The present invention relates to an endoscope.
An imaging device mounted on a distal end portion of an insertion part of an endoscope generally comprises a solid-state imaging element (image sensor) and a circuit board on which the solid-state imaging element is mounted, and a plurality of cables inserted through the insertion part are connected to the circuit board.
In addition, a configuration in which a cable is directly connected to a solid-state imaging element without using a circuit board has also been proposed. This makes it possible to further reduce a size of the distal end portion and reduce the number of parts (cost reduction).
For example, JP2017-046854A discloses an endoscope comprising: a lens unit that houses a plurality of lenses in a lens support member; an imaging element having an imaging surface covered by an element cover glass; a resin for adhesion that fixes the lens unit in which optical axes of the plurality of lenses are aligned with the center of the imaging surface and the element cover glass; a distal end portion whose maximum outer diameter is in a range of a finite diameter to 1.8 nm, which corresponds to a diameter of a circumscribed circle of a substrate of the imaging element; a mold portion that covers and fixes at least a part of the lens unit and the imaging element with a mold resin; and a tubular sheath that is formed to have the same outer diameter as the distal end portion and covers at least a part of the mold portion so as to be connected to the mold portion.
JP2017-046854A discloses that a plurality of transmission cables are connected to a surface of the imaging element opposite to the imaging surface, and the transmission cables are covered and fixed with the mold resin.
An endoscope needs to be disinfected and/or sterilized using a chemical after use.
However, in the configuration in which the transmission cable is covered and fixed with the mold resin as in the endoscope of JP2017-046854A, the mold resin is vulnerable to chemicals, and thus, repeated disinfection and/or sterilization may cause deterioration of the mold resin due to chemicals and damage to the transmission cable. Further, in a case where the mold resin deteriorates, the transmission cable cannot be fixed with the mold resin. Therefore, in a case where the insertion part is bent, the transmission cable may be pulled and a load may be applied to a solder portion at an end portion of the cable, resulting in disconnection.
In addition, in the configuration in which the transmission cable is covered and fixed with the mold resin, there is a problem that it is complicated to connect shield wires of the plurality of transmission cables to each other.
An object of the present invention is to solve such a problem and to provide an endoscope having high chemical resistance and easy wiring.
The present invention solves the problems by the following configurations.
[1] An endoscope comprising:
an imaging device provided at a distal end portion of an insertion part to be inserted into a subject,
in which the imaging device includes
the pipe-shaped member has a cutout portion on at least a part of a peripheral surface thereof, and
at an end portion of the cable bundle on the solid-state imaging element side, at least one of each shield wire of the one or more coaxial cables or the collective shield wire is joined to the pipe-shaped member by at least one of solder, metal braze, or metal paste in the cutout portion of the pipe-shaped member.
[2] The endoscope according to [1],
in which at the end portion of the cable bundle on the solid-state imaging element side, at least two of each shield wire of the one or more coaxial cables and the collective shield wire are joined to the pipe-shaped member by at least one of solder, metal braze, or metal paste in the cutout portion of the pipe-shaped member.
[3] The endoscope according to [1] or [2], further comprising:
a case member that encloses the solid-state imaging element,
in which the pipe-shaped member is joined to the case member.
[4] The endoscope according to [3],
in which the pipe-shaped member is joined to the case member by one or more of joining using at least one of solder, metal braze, or metal paste, welding, and pressure welding.
[5] The endoscope according to [3] or [4], further comprising:
a lens barrel disposed on the image receiving surface side of the solid-state imaging element,
in which the lens barrel is joined to the case member.
[6] The endoscope according to [5],
in which the lens barrel is joined to the case member via a sensor holder that holds the lens barrel.
[7] The endoscope according to [5] or [6],
in which the lens barrel or the sensor holder is joined to the case member by one or more of joining using at least one of solder, metal braze, or metal paste, welding, and pressure welding.
[8] The endoscope according to any one of [1] to [3], further comprising:
a case member that encloses the solid-state imaging element,
in which the pipe-shaped member and the case member are integrally formed.
[9] The endoscope according to any one of [3] to [8],
in which the case member encloses at least a part of the pipe-shaped member, and has an opening portion corresponding to at least at a position the cutout portion of the pipe-shaped member.
[10] The endoscope according to any one of [1] to [9],
in which the pipe-shaped member has an opening through which the cable bundle is inserted.
According to the present invention, it is possible to provide an endoscope having high chemical resistance and easy wiring.
Hereinafter, embodiments of an endoscope of the present invention will be described with reference to the drawings.
