1. Technical Field
The present disclosure relates to an electrosurgical return pad, and more particularly, the present disclosure relates to an electrosurgical return pad with contact quality monitoring for use during electrosurgery.
2. Background of Related Art
Electrosurgery is the application of electricity and/or electromagnetic waves to cut or modify biological tissue during a surgical procedure. Generally, electrosurgery utilizes an electrosurgical generator, a return electrode, and a source electrode. The electrosurgical generator produces an electromagnetic wave, typically above 100 kilohertz, between the return and source electrodes when applied to tissue. The electromagnetic wave created therebetween dissipates energy as heat as it travels from one electrode to the other. Electromagnetic frequencies above 100 kilohertz are employed to avoid muscle and/or nerve stimulation.
During electrosurgery, current generated by the electrosurgical generator is conducted through patient tissue between the two electrodes. The current causes the tissue to heat up as the electromagnetic waves overcome the tissue impedance. Although, many other variables affect the total heating of the tissue, usually with more current density, increased heating results. Current can be used for cutting, dissection, ablation, arresting blood loss and coagulation, and are well-known.
The two basic types of electrosurgery employed are monopolar and bipolar electrosurgery. Both types use an “active” and a “return” electrode, although the distinction is not always necessary. In bipolar electrosurgery, the surgical instrument has an active electrode and a return electrode on the same instrument or in very close proximity, usually causing current to flow through a smaller amount of tissue. In monopolar electrosurgery, the return electrode is located elsewhere on the patient's body and is usually not part of the surgical instrument itself. In monopolar electrosurgery, the return electrode is part of a device referred herein as a return pad.
The return pad is intended to lower the current density in nearby tissue when current flows between the return pad and the patient's tissue. The current density through the tissue near the return pad is related to the impedance between the tissue and the return pad. This impedance is referred to herein as contact impedance. When the surface area of the return electrode contacting the skin is reduced, increases in current density may heat tissue up to the point of possibly causing skin damage. Maintaining low contact impedance helps prevent electrosurgery related injuries.
Generally, resistive electrodes tend to have more uneven heating than capacitive electrodes. Because electricity tends to conduct through the path of least resistance, more current tends to conduct through the tissue near the edge of a resistive electrode that is closest to the active electrode, creating more localized heat. This is known as the “edge effect”. Although, capacitive electrodes tend to have more uniform heating than resistive electrodes, measuring contact quality has been more difficult.
The present disclosure relates to an electrosurgical return pad, and more particularly, the present disclosure relates to an electrosurgical return pad with contact quality monitoring for use during electrosurgery.
In one embodiment, the return pad includes a backing, at least one return electrode, and at least one ring sensor. The backing has a top side, a bottom side, and a periphery. The return electrode is disposed on the bottom side of the backing layer and is adapted to connect to a current generator. The return electrode may be capacitive or resistive; and the ring sensor may be capacitive or resistive. The ring sensor may be disposed in substantial concentric registration with the periphery of the backing. Additionally or alternatively, the ring sensor may be disposed in substantial vertical registry with the bottom side of the backing layer. The ring sensor may also be configured to connect to a measuring component. The measuring component is operable to approximate contact quality of the return electrode during electrosurgical application and may be configured to communicate with the generator.
In another embodiment, the ring sensor may include two partially concentric ring electrodes configured to cooperate with the measuring component. The ring sensor can measure contact quality during an electro surgical procedure and communicate contact quality to the generator. The two ring electrodes may be disposed in substantial vertical registry with the return electrode.
In yet another embodiment, a patient interface material may be disposed between the backing layer of the return pad and skin. The patient interface material may also be configured to facilitate contact quality monitoring of the return electrode. The interface material may include a conductive gel, a conductive adhesive, an insulating gel, an insulating adhesive, a dielectric gel, a dielectric adhesive, an insulator, and/or some combination thereof. The ring sensor may include a temperature sensitive material that may be configured to sense contact quality based upon temperature, e.g., a positive temperature coefficient ink.
In another embodiment a control component of the generator may be utilized; and the measuring component may be configured to receive and process sensor data and relay the sensor data to the control component. The return electrode may be configured to electrically isolate the return electrode from the generator when the measurement component determines that a threshold condition has been reached. Additionally or alternatively, the return pad may include an intelligence component that may be configured to process sensor data and analyze the data with a risk function algorithm.
In yet another embodiment, a method for monitoring contact quality of a return pad described above is disclosed. The method includes the steps of: providing a return pad; activating at least one ring sensor of the return pad to operatively communicate with a measuring component; and approximating the contact quality of the return electrode by analyzing capacitance, impedance and/or resistance from the at least one ring sensor. The methodology may further include the step of electrically isolating the return electrode of the return pad from a generator when the measuring component determines that a threshold condition has been reached.
