477 Dec 2001 WO
WO2002002722 Jan 2002 WO
WO2002006436 Jan 2002 WO
WO2002006438 Jan 2002 WO
WO2002008370 Jan 2002 WO
WO2002008371 Jan 2002 WO
WO2002008373 Jan 2002 WO
WO2002014065 Feb 2002 WO
WO2002033038 Apr 2002 WO
WO2002040628 May 2002 WO
WO2002042408 May 2002 WO
WO2002072653 Sep 2002 WO
WO2002078862 Oct 2002 WO
WO2002078953 Oct 2002 WO
WO2002092747 Nov 2002 WO
WO2002096761 Dec 2002 WO
WO2003008528 Jan 2003 WO
WO2003011102 Feb 2003 WO
WO2003015588 Feb 2003 WO
WO2003018734 Mar 2003 WO
WO2003027218 Apr 2003 WO
WO2003038143 May 2003 WO
WO2003043480 May 2003 WO
WO2003043482 May 2003 WO
WO2003044834 May 2003 WO
WO2003051988 Jun 2003 WO
WO2003059992 Jul 2003 WO
WO2003062291 Jul 2003 WO
WO2003070828 Aug 2003 WO
WO2003090003 Oct 2003 WO
WO2003096863 Nov 2003 WO
WO2003096866 Nov 2003 WO
WO2003099096 Dec 2003 WO
WO2004000082 Dec 2003 WO
WO2004005394 Jan 2004 WO
WO2004009691 Jan 2004 WO
WO2004014139 Feb 2004 WO
WO2004018607 Mar 2004 WO
WO2004018611 Mar 2004 WO
WO2004022669 Mar 2004 WO
WO2004024025 Mar 2004 WO
WO2004024348 Mar 2004 WO
WO2004026921 Apr 2004 WO
WO2004033301 Apr 2004 WO
WO2004045783 Jun 2004 WO
WO2004046301 Jun 2004 WO
WO2004046302 Jun 2004 WO
WO2004063241 Jul 2004 WO
WO2004064572 Aug 2004 WO
WO2004067588 Aug 2004 WO
WO2004082445 Sep 2004 WO
WO2004092283 Oct 2004 WO
WO2004092450 Oct 2004 WO
WO2004093622 Nov 2004 WO
WO2004108816 Dec 2004 WO
WO2004108842 Dec 2004 WO
Non-Patent Literature Citations (10)
Entry
Appellant's Appeal Brief from U.S. Appl. No. 11/330,499, filed Jul. 6, 2010.
Examiner's Answer from U.S. Appl. No. 11/330,499 dated Jul. 29, 2010.
Appellant's Reply Brief from U.S. Appl. No. 11/330,499, filed Aug. 20, 2010.
Decision on Appeal for U.S. Appl. No. 11/330,499 dated Apr. 26, 2012.
Feb. 23, 2010 Final Office Action for U.S. Appl. No. 11/330,499.
Oct. 5, 2009 Office Action for U.S. Appl. No. 11/330,499.
“Basics of Design Engineering” published by Penton Media, Inc. in 1999.
“Chemlon Black P2297 Material Safety Data Sheet” written by Akzo Nobel, printed on Apr. 20, 2005.
“The Remarkable Fluoropolymer Coating That Lasts 100 Times Longer Than Other Coatings” by Whitford Corporation, published prior to 2002.
“Utah Medical Products Inc. Specialized Dissection Electrodes” from http://www.utahmed.com/dissect.htm, 2000-2002, printed on Jun. 18, 2003.
Related Publications (1)
Number Date Country
20200054384 A1 Feb 2020 US
Continuations (3)
Number Date Country
Parent 15486012 Apr 2017 US
Child 16598760 US
Parent 14444603 Jul 2014 US
Child 15486012 US
Parent 11330499 Jan 2006 US
Child 14444603 US
Continuation in Parts (1)
Number Date Country
Parent 11127545 May 2005 US
Child 11330499 US