The on resistance (RDSON) of a p-channel device is inversely proportional to gate drive voltage.
Due to conflicting trade-offs, it is difficult to select an appropriate p-channel device for a system. Selecting a high voltage p-channel device for low voltage operation where gate drive is not optimal results in high RDSON. Selecting a low voltage p-channel device can improve the RDSON but results in higher channel and junction leakage. Junction voltage breaks during high voltage operation if the voltage rating of the p-channel is exceeded. Thus, selecting a low voltage p-channel device significantly limits range of operation. Selecting a p-channel device with a larger p-channel area may achieve a desired RDSON but at the expense of a larger footprint.
A p-channel device is typically best suited for a system in which the supply voltage range can be restricted. In such cases, an optimal p-channel operation voltage can be selected for that supply voltage range. It would be useful for p-channel devices to be suitable for a wider class of systems.
Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings.
The invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and/or a processor, such as a processor configured to execute instructions stored on and/or provided by a memory coupled to the processor. In this specification, these implementations, or any other form that the invention may take, may be referred to as techniques. In general, the order of the steps of disclosed processes may be altered within the scope of the invention. Unless stated otherwise, a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task. As used herein, the term ‘processor’ refers to one or more devices, circuits, and/or processing cores configured to process data, such as computer program instructions.
A detailed description of one or more embodiments of the invention is provided below along with accompanying figures that illustrate the principles of the invention. The invention is described in connection with such embodiments, but the invention is not limited to any embodiment. The scope of the invention is limited only by the claims, and the invention encompasses numerous alternatives, modifications, and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the invention. These details are provided for the purpose of example, and the invention may be practiced according to the claims without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the invention has not been described in detail so that the invention is not unnecessarily obscured.
A technique for enhancing the conduction (or, equivalently, reducing the RDSON) of a p-channel is disclosed. The conduction of a p-channel is proportional to the gate drive voltage. The disclosed technique comprises using a negative charge pump to maintain an optimal gate drive voltage for a p-channel device. A negative charge pump creates a negative voltage potential below ground and facilitates increased gate drive for a p-channel device. As used herein, a p-channel device may comprise any PMOS (p-channel metal-oxide-semiconductor field-effect transistor) device. For example, a PMOS device may comprise a switch, a load switch, a power FET, etc.
As depicted, circuit 200 comprises a negative charge pump 202 that delivers a voltage potential to drive a p-channel device 206. Negative charge pump 202 may be configured to supply a voltage up to the maximum VGS of p-channel device 206 below input voltage supply VIN. For example, if the maximum VGS of p-channel device 206 is 5V, the voltage from negative charge pump 202 is 5V below VIN. Consider a VIN<5V. For instance, if VIN=1 V, negative charge pump 202 delivers-4 V.
Logic block 204 of circuit 200 implements functionalities associated with the ON/OFF pin and ENH pin of the circuit. In the given example, the ON/OFF pin controls the turn-on and turn-off of p-channel device 206, and the ENH pin controls the gate voltage of p-channel device 206 while in the “ON” state. When ENH is set, the gate pulls to the charge pump voltage level, resulting in higher gate drive and reduced RDSON. When ENH is not set, the gate is pulled to ground, resulting in a higher RDSON. Thus, two modes of gate drive are provided and may be accordingly selected based on the application.
P-channel device 206 of circuit 200 comprises a switch for passing power to an associated system when the gate of the device is pulled to the charge pump voltage or to ground. Power is passed out of the circuit via the VOUT pin.
Gate driver 208 of circuit 200 pulls the gate of p-channel device 206 to the charge pump voltage when ENH is set. Quiescent current is required to keep the charge pump running Similarly, gate driver 210 of circuit 200 pulls the gate of p-channel device 206 to ground when ENH is not set. In this mode, the average quiescent current is zero.
The waveforms below circuit diagram 300 illustrate example signals at the marked nodes of circuit 300. Each of diodes D1, D2, D3, and D4 is assumed to have a 0.5V drop. A more detailed description of the signals at the marked nodes follows.
Node 1 corresponds to the oscillator output in the form of a square wave.
Node 2 corresponds to the signal of the oscillator boosted by capacitor C4. The maximum voltage level is VIN clamped by D1.
Node 3 represents diode D2 blocking current from passing into node 2. When the node 2 voltage is lower, D2 is forward biased, and current flows from node 3 to node 2. Capacitor C7 stores charge between node 3 and VIN.
Node 4 corresponds to the signal of node 1 boosted by capacitor C5. When node 4 is high, it is clamped to node 3 by diode D3. When node 1 goes low, capacitor C5 pulls node 4 down.
Node 5 corresponds to the last stage of charge pump 300. Charge pump 300 of the given example can pump down to: VIN−2VDD+4 Vd where Vd is the diode voltage drop.
In the waveform example of
As described, an optimal gate drive level for a p-channel device can be achieved via a negative charge pump. Using a negative charge pump with a p-channel device offers many advantages including not limiting the voltage range of the p-channel device and maintaining low RDSON of the p-channel for a wide operating voltage range. Moreover, larger sized p-channel devices are not needed to achieve a prescribed RDSON. Rather, devices having relatively smaller sized p-channels may be employed for the same RDSON by using the negative charge pump to keep the gate drive at an optimal level. Furthermore, the negative charge pump configuration allows a p-channel device having a higher threshold voltage to be used so that junction and channel leakage can be avoided.
Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, the invention is not limited to the details provided. There are many alternative ways of implementing the invention. The disclosed embodiments are illustrative and not restrictive.
This application claims priority to U.S. Provisional Patent Application No. 61/887,298 entitled ENHANCED CONDUCTION FOR P-CHANNEL LOAD SWITCH filed Oct. 4, 2013 which is incorporated herein by reference for all purposes.
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Number | Date | Country | |
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61887298 | Oct 2013 | US |