Patent Application
20110266047
Relevant subject matter is disclosed in the co-pending U.S. patent applications (Attorney Docket No. US32221, No. US32670, No. US32671, No. US32874, No. US32875, and No. US33505) having the same title, which are assigned to the same assignee as named herein.
1. Technical Field
The present disclosure relates to an enclosure of an electronic device.
2. Description of Related Art
For the enclosure of a typical electronic device, electromagnetic interference (EMI) is a common problem during operation. Commonly, through holes are defined in the enclosure for aiding in heat dissipation, and though sizes and placement of the holes are chosen and arranged to help avoid EMI, problems from EMI still occur.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The plate 2 defines a plurality of through holes 3. A first shield 4 extends from an edge partially bounding each through hole 3 towards a first direction. A second shield 5 extends from the edge partially bounding each through hole 3 towards a second direction opposite to the first direction. Each first shield 4 and second shield 5 are partially dome-shaped. In the present embodiment, each of the first shields 4 and the second shields 5 is substantially shaped as a quarter of a spherical surface. Each through hole 3 is round in shape, and includes a first portion, a second portion, and a third portion between the first and second portions. The first portion is covered by the first shield 4. The second portion is covered by the second shield 5. The third portion is not covered by the first shield 4 and the second shield 5. In other words, the first shield 4 and the second shield 5 cannot fully cover the through hole 3. As a result, heat inside the enclosure can be vented to the outside through the through holes 3.
Referring to
In other embodiments, the size of the shields 4 and 5 can be changed according to need. When the shields 4 and 5 are configured with a different size, the EMI shielding effectiveness of the enclosure may be different. In addition, shape of the through holes 3 need not be round as shown in the figures.
The foregoing description of the embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above everything. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those of ordinary skills in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.
| Number | Date | Country | Kind |
|---|---|---|---|
| 99113770 | Apr 2010 | TW | national |
