Claims
- 1. An electrothermal sensor comprising:
- a resistive element of predetermined electrical resistance;
- a first electrothermal sensor disposed on a central region of said element for monitoring the temperature of said element as an indication of the current level passing through said element;
- a second electrothermal sensor disposed adjacent said
- element and remote from said central region to monitor the ambient temperature of said element; and
- heat sink means upon which said resistive element is mounted, said heat sink means having spaced studs between which the resistive element is coupled.
Parent Case Info
This application is a division of application Ser. No. 07/224,153, filed Jul. 26, 1988, now U.S. Pat. No. 4,866,559.
US Referenced Citations (16)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1454323 |
Nov 1976 |
GBX |
Non-Patent Literature Citations (1)
Entry |
High Speed Thermal Transfer Printing, IBM Tech. Disclosure, vol. 28, #7, Dec. 1985. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
224153 |
Jul 1988 |
|