BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block chart of a frequency synthesizer of the prior art;
FIG. 2 is a perspective view of a preferred embodiment of the present invention;
FIG. 3 is a side view of the preferred embodiment of the present invention; and
FIG. 4 is bird's eye view of the preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 2 for a perspective view of a circuit module and shielding structure for EM waves or RF interferences of the present invention, a circuit module 2 is comprised of a circuit board 21 and a shielding structure 22. The shielding structure 22 includes an electronic component 221, a metal partition 222, and a conduction post 224. The electronic component 221 adapted to the circuit board 21 is provided to execute operation, process or memory functions. When the electronic component 221 is working at a faster clock, it will radiate EM waves or RF interference at the same time to the area outside the electronic component 221. To other electronic components on the circuit board, the electronic component 211 radiating EM waves or RF interferences becomes an interference source. The metal partition 222 is disposed with one or a plurality of through holes 223 and all the ends of the metal partition 222 are vertically connected to the conduction post 224 so that the metal partition 222 may be erected over but not contacting the electronic component 221. Whereas the metal partition 222 is provided with inherited conductivity, it is capable of converting those EM waves or RF interferences into transient current thus to achieve the purpose of shielding EM waves or RF interferences. One or a plurality of ends from the conduction post 224 are electrically connected to the metal partition 222 while the other end of conduction post 224 is electrically connected to a ground end 211 to guide the transient current converted from those EM waves or RF interference to the ground end 211. The heat generated from the active electronic component 221 is dissipated via the through hole 223 to prevent possible damage or compromised performance due to the collected heat without dissipation. Whereas the through hole is made in a smaller diameter, it is capable of preventing the risk of having those EM waves or RF interferences to escape from the through hole 223 unless the interference is at an extremely high frequency. The present invention therefore achieves the results of heat dissipation and shielding the EM waves or RF interferences. The circuit board 21 may be related to a motherboard mounted in a computer or other electronic device; the electronic component 221 may be related to a CPU, Northbridge chipset, memory or clock generator mounted on the motherboard; and the metal partition 222 may be made of aluminum or copper.
As illustrated in FIG. 3 for a side view of the present invention, the conduction post 224 is connected between the metal partition 222 and the circuit board, and is also connected to the ground end 211 of the circuit board 21. Accordingly, the metal partition 222 is positioned over but without contacting the electronic component 221, while permitting the transient current in the metal partition 222 to be guided to the ground end 211.
Referring to FIG. 4 for a bird's eye view of the present invention, the area of the metal partition 222 is greater than that of the electronic component 221 to fully cover up the electronic component 221 for achieving the optimal masking results.
Patent Application
20080049409
