1. Field of the Invention
The present invention relates to an element substrate, a printhead, and a printing apparatus and, particularly, to a full-line printhead having an element substrate integrated with it, which performs printing in accordance with, for example, an inkjet method and a printing apparatus that performs printing using the same. More specifically, the present invention relates to a printhead including an element substrate, in which a plurality of print elements and driving circuits configured to drive the print elements are provided on the single element substrate, and a printing apparatus.
2. Description of the Related Art
For example, as information output apparatuses such as a word processor, a personal computer, and a facsimile apparatus, in general, inkjet printing apparatuses (to be referred to as printing apparatuses hereinafter) for printing any desired information such as characters and images on a sheet-like printing medium such as a paper sheet or a film are widely used.
Electrothermal transducers (heaters) of a printhead included in a printing apparatus and driving circuits thereof are generally formed on a single substrate using the semiconductor process technology as described in, for example, Japanese Patent Laid-Open No. 2007-022069. As one configuration, there is proposed a printhead having an element substrate integrated with it, in which an ink supply port is located near the center of the substrate, and heaters facing each other are located at positions sandwiching the ink supply port.
In addition, for example, Japanese Patent Laid-Open No. 10-119273 discloses a method of correcting a fluctuation in the discharge characteristics of a printhead with respect to the temperature.
As shown in
For example, Japanese Patent Laid-Open No. 2008-302691 discloses an arrangement that adjusts the respective times of a double-pulse in accordance with the environmental temperature.
According to
When the arrangement of the above-described related art is employed, the pulse width of an HE signal can desirably be set. However, in a case where a heater is driven a plurality of times at the same heating period, that is, an HE signal pulse is given a plurality of times, as shown in
Accordingly, the present invention is conceived as a response to the above-described disadvantages of the conventional art.
For example, an element substrate, a printhead using the same, and a printing apparatus including the printhead according to this invention are capable of implementing size reduction of the element substrate and simplification of the arrangement as well as a highly-reliable print operation.
According to one aspect of the present invention, there is provided an element substrate comprising: a plurality of print elements; a plurality of drive elements provided in correspondence with the plurality of print elements and configured to drive the plurality of print elements; and a driving circuit configured to generate a double-pulse upon receiving a single reference voltage and two ramp waves and apply the double-pulse to the plurality of drive elements and drive the plurality of drive elements. The driving circuit includes: a generation circuit configured to generate the single reference voltage and the two ramp waves; and a comparison circuit configured to compare the single reference voltage with the two ramp waves, and the driving circuit generates a plurality of double-pulses having different pulse widths from a result of comparison of the comparison circuit, using ramp waves having different slopes.
According to another aspect of the present invention, there is provided a printhead using an element substrate having the above-described arrangement and, more particularly, a full-line inkjet printhead that prints by discharging ink in accordance with an inkjet method.
According to still another aspect of the present invention, there is provided a printing apparatus for printing using the full-line printhead.
The invention is particularly advantageous since a plurality of double-pulses can be generated from one reference voltage. This obviates the necessity of using many data for generation of a plurality of double-pulses and can thus eliminate the arrangement necessary for transfer and control of many data. This contributes to size reduction of the element substrate, simplification of the element circuit, and highly-reliable print operation).
Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings).
Exemplary embodiments of the present invention will now be described in detail in accordance with the accompanying drawings. Note that the same reference numerals denote already explained parts, and a repetitive description thereof will be omitted.
In this specification, the terms “print” and “printing” not only include the formation of significant information such as characters and graphics, but also broadly includes the formation of images, figures, patterns, and the like on a print medium, or the processing of the medium, regardless of whether they are significant or insignificant and whether they are so visualized as to be visually perceivable by humans.
Also, the term “print medium” not only includes a paper sheet used in common printing apparatuses, but also broadly includes materials, such as cloth, a plastic film, a metal plate, glass, ceramics, wood, and leather, capable of accepting ink.
Furthermore, the term “ink” (to be also referred to as a “liquid” hereinafter) should be extensively interpreted similar to the definition of “print” described above. That is, “ink” includes a liquid which, when applied onto a print medium, can form images, figures, patterns, and the like, can process the print medium, and can process ink. The process of ink includes, for example, solidifying or insolubilizing a coloring agent contained in ink applied to the print medium.