Description of constituents described below may be made based on a typical embodiment of the present invention, but the present invention is not limited to such an embodiment. In the drawings of the present specification, the scale of each part is appropriately changed and shown in order to facilitate visual recognition.
In the present specification, a numerical range represented by “to” means a range including numerical values before and after “to” as a lower limit value and an upper limit value.
The endoscope of the embodiment of the present invention comprises: an imaging device provided at a distal end portion of an insertion part to be inserted into a subject. The imaging device includes a solid-state imaging element having an image receiving surface which is disposed to intersect with a longitudinal direction of the insertion part and photoelectrically converting an optical image formed on the image receiving surface, a cable bundle including one or more coaxial cables respectively connected to one or more connection terminals provided on a surface of the solid-state imaging element opposite to the image receiving surface, and a collective shield wire that covers an outer periphery of the one or more coaxial cables, and a metallic pipe-shaped member into which the cable bundle is inserted. The pipe-shaped member has a cutout portion on at least a part of a peripheral surface thereof, and at an end portion of the cable bundle on the solid-state imaging element side, at least one of each shield wire of the one or more coaxial cables or the collective shield wire is joined to the pipe-shaped member by at least one of solder, metal braze, or metal paste in the cutout portion of the pipe-shaped member.
An endoscope system 1 comprises an endoscope 2, a light source unit 3, and a processor unit 4. The endoscope 2 has the same configuration as a general endoscope except for a portion of an imaging device 10 which will be described later. The endoscope 2 has an insertion part to be inserted into a subject, an operation part connected to the insertion part, and a universal cord extending from the operation part, and the insertion part includes a distal end portion, a bending portion connected to the distal end portion, and a flexible portion connecting the bending portion and the operation part to each other.
The distal end portion is provided with an illumination optical system that emits illumination light for illuminating an observation region, an imaging device and an imaging optical system that image the observation region, and the like. The bending portion is configured to be bendable in a direction orthogonal to a longitudinal axis of the insertion part, and a bending operation of the bending portion is performed by the operation part. In addition, the flexible portion is configured to be relatively flexible so as to be deformable according to a shape of an insertion path of the insertion part.
The operation part is provided with a button for operating an imaging operation of the imaging device of the distal end portion, a knob for operating the bending operation of the bending portion, and the like. In addition, the operation part is provided with an introduction port into which a treatment tool such as an electric scalpel is introduced, and a treatment tool channel which reaches the distal end portion from the introduction port and through which a treatment tool such as forceps is inserted is provided inside the insertion part.
A terminal of the universal cord is provided with a connector, and the endoscope 2 is connected to, via the connector, the light source unit 3 that generates illumination light emitted from the illumination optical system of the distal end portion and the processor unit 4 that processes a video signal acquired by the imaging device of the distal end portion. The processor unit 4 processes the input video signal to generate video data of the observation region, and displays and records the generated video data on a monitor.
A light guide and an electric wire group (cable bundle) are housed inside the insertion part, the operation part, and the universal cord. Illumination light generated by the light source unit 3 is guided to the illumination optical system of the distal end portion via the light guide, and a signal and electric power are transmitted between the imaging device of the distal end portion and the processor unit 4 via the electric wire group.
A distal end hard portion of the endoscope 2 is provided with an imaging device 20 and a distal end portion of the treatment tool channel, and is also provided with the illumination optical system or the like that emits illumination light guided from the light source unit 3 via the light guide.
A sensor holder 23 that holds an image sensor 21 and a lens barrel 22 of the imaging device 20 is housed in a housing hole formed in the distal end hard portion made of a metal material such as stainless steel, and is fixed to the distal end hard portion. The distal end portion of the treatment tool channel and the illumination optical system are also respectively housed in the housing hole formed in the distal end hard portion, and are fixed to the distal end hard portion.
An image receiving surface 21a of the image sensor 21 held by the sensor holder 23 fixed to the distal end hard portion is disposed substantially perpendicularly to a longitudinal axis of the insertion part.
The imaging device 20 comprises the image sensor (solid-state imaging element) 21 such as a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor, the lens barrel 22 that houses an imaging optical system for forming an image of a subject on the image receiving surface 21a of the image sensor 21, the sensor holder 23 that holds the image sensor 21 and the lens barrel 22, a cable bundle 32 that comprises a plurality of cables connected to a connection terminal 26 of the image sensor 21, a metallic (conductor) pipe-shaped member 30 into which the cable bundle 32 is inserted, a metallic (conductor) case member 28 that covers the image sensor 21 and a part of the pipe-shaped member 30, and the conductive joining member 40 that joins at least one of shield wires of the cables to the pipe-shaped member 30 in a cutout portion 30a of the pipe-shaped member 30. In the present invention, the conductive joining member 40 is at least one of solder, metal braze, or metal paste.