In another embodiment, an electrosurgical system for measuring contact quality of a return pad is discussed. The system includes a return pad, a return interface and a sensing interface. The return pad includes a backing layer, a first capacitive electrode and a second capacitive electrode. The first and second electrodes may be disposed on the backing layer. The return interface may be adapted to return current for the first and second capacitive electrodes. The sensing interface may be operatively coupled to a generator and configured to monitor the impedance between the first and second capacitive electrodes to determine contact quality. Additionally or alternatively, the sensing interface is operatively coupled to a generator and is configured to monitor a return current difference between the first and second capacitive electrodes to determine contact quality.
Various embodiments of the subject instrument are described herein with reference to the drawings wherein:
The embodiments that follow are described with reference to the attached drawings. Like reference numerals are used to refer to like elements, steps or features but are not intended to indicate identical features. The word “component” is used herein to refer to an entity that relates to and/or utilizes hardware, software, circuitry, transducers, a microprocessor, a microcontroller, software in execution, or some combination thereof. The term “impedance” is not intended to limit, but rather is to describe the natural phenomenon of a material's opposition to a wave as the wave propagates through the material, where the type of waves included are electromagnetic waves, electrical waves, electricity waves, RF waves, AM-frequency waves, FM-frequency waves, microwave waves, or any other wave of oscillating electrical charge or magnetic field. In addition, the term “current” is used herein to describe the flow of electrical charge.
Turning to
Referring initially to
The backing 102 may be made of cloth, cardboard or any other material to facilitate return pad operation. The return electrode 104 may be made from materials that include aluminum, copper, mylar, metalized mylar or other suitable conductive material. Electrode 104 may also include an insulator, glue, adhesive, gel or other material that is configured to attach the return electrode 104 to tissue. Return electrode 104 may additionally include a dielectric, insulator or other material positioned between a conductor and tissue to enhance capacitive properties of the return electrode as explained in more detail below.
As mentioned above, ring electrodes 106 and 108 form ring sensor 110 (
One example of use of a return pad 100 according to the present disclosure includes a return electrode 104 in a capacitive configuration with ring sensor 110 in a resistive configuration. In this example, RF energy can return through 104 while concurrently having an oscillating current between ring electrode 106 and ring electrode 108 to produce a current through contacting tissue approximately below return electrode 104. If the center portion of return pad 100 starts tenting (i.e., starts peeling away from the skin), the impedance measurement from ring electrode 106 and ring electrode 108 may increase. If a rise in impedance is significant enough, generator 516 (see
Turning now to the more detailed depiction of a return pad 100 in use,
Current arrows 122 depict current traveling through the skin barrier 114 and interface material 118. Current arrows 124 depict current traveling through the skin barrier 114 and interface material 120; and current arrows 126 depict current traveling through the skin barrier 114 and interface material 116. Current arrows 128 and 130 depict current traveling between ring electrodes 106, 108 and interface materials 120, 116, respectively. Current arrows 132, 134 depict current traveling between interface materials 120, 116, and 118 and current arrows 136 depict current which may travel between return electrode 104 and interface material 118.
Interface materials 118, 120, or 116 may be conductive, insulating, dielectric, or can have any other electrical property. Additionally or alternatively, interface material 118, 120, or 116 may provide adhesion or temperature dependent properties. In another embodiment, there may be electrical insulation (including air) between interface material 118 and 116 and/or between interface material 118 and 120 (not shown in this configuration). Adding insulation and/or an air gap between interface materials 118 and 116, and/or between interface materials 118 and 120 to reduced current arrows 134 and 132, respectively, may increase the sensitivity of ring sensor 110.
A measuring component 706 (
One way to effectively approximate impedance is to assume that impedance Z0 is defined as the impedance from ring electrode 106, through interface material 120, through interface material 118, through interface material 116 and to ring electrode 108. Also, assume that impedance Z1 is defined as the impedance from interface material 120 through skin 114 and then through interface material 116. In this case, the total impedance, Ztotal measured by ring sensor 110 is approximately the impedance of Z0 in parallel with Z1. Thus, the relationship is described as Ztotal≈Z0∥Z1. Any change of contact impedance from interface material 120 and skin 114 or interface material 116 and skin 114 would thus have an impact of Ztotal and is measurable. By utilizing various conductive and insulating materials, it is possible to keep impedances approximately constant (in this example, Z0) so that the impedance being measured (in this example Z1) can be more accurately ascertained.
Measuring component 706 (see
As shown in
Turning now to another ring sensor 110 configuration of the present disclosure,
Electrical current is depicted in
A measuring component 706 (see
Although return pad 200 is depicted as having a connector region 214 near ring return region 218, the connector region 214 may not be located on the same portion or near each other on return pad 200, i.e., the ring sensor signal may exit from any location on or near return pad 200. Additionally or alternatively, the return signal may exit return pad 200 from any location as well depending on a particular pad 200 configuration. Break point 216 may also be located at any position on return pad 200.
