Patent Application
20160166132
The present invention relates to image-acquisition units that are applied to endoscopes.
Recently, it has become desirable to reduce the diameters of the distal ends of inserted portions of medical endoscopes, such as transnasal endoscopes, from the viewpoint of reducing the burden of patients, etc. Accordingly, small image-acquisition devices (CCDs and CMOSs) for endoscopes have been developed, and the pixel pitches thereof are decreasing year by year. In accordance with this decrease in pixel pitch, tolerable assembly errors for the distances between lenses, between an image-acquisition device and an objective lens, etc. are decreasing, and assembly errors on the order of a few micrometers to submicrometers may occur.
As disclosed in Patent Literature 1, an endoscopic image-acquisition unit is configured such that an objective-lens-unit frame that holds an objective lens and an image-acquisition-device holding frame that holds an image-acquisition device are fitted and fixed together. More specifically, a thermosetting resin is applied to fitting regions of the objective-lens-unit frame and the image-acquisition-device holding frame, and with the optical axes of an objective optical system and an image-acquisition device oriented so as to achieve a desired focus, the frames are fixed together by using assembly jigs and are heated in a drying furnace, etc. Thus, the thermosetting resin is cured, whereby the objective-lens-unit frame and the image-acquisition-device holding frame are bonded to and fixed together.
Japanese Unexamined Patent Application, Publication No. Hei 9-192093
With the conventional endoscopic image-acquisition unit described above, however, since the objective-lens-unit frame and the image-acquisition-device holding frame are heated in a drying furnace while being fixed together by using assembly jigs when curing the thermosetting resin, parts and the jigs experience thermal expansion. This thermal expansion may cause deviations of the objective-lens-unit frame and the image-acquisition-device holding frame from desired positions, which may result in manufacturing errors exceeding tolerances.
According to a first aspect of the present invention, there is provided an endoscopic image-acquisition unit including an objective-lens-unit frame that holds an objective lens; and an image-acquisition-device holding frame that is fitted with the objective-lens-unit frame and that holds an image-acquisition device, wherein the objective-lens-unit frame and the image-acquisition-device holding frame are bonded and fixed with a thermosetting resin that is applied to a fitting region of these frames, and wherein, of the outer surface of the frame that is located on the outer side when the objective-lens-unit frame and the image-acquisition-device holding frame are fitted together, the outer surface of the fitting region and the outer surface of the region other than the fitting region satisfy the following conditional expression:
α/β>2 (1)
where α signifies the infrared absorption rate per unit area of the outer surface of the fitting region, and β signifies the infrared absorption rate per unit area of the outer surface of the region other than the fitting region.
According to the first aspect of the present invention, of the outer surface of the frame that is located on the outer side when the objective-lens-unit frame and the image-acquisition-device holding frame are fitted together, the outer surface of the fitting region and the outer surface of the region other than the fitting region are configured to satisfy conditional expression (1). Thus, the infrared absorption rate is higher in the fitting region of the objective-lens-unit frame and the image-acquisition-device holding frame compared with the region other than the fitting region. That is, in this configuration, the fitting region of the objective-lens-unit frame and the image-acquisition-device holding frame is heated more easily by infrared irradiation compared with the region other than the fitting region.
In the above first aspect, conditional expression (2) below may be satisfied:
α/β>4 (2)
In the above first aspect, conditional expression (3) below may be satisfied:
Ra>3×Rb (3)
where Ra signifies the maximum height of the surface roughness of the outer surface of the fitting region, and Rb signifies the maximum height of the surface roughness of the outer surface of the region other than the fitting region. The maximum height here refers to a value (μm) indicating the difference between a maximum value and a minimum value of the surface roughness.
According to a second aspect of the present invention, there is provide an endoscopic image-acquisition unit including an objective-lens-unit frame that holds an objective lens; and an image-acquisition-device holding frame that is fitted with the objective-lens-unit frame and that holds an image-acquisition device, wherein the objective-lens-unit frame and the image-acquisition-device holding frame are bonded and fixed with a thermosetting resin that is applied to a fitting region of these frames, and wherein the outer surface of the frame that is located on the outer side when the objective-lens-unit frame and the image-acquisition-device holding frame are fitted together and the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side satisfy conditional expression (4) below:
ρ/γ>1.5 (4)
where ρ signifies the infrared absorption rate per unit area of the outer surface of the frame that is located on the outer side, and γ signifies the infrared absorption rate per unit area of the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side.