The lens barrel 22 is held by the sensor holder 23 so as to be movable along an optical axis of the imaging optical system, and the lens barrel 22 is moved such that a position of the image sensor 21 with respect to the imaging optical system is adjustable. The lens barrel 22 is fixed to the sensor holder 23 by, for example, an adhesive after the image sensor 21 is positioned.
The image sensor 21 has the image receiving surface 21a disposed to intersect with a longitudinal direction of the insertion part 6, and photoelectrically converts an optical image formed on the image receiving surface 21a. An outer diameter of the image sensor 21 as seen in a normal direction of the image receiving surface 21a is 1 mm square or less. A plurality of connection terminals for inputting and outputting a signal and electric power are provided on a back surface of the image sensor 21 opposite to the image receiving surface 21a. In
Cables included in the cable bundle 32 are electrically connected to the connection terminals, respectively.
The cable bundle 32 comprises two or more coaxial cables respectively connected to two or more connection terminals provided on a surface of the image sensor 21 opposite to the image receiving surface 21a, and a collective shield wire that covers outer peripheries of the two or more coaxial cables.
In the examples shown in
As shown in
In the present invention, the end portion of the cable bundle on the image sensor (solid-state imaging element) side refers to a portion where the sheath 32b is peeled off to expose the collective shield wire 32a and the cable.
The coaxial cable 33 is a coaxial cable in which a periphery of an inner conductor 33b is electromagnetically shielded by a shield wire 33a, and has the inner conductor 33b, an insulator between the inner conductor 33b and the shield wire 33a, the shield wire 33a, and a sheath that covers an outer periphery of the shield wire 33a.
As shown in
A distal end portion of the exposed inner conductor 33b is electrically connected to the connection terminal 26a of the image sensor 21.
The coaxial cable 36 has the same configuration as the coaxial cable 33, and is electrically connected to the connection terminal of the image sensor 21 (not shown).
The single-axis cable 34 is a cable for supplying electric power to the image sensor 21, and has an inner conductor 34a and a sheath that covers an outer periphery of the inner conductor 34a.
As shown in
A distal end portion of the exposed inner conductor 34a is electrically connected to the connection terminal 26b of the image sensor 21.
The ground cable 35 is a cable for connecting the image sensor 21 to the ground, and has an inner conductor 35a and a sheath that covers an outer periphery of the inner conductor 35a.
As shown in
A distal end portion of the exposed inner conductor 35a is electrically connected to the connection terminal of the image sensor 21 (not shown).
The cable bundle 32 is inserted through the insertion part and the universal cord of the endoscope, and the image sensor 21 is connected to the processor unit 4 via the plurality of cables of the cable bundle 32.
The cable bundle 32 is inserted through the pipe-shaped member 30 in the vicinity of the end portion thereof.
The pipe-shaped member 30 is a metallic member into which the cable bundle 32 is inserted. The pipe-shaped member 30 has the cutout portion 30a on at least a part of a peripheral surface thereof. The pipe-shaped member 30 preferably has an opening through which the cable bundle 32 can be inserted.
In the example shown in
In addition, as shown in
The case member 28 is a member that encloses the image sensor 21.
In the example shown in
The case member 28 encloses (supports) a part of the pipe-shaped member 30 that holds the cable bundle 32 and the image sensor 21, with the longitudinal direction thereof aligned with the longitudinal direction of the cable bundle 32.
It is preferable that the case member 28 encloses at least a part of the pipe-shaped member and has an opening portion at least at a position corresponding to the cutout portion of the pipe-shaped member. In the example shown in
In addition, as shown in
The case member 28 and the pipe-shaped member 30 may be joined to each other by a method such as welding and pressure welding. In addition, the joining position of the case member 28 and the pipe-shaped member 30 is not limited to the back surface side of the case member 28, and joining may be performed at any position as long as the case member 28 and the pipe-shaped member 30 can be joined to each other.
The image sensor 21 is disposed at one end portion of the case member 28. The case member 28 and the image sensor 21 are preferably joined to each other by an adhesive.
The sensor holder 23 is joined to an end portion of the case member 28 on the image sensor 21 side.
The case member 28 and the sensor holder can be joined to each other by a method using the above-described conductive joining member and a method such as welding and pressure welding.
Here, as shown in
The conductive joining member 40 is at least one of solder, metal braze, or metal paste.
As the solder, various kinds of solder used for a wiring board or the like of an endoscope in the related art are available.