Further, a “nozzle” generically means an ink orifice or a liquid channel communicating with it, and an element for generating energy used to discharge ink, unless otherwise specified.
An element substrate (head substrate) for a printhead to be used below indicates not a mere base made of silicon semiconductor but a component provided with elements, wirings, and the like.
“On the substrate” not only simply indicates above the element substrate but also indicates the surface of the element substrate and the inner side of the element substrate near the surface. In the present invention, “built-in” is a term not indicating simply arranging separate elements on the substrate surface as separate members but indicating integrally forming and manufacturing the respective elements on the element substrate in, for example, a semiconductor circuit manufacturing process.
An embodiment of an inkjet printing apparatus will be described next. This printing apparatus is a high-speed line printer that uses a continuous sheet (print medium) wound into a roll and supports both single-sided printing and double-sided printing. The printing apparatus is suitable for, for example, a mass print field in a print laboratory or the like.
The sheet supply unit 1 stores and supplies a continuous sheet wound into a roll. The sheet supply unit 1 can store two rolls R1 and R2, and is configured to selectively draw and supply a sheet. Note that the number of storable rolls is not limited to two, and one or three or more rolls may be stored. The decurling unit 2 reduces the curl (warp) of the sheet supplied from the sheet supply unit 1. The decurling unit 2 bends and strokes the sheet so as to give a warp in an opposite direction to the curl using two pinch rollers with respect to one driving roller, thereby reducing the curl. The skew adjustment unit 3 adjusts the skew (tilt with respect to the original traveling direction) of the sheet that has passed through the decurling unit 2. A sheet end on a reference side is pressed against a guide member, thereby adjusting the skew of the sheet.
The print unit 4 forms an image on the conveyed sheet by a printhead unit 14. The print unit 4 also includes a plurality of conveyance rollers configured to convey the sheet. The printhead unit 14 includes a full-line printhead (inkjet printhead) in which an inkjet nozzle array is formed within a range covering the maximum width of sheets assumed to be used. In the printhead unit 14, a plurality of printheads are arranged parallelly along the sheet conveyance direction. In this embodiment, the printhead unit 14 includes four printheads corresponding to four colors of K (black), C (cyan), M (magenta), and Y (yellow). The printheads are arranged in the order of K, C, M, and Y from the upstream side of sheet conveyance. Note that the number of ink colors and the number of printheads are not limited to four. As the inkjet method, a method using heating elements, a method using piezoelectric elements, a method using electrostatic elements, a method using MEMS elements, or the like can be employed. The respective color inks are supplied from ink tanks to the printhead unit 14 via ink tubes.
The inspection unit 5 optically reads an inspection pattern or image printed on the sheet by the print unit 4, and inspects the states of nozzles of the printheads, the sheet conveyance state, the image position, and the like. The inspection unit 5 includes a scanner unit that actually reads an image and generates image data, and an image analysis unit that analyzes the read image and returns the analysis result to the print unit 4. The inspection unit 5 includes a CCD line sensor which is arranged in a direction perpendicular to the sheet conveyance direction.
Note that the printing apparatus shown in
When performing a printing operation, the full-line printhead 100 is fixed on the printing apparatus, the print medium 800 is conveyed, and the inks are discharged from a plurality of orifices 706 provided in element substrates 101, thereby forming an image on the print medium 800.
As is apparent from
The full-line printhead 100 includes four element substrates 101-1, 101-2, 101-3, and 101-4, a support member 501, a printed board 110, and an ink supply member 502. As shown in
As is apparent from
Several embodiments will be described next concerning an element substrate integrated with a full-line printhead included in a printing apparatus having the above-described arrangement.
A following HE signal is taken into consideration as a prerequisite to an explanation of this embodiment.
In
Referring to
This comparator includes a memory formed from a capacitor 201, a comparison portion 202 formed from a switch 203 and an inverter 204, and a buffer 205 configured to output a waveform. This comparator stores the reference voltage Ref in the memory, and then compares it with an input ramp wave. Note that switches 209 and 210 are provided in the input and output portions of the comparator, respectively.
