Claims
- 1. An enclosure for thermally protecting one or more heat sensitive devices from a high temperature environment, said enclosure comprising:
- an outer housing having interior surfaces defining an interior cavity, said interior cavity for containing said one or more heat sensitive devices;
- a composition comprising between about 10 percent and about 100 percent by weight of a bicarbonate compound;
- wherein said composition occupies at least a portion of said interior cavity and substantially encloses said one or more heat sensitive devices; and
- wherein said bicarbonate compound exhibits endothermic decomposition when said enclosure is subjected to said high temperature environment, and wherein said composition absorbs heat from said high temperature environment during said endothermic decomposition of said bicarbonate compound.
- 2. The enclosure according to claim 1 wherein said one or more heat sensitive devices is a solid state electronic memory device for storing data which is to be recovered from each of said solid state electronic memory devices following exposure of said enclosure to said high temperature environment.
- 3. The enclosure according to claim 1 further comprising a thermal insulating liner between said composition and said interior surfaces of said interior cavity.
- 4. The enclosure according to claim 1, further comprising a means for venting carbon dioxide from the enclosure.
- 5. The enclosure according to claim 1 wherein said bicarbonate compound comprises bicarbonate of soda.
- 6. The enclosure according to claim 5 wherein said bicarbonate of soda is in powdered form.
Parent Case Info
This application is a continuation of and claims priority from Ser. No. 08/963,879 filed Nov. 4, 1997, now U.S. Pat. No. 5,932,839, titled `Method for Dissipating Heat Away From a Heat Sensitive Device Using Bicarbonate Compositions`, the entire specification of which is incorporated herein by reference.
US Referenced Citations (12)
Foreign Referenced Citations (1)
Number |
Date |
Country |
03 174481 |
Jul 1991 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
963879 |
Nov 1997 |
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