The throughput of communications, between multiple computing devices, that are transmitted via network connections continues to increase. For example, modern networking hardware enables physically separate computing devices to communicate with one another orders of magnitude faster than was possible with prior generations of networking hardware. Furthermore, high-speed network communication capabilities are being made available to a greater number of people, both in the locations where people work, and in their homes. As a result, an increasing amount of data and services can be meaningfully provided via such network communications. For example, audio and video entertainment can now be stored in a single, centralized location and accessed by multiple individuals “on-demand” by streaming such content, via network communications, from the centralized location to the computing devices utilized by those multiple individuals at their respective locations. Similarly, a greater variety of services can be provided over network communications including, for example, services that were traditionally executed locally on individual computing devices.
To provide such data and services, via network communications, from a centralized location, the centralized location typically comprises hundreds or thousands of computing devices, typically mounted in vertically oriented racks. Such a collection of computing devices, as well as the associated hardware necessary to support such computing devices, and the physical structure that houses the computing devices and associated hardware, is traditionally referred to as a “datacenter”. With the increasing availability of high-speed network communication capabilities, and thus the increasing provision of data and services from centralized locations, as well as the traditional utilizations of datacenters, such as the provision of advanced computing services and massive amounts of computing processing capability, the size and quantity of datacenters continues to increase.
Data centers often consume large quantities of electrical power, both to power the computing devices and associated hardware, as well as to provide environmental control, most notably cooling capability, to the computing devices. The processors and other hardware components of a computing device generate heat as part of their normal operation and, when such heat generation is multiplied across the myriad of such processors and hardware components that are present in the computing devices of the data center, the amount of heat that can be generated within the data center can be significant. Traditionally, computing devices in a data center are mounted in vertically oriented racks of such computing devices which are then aligned into rows with aisles between them. Typically, the rows of the racks of computing devices are oriented such that the backs of the computing devices of one row face the backs of the computing devices of another row. Most computing devices are cooled via airflow over the processing components, and other components that need cooling, which airflow is then directed out the back of the computing device. Consequently, by orienting the racks of the computing devices into rows where the backs of the computing devices face each other, the aisle between them becomes a “hot aisle” into which the heat produced by the processing components of those computing devices is exhausted. By contrast, the aisle between the rows of racks of computing devices into which the front and sides of those computing devices faces becomes a “cold aisle” from which air is drawn through the computing devices to be exhausted into the “hot aisle”.
In one embodiment, racks of computing devices can be oriented in an “enclosing” arrangement in which their arrangement fully encloses a space. The space can be fully enclosed by the edges of the racks themselves or it can be fully enclosed by the edges of the racks themselves in combination with structural features of the data center including, for example, a wall, a door, or combinations thereof. The enclosing racks can be arranged such that the fully enclosed space is the hot aisle, with the air vented from the computing devices of the racks being directed into the fully enclosed space, or the enclosing racks can be arranged such that the fully enclosed space is the cold aisle, with the air utilized to cool the computing devices of the racks being drawn from the cold aisle.
In another embodiment, one or more fans, or other air moving equipment, can be oriented at the top, bottom, or both vertical ends of the fully enclosed space. Because the space is fully enclosed, a reduced number of fans can be utilized to draw air through the computing devices of the racks, thereby cooling them. The computing devices themselves can be actively cooled, such as by having their own fans, or can be passively cooled strictly by the movement of air facilitated by the fans, or other air moving equipment, oriented at the vertical ends of the fully enclosed space. To maintain proper air pressure throughout the fully enclosed space the fans of individual computing devices, which are positioned at different heights in the racks, can be individually varied or other airflow controls can be provided on the individual computing devices, such as, for example, impedance screens.
In a further embodiment, the enclosing arrangement of the racks enables shorter cabling runs between the racks. Cables between the racks can be routed into established cable “raceways” that can be oriented around the periphery of the enclosed space, such as for an orientation of the computing devices where the connections are made on the sides of the computing devices that face inward into the enclosed space, or the established cable raceways can be oriented around the periphery of the rack, such as for an orientation of the computing devices where the connections are made on the sides of the computing devices that face outward away from the enclosed space.