Ring electrode 106 and ring electrode 108 are disposed in substantial concentric registration with the periphery of backing 102. Electrode 104 is disposed relative to ring electrode 106 and 108 in a generally concentric fashion, which is configured to facilitate peel detection. The impedance measurement taken from ring sensor 110 is primarily a function of contact impedance between ring electrode 106 and ring electrode 108. Any edge peeling would affect the measured impedance thus allowing measuring component 706 (see
Return pad 300 is shown as contacting skin barrier 114 and illustrates the effects that an edge peel would have on an impedance measurement in this configuration. To measure impedance, a DC or AC signal may be applied across ring electrode 108 and ring electrode 106 to produce a current. An analysis of the current 320 and/or 322 can be the basis for monitoring contact quality. For example, if interface material 314 partially peeled away from skin 114, then the impedance across the 314 interface material/skin barrier 114 would increase and a larger voltage would be necessary to maintain the previous current levels of current 320 and/or current 322. This increase in voltage would correspond to an increase in contact impedance, which would be recognized by the electrosurgical unit 702.
In contrast to
To avoid an electrical contact between return electrode 104, and ring electrodes 106 and 108, an electrical insulator (not shown) may be positioned therebetween to avoid any unwanted electrical connections. Any suitable insulator may be used.
Although
A small arrow representing current is shown as current arrows 514. Although not all current is shown, the region between the outer edge of return electrode 104 and ring sensor 508 can have current flowing therebetween when contacting tissue. Measuring the impedance between return electrode 104 and ring sensor 508 can be accomplished with a control circuit by utilizing a common reference, e.g., a ground. One example of a control circuit is shown in 5B.
By changing the behavior of current traveling between return electrode 104 and ring sensor 508 impedance can be measured that relates predominately to the contact impedance of return electrode 104 and ring sensor 508. Any reduction in skin contact of the edges around or near return electrode 504 would result in an increase of measured impedance.
As mentioned above,
In use, if return pad 500 started to peel off of a patient, the contact impedance of ring electrode 506 would increase also increasing the contact impedance of ring sensor 508; thus, measuring component 522 would measure an increase in impedance of secondary body impedance 526 because that includes the contact impedance of ring sensor 508. Since impedance measured by measuring component 522 is the addition of the impedances of ring sensor 508, secondary body impedance 526, and return electrode 504, measuring component 522 will sense any change in secondary body impedance 526 which includes the contact impedances of return electrode 504 and ring sensor 508. E.g., if return electrode 504 starts “tenting”, measuring component 522 will also detect a rise in contact impedance of ring sensor 508 as a rise in secondary body impedance 526 and communicate with the generator to compensate for the abnormality.
Measuring component 522 measures contact quality by measuring impedance. For example, measuring component 522 may utilize ring sensor 110 (see
References 614 and 612 may be electrically isolated and/or an AC power source (not shown) may also be electrically isolated from both references 614 and 612, e.g. by a transformer. Surgical instrument 616 is connected to the control component 610 by a waveguide 618. A measuring current is produced by measuring component 522.
During use, return pad 602 is placed onto an area of skin utilizing an adhesive and/or conductive material to help secure return pad 602 to a patient's skin or to enhance electrical properties, e.g., to reduce contact impedance. When a surgeon applies surgical instrument 616 to another part of a patient's body, the patient completes the electrical circuit of control component 610 and may produce the desired tissue effect, e.g., cutting, coagulation, ablation etc. The return energy flows through the first foil electrode 606 and/or the second foil electrode 608 back to control component 610 via waveguide 620.
Generator 516 can take contact quality measurements of return pad 602 by utilizing measuring component 522. A test current can be created by measuring component 522 to flow from return electrode 606, through patient tissue, and to return electrode 608. Because return electrode 606 and 608 are capacitive, the measurement current should be configured with proper frequency, current, voltage, and/or wattage for capacitive purposes.
Ground references 612 and 614 may be electrically connected or isolated. For example, if references 612 and 614 were connected via a wire, then a filter (not shown) may be included at some point between return electrode 606 and reference 612 to filter out the measuring current. This can be accomplished by suitable technologies such as a notch filter, a low-pass filer, a high pass filter, a band-pass filter, a buffer, or some combination thereof. For example, if measuring component 522 were operating at frequency f0 and therapeutic current were operating at frequency f1 then a filter, such as a notch-filter, can attenuate frequencies at and/or near f0 from traveling along waveguide 620.
Filtering, buffer, smoothing, processing or switching can be implemented within measuring component 522 or control component 610 to enhance the system. For example, the aforementioned technologies may be used to enhance noise immunity and/or provide a more efficient and accurate impedance measurement.
System 600 may also include an intelligence component (not shown) to determine when an unsafe impedance measurement has been detected. For example, an alarm may be included within the control circuitry when the contact impedance reaches a predetermined threshold, e.g., 100 ohms. The alarm may also be configured to determine if an unsafe temperature rise is predicted, which will trigger the generator 516 to disconnect waveguide 620 (and/or waveguide 620) from the current component 516. The intelligence component may be disposed inside control component 610, inside measuring component 614, or otherwise located within generator 516. The intelligence component may be implemented using suitable software, hardware, software in execution, or some combination thereof.