That is, a double-pulse HE signal including a prepulse, an interval time, and a main pulse in one heat period, as shown in
Assuming the above-described arrangement, a method of generating a double-pulse HE signal based on one reference voltage will be described next. A method of generating a double-pulse by controlling the pulse width of the HE signal for each heater (print element) in accordance with fluctuations in the element substrate (for example, temperature distribution, fluctuation in heater resistance, and film thickness distribution of a protection film) will be explained here. Although a stepwise wave is generated in fact using a DAC, a ramp wave having a predetermined slope is used here for the sake of descriptive simplicity.
In this way, any desired double-pulse can be generated by changing the slope of the ramp wave with respect to one set reference voltage Vref or changing the reference voltage Vref without changing the slope of the ramp wave. Note that giving a supplementary explanation, input of the ramp wave for the prepulse is done next to input of the reference voltage (to be described later).
A method of individually adjusting the pulse width for each heater will be described here.
In the example shown in
Driving circuits (DRV) 603 are arranged between the pads 604 along the upper side of the element substrate 101 and the ink supply ports 601 and the heater arrays. Comparators (Cmp) 609 are arranged near the driving circuits (DRV) 605 provided behind the heaters 602.
On the other hand, OP amplifiers (OP) 606 and DACs (Digital/Analog Converters) 607 are arranged between the pads 604 along the lower side of the element substrate 101 and the ink supply ports 601 and the heater arrays. Such a circuit layout makes it possible to individually set the pulse width of the HE signal for each heater and give adequate energy to each heater.
A data signal DATA_A—1 applied to the pad 604 includes a clock signal CLK, a latch signal LT, and print data signal DATA, and is input to a shift register (SR) 703 and a decoder 704 included in the internal circuit, via an input circuit 702. The print data signal DATA selects heaters to be driven during a certain heat period.
As the data signal, another signal is input from a pad that changes depending on the circuit block. The input data signal is expanded by the shift register 703, and some of the signals are input to a plurality of heater drive groups 707 as the print data signals DATA to select enable/disable of the heater drive groups. Some of the remaining signals of the expanded data signals are input to the decoder 704. The decoder 704 outputs time division signals (BLKn) 706 that sequentially switch over heaters to be driven in the heater drive groups. Provided that one group includes 2n heaters, 2n time division signals are necessary.
In this case, one heater drive group includes 2n heaters continuously provided on the element substrate while being close to each other in a heater array. The 2n heaters are time-divisionally driven. One comparator (comparison circuit) is provided in correspondence with each group.
HE data (HENB) included in still another part of the remaining signals of the data signals are supplied to the comparators (Cmp) 609 via a DAC shift register (SR) 708, the DAC 607, and the OP amplifier (OP) 606. Each comparator (Cmp) 609 generates a heat enable (HEn) signal. In the example of
The DAC 607 is a circuit (generation circuit) capable of generating an analog voltage value set by digital data. In this embodiment, using the capability of generating any desired voltage value, the DAC 607 is used to generate the reference voltage Ref and the ramp wave. The shift register (SR) 708 receives the HE data (HENB) for determining the HE pulse width, which is included in the data signal, from the shift register (SR) 703 and transfers the HE data to the DAC 607. The comparators (Cmp) 609 of the plurality of groups are connected to the DAC 607 via the OP amplifier 606.
The comparators (Cmp) 609 function as the load of the DAC 607. Hence, if directly connected, the response speed decreases, and the output waveform is rounded. On the other hand, the OP amplifier 606 operates so to make the input and output equal upon receiving negative feedback. Using this characteristic, the OP amplifier 606 is inserted between the DAC 607 and the comparators 609. Since the load of the DAC 607 includes only the OP amplifier 606, the same waveform as the output of the DAC 607 can be output to the comparators 609. In this way, the reference voltage and the ramp wave are generated by the DAC 607 and transferred to the comparators 609.
The circuit arrangement of the comparator 609 shown in
During a period t1, the switches 203 and 209 are closed. When the switch 203 is closed, the input and output of the inverter 204 short, and the potential Va of the electrode of the capacitor 201 on the side of the inverter 204 changes to Vth. Vth is the threshold voltage of the inverter 204. When the switch 209 is closed, the potential of the electrode of the capacitor 201 on the side of the switch 209 changes to Vref. The capacitor 201 is thus electrically charged in proportion to Vth−Vref (in other words, a potential difference Vth−Vref is applied to the capacitor 201).
