The disclosure generally relates to enclosures, and particularly, to an enclosure that can provide power to an electronic device.
Environmental concerns require that attention be paid to the environmental impact of a product. However, the design of the enclosure of many products is only focused on ornamental and weight considerations, and environmentally-conscious consumers may not be satisfied.
Therefore, it is desirable to provide an enclosure which can overcome the above-mentioned problems.
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
In an alternative embodiment, the electronic device 1 is a portable smart terminal, such as a cellular phone or a music player.
Referring to
Each of the thin film solar cells 100 includes a substrate 110, an n-type semiconductor layer 112 and a p-type semiconductor layer 114 formed above the substrate 110, an anode 116b formed on the p-type semiconductor layer 114, and a cathode 116a formed on the n-type semiconductor layer 112. The light passes through the protection layer 102 and strikes an interface between the n-type semiconductor layer 112 and the p-type semiconductor layer 114 to activate a number of electron-hole pairs. The electrons and holes are respectively collected at the n-type semiconductor layer 112 and at the p-type semiconductor layer 114, to generate a voltage. The voltage is applied to the power module 12 via the anode 116b and the cathode 116a. In this embodiment, the substrate 110 is made of flexible material. The n-type semiconductor layer 112 and the p-type semiconductor layer 114 are made of amorphous silicon. The thin film solar cells 100 are attached to the heat dissipation layer 104 via the substrate 110.
The thin film solar cells 100 are arranged between the heat dissipation layer 104 and the protection layer 102. The heat dissipation layer 104 dissipates any heat generated by the thin film solar cells 100, to keep the electronic device 1 at an acceptable temperature. The heat dissipation layer 104 is made of a lightweight material with high thermal conductivity. In this embodiment, the heat dissipation layer 104 is made of metal alloy or graphite. The thin film solar cells 100 are adhesively attached to the heat dissipation layer 104. In an alternative embodiment, the n-type semiconductor layer 112 and the p-type semiconductor layer 114 can be directly formed on the heat dissipation layer 104, and the substrate 110 of the thin film solar cells 100 can be omitted.
The power module 12 connects with the anode 116b and the cathode 116a to store and distribute the electrical energy converted by the thin film solar cells 100 to components of the electronic device 1. The power module 12 also can also be connected with an external power source or the back up battery 13 for providing uninterruptible power to the electronic device 1.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Number | Date | Country | Kind |
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100141164 | Nov 2011 | TW | national |