According to the second aspect of the present invention, the outer surface of the frame that is located on the outer side when the objective-lens-unit frame and the image-acquisition-device holding frame are fitted together and the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side are configured to satisfy conditional expression (4), so that the infrared absorption rate is higher in the fitting region of the objective-lens-unit frame and the image-acquisition-device holding frame compared with the region other than the fitting region. That is, in this configuration, the fitting region of the objective-lens-unit frame and the image-acquisition-device holding frame is heated more easily by infrared irradiation compared with the region other than the fitting region.
In the above second aspect, conditional expression (5) below may be satisfied:
ρ/γ>2 (5)
In the above second aspect, conditional expression (6) below may be satisfied:
Rbo>3×Rai (6)
where Rai signifies the maximum height of the surface roughness of the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side, and Rbo signifies the maximum height of the surface roughness of the outer surface of the frame that is located on the outer side. The maximum height here refers to a value (μm) indicating the difference between a maximum value and a minimum value of the surface roughness.
In the above second aspect, conditional expression (7) below may be satisfied:
2.5×P×Fno<0.03 (7)
where P signifies the pitch of the image-acquisition device, and Fno signifies the effective F number of the objective optical system.
An endoscopic image-acquisition unit according to a first embodiment of the present invention will be described below with reference to the drawings.
As shown in
The objective-lens-unit frame 2 holds multiple lenses L1, L2, L3, and L4. In the objective-lens-unit frame 2, an end region on the image-acquisition-surface side constitutes a fitting region 10 that is fitted with the image-acquisition-device holding frame 3.
The image-acquisition-device holding frame 3 holds an image-acquisition device 4 and a cover glass plate 5. In the image-acquisition-device holding frame 3, an end region on the object-surface side constitutes a fitting region 11 that is fitted with the objective-lens-unit frame 2.
Of the outer surface of the image-acquisition-device holding frame 3, which is the frame that is located on the outer side when the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3 are fitted together, the outer surface of the fitting region 11 and the outer surface of the region other than the fitting region 11 are configured to satisfy the following conditional expression:
α/β>2 (1)
where α signifies the infrared absorption rate per unit area of the outer surface of the fitting region, and β signifies the infrared absorption rate per unit area of the outer surface of the region other than the fitting region.
In this embodiment, the image-acquisition-device holding frame 3 is made of a metallic material. Of the outer surface of the image-acquisition-device holding frame 3, the outer surface of the fitting region 11 is plated with chromium, and the outer surface of the region other than the fitting region 11 is not plated or otherwise treated, so that the machined surface of the metallic material is exposed, constituting a lustrous metallic surface. That is, of the outer surface of the image-acquisition-device holding frame 3, compared with the metallic surface of the outer surface of the region other than the fitting region 11, the outer surface of the fitting region 11 absorbs infrared rays more efficiently since it is chromium-plated and is black. For the convenience of description, in
For example, in the case where stainless steel is used as the metallic material of the image-acquisition-device holding frame 3, which is located on the other side, and the outer surface thereof is irradiated with infrared rays having a wavelength of about 1 to 2 μm, the infrared absorption rate per unit area of the outer surface (metallic surface) of the region other than the fitting region 11, which is not chromium-plated, is about 7%. On the other hand, the infrared absorption rate per unit area of the outer surface of the fitting region 11, where the stainless steel is chromium-plated, can be improved to about 16% by the effect of a chromium-oxide film that is used for chromium plating.
At this time, α=16%, β=7%, and α/β=2.3, so that conditional expression (1) given above is satisfied.
It is possible to further improve the infrared absorption rate per unit area of the outer surface of the fitting region 11 by applying conditional expression (2) instead of conditional expression (1) above:
α/β>4 (2)
The endoscopic image-acquisition unit configured as described above is assembled as follows. As shown in
As described above, in the image-acquisition-device holding frame 3, which is located on the outer side when fitted with the objective-lens-unit frame 2, the outer surface of the fitting region 11 is configured so that it is heated more easily by infrared irradiation compared with the region other than the fitting region 11. Therefore, it is possible to efficiently heat only the fitting region 11 by infrared irradiation of the fitting region 11. Accordingly, it is possible to suppress positional deviations due to thermal expansion of jigs and parts, which serves to suppress manufacturing errors, so that the accuracy of positioning between the objective lenses and the image-acquisition device can be improved.
