1. Technical Field
The present disclosure relates to an enclosure of an electronic device.
2. Description of Related Art
For the enclosure of a typical electronic device, electromagnetic interference (EMI) is a common problem during operation. Commonly, through holes are defined in the enclosure for aiding in heat dissipation, and though sizes and placement of the holes are chosen and arranged to help avoid EMI, problems from EMI still occur.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The ventilation plate 3 includes a plurality of tabs 30 and a plurality of crisscrossed connection bars 32. Each tab 30 is round shaped, and extending through the center of the corresponding connection bar 32. A plurality of through holes 33 are defined by the connection bars 32. A tab 30 is formed at each of the connection bars 32 bounding each one of the through holes 33. The tabs 30 are substantially perpendicular to the panel of a grid 2 formed by the connection bars 32 to elongate a path electromagnetic signals must travel to pass through the ventilation plate 3. In the embodiment, every two adjacent tabs 30 bounding a through hole 33 are perpendicular to each other, and every two opposite tabs in a hole are parallel with each other. In other embodiments, the tabs 30 may be set at other angles, such as 30 degrees. In other words, the tabs 30 are substantially angled from the plane of the grid 2.
In other words, the plate 3 defines the plurality of through holes 33. Each through hole 33 is bounded by four tabs 30 which are located on different planes, and connecting bars 32. The four tabs 30 are round and connected together by the connecting bars 32, and perpendicular to the plate 3. As a result, heat inside the enclosure can be vented to the outside through the through holes 3.
Referring to
Furthermore, in other embodiments, the size and shape of the tabs 30 and the connection bars 32 can be changed according to need. When the tabs 4 are configured with a different size and a different shape, the EMI shielding effectiveness of the enclosure 1 may be different.
The foregoing description of the embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above everything. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those of ordinary skills in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
Number | Date | Country | Kind |
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99118302 | Jun 2010 | TW | national |
Relevant subject matter is disclosed in the co-pending U.S. patent applications (Attorney Docket Nos. US32221, US32384, US32670, US32671, US32874, and US33505) having the same title and assigned to the same assignee as named herein.