During a period t2, the switch 203 is opened. The potential difference Vth−Vref is maintained across the capacitor 201 serving as a memory. The switch 209 is closed (
As described above, the comparator adjusts the pulse width by the reference voltage Vref that charges the capacitor serving as a memory and the ramp wave. The comparator according to this embodiment includes a capacitor serving as the memory portion and an inverter in the comparison portion, as described above. Hence, the comparator has a small circuit scale and is therefore advantageous for suppressing the substrate area.
The DAC 607 will be described next.
Using an arrangement that parallel-connects a plurality of current mirror circuits, the DAC 607 controls the switches 901 to 905 provided in the output portions of the current mirror circuits and adjusts a current flowing to the resistors, thereby generating any desired voltage. In this arrangement, the outputs from the switches 902 to 905 correspond to the four bits, respectively.
When the switch 902 is turned on, a current I flows. Hence, a voltage (R/2+R/2)×I=RI is output from an output terminal OUT. When the switch 903 is further turned on, 2×RI is output. When the switch 904 is turned on, 3×RI is output. When the switch 905 is turned on, 4×RI is output. When the switches are turned on/off in this way, any desired voltage can be generated.
In this embodiment, the reference voltage Vref and the ramp wave are generated by a common DAC. Hence, the ramp wave and the reference voltage Vref shifted by a ½ level need to be generated by one DAC. For this reason, the DAC 607 is configured such that a resistor R is divided into the resistors 906 and 907 each corresponding to R/2, and a current controlled by the switch 901 flows between them. Hence, such an arrangement need not be employed when the DAC is not shared. Another arrangement that, for example, adds a weight to the current by the size ratio of MOS transistors may be employed.
Note that as is apparent from
The heater drive group 707 is formed from drive elements 1004, voltage conversion circuits (LVC) 1005, and heater selection circuits 1006, which are arranged in correspondence with the heaters 602 arranged in an array. An externally supplied heater power supply voltage (VH: first power supply voltage) is applied to a heater power supply line 1001. A current flows to ground (GNDH) 1002 via the heaters 602.
The drive element 1004 serves as a switching element for determining whether or not to send an electric current to the heater 602. Signals from a print data signal line 1007, a time division signal line 1008, and a heat enable signal line 1009 are input to an AND gate that is the heater selection circuit 1006. When all the three signals are active, the output of the AND gate is active. The voltage conversion circuit 1005 level-converts (boosts) the voltage swing of the output signal of the AND gate to a power supply voltage (VHM: second power supply voltage) higher than the driving voltage (VDD: third power supply voltage) used for driving the input circuit 702 to the heater selection circuit 1006. The level-converted signal is applied to the gate of the drive element 1004. The heater 602 connected to the MOS transistor to which the gate voltage is applied is energized and driven.
With such an the arrangement for performing individual control on a heater basis, the reference voltage Vref and the ramp wave shown in
In the example shown in
In this embodiment, a double-pulse is generated. Hence, as shown in
Three methods of changing the slope of the ramp wave will be described next.
(1) First Method (Method of Switching Over Resistors in DAC)
The arrangement for generating a current by current mirror circuits is the same as in
Hence, the slope of the ramp wave can be changed by switching over the resistance value. For example, when the switches 1116 and 1117 are turned on, and the switches 902 to 905 are sequentially turned on, voltages 3R×I, 3R×2I, 3R×3I, and 3R×4I are sequentially output, and a ramp wave is generated. Next, when the switches 1118 and 1119 are turned on, voltages 2.1R×I, 2.1R×2I, 2.1R×3I, and 2.1R×4I are sequentially output, and the voltage of the entire ramp wave is compressed. Since the switches 902 to 905 are turned on in accordance with the clock signal CLK, and therefore, the boosting time does not change, the slope of the ramp wave changes. The slope of the ramp wave can be changed by switching over the resistors in this way. The driving pulses PWM1 to PWM4 shown in
(2) Second Method (Method of Switching Over Mirror Ratio of DAC)
The arrangement for generating a current by current mirror circuits is the same as in
A voltage corresponding to R×current value is output from the output terminal OUT. Hence, for example, when MOSFETs having a size ratio of 3 in the current mirror portions 1211 and 1212 are turned on, a current 3I is mirrored. In this case, since the current 3I flows to the switches 902 to 905 as well, voltages R×3I to R×12I are output from the output terminal OUT. As compared to this, when MOSFETs having a size ratio of 2.1 are selected, voltages R×2.1I to R×8.4I are output from the output terminal OUT, and the voltage of the entire ramp wave is compressed. Since the switches 902 to 905 are turned on in accordance with the clock signal CLK, and therefore, the boosting time does not change, the slope of the ramp wave changes. The driving pulses PWM1 to PWM4 shown in
(3) Third Method (Method of Switching Over Capacitor of Comparator)
Note that the basic arrangement of the comparator is the same as that of the comparator shown in
Additionally, in this embodiment, a voltage changeable memory 1307, that is, new capacitors are inserted in series with the capacitor serving as the memory 201. Furthermore, a GND capacitance 1309 is inserted for the descriptive convenience. In this arrangement, the input voltage Va to the inverter 204 has a value obtained by dividing the input voltage Vin by the voltage changeable memory 1307, the memory 201, and the GND capacitance 1309.