In this embodiment, the image-acquisition-device holding frame 3, which is located on the outer side, is made of a metallic material, and the metallic material is plated with chromium. Alternatively, however, other kinds of blackening treatment may be employed, such as chromate treatment, alumite treatment, or nickel plating. It is possible to employ treatment that enables black plating in relation to a metallic material that is used for the frame that is located on the outer side among the image-acquisition-device holding frame 3 and the objective-lens-unit frame 2. Furthermore, although stainless steel is described as the metallic material, without limitation to stainless steel, other kinds of metallic material, such as copper, brass, aluminum, and iron, may be used.
Furthermore, although the objective-lens-unit frame 2 is located on the inner side and the image-acquisition-device holding frame 3 is located on the outer side when the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3 are fitted together in this embodiment, there is no limitation to this configuration. Alternatively, the configuration may be such that the objective-lens-unit frame 2 is located on the outer side and the image-acquisition-device holding frame 3 is located on the inner side. In this case, the outer surface of the fitting region 10 of the objective-lens-unit frame 2, which is located on the outer side when fitted, is chromium-plated or otherwise treated so that the infrared absorption rate will be higher.
In the first embodiment described above, the outer surface of the fitting region 11 of the image-acquisition-device holding frame 3 is chromium-plated. Alternatively, instead of such plating, an infrared-absorbing material may be applied to the outer surface of the fitting region 11.
Specifically, an infrared-absorbing material is applied to the outer surface of the fitting region of the frame that is located on the outer side when the objective-lens-unit frame and the image-acquisition-device holding frame are fitted together such that conditional expression (1) given earlier is satisfied. With this configuration, the outer surface of the fitting region is heated more easily by infrared irradiation compared with the outer surface of the region other than the fitting region.
As the infrared-absorbing material, for example, a black paint, or a black paint in which a metal oxide, etc. is introduced so that infrared rays can be absorbed efficiently, may be used. In this case, black ink may be used alone, or powder of an oxide of a metal, such as chromium, copper, iron, nickel, or molybdenum, may be introduced to further improve the absorption rate, whereby the infrared absorption rate per unit area can be further improved. By applying such a paint only to the outer surface of the fitting region of the frame that is located on the outer side and forming a metallic surface on the outer surface of the region other than the fitting region, the infrared absorption rate of the fitting region can be made higher than that of the region other than the fitting region.
An endoscopic image-acquisition unit according to a second embodiment of the present invention will be described below with reference to the drawings. In the following description, parts that are configured the same as those of the endoscopic image-acquisition unit according to the first embodiment described above are designated by the same reference signs, and descriptions thereof will be omitted. Furthermore, this embodiment will also be described assuming that, similarly to the first embodiment, the objective-lens-unit frame 2 is located on the inner side and the image-acquisition-device holding frame 3 is located on the outer side when these frames are fitted together.
As shown in
Ra>3×Rb (3)
where Ra signifies the maximum height of the surface roughness of the outer surface of the fitting region 11, and Rb signifies the maximum height of the surface roughness of the outer surface of the region other than the fitting region 11.
The maximum height here refers to a value (μm) indicating the difference between a maximum value and a minimum value of surface roughness. As shown in
In
It is possible to make the surface roughness of the outer surface of the fitting region 11 greater than the surface roughness of the outer surface of the region other than the fitting region 11, for example, by varying the rotation rate or moving amount of a cutting blade between the outer surface of the fitting region 11 and the outer surface of the region other than the fitting region 11 when machining the frame or by performing sandblasting after machining. By subsequently performing blackening treatment, such as plating, it is possible to configure an image-acquisition-device holding frame in which the outer surface of the fitting region 11 has a higher infrared absorption rate than the outer surface of the region other than the fitting region 11.