In a still further embodiment, computing devices that are to be positioned in the racks that are arranged in an enclosing manner can be designed to draw air from the sides of those computing devices, thereby avoiding having to draw air across removable devices that are typically positioned at the front of computing devices and which can limit the flow of air into the computing devices when such air is drawn from the front. By drawing air from the sides of the computing devices the airflow can more directly pass over those processing components that most need cooling and can exit, in the traditional manner, out of the back of the computing device. The enclosing arrangement of the racks provides for interstitial space between the racks, thereby facilitating the side-cooling of computing devices positioned within those racks. Alternatively, or in addition, the interstitial space can also be utilized for cabling, with such cables being connected to those sides of the computing devices facing tangentially to the enclosed space.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
Additional features and advantages will be made apparent from the following detailed description that proceeds with reference to the accompanying drawings.
The following detailed description may be best understood when taken in conjunction with the accompanying drawings, of which:
The following description relates to an enclosing arrangement of racks of computing devices, such as would commonly be found in a datacenter or any other like facility. The enclosing arrangement of racks fully encloses a space, either solely by the racks themselves, or in conjunction with structural features of the datacenter, such as walls and doors. The computing devices in the racks can be oriented to either vent exhaust air, which has already been utilized to cool relevant computing components and is, therefore, hot, into the enclosed space or, conversely, the computing devices in the racks can be oriented to draw air from the enclosed space, which air, since it has not yet been utilized to cool computing components is, therefore, cold. One or more fans can be positioned at the vertical extremities of the enclosed space, such as in the floor, in the ceiling, or combinations thereof, to either draw hot air out of the enclosed space or to pump cold air into the enclosed space. Individual computing devices positioned in the enclosing arrangement of racks can have their own fans, or can be passively cooled by the fans at the vertical extremities of the enclosed space which can draw air through the computing devices, thereby cooling the relevant computing components. To maintain proper pressurization across a vertical cross-section of the enclosed space, specific ones of the computing devices can have their fans adjusted based on their vertical position within the racks or can have passive airflow adjustments added, such as, for example, impedance screens. The enclosing arrangement of racks can provide for shorter cabling runs between individual ones of the computing devices in the racks, thereby decreasing communication delays and the cost associated with such cabling, such as by enabling the use of less-expensive lower-power cables and interfaces. The cables can be grouped into “raceways” which can travel around the outside periphery of the enclosed space or the outside periphery of the enclosing arrangement of racks. Additionally, computing devices can be designed to either draw or vent air from their sides to provide more efficient cooling of computing components inside of those computing devices since an enclosing arrangement of racks provides for interstitial space between the racks from which such air can be drawn or into which such air can be vented.
For purposes of illustration, the techniques described herein make reference to existing and known facilities, such as datacenters, within which the described techniques can be utilized. Such references, however, are strictly exemplary and are not intended to limit the mechanisms described to the specific examples provided. For example, the enclosing arrangement of racks described can be utilized in any facility or context in which multiple computing devices are co-located. Similarly, for purposes of providing concrete examples to elucidate the descriptions provided, the illustrations referenced herein specifically identify a “cold aisle” and a “hot aisle” which comprise, respectively, cold air to be utilized to cool computing components and hot air that has already been utilized to cool computing components. Such references, however, are strictly exemplary and are not intended to limit the mechanisms described to the specific examples provided. Instead, any area labeled as a “hot aisle” can likewise be utilized as a “cold aisle”, and vice versa, merely by reorienting the computing devices or reversing the airflow through the computing devices.