As the metal braze, various kinds of metal braze used for a wiring board or the like of an endoscope in the related art are available.
As the metal paste, various kinds of metal paste such as silver paste used for a wiring board or the like of an endoscope in the related art are available.
As described above, in a configuration in which a transmission cable is covered and fixed with a mold resin in the related art, the mold resin is vulnerable to chemicals, and thus, repeated disinfection and/or sterilization may cause deterioration of the mold resin due to chemicals and damage to the transmission cable. Further, in a case where the mold resin deteriorates, the transmission cable cannot be fixed with the mold resin. Therefore, in a case where the insertion part is bent, the transmission cable may be pulled and a load may be applied to a solder portion at an end portion of the cable, resulting in disconnection.
Further, there is also a problem that it is complicated to connect shield wires of a plurality of the transmission cables to each other.
With respect to this, in the endoscope of the embodiment of the present invention, the cable bundle comprising one or more coaxial cables respectively connected to the connection terminal of the solid-state imaging element and the collective shield wire that covers the outer periphery of the one or more coaxial cables is inserted into the metallic pipe-shaped member, and at least one of each shield wire of the one or more coaxial cables or the collective shield wire is joined to the pipe-shaped member by the conductive joining member in the cutout portion of the pipe-shaped member.
Since each shield wire (collective shield wire) is joined to the pipe-shaped member by the conductive joining member, the conductive joining member does not deteriorate due to chemicals, and the shield wire and the collective shield wire can be protected.
In addition, since the conductive joining member that fixes the shield wire and the collective shield wire is at least one of solder, metal braze, or metal paste, the conductive joining member does not easily deteriorate due to chemicals. For that reason, even though the disinfection and/or sterilization is repeated, the shield wire and the collective shield wire can be maintained in a fixed state. Therefore, it is possible to suppress a problem such that a transmission cable may be pulled and a load may be applied to a solder portion at an end portion of the cable to cause disconnection, in a case where the insertion part is bent.
In addition, by joining each shield wire and the collective shield wire to each other by the conductive joining member, conduction between the shield wires can be ensured, and wiring is easy. By making potentials of a plurality of the shield wires constant, electromagnetic interference between the shield wires can be prevented, and noise can be reduced.
Here, in the example shown in
As in the example shown in
In addition, as in the example shown in
In the example shown in
In the example shown in
In addition, in the example shown in
In the example shown in
For example, as in the example shown in
In the example shown in
In the examples shown in
In the examples shown in
A configuration in which the shield wire of the coaxial cable and the collective shield wire of the cable bundle are covered with the conductive joining member 40, and further, the cutout portion 30a of the pipe-shaped member 30 or the opening portion 28a of the case resin mold is filled with resin mold may be adopted.
It is preferable that materials of the pipe-shaped member 30, the case member 28, and the sensor holder are those having conductivity, such as stainless steel and brass.
Next, a method of manufacturing the imaging device included in the endoscope of the embodiment of the present invention will be described with reference to
First, as shown in
Next, as shown in
As described above, since the conductive joining member 40 is any of solder, metal braze, and metal paste, the shield wire and the pipe-shaped member 30 need only be joined to each other by the conductive joining member 40 by a method according to a material to be used.
After the shield wire and the collective shield wire 32a are joined to the pipe-shaped member 30 by the conductive joining member 40 in the cutout portion 30a of the pipe-shaped member 30, the inner conductor of each cable may be connected to the connection terminal 26 of the image sensor 21.
Next, as shown in
As described above, the case member 28 and the pipe-shaped member 30 can be joined by a method using a conductive joining member (solder, metal braze, and metal paste) and a method such as welding and pressure welding.
After that, as shown in
As described above, the case member 28 and the sensor holder 23 can be joined by a method using a conductive joining member (solder, metal braze, and metal paste) and a method such as welding and pressure welding.
Thus, the imaging device of the endoscope is manufactured.
Although the endoscope of the embodiment of the present invention has been described above in detail, the present invention is not limited to the above-described embodiments, and various improvements and changes may be made without departing from the scope of the present invention.
Number | Date | Country | Kind |
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2018-061913 | Mar 2018 | JP | national |
This application is a Continuation of PCT International Application No. PCT/JP2019/003792 filed on Feb. 4, 2019, which claims priority under 35 U.S.C. § 119(a) to Japanese Patent Application No. 2018-061913 filed on Mar. 28, 2018. The above application is hereby expressly incorporated by reference, in its entirety, into the present application.
Number | Date | Country | |
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Parent | PCT/JP2019/003792 | Feb 2019 | US |
Child | 17016647 | US |