In this embodiment, for example, stainless steel is used as the metallic material of the image-acquisition-device holding frame 3, which is located on the outer side. The infrared absorption rate per unit area of the outer surface of the fitting region 11, where the stainless steel is plated with chromium, is improved to about 16% due to the effect of a chromium oxide film used for chromium plating. Furthermore, when Ra=25 μm and Rb=6.3 μm, the infrared absorption rate per unit area of the Ra region is:
0.16×1.16×1.16×1.16×1.16=0.29
This indicates that, as opposed to the Rb region, which is not plated or otherwise treated, the infrared absorption rate per unit area is improved to about 29%. In this case, Ra=3.97×Rb, so that the condition Ra>3×Rb is satisfied. At this time, α=29%, and the infrared absorption rate per unit area of the outer surface (metallic surface) of the region other than the fitting region 11, which is not plated, is β=7%, so that α/β=4.14, which satisfies conditional expression (2), so that it is possible to heat the required region with this configuration.
This embodiment has been described in the context of an example in which machining is performed such that Ra=25 μm and Rb=6.3 μm. Alternatively, for example, by making Ra=25 μm and Rb=3.2 μm, the infrared absorption rate per unit area can be improved to about 45%. In this case, α/β=6.4, so that conditional expression (2) is well satisfied, as well as conditional expression (1).
The endoscopic image-acquisition unit configured as described above is assembled by applying an adhesive 12 made of a thermosetting resin to the outer surface of the fitting region 10 or the inner surface of the fitting region 11, adjusting the spacing between the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3, and then curing the adhesive 12 by heating it from the outside by using infrared rays.
As described above, the surface roughness of the outer surface of the fitting region 11 of the image-acquisition-device holding frame 3, which is located on the outer side when fitted with the objective-lens-unit frame 2, is greater than the surface roughness of the outer surface of the region other than the fitting region 11. Therefore, it is possible to efficiently heat only the fitting region 11 by infrared irradiation of the fitting region 11. Accordingly, it is possible to suppress positional deviations due to thermal expansion of jigs and parts, which serves to suppress manufacturing errors, so that the accuracy of positioning between the objective lenses and the image-acquisition device can be improved.
An endoscopic image-acquisition unit according to a third embodiment of the present invention will be described below with reference to the drawings. In the following description, parts that are configured the same as those of the endoscopic image-acquisition unit according to the first embodiment described above are designated by the same reference signs, and descriptions thereof will be omitted. Furthermore, this embodiment will also be described assuming that, similarly to the first embodiment, the objective-lens-unit frame 2 is located on the inner side and the image-acquisition-device holding frame 3 is located on the outer side when these frames are fitted together.
As shown in
That is, the outer surface of the frame that is located on the outer side when the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3 are fitted together and the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side are configured to satisfy conditional expression (4) given below:
ρ/γ>1.5 (4)
where ρ signifies the infrared absorption rate per unit area of the outer surface of the frame that is located on the outer side, and γ signifies the infrared absorption rate per unit area of the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side. Although γ here signifies the infrared absorption rate per unit area of the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side when fitted, alternatively, the entire outer surface of the frame that is located on the inner side when fitted, including the fitting region thereof, may have the same infrared absorption rate γ. This indicates that either is acceptable since the outer surface of the fitting region of the frame that is located on the inner side when fitted is not irradiated with infrared rays in the case of infrared irradiation from the outside.
In this embodiment, the image-acquisition-device holding frame 3, which is located on the outer side, and the objective-lens-unit frame 2, which is located on the inner side, are made of a metallic material. In this embodiment, for example, the configuration may be such that stainless steel is used as a metallic material for both frames, the peripheral surface of the region other than the fitting region of the objective-lens-unit frame 2, which is located on the inner side, is not plated or otherwise treated, so that the machined surface of the metallic material is exposed, constituting a lustrous metallic surface, and the outer surface of the fitting region of the image-acquisition-device holding frame 3, which is located on the outer side, is plated with chromium. In this case, as described above, the peripheral surface of the fitting region of the objective-lens-unit frame 2, which is located on the inner side, is not plated or otherwise treated, so that the machined surface of the metallic material is exposed, constituting a lustrous metallic surface, similarly to the peripheral surface of the region other than the fitting region.
In assembling the endoscopic image-acquisition device, it is difficult to irradiate only the fitting region with infrared rays, and there are cases where the peripheral surface of the region other than the fitting region of the frame that is located on the inner side is also irradiated with infrared rays. Thus, it is desired to suppress, as much as possible, absorption of infrared rays by the outer surface of the region other than the fitting region of the frame that is fitted on the inner side so that infrared rays will be absorbed efficiently only by the outer surface of the frame that is located on the outer side.