Turning to
The enclosing arrangement 100 shown in
In one embodiment, one or more fans, such as the fan 130, can be installed in the vertical extremities of the enclosed space 140, such as in the ceiling above the enclosed space 140, which represents the top of the enclosed space 140, the floor below the enclosed space 140, which represents the bottom of the enclosed space 140, or combinations thereof. For example, if the enclosed space is the hot aisle, then one or more fans, such as the fan 130, can be installed in the ceiling above the enclosed space 140 to vent out the hot air in the enclosed space 140. As another example, if the enclosed space is the cold aisle, then one or more fans, such as the fan 130, can be installed in the floor below the closed space 140 to draw in cooled air. A single fan 130 is illustrated in
The fan 130 can, in one embodiment, provide sufficient air movement that the individual computing devices in the racks 111, 112, 113, 114, 115, 116, 117 and 118 need not utilize their own fans to draw air across the various computing components that require cooling. For example, in the embodiment illustrated in
The racks of computing devices, such as the racks 111, 112, 113, 114, 115, 116, 117 and 118, can be several feet high, often reaching close to the ceiling of the space in which those racks are positioned. Consequently, in one embodiment, the air movement through individual computing devices in the racks 111, 112, 113, 114, 115, 116, 117 and 118 can be individually controlled to provide a desirable air pressure throughout the vertical column of air in the enclosed space 140. For example, if the enclosed space 140 was the hot aisle, with the fan 130 mounted in the ceiling above the enclosed space 140 and drawing air out from the enclosed space 140, then individual computing devices positioned near the top of the racks 111, 112, 113, 114, 115, 116, 117 and 118 need not operate their own fans as intensively, while the individual computing devices positioned near the bottom of the racks 111, 112, 113, 114, 115, 116, 117 and 118 may need to operate their own fans at a higher rate of speed. Alternatively, utilizing the same example, the individual computing devices positioned near the top of the racks 111, 112, 113, 114, 115, 116, 117 and 118 can have impedance screens installed to restrict the airflow in to, or out of, such computing devices, while the individual computing devices positioned near the bottom of the racks 111, 112, 113, 114, 115, 116, 117 and 118 can have no such impedance screens installed. As will be recognized by those skilled in the art, in another embodiment, where the enclosed space 140 is the cold aisle, and the fan 130 pushes cold air into the enclosed space 140, the above examples can be reversed.
In another embodiment, air can be mixed between the enclosed space 140 and the space 150 outside of the enclosing arrangement 100. For example, if the enclosed space 140 is the hot aisle, then air from the hot aisle 140 can be returned into the cold aisle 150 to be subsequently cooled and re-drawn through the computing devices of the racks of the enclosing arrangement 100. In such an embodiment, the fan 130 can represent a “mixing chamber” or other like device that can be installed near the top of the racks of the enclosing arrangement 100. As will be recognized by those skilled in the art, such a mixing chamber can also operate if the enclosed space 140 is the cold aisle, and the space 150 outside of the enclosing arrangement 100 is the hot aisle.
Traditionally, racks of computing devices, such as the racks 111, 112, 113, 114, 115, 116, 117 and 118, are square or rectangular in nature, having approximately 90 degree angles at their edges. Consequently, once such racks of computing devices are oriented in an enclosing arrangement, such as the enclosing arrangement 100 shown in
Turning to
Thus, as can be seen, an enclosing arrangement can be generated from at least three racks of computing devices or at least two racks of computing devices and at least one other additional structural element, such as a structural element of the data center within which these racks of computing devices are positioned. Turning to
Another exemplary enclosing arrangement 302 is also shown in
As can be seen from the previously described Figures, at least three racks of computing devices, or at least two racks of computing devices and at least one structural element, can be arranged in an enclosing arrangement that can enclose the space that can act as either a hot aisle or a cold aisle, and that can have one or more fans positioned in at least one vertical extremity of such an enclosed space, such as in the floor or ceiling. In one embodiment, a threshold number of computing racks can be reached, beyond which the space enclosed by an enclosing arrangement of that many computing racks can simply become too large to maintain adequate, or proper, air pressure within the enclosed space. For example, if the enclosed space represents a hot aisle, then the air pressure within such a hot aisle can be such that the cold aisle outside of the enclosing arrangement has a higher air pressure to facilitate the movement of air across computing components that require cooling. Additionally, the air pressure within such a hot aisle can be maintained such that any variances in a vertical cross-section of such a hot aisle can be addressed through individual control of the fans, or other active air movement components, of individual computing devices positioned at different vertical levels in the racks, or can be addressed through individual, passive air movement components, such as impedance screens, which can be applied to the individual computing devices positioned at different vertical levels in the racks. In one embodiment, such impedance screens can be applied to either the intake vents, exhaust vents, or combinations thereof. Similarly, as another example, if the enclosed space represents a cold aisle, then the air pressure within such a cold aisle can be greater than the air pressure of the hot aisle outside of the enclosing arrangement to, again, facilitate the movement of air across computing components that require cooling.
