BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a front view of a prior art telecommunications base station electronics system having circuit packs installed therein.
FIG. 2 shows a front view of a telecommunications base station electronics system having circuit packs enclosed within circuit pack housings for EMI protection installed therein in accordance with an illustrative embodiment of the present invention.
FIG. 3 shows a top view of a circuit pack enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention.
FIG. 4 shows a side view of a circuit pack enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention.
FIG. 5 shows a top view of a circuit pack partially enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention, wherein one side of the circuit pack housing is opened.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 1 shows a front view of a prior art telecommunications base station electronics system. The prior art system of FIG. 1 includes a number of component sections (i.e., shelves), and comprises antennae 11 (two are shown), a shelf comprising filters 12, a shelf comprising amplifiers 14, and a shelf comprising circuit packs 16, as well as fan tray 13 (positioned between the shelf comprising filters 12 and the shelf comprising amplifiers 14), and fan tray 15 (positioned between the shelf comprising amplifiers 14 and the shelf comprising circuit packs 16).
As can be seen in the figure, circuit packs 16 may be installed in their corresponding shelf with use of slotted openings in the top and bottom portions of the shelf, thus allowing the circuit packs to be slid into place. Also, as is typical, the back sides of many of the included components may be connected to either a cabling harness or, preferably, a PWB (Printed Wiring Board) backplane (which is not visible in the figure). Note that in order to provide EMI protection for each of circuit packs 16, a significant amount of space is required between each adjacent pair of circuit packs 16, thereby limiting the number of such circuit packs which may be included in the shelf and/or increasing the bulkiness of the resultant system.
FIG. 2 shows a front view of a telecommunications base station electronics system having circuit packs enclosed within circuit pack housings for EMI protection installed therein in accordance with an illustrative embodiment of the present invention. The illustrative telecommunications base station electronics system of FIG. 2 includes a number of component sections (i.e., shelves), and comprises antennae 21 (two are shown), a shelf comprising filters 22, a shelf comprising amplifiers 24, and a shelf comprising circuit packs 26, as well as fan tray 23 (positioned between the shelf comprising filters 22 and the shelf comprising amplifiers 24), and fan tray 25 (positioned between the shelf comprising amplifiers 24 and the shelf comprising circuit packs 26).
Although not visible, it may be assumed that the back sides of many of these components are advantageously connected to a PWB (Printed Wiring Board) backplane. Moreover, in order to provide EMI protection in accordance with the principles of the present invention, each of circuit packs 26 is advantageously enclosed in a corresponding circuit pack housing 27, which is constructed in accordance with an illustrative embodiment of the present invention. Also, as can be seen in the figure, circuit packs 26, together with their corresponding circuit pack housings 27, are advantageously installed in their corresponding shelf with use of slotted openings in the top and bottom portions of the shelf, thus allowing the circuit packs (together with their corresponding circuit pack housings) to be slid into place.
FIG. 3 shows a top view of a circuit pack enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention. As shown in the figure, circuit pack 30, which includes circuit pack connector 31, is fully enclosed within illustrative circuit pack housing 32. Note that circuit pack connector 31 is advantageously provided to connect circuit pack 30 to the system backplane in order to energize the circuit pack. (Also shown in the figure is corresponding backplane connector 38 into which circuit pack connector 31 is to be inserted, as well as backplane/system ground 39.)
Circuit pack housing 32 comprises plastic casing 33, which advantageously includes two “living” hinges 34 molded therein. (See description of FIG. 5 below for a detailed discussion of “living” hinges 34.) Circuit pack housing 32 also advantageously comprises metalized inner surface 35, which advantageously has a plurality of metalized circuit pack grounding tabs 36 physically attached and electrically connected thereto. Each of metalized circuit pack grounding tabs 36 are advantageously positioned such that they provide grounding of circuit pack 30 at a corresponding plurality of locations. That is, grounding tabs 36 are advantageously located so that, when circuit pack housing 32 is closed around circuit pack 30, grounding tabs 36 make physical and electrical contact with grounding paths provided on the surface of circuit pack 30.