In this embodiment, the outer surface of the region other than the fitting region 10 of the objective-lens-unit frame 2, which is located on the inner side, is simply the metallic surface, so that it is possible to achieve the infrared absorption rate per unit area of γ=7%. Furthermore, the outer surface of the image-acquisition-device holding frame 3, which is located on the outer side, is plated with chromium, so that it is possible to achieve the infrared absorption rate per unit area of ρ=16%.
Thus, ρ/γ=2.28, so that conditional expression (4) given earlier is well satisfied. In this case, even if the region other than the fitting region is irradiated with infrared rays, it is possible to heat the fitting region more efficiently compared with the other region.
Furthermore, by applying conditional expression (5) below instead of conditional expression (4) given earlier, it is possible to further increase the infrared absorption rate in the fitting region.
ρ/γ>2 (5)
Also in this embodiment, the image-acquisition-device holding frame 3, which is located on the outer side, is made of a metallic material, and the metallic material is plated with chromium. Alternatively, however, other kinds of blackening treatment may be employed, such as chromate treatment, alumite treatment, or nickel plating. Furthermore, although an example in which stainless steel is used for the image-acquisition-device holding frame 3 has been described, without limitation to this example, other kinds of metallic material, such as copper, brass, aluminum, and iron, may be used.
Furthermore, although this embodiment has been described in the context of an example in which the infrared absorption rate per unit area is increased by chromium-plating the outer surface of the image-acquisition-device holding frame 3, which is located on the outer side, other configurations may be employed as long as it is possible to increase the infrared absorption rate per unit area, such as a configuration in which an infrared absorbing material is applied. Examples of such an infrared absorbing material have been given earlier.
An endoscopic image-acquisition unit according to a fourth embodiment of the present invention will be described below with reference to the drawings. In the following description, parts that are configured the same as those of the endoscopic image-acquisition unit according to the first embodiment described above are designated by the same reference signs, and descriptions thereof will be omitted. Furthermore, this embodiment will also be described assuming that, similarly to the first embodiment, the objective-lens-unit frame 2 is located on the inner side and the image-acquisition-device holding frame 3 is located on the outer side when these frames are fitted together.
As shown in
Rbo>3×Rai (6)
where Rai signifies the maximum height of the surface roughness of the outer surface of the region other than the fitting region in the outer surface of the frame that is located on the inner side, and Rbo signifies the maximum height of the surface roughness of the outer surface of the frame that is located on the outer side. The maximum height here refers to a value (μm) indicating the difference between a maximum value and a minimum value of the height of surface roughness. Although Rai here signifies the maximum height of the surface roughness of the outer surface of the region other than the fitting region 10 in the outer surface of the frame that is located on the inner side, alternatively, the entire outer surface of the frame that is located on the inner side, including the fitting region thereof, may have the same surface roughness Rai. This indicates that either is acceptable since the outer surface of the fitting region of the frame that is located on the inner side when fitted is not irradiated with infrared rays in the case of infrared irradiation from the outside.
In
For example, in the case where the maximum height of the surface roughness of the outer surface of the image-acquisition-device holding frame 3, which is located on the outer side, is Rbo=25 μm, and the maximum height of the surface roughness of the outer surface of the region other than the fitting region 10 in the outer surface of the objective-lens-unit frame 2, which is located on the inner side, is Rai=6.3 μm, conditional expression (6) given earlier is satisfied.
In this embodiment, the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3 are both made of a stainless steel material, and black plating is applied at least to the outer surfaces thereof. In this case, the ratio of the infrared absorption rate per unit area of the outer surface of the objective-lens-unit frame 2, which is located on the inner side at the fitting region, and the infrared absorption rate per unit area of the outer surface of the image-acquisition-device holding frame 3, which is located on the outer side, is ρ/γ=1.81.
As another example, in the case where the maximum height of the surface roughness of the outer surface of the image-acquisition-device holding frame 3, which is located on the outer side, is Rbo=25 μm, and the maximum height of the surface roughness of the outer surface of the region other than the fitting region 10 in the outer surface of the objective-lens-unit frame 2, which is located on the inner side, is Rai=3.2 μm, conditional expression (6) given earlier is satisfied, and ρ/γ in this case is 2.4.