Turning to
Turning to
Alternatively, in another embodiment, the computing devices can be positioned in the racks of the enclosing arrangement 500 such that the side of the computing devices on which the connectors for cables are located can be oriented to face outward away from the enclosed space 540 and into the space 550. In such an alternative embodiment, the cables can, again, be routed vertically along the side of the racks 511, 512, 513, 514, 515, 516, 517 and 518 that faces outward into the space 550 until they reach a cable raceway 570. Again, as with the cable raceway 560, the cable raceway 570 can be positioned at any number of vertical heights including, for example, the same vertical height as is traditionally used by other cable raceways in the data center in which the enclosing arrangement 500 is located. The cables can then be routed along the cable raceway 570 until they reach a rack containing the computing device to which those cables are to be connected, at which point they can travel vertically along that rack until they reach the location of the computing device itself.
In another embodiment, not specifically illustrated in
Turning to
Traditional cooling of such a computing device requires drawing air past the front access devices and across the computing components of the motherboard 630 that require cooling, and then venting such air out the back of the computing device. Such traditional cooling is implemented because, as indicated previously, racks of computing devices are traditionally aligned in rows such that there is no interstitial space between the sides of the racks of computing devices. However, as indicated previously, in enclosing arrangements, such as the enclosing arrangements described in detail above, interstitial space exists between the sides of the racks of the computing devices such that a computing device can draw air from that interstitial space to aid in cooling.
In one embodiment, such as that illustrated by the computing device 600 of
Because the primary airflow 651 and 652 is not impeded by the front access devices 621, 622, 623 and 624, a reduced amount of fans, or reduced fan energy, can be utilized while still maintaining adequate cooling of the computing components on the motherboard 630. Similarly, because the primary airflow 651 and 652 is not drawn from the front of the computing device and across the front access devices 621, 622, 623 and 624, it is not pre-heated by those devices, which, as will be recognized by those skilled in the art, also can generate heat. As a result, the primary airflow 651 and 652 allows for cooler air to reach the motherboard 630, thereby further making such cooling more efficient. Additionally, because of such unobstructed airflow, the pressure drop between the hot aisle and the cold aisle can be lessened. As yet another benefit, by drawing, or venting, air from the sides of the computing device, such as via the air vents 611 and 612, a greater quantity of components can be positioned on the motherboard 630 within a direct airflow path. Consequently, the placement of components need not be as critical, since a greater quantity of components can receive more efficient cooling, while the density of the components on the motherboard 630 need not change. The placement of components on a motherboard, such as the motherboard 630, that can have the benefit of side cooling can also enable such components to be more easily accessible, such as for maintenance or replacement. For example, the air vents 611 and 612 can be removable, hinged, or otherwise able to provide access to the interior of the computing device 600 from its sides. Consequently, in such an embodiment, the front access devices 621, 622, 623 and 624 can be easily and efficiently serviced from the front of the computing device 600, while the motherboard 630, and associated components, or components located proximate thereto, can be easily and efficiently services from the sides of the computing device 600.
In one embodiment, only some computing devices within a rack of computing devices can be designed in the manner of the computing device 600 of
In another embodiment, in addition to the air vents 611 and 612, or instead of, the computing device 600 can further comprise connectors located on its sides such that cabling can be routed vertically along the sides of a rack of computing devices, thereby utilizing the interstitial space between racks of computing devices, which are arranged in an enclosing arrangement, for cabling. In such an embodiment, a cable raceway, such as those illustrated in
As can be seen from the above descriptions, enclosing arrangements of racks of computing devices have been enumerated. In view of the many possible variations of the subject matter described herein, we claim as our invention all such embodiments as may come within the scope of the following claims and equivalents thereto.