In accordance with the illustrative embodiment of the present invention shown in FIG. 3, circuit pack housing 32 also comprises a plurality (two are shown) of protruding grounding and sealing tabs 37 which are advantageously flexible so that they can be operated in order to affix circuit pack connector 31 into backplane connector 39. Moreover, grounding and sealing tabs 37 are advantageously metalized and electrically connected to metalized inner surface 35, in order to advantageously connect and seal the circuit pack ground to backplane/system ground 39 when operated to affix circuit pack connector 31 into backplane connector 39. Such a sealing feature advantageously prevents corrosion from taking place.
In accordance with one illustrative embodiment of the present invention, the plastic casing of the circuit pack housing may, for example, comprise a nylon-based plastic such as, for example, grilamid®. (Grilamid® is a nylon-based polyamide 12 injection moulding and extrusion material product from, and a registered trademark of, EMS-Chemie (Asia) Ltd, and is fully familiar to those skilled in the art.) Also, in accordance with one illustrative embodiment of the present invention, the area surrounding circuit pack connecter 31 may be advantageously filled with silicone gel in order to provide improved sealing between circuit pack connector 31 and backplane connector 39.
Additionally, in accordance with one illustrative embodiment of the present invention, metalized circuit pack grounding tabs 36 may comprise tabs made of metalized plastic. That is, as is well known to those skilled in the art, metal may be sprayed onto a plastic material so that the material advantageously becomes electrically conducting, and yet still retains many of the advantages of a plastic material (such as, for example, its light weight).
FIG. 4 shows a side view of a circuit pack enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention. In particular, the figure shows circuit pack 30 enclosed within circuit pack housing 32.
FIG. 5 shows a top view of a circuit pack partially enclosed within a circuit pack housing for EMI protection in accordance with an illustrative embodiment of the present invention, wherein one side of the circuit pack housing is opened. In particular, as shown in the figure, circuit pack 30 is partially enclosed within illustrative circuit pack housing 32, which has one of its two sides in an opened position with respect to circuit pack 30.
As can be clearly seen in FIG. 5, illustrative circuit pack housing 32 comprises plastic casing 33 which advantageously includes two “living” hinges 34 molded therein. Specifically, these “living” hinges may, for example, comprise a curved notch molded directly into the plastic of plastic casing 33, thereby advantageously allowing that portion of the plastic casing itself to be operable as a hinge. The use of such “living’ hinges, fully familiar to those of ordinary skill in the art, advantageously minimizes the cost of the circuit pack housing as well as the associated assembly and installation time.
In accordance with other illustrative embodiments of the present invention, separate physical hinges (i.e., mechanical devices which are attached to plastic casing 33) may alternatively be used. In addition, although the illustrative embodiment of the present invention as shown herein comprises two “living” hinges, in accordance with other illustrative embodiments of the present invention, a different number of hinges—whether “living” hinges or separate physical hinges—may be used. For example, it will be obvious to those of ordinary skill in the art that a circuit pack housing with just a single operable hinge may be devised in accordance with the principles of the present invention.
In accordance with one illustrative embodiment of the present invention, the illustrative circuit pack housing shown in FIG. 5 also advantageously comprises latch 51 and corresponding latch receptacle 52, which together operate to enable circuit pack housing 32 to completely enclose circuit pack 30 when closed (i.e., when latch 51 is inserted into latch receptacle 52). Thus, when closed, circuit pack housing 32 serves to seal circuit packet 30, and, in accordance with the principles of the present invention, thereby serves to protect the circuit pack from EMI (e.g., as a result of grounded metalized inner surface 35, which fully surrounds circuit pack 30 when circuit pack housing 32 is fully closed). Advantageously, the latching mechanism (i.e., latch 51 and latch receptacle 52) may, like the “living” hinges described above, be molded directly into the plastic of plastic casing 33. This also advantageously minimizes the cost of the circuit pack housing as well as the associated assembly and installation time. However; in accordance with other illustrative embodiments of the present invention, separate physical latching mechanisms (i.e., mechanical devices which are attached to plastic casing 33) may alternatively be used.
Addendum to the Detailed Description
It should be noted that all of the preceding discussion merely illustrates the general principles of the invention. It will be appreciated that those skilled in the art will be able to devise various other arrangements, which, although not explicitly described or shown herein, embody the principles of the invention, and are included within its spirit and scope. In addition, all examples and conditional language recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. It is also intended that such equivalents include both currently known equivalents as well as equivalents developed in the future—i.e., any elements developed that perform the same function, regardless of structure.
Patent Application
20080080158