System 700 also includes return pad 704 that includes return electrode 706 and ring sensor 708. Return electrode 706 is coupled to generator 516, and ring sensor 708 is coupled to measuring component 522. A monopolar surgical instrument 616 is shown coupled to control component 610 for applying therapeutic current to a patient (not explicitly shown).
During monopolar electrosurgery, measuring component 522 may monitor contact quality by utilizing ring sensor 708. Intelligence component 710 may analyze the information from measuring component 522. An intelligence component may be located inside generator 516, inside measuring component 522, inside control component 610, or located elsewhere. An intelligence component, as mentioned above, can utilize a risk function algorithm to determine if an unsafe condition is reached in return pad 704. The risk function algorithm may be a function of therapeutic current duty cycle, therapeutic current amperage, therapeutic current settings, therapeutic current frequency, air temperature, air humidity and air composition and/or other variables that affect patient and/or surgical team safety. If an unsafe condition is reached, the intelligence component 710 communicates with the generator 516 to reduce current or otherwise take appropriate action, e.g., sounding an alarm. For example, intelligence component 710 may determine that cut-off component 702 should electrically disconnect generator 516 from return pad 704 and communicate a command; or cut-off component may electrically disconnect return electrode 706 from generator 516. Cut off component 702 may have pre-determined conditions that causes cut off component 702 to disconnect return electrode 706 or return pad 704 from generator 516, e.g., when a short occurs. Also, cut-off component may be hardware, software, software in execution, and/or circuitry, e.g., such as a microcontroller that determines that a unsafe condition is present and signals this to a relay.
Referencing
The ring sensor(s) 110 of the providing step may include at least two partially concentric ring electrodes 106 and 108 configured to cooperate with the measuring component 522 to measure contact quality during an electrosurgical procedure and communicate contact quality to the generator. The ring sensor 110 may also include a temperature sensitive material such as a positive temperature coefficient ink.
The return pad 100 (or 200, 300, 400 or 500) of the providing step may also include a patient interface material 116 disposed between the backing layer 102 and skin. The patient interface material 116 is configured to facilitate contact quality monitoring of the return electrode 104 and may include a material selected from the group consisting of a conductive gel, a conductive adhesive, an insulating gel, an insulating adhesive, a dielectric gel, a dielectric adhesive and an insulator.
Measurements may be taken by varying electrical parameters of a test signal or current, e.g. voltage, frequency wattage, and/or current. The measurement may be made by a measuring component, e.g., measuring component 522. A control component, control component 610, may be utilized to change the surgical current based upon the measurements made by measuring component 522.
An intelligence component 710 may also be included, e.g., as part of an electrosurgical system, to monitor the conditions of return pad in act 802 and communicate the information to control component 610, to cut-off component 702, and/or otherwise to other circuitry that a pre-determined condition has occurred. For example, if contact quality has been degraded beyond an acceptable level, intelligence component 710 may cause an event to happen, such as sounding an alarm or by performing the electrically isolating step. The term “electrically isolating” may include disconnecting the pad from generator 516 or by utilizing cut-off component 702. For example, cut-off component 702 may be a relay or transistors that can electrically isolate the return pad in act 802 from generator 516.
While several embodiments of the disclosure have been shown in the drawings and/or discussed herein, it is not intended that the disclosure be limited thereto, as it is intended that the disclosure be as broad in scope as the art will allow and that the specification be read likewise. Therefore, the above description should not be construed as limiting, but merely as exemplifications of particular embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto.
