Claims
- 1. A board level EMI shield system comprising:
a printed circuit board; a conductive stiffener disposed on said printed circuit board, said stiffener also being coextensive with at least a portion of said printed circuit board with a portion of said stiffener extending beyond an edge of said printed circuit board with said extended portion including two rows of parallel slots; at least one EMI shield strip disposed so as to have a portion thereof engaging the edges of said slots with another portion thereof extending through a slot in the opposing parallel row of slots.
- 2. The system of claim 1 further including a printed circuit card cartridge which is electrically connected to circuits on said printed circuit board and which includes a conductive bezel which houses a conductive EMI shield plate attached to said printed circuit card, said shield plate including a tab which electrically engages said shield strip portion which extends through said slot in said parallel row of slots.
- 3. The system of claim 2 further including an electrically conductive link between said bezel and said circuit card EMI shield plate.
Parent Case Info
[0001] This application is a divisional of U.S. patent application Ser. No. 09/941,809 filed on Aug. 29, 2001, entitled “EMI Spring Configuration”, the entirety of which is hereby incorporated herein by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09941809 |
Aug 2001 |
US |
Child |
10345769 |
Jan 2003 |
US |