For example, in a case where the memory 201 and the GND capacitance 1309 have a capacitance of 1 pF, as shown in
As described above, in a case where a voltage changeable memory is formed using a plurality of capacitors (second capacitors) whose capacitance values are different from each other, and a capacitor is selected by a switch 1308, the slope of the ramp wave can be selected. In the method of inserting capacitors, the capacitors are inserted in series with the memory 201. Hence, the combined capacitance decreases, and the slope of the ramp wave becomes small. In this adjustment method using the capacitors, the adjustment is made in a direction in which the slope becomes small. Hence, a capacitance ratio assuming a case where the slope of the ramp wave for the main pulse is changed using the prepulse width T1 as a reference has been described.
Hence, according to the above-described embodiment, a plurality of pulses having different pulse widths can be generated from one reference voltage Vref. As a result, many data need not be used to generate the plurality of pulses. This also obviates the necessity of countermeasure of increasing the data transfer speed or dividing data to be transferred. In addition, since the number of memories need not be increased, an increase in the circuit scale can be prevented.
An example in which a double-pulse is generated using a ramp wave different from that shown in the first embodiment will be described.
In this way, when the waveform of the main pulse is inverted, the start time and end time of the double-pulse can be fixed together with the total time of the double-pulse. For this reason, in a case where the total time is fixed, it is only necessary to change the slope of the ramp wave in accordance with the pulse width, resulting in simple control.
However, when the ramp wave for the prepulse falls at the end, and when the ramp wave for the main pulse rises at the start, the voltage crosses the reference voltage Vref, and the comparator outputs a pulse. Hence, at this time, a switch 210 of the comparator needs to be off. Note that giving a supplementary explanation, input of the ramp wave for the prepulse is done next to input of the reference voltage, as described with reference to
In this embodiment, an example in which ramp waves other than the waveform patterns used in the first and second embodiments are used will be described.
This example uses ramp waves in which the waveform of the ramp wave for the main pulse is inverted from that of the ramp wave for the prepulse, and the ramp wave does not fall between the ramp wave for the prepulse and that for the main pulse.
This ramp wave can fix the start time and end time together with the total time of the double-pulse, as in the second embodiment. It is therefore possible to change the prepulse width, the interval time, and the main pulse width only by changing the reference voltage Vref.
For example, when the reference voltage Vref1 shown in
A method of generating driving pulses PWM1 to PWM4 shown in
In the example of
The slope of the ramp wave for the main pulse may be changed using the prepulse width T1 as a reference, as shown in
When the element substrate has a fluctuation 1802 in the film thickness, resistance, or the like in the arrayed direction of heaters 602, as shown in the middle of
Hence, according to the above-described embodiment, a plurality of pulses having different pulse widths can be generated only by setting one reference voltage and switching over the slope of the ramp wave. In addition, since the ramp wave does not cross the reference voltage, control to switch over the switch of the comparator is unnecessary, and the control becomes simpler.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2013-138440, filed Jul. 1, 2013, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2013-138440 | Jul 2013 | JP | national |
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Number | Date | Country |
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0694395 | Jan 1996 | EP |
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2007-022069 | Feb 2007 | JP |
2008-302691 | Dec 2008 | JP |
Entry |
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European Search Report issued in corresponding EP application No. 14002260.9 dated on Oct. 6, 2014—4 pages. |
Number | Date | Country | |
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20150002566 A1 | Jan 2015 | US |