This application is a Divisional of U.S. patent application Ser. No. 11/800,687, filed May 7, 2007, now U.S. Pat. No. 8,080,007, the entirety of which is incorporated by reference herein for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
2536271 | Fransen et al. | Jan 1951 | A |
3380445 | Frasier | Apr 1968 | A |
3534306 | Watrous et al. | Oct 1970 | A |
3543760 | Bolduc | Dec 1970 | A |
3642008 | Bolduc | Feb 1972 | A |
3683923 | Anderson | Aug 1972 | A |
3812861 | Peters | May 1974 | A |
3913583 | Bross | Oct 1975 | A |
3923063 | Andrews et al. | Dec 1975 | A |
3933157 | Bjurwill et al. | Jan 1976 | A |
3987796 | Gonser | Oct 1976 | A |
4067342 | Burton | Jan 1978 | A |
4092985 | Kaufman | Jun 1978 | A |
4094320 | Newton et al. | Jun 1978 | A |
4102341 | Ikuno et al. | Jul 1978 | A |
4114622 | Gonser | Sep 1978 | A |
4117846 | Williams | Oct 1978 | A |
4121590 | Gonser | Oct 1978 | A |
4126137 | Archibald | Nov 1978 | A |
4166465 | Esty et al. | Sep 1979 | A |
4188927 | Harris | Feb 1980 | A |
4200104 | Harris | Apr 1980 | A |
4200105 | Gonser | Apr 1980 | A |
4213463 | Osenkarski | Jul 1980 | A |
4231372 | Newton | Nov 1980 | A |
4237887 | Gonser | Dec 1980 | A |
4253721 | Kaufman | Mar 1981 | A |
4303073 | Archibald | Dec 1981 | A |
4304235 | Kaufman | Dec 1981 | A |
4331149 | Gonser | May 1982 | A |
4343308 | Gross | Aug 1982 | A |
4381789 | Naser et al. | May 1983 | A |
4384582 | Watt | May 1983 | A |
4387714 | Geddes et al. | Jun 1983 | A |
4393584 | Bare et al. | Jul 1983 | A |
4416276 | Newton et al. | Nov 1983 | A |
4416277 | Newton et al. | Nov 1983 | A |
4437464 | Crow | Mar 1984 | A |
4494541 | Archibald | Jan 1985 | A |
4494552 | Heath | Jan 1985 | A |
4643193 | DeMarzo | Feb 1987 | A |
4657015 | Irnich | Apr 1987 | A |
4658819 | Harris et al. | Apr 1987 | A |
4662369 | Ensslin | May 1987 | A |
4669468 | Cartmell et al. | Jun 1987 | A |
4699146 | Sieverding | Oct 1987 | A |
4722761 | Cartmell et al. | Feb 1988 | A |
4725713 | Lehrke | Feb 1988 | A |
4741334 | Irnich | May 1988 | A |
4745918 | Feucht | May 1988 | A |
4748983 | Shigeta et al. | Jun 1988 | A |
4750482 | Sieverding | Jun 1988 | A |
4754757 | Feucht | Jul 1988 | A |
4768514 | DeMarzo | Sep 1988 | A |
4770173 | Feucht et al. | Sep 1988 | A |
4788977 | Farin et al. | Dec 1988 | A |
4799480 | Abraham et al. | Jan 1989 | A |
4807621 | Hagen et al. | Feb 1989 | A |
4844063 | Clark | Jul 1989 | A |
4848335 | Manes | Jul 1989 | A |
4852571 | Gadsby et al. | Aug 1989 | A |
4862889 | Feucht | Sep 1989 | A |
4873974 | Hagen et al. | Oct 1989 | A |
4878493 | Pasternak et al. | Nov 1989 | A |
4887047 | Somerville | Dec 1989 | A |
4895169 | Heath | Jan 1990 | A |
4933535 | Zabinski | Jun 1990 | A |
4942313 | Kinzel | Jul 1990 | A |
4947846 | Kitagawa et al. | Aug 1990 | A |
4955381 | Way et al. | Sep 1990 | A |
4961047 | Carder | Oct 1990 | A |
4969885 | Farin | Nov 1990 | A |
5000753 | Hagen et al. | Mar 1991 | A |
5004425 | Hee | Apr 1991 | A |
5010896 | Westbrook | Apr 1991 | A |
5038796 | Axelgaard et al. | Aug 1991 | A |
5042981 | Gross | Aug 1991 | A |
5061914 | Busch et al. | Oct 1991 | A |
5087257 | Farin et al. | Feb 1992 | A |
5114424 | Hagen et al. | May 1992 | A |
5152762 | McElhenney | Oct 1992 | A |
5160334 | Billings et al. | Nov 1992 | A |
5196008 | Kuenecke et al. | Mar 1993 | A |
5246439 | Hebborn et al. | Sep 1993 | A |
5271417 | Swanson et al. | Dec 1993 | A |
5276079 | Duan et al. | Jan 1994 | A |
