Embedment system for ultrahigh-burning rate propellants of solid propulsion subsystems

Abstract

An improved embedment system is disclosed which is comprised of an embedm granule portion in percent by weight of nitrocellulose of about 23.0, nitroglycerine of about 15.0, resorcinol of about 1.5, 2-nitrodiphenylamine of about 1.0, ammonium perchlorate (10 micrometers) of about 45.5, and aluminum powder (20 micrometers) of about 14.0 and an embedment resin portion in percent by weight of bisphenol A-epichlorohydrin of about 44, epoxidized dimer acid of about 20, and a curative which is the condensation product of 2 moles of 1,2-bis(maleimido)ethane and one mole of triaminotriazine of about 36.0. This embedment system has superior characteristics of a high peel strength and greater resistance to penetration by or absorption of carboranylmethyl propionate or casting solvent absorption.

Description

BACKGROUND OF THE INVENTION

The interface composition system for a solid propellant rocket motor grain and insulation is generally comprised of an embedment powder and an embedment resin which comprise an embedment system. A compatibility between the grain composition and the embedment system is necessary since this system functions as an interface between the propellant grain and the insulation system. Requirements of an embedment system include a high peel strength and a resistance to penetration by or absorption of catalyst components or casting solvent components contained in the propellant composition. Without proper peel strength and resistance to penetration the bond strength to the propellant and insulation is adversely effected. The burning rate of the propellant grain would also be adversely affected as well as the smooth burning rate because of poor adhesion to the embedment system.

An embedment system for use in conjunction with a crosslinked, carboranyl-catalyzed, composite-modified, double-base propellant composition differs from the propellant composition with which it is used in the following aspects: the embedment powder contains no carboranyl burning rate accelerator, no aluminium whiskers, and the particle size of the ammonium perchlorate has a considerably larger weight-mean-diameter. The other portion of the embedment system is an embedment resin portion composed of bisphenol A-epichlorohydrin (EPON 828) and epoxidized Dimer* acid (EPON 871). (Emery Industries of Cincinnati, Ohio is a major supplier of dimerized oleic acid which is marketed as Dimer* acid.) The curative presently used consists of a blend of meta-phenylenediamine, methylenedianiline, isopropyl meta-phenylenediamine and dinitrophenol as accelerator. This sytem is a diamine-cured epoxy embedment system.

The above described embedment system has several limitations and has proven to be unsatisfactory because of lower than required peel strength and a lower resistance to penetration by an absorption of catalyst and the casting solvents from the propellant composition.

Therefore, an object of this invention is to provide an embedment system for composite-modified double-base propellant composition which has superior characteristics to the diamine-cured epoxy embedment resin.

A further object of this invention is to provide a polyimide embedment system for composite-modified double-base propellant which has superior characteristics when compared to the characteristics of a diamine-cured epoxy embedment system.

SUMMARY OF THE INVENTION

The embedment system of this invention comprise an embedment granule portion in combination with an embedment resin portion that is cured with a substituted polybismaleimide prepared by the interaction or condensation of 2 moles of 1,2-bis(maleimido)ethane with one mole of triaminotriazine (melamine) at 80.degree.-100.degree. C. to yield the low-molecular weight reaction prepolymer (e.g., molecular weight range--2000-2500). This prepolymer, when incorporated into the embedment resin matrix, reacts with epoxy resins. The result is a superior embedment system for a composite-modified double-base propellant composition. The embedment system when cured has superior characteristics, and when the propellant is cast-in-place and cured to the embedment system these superior characteristics include a high peel strength and greater resistance to penetration by or absorption of carboranylmethyl propionate (catalyst) or casting solvent absorption. The superior embedment system is comprised of bisphenol A-epichlorohydrin (EPON 828) 44 parts, epoxidized Dimer acid (EPON 871) 20 parts, and cured with a condensation product comprised of 2 moles of 1,2-bis(maleimido)ethane and one mole of triaminotriazine, 36 parts.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The superior embedment system of this invention is a polyimide embodiment system for use with a composite-modified double-base propellant composition to achieve superior peel strength and resistance to penetration and absorption of the carboranylmethyl propionate and casting solvent from the propellant composition.

Table I illustrates the polyimide embedment system of this invention for use with a composite-modified double-base propellant composition.

TABLE I______________________________________POLYIMIDE EMBEDMENT SYSTEM FORCOMPOSITE-MODIFIEDDOUBLE-BASE PROPELLANTCOMPOSITION: PERCENTINGREDIENTS (BY WEIGHT)______________________________________(A) EMBEDMENT GRANULENitrocellulose 23.0Nitroglycerine 15.0Resorcinol 1.52-Nitrodiphenylamine 1.0Ammonium perchlorate (10 Micrometers*) 45.5Aluminum powder (20 Micrometers*) 14.0(B) EMBEDMENT RESINEPON 871 20EPON 828 44**CONDENSATION PRODUCT1,2-Bis(maleimido)ethane +Triaminotriazine 36______________________________________ *Weight-mean-diameter particle size **Molecular Weight Range 2000-25000

Table II illustrates a currently used embedment system for use with a composite-modified double-base propellant composition. This system is for comparison purposes to illustrate the presently used embedment system formulation comprised of the embedment granule portion and the embedment resin portion cured with a blend of meta-phenylenediamine, methylenedianiline, isopropyl meta-phenylenediamine and dinitrophenol as accelerator.

