1. Technical Field
The present disclosure relates to an enclosure of an electronic device.
2. Description of Related Art
For the enclosure of a typical electronic device, electromagnetic interference (EMI) is a common problem during operation. Commonly, through holes are defined in the enclosure for aiding in heat dissipation, and though sizes and placement of the holes are chosen and arranged to help avoid EMI, problems from EMI still occur.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The plate 2 defines a plurality of through holes 3, with a plurality of shields 4 extending from the edges bounding the through holes 3 respectively. Each shield 4 is a hollow truncated cone. A bottom side of the shield 4 matches the through hole 3 in diameter. A top side of the shield 4 is smaller than the bottom side. A sidewall of the shield 4 between the top and bottom sides is depressed towards the through hole 3, to form a smooth curved surface. Heat inside the enclosure can be vented to the outside through the through holes 3 and the space bounded by the shields 4.
Referring to
In other embodiments, the size of the shield 4 can be changed according to need. When the shields 4 are configured with a different size, the EMI shielding effectiveness of the enclosure may be different. In addition, shape of the through holes 3 need not be round as shown in the figures.
The foregoing description of the embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above everything. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those of ordinary skills in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
Number | Date | Country | Kind |
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99118297 | Jun 2010 | TW | national |
Relevant subject matter is disclosed in the co-pending U.S. patent applications (Attorney Docket No. US32221, No. US32384, No. US32671, No. US32874, No. US32875, and No. US33505) having the same title, which are assigned to the same assignee as named herein.