5286255 | Weber | Feb 1994 | A |
5312401 | Newton et al. | May 1994 | A |
5336255 | Kanare et al. | Aug 1994 | A |
5352315 | Carrier et al. | Oct 1994 | A |
5362420 | Itoh et al. | Nov 1994 | A |
5370645 | Klicek et al. | Dec 1994 | A |
5372596 | Klicek et al. | Dec 1994 | A |
5385679 | Uy et al. | Jan 1995 | A |
5388490 | Buck | Feb 1995 | A |
5389376 | Duan et al. | Feb 1995 | A |
5390382 | Hannant et al. | Feb 1995 | A |
5409966 | Duan et al. | Apr 1995 | A |
5447513 | Davison et al. | Sep 1995 | A |
5449365 | Green et al. | Sep 1995 | A |
5452725 | Martenson | Sep 1995 | A |
5480399 | Hebborn | Jan 1996 | A |
5496312 | Klicek | Mar 1996 | A |
5496363 | Burgio et al. | Mar 1996 | A |
5520180 | Uy et al. | May 1996 | A |
5536446 | Uy et al. | Jul 1996 | A |
5540684 | Hassler, Jr. | Jul 1996 | A |
5585756 | Wang | Dec 1996 | A |
5599347 | Hart et al. | Feb 1997 | A |
5601618 | James | Feb 1997 | A |
5611709 | McAnulty | Mar 1997 | A |
5632280 | Leyde et al. | May 1997 | A |
5633578 | Eggers et al. | May 1997 | A |
5643319 | Green et al. | Jul 1997 | A |
5660892 | Robbins et al. | Aug 1997 | A |
5670557 | Dietz et al. | Sep 1997 | A |
5674561 | Dietz et al. | Oct 1997 | A |
5678545 | Stratbucker | Oct 1997 | A |
5688269 | Newton et al. | Nov 1997 | A |
5695494 | Becker | Dec 1997 | A |
5707369 | Vaitekunas et al. | Jan 1998 | A |
5718719 | Clare et al. | Feb 1998 | A |
5720744 | Eggleston et al. | Feb 1998 | A |
5766165 | Gentelia et al. | Jun 1998 | A |
5779632 | Dietz et al. | Jul 1998 | A |
5797902 | Netherly | Aug 1998 | A |
5800426 | Taki et al. | Sep 1998 | A |
5817091 | Nardella et al. | Oct 1998 | A |
5830212 | Cartmell et al. | Nov 1998 | A |
5836942 | Netherly et al. | Nov 1998 | A |
5846558 | Nielsen et al. | Dec 1998 | A |
5853750 | Dietz et al. | Dec 1998 | A |
5868742 | Manes et al. | Feb 1999 | A |
5924983 | Takaki et al. | Jul 1999 | A |
5947961 | Netherly | Sep 1999 | A |
5952398 | Dietz et al. | Sep 1999 | A |
5971981 | Hill et al. | Oct 1999 | A |
5976128 | Schilling et al. | Nov 1999 | A |
5983141 | Sluijter et al. | Nov 1999 | A |
5985990 | Kantner et al. | Nov 1999 | A |
5999061 | Pope et al. | Dec 1999 | A |
6007532 | Netherly | Dec 1999 | A |
6010054 | Johnson et al. | Jan 2000 | A |
6026323 | Skladnev et al. | Feb 2000 | A |
6030381 | Jones et al. | Feb 2000 | A |
6032063 | Hoar et al. | Feb 2000 | A |
6039732 | Ichikawa et al. | Mar 2000 | A |
6053910 | Fleenor | Apr 2000 | A |
RE36720 | Green et al. | May 2000 | E |
6059778 | Sherman | May 2000 | A |
6063075 | Mihori | May 2000 | A |
6083221 | Fleenor et al. | Jul 2000 | A |
6086249 | Urich | Jul 2000 | A |
6121508 | Bischof et al. | Sep 2000 | A |
6135953 | Carim | Oct 2000 | A |
6171304 | Netherly et al. | Jan 2001 | B1 |
6200314 | Sherman | Mar 2001 | B1 |
6203541 | Keppel | Mar 2001 | B1 |
6214000 | Fleenor et al. | Apr 2001 | B1 |
6232366 | Wang et al. | May 2001 | B1 |
6240323 | Calenzo, Sr. et al. | May 2001 | B1 |
6246912 | Sluijter et al. | Jun 2001 | B1 |
6258085 | Eggleston | Jul 2001 | B1 |
6258087 | Edwards et al. | Jul 2001 | B1 |
6275786 | Daners | Aug 2001 | B1 |
6283987 | Laird et al. | Sep 2001 | B1 |
6301500 | Van Herk et al. | Oct 2001 | B1 |
6310611 | Caldwell | Oct 2001 | B1 |
6347246 | Perrault et al. | Feb 2002 | B1 |
6350264 | Hooven | Feb 2002 | B1 |
6350276 | Knowlton | Feb 2002 | B1 |
6355031 | Edwards et al. | Mar 2002 | B1 |
6356779 | Katzenmaier et al. | Mar 2002 | B1 |
6357089 | Koguchi et al. | Mar 2002 | B1 |