TABLE II______________________________________EMBEDMENT SYSTEM FOR COMPOSITE-MODIFIEDDOUBLE-BASE PROPELLANTCOMPOSITION: PERCENTINGREDIENTS (BY WEIGHT)______________________________________(A) EMBEDMENT GRANULENitrocellulose 23.0Nitroglycerine 15.0Resorcinol 1.52-Nitrodiphenylamine 1.0Ammonium perchlorate (10 Micrometers) 45.5Aluminum powder (20 Micrometers) 14.0(B) EMBEDMENT RESINEPON 828* 44EPON 871** 20CURING AGENT*** 36______________________________________ *Bisphenol Aepichlorohydrin **Epoxidized Dimer acid ***Blend of MetaPhenylenediamine, Methylenedianiline, Isopropyl MetaPhenylenediamine and Dinitrophenol as Accelerator

Table III sets forth data which includes the properties and test data for comparison of a diamine-cured (prior art) and an imine-cured embedment system of this invention.

TABLE III______________________________________COMPARISON OF DIAMINE- ANDIMINE-EMBEDMENT SYSTEMS DIAMINE- IMINE-PROPERTY CURED CURED______________________________________Tensile strength (PSI) 2800 4000Strain @ Max Stress (%) 55 87Tack at Ambient temp. Fair Very GoodResistance to high humidity Fair Very GoodVoid formation Few NoneWeight gain after immersionin casting solvent at 140.degree. F.for 21 days. (%) 19-20 0-5Weight gain after immersion incarboranylmethyl propionate at140.degree. F. for 21 days (%) 40-45 0-5EMBEDMENT SYSTEM-TO-PROPELLANT INTERFACEBond-in-tension (PSI) Crosshead speed2-in/min 250 360 Crosshead speed 0.02 in/ min (PL1) 5-9 18-2090.degree. Peel Crosshead speed 2.0 in/ min (PL1) 9-12 30-35______________________________________ *The mechanical properties of the two resins were tested by casting the resins into inch thick dogbone tensile specimens that were inch wide at the gage section. The specimens were tested at 77.degree. F. at a crosshead speed of 0.2 in/min. The data, listed in Table III show that th iminecured resin is markedly superior to the diaminecured resin. **Voids in the casebond area may be detected by submerging a propellant/casebond specimen in a silicone resin, pressurizing, relieving the pressure, sectioning the sample, and looking for silicon atoms by energy dispersion. To do this, oneinch cubes of propellant with casebond on one face which were obtained from a grain casting were immersed in uncured General Electric RTV silicone rubber; (this rubber wets the propellant, and, as a result, would wick into any voids). The specimens are pressurized to 1000 and 2000 psi in a container, and held for three minutes. The excess RTV rubber is removed, and the rubber is cured overnight at 125.degree. F. The cubes are microtomed, and the casebond region is examined for silicon atoms using energy dispersive Xray.

The chemical reaction equations No. 1, set forth below, illustrates the preparation of the substituted polybismaleimide (curing compound for resins) by the interaction of 2 moles 1,2-bis(maleimido)ethane with one mole of triaminotriazine. ##STR1##

Claims

1. An embedment system for use with a composite-modified double-base propellant composition, said embedment system comprised of an embedment granule portion (A) which comprises ingredients (i-vi) in percent by weight as follows: (A) embedment granule portion:

(i) nitrocellulose: 23.0;

(ii) nitroglycerine: 15.0;

(iii) resorcinol: 1.5;

(iv) 2-nitrodiphenylamine: 1.0;

(v) ammonium perchlorate (10 micrometers weight-mean-diameter particle size): 45.5; and,

(vi) aluminum powder (20 micrometers weight-mean-diameter particle size): 14.0; and,

an embedment resin portion (B) which comprises ingredients (i-iii) in percent by weight as follows:

(B) embedment resin portion:

(i) bisphenol A epichlorohydrin: 44.0;

(ii) epoxidized dimer acid: 20.0; and,

(iii) condensation product of 2 moles of 1,2-bis(maleimido)ethane with one mole of triaminotriazine: 36.0,

said condensation product prepared by reacting said 1,2-bis(maleimido)ethane and said triaminotriazine at 80.degree.-100.degree. C. to yield a low molecular weight reaction prepolymer for curing said bisphenol A-epichlorohydrin and said epoxidized dimer acid.