Also with this configuration, in which blackening treatment is applied to both the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3, it is possible to efficiently heat the fitting region, i.e., only the region that is to be bonded and fixed, thereby curing the adhesive 12.
Furthermore, in this embodiment, the surface roughness of the peripheral surface of the fitting region of the objective-lens-unit frame 2, which is located on the inner side in the fitting region, may be either the same as or different from the surface roughness Rai of the peripheral surface of the region other than the fitting region.
As described earlier, for black plating of the metal, it is possible to choose an appropriate treatment that enables blackening with a metallic material, such as chromium plating, chromate treatment, alumite treatment, or nickel plating. Furthermore, for the objective-lens-unit frame 2 and the image-acquisition-device holding frame 3, it is possible to use a variety of metallic materials, such as copper, brass, aluminum, and iron, without limitation to stainless steel.
By configuring each of the endoscopic image-acquisition units according to the embodiments described above such that conditional expression (7) given below is satisfied, it is possible to improve the precision of positioning in an optical system that requires positioning with high precision.
2.5×P×Fno<0.03 (7)
where P signifies the pitch of the image-acquisition device, and Fno signifies the effective F number of the objective optical system.
This is because, as shown in
δ/D=Δpinto/f
Δpinto/f=δ·f/D
and assuming δ=2.5 P, the following equation is obtained:
Δpinto=Fno×2.5×P
where D signifies the effective aperture of the objective lenses, f signifies the focal distance, and δ signifies the diameter of blurring that is tolerable on the image plane.
The reason for 5=2.5 P is as follows. In the case where an image of a black and white chart is formed on the image-acquisition device by the objective optical system, for each pixel of the image-acquisition device, the reference quantity of blurring is δ=2 P. Image-acquisition devices that use luminance signals are a type of image-acquisition device that uses such a reference quantity. Furthermore, in the case of an image-acquisition device having color filters at each pixel thereof, it is necessary to generate luminance signals from the color filters, and the reference quantity for blurring is generally considered to be at the level of δ=3 P. Accordingly, the intermediate value, δ=2.5 P, is used as a reference quantity of blurring that is compatible with all image-acquisition devices.
According to the present invention, when bonding and fixing the fitting region of the objective-lens-unit frame and the image-acquisition-device holding frame by curing the thermosetting resin, it suffices to irradiate the fitting region with infrared rays, and it is unnecessary to heat the entire objective-lens-unit frame and image-acquisition-device holding frame fixed together by using jigs. Furthermore, by making the infrared absorption rate of the fitting region greater than the infrared absorption rate of the region other than the fitting region, the fitting region is heated effectively, whereas heating of the region other than the fitting region is suppressed, so that transfer of heat to the jigs is minimized. Accordingly, it is possible to suppress positional deviations due to thermal expansion of jigs and parts, which serves to suppress manufacturing errors, so that the precision of positioning between the objective lens and the image-acquisition device can be improved.
It is possible to make the infrared absorption rate of the fitting region greater compared with the region other than the fitting region. Accordingly, it is possible to suppress positional deviations due to thermal expansion of jigs and parts, which serves to suppress manufacturing errors, so that the precision of positioning between the objective lens and the image-acquisition device can be improved.
It possible to increase the surface area of the outer surface of the fitting region, so that it is possible to make the infrared absorption rate of the fitting region greater compared with the region other than the fitting region.
When curing the thermosetting resin, it suffices to irradiate the fitting region with infrared rays, and it is unnecessary to heat the entire objective-lens-unit frame and image-acquisition-device holding frame fixed together by using jigs. Furthermore, by increasing the infrared absorption rate of the fitting region such that the infrared absorption rate of the region other than the fitting region is lower compared with the fitting region, transfer of heat to the jigs is minimized. Accordingly, it is possible to suppress positional deviations due to thermal expansion of jigs and parts, which serves to suppress manufacturing errors, so that the precision of positioning between the objective lens and the image-acquisition device can be improved.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-068942 | Mar 2014 | JP | national |
This is a continuation of International Application PCT/JP2015/052962, with an international filing date of Feb. 3, 2015, which is hereby incorporated by reference herein in its entirety. This application claims the benefit of Japanese Patent Application No. 2014-068942, filed on Mar. 28, 2014, the content of which is incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2015/052962 | Feb 2015 | US |
| Child | 15050763 | US |