6358245 | Edwards et al. | Mar 2002 | B1 |
6379161 | Ma | Apr 2002 | B1 |
6409722 | Hoey et al. | Jun 2002 | B1 |
6413255 | Stern | Jul 2002 | B1 |
6415170 | Loutis et al. | Jul 2002 | B1 |
6454764 | Fleenor et al. | Sep 2002 | B1 |
6488678 | Sherman | Dec 2002 | B2 |
6511478 | Burnside et al. | Jan 2003 | B1 |
6537272 | Christopherson et al. | Mar 2003 | B2 |
6544258 | Fleenor et al. | Apr 2003 | B2 |
6546270 | Goldin et al. | Apr 2003 | B1 |
6565559 | Eggleston | May 2003 | B2 |
6569160 | Goldin et al. | May 2003 | B1 |
6582424 | Fleenor et al. | Jun 2003 | B2 |
6666859 | Fleenor et al. | Dec 2003 | B1 |
6669073 | Milliman et al. | Dec 2003 | B2 |
6736810 | Hoey et al. | May 2004 | B2 |
6796828 | Ehr et al. | Sep 2004 | B2 |
6799063 | Carson | Sep 2004 | B2 |
6830569 | Thompson et al. | Dec 2004 | B2 |
6849073 | Hoey et al. | Feb 2005 | B2 |
6860881 | Sturm | Mar 2005 | B2 |
6875210 | Refior et al. | Apr 2005 | B2 |
6892086 | Russell | May 2005 | B2 |
6905497 | Truckai et al. | Jun 2005 | B2 |
6939344 | Kreindel | Sep 2005 | B2 |
6948503 | Refior et al. | Sep 2005 | B2 |
6953139 | Milliman et al. | Oct 2005 | B2 |
6958463 | Kochman et al. | Oct 2005 | B1 |
6959852 | Shelton, IV et al. | Nov 2005 | B2 |
6979329 | Burnside et al. | Dec 2005 | B2 |
6997735 | Ehr et al. | Feb 2006 | B2 |
7025765 | Balbierz et al. | Apr 2006 | B2 |
7112201 | Truckai et al. | Sep 2006 | B2 |
7128253 | Mastri et al. | Oct 2006 | B2 |
7137980 | Buysse et al. | Nov 2006 | B2 |
7143926 | Shelton, IV et al. | Dec 2006 | B2 |
7160293 | Sturm et al. | Jan 2007 | B2 |
7166102 | Fleenor et al. | Jan 2007 | B2 |
7169144 | Hoey et al. | Jan 2007 | B2 |
7169145 | Isaacson et al. | Jan 2007 | B2 |
7182604 | Ehr et al. | Feb 2007 | B2 |
7220260 | Fleming et al. | May 2007 | B2 |
7229307 | Ehr et al. | Jun 2007 | B2 |
7258262 | Mastri et al. | Aug 2007 | B2 |
7267675 | Stern et al. | Sep 2007 | B2 |
7278562 | Mastri et al. | Oct 2007 | B2 |
7303107 | Milliman et al. | Dec 2007 | B2 |
7308998 | Mastri et al. | Dec 2007 | B2 |
7311560 | Ehr et al. | Dec 2007 | B2 |
7357287 | Shelton, IV et al. | Apr 2008 | B2 |
7380695 | Doll et al. | Jun 2008 | B2 |
7422586 | Morris et al. | Sep 2008 | B2 |
7422589 | Newton et al. | Sep 2008 | B2 |
7425835 | Eisele | Sep 2008 | B2 |
7452358 | Stern et al. | Nov 2008 | B2 |
7465302 | Odell et al. | Dec 2008 | B2 |
7473145 | Ehr et al. | Jan 2009 | B2 |
7483738 | Tamarkin et al. | Jan 2009 | B2 |
7520877 | Lee, Jr. et al. | Apr 2009 | B2 |
7566332 | Jarrard et al. | Jul 2009 | B2 |
7588567 | Beveja et al. | Sep 2009 | B2 |
7637907 | Blaha | Dec 2009 | B2 |
7722412 | Ehr et al. | May 2010 | B2 |
7722603 | McPherson | May 2010 | B2 |
7736357 | Lee, Jr. et al. | Jun 2010 | B2 |
7736359 | McPherson | Jun 2010 | B2 |
7771419 | Carmel et al. | Aug 2010 | B2 |
7771422 | Auge, II et al. | Aug 2010 | B2 |
7837680 | Isaacson et al. | Nov 2010 | B2 |
7909819 | Falkenstein et al. | Mar 2011 | B2 |
7927329 | McPherson | Apr 2011 | B2 |
7938825 | Sturm et al. | May 2011 | B2 |
8021360 | Dunning et al. | Sep 2011 | B2 |
8062291 | McPherson | Nov 2011 | B2 |
8080007 | Dunning et al. | Dec 2011 | B2 |
8100898 | Gregg | Jan 2012 | B2 |
20030020072 | Higgins | Jan 2003 | A1 |
20030139741 | Goble et al. | Jul 2003 | A1 |
20040150504 | Nicholson | Aug 2004 | A1 |
20040206365 | Knowlton | Oct 2004 | A1 |
20050085806 | Auge, II et al. | Apr 2005 | A1 |
20060041251 | Odell et al. | Feb 2006 | A1 |
20060041252 | Odell et al. | Feb 2006 | A1 |
20060079872 | Eggleston | Apr 2006 | A1 |
20060173250 | Nessler | Aug 2006 | A1 |
20060217742 | Messerly et al. | Sep 2006 | A1 |
20060224150 | Arts et al. | Oct 2006 | A1 |
20070049914 | Eggleston | Mar 2007 | A1 |
20070049916 | Isaacson et al. | Mar 2007 | A1 |
20070049919 | Lee, Jr. et al. | Mar 2007 | A1 |
20070074719 | Danek et al. | Apr 2007 | A1 |
20070161979 | McPherson | Jul 2007 | A1 |
20070167942 | Rick | Jul 2007 | A1 |
20070203481 | Gregg et al. | Aug 2007 | A1 |
20070244478 | Bahney | Oct 2007 | A1 |
20080009846 | Ward | Jan 2008 | A1 |
20080082092 | McPherson | Apr 2008 | A1 |
20080083806 | Scirica | Apr 2008 | A1 |
20080083813 | Zemlok et al. | Apr 2008 | A1 |
20080097558 | Eggers et al. | Apr 2008 | A1 |
20080249520 | Dunning et al. | Oct 2008 | A1 |
20080249524 | Dunning | Oct 2008 | A1 |
20080281309 | Dunning et al. | Nov 2008 | A1 |
20080281310 | Dunning et al. | Nov 2008 | A1 |
20080281311 | Dunning et al. | Nov 2008 | A1 |
20090036884 | Gregg et al. | Feb 2009 | A1 |
20090036885 | Gregg | Feb 2009 | A1 |
20090138006 | Bales et al. | May 2009 | A1 |
20090198229 | Dunning | Aug 2009 | A1 |
20090198230 | Behnke et al. | Aug 2009 | A1 |
20090209953 | Schoenman | Aug 2009 | A1 |
20090223041 | Garrison et al. | Sep 2009 | A1 |
20090234352 | Behnke et al. | Sep 2009 | A1 |
20090234353 | McPherson | Sep 2009 | A1 |
20100185195 | McPherson | Jul 2010 | A1 |
20100241023 | Gilbert | Sep 2010 | A1 |
20110077641 | Dunning | Mar 2011 | A1 |
20110112525 | Dunning et al. | May 2011 | A1 |
20110112530 | Keller | May 2011 | A1 |
20110190761 | McPherson | Aug 2011 | A1 |
Number | Date | Country |
---|---|---|
1219642 | Mar 1987 | CA |
3239640 | May 1983 | DE |
3206947 | Sep 1983 | DE |
3206947 | Sep 1983 | DE |
3544443 | Jun 1987 | DE |
4238263 | May 1993 | DE |
4231236 | Mar 1994 | DE |
19717411 | Nov 1998 | DE |
19751108 | May 1999 | DE |
19801173 | Jul 1999 | DE |
10328514 | Jun 2003 | DE |
102004010940 | Sep 2005 | DE |
0262888 | Apr 1988 | EP |
390937 | Oct 1990 | EP |
836868 | Apr 1998 | EP |
1051949 | Nov 2000 | EP |
1076350 | Feb 2001 | EP |
0930048 | Apr 2003 | EP |
1645236 | Apr 2006 | EP |
1707151 | Oct 2006 | EP |
1808144 | Jul 2007 | EP |
1468653 | Nov 2007 | EP |
1902684 | Mar 2008 | EP |
1990020 | Nov 2008 | EP |
1994905 | Nov 2008 | EP |
2033588 | Mar 2009 | EP |
2276027 | Jun 1974 | FR |
2516782 | May 1983 | FR |
2054382 | Feb 1981 | GB |
2374532 | Oct 2002 | GB |
WO 9300862 | Jan 1993 | WO |
WO 9619152 | Jun 1996 | WO |
WO 9737719 | Oct 1997 | WO |
WO 9818395 | May 1998 | WO |
WO 9853751 | Dec 1998 | WO |
WO 9909899 | Mar 1999 | WO |
WO 9911187 | Mar 1999 | WO |
WO 0006246 | Feb 2000 | WO |
WO 0032122 | Jun 2000 | WO |
WO 0053113 | Sep 2000 | WO |
WO 0065993 | Nov 2000 | WO |
WO 0187175 | Nov 2001 | WO |
WO 02024092 | Mar 2002 | WO |
WO 02058579 | Aug 2002 | WO |
WO 02060526 | Aug 2002 | WO |
WO 02099442 | Dec 2002 | WO |
WO 03094766 | Nov 2003 | WO |
WO 2004028385 | Apr 2004 | WO |
WO 2004074854 | Sep 2004 | WO |
WO 2005048809 | Jun 2005 | WO |
WO 2005087124 | Sep 2005 | WO |
WO 2005087124 | Sep 2005 | WO |
WO 2005099606 | Oct 2005 | WO |
WO 2005110263 | Nov 2005 | WO |
WO 2005115262 | Dec 2005 | WO |
WO 2008009385 | Jan 2008 | WO |
WO 2009031995 | Mar 2009 | WO |
WO 2009099960 | Aug 2009 | WO |
Number | Date | Country | |
---|---|---|---|
20120089140 A1 | Apr 2012 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11800687 | May 2007 | US |
Child | 13326040 | US |