Claims
- 1. A method of fabricating an electron emitter comprising the steps of:
- selecting an electron emission site;
- forming a layer of material with first phase portions characterized by a first chemical bond;
- forming second phase portions in the layer characterized by a second chemical bond; and
- positioning the second phase portions adjacent the first phase portions at the electron emission site so as to define a non-segregated multi-phase region in which properties of the first and second phase portions are blended to create an enhanced electron emission structure at the electron emission site.
- 2. A method of fabricating an electron emitter as claimed in claim 1 wherein the step of forming the layer of material with first portions characterized by the first chemical bond includes forming the layer of material with first portions including diamond-like carbon.
- 3. A method of fabricating an electron emitter as claimed in claim 2 wherein the step of forming the layer of material with second portions characterized by the second chemical bond includes forming the layer of material with second portions including graphite-like carbon.
- 4. A method of fabricating an electron emitter as claimed in claim 1 wherein the step of forming the layer of material with first portions characterized by the first chemical bond includes forming the layer of material with first portions including aluminum nitride.
- 5. A method of fabricating a field emission device comprising the steps of:
- forming an electron emitter including
- selecting an electron emission site,
- forming a layer of material with first portions characterized by a first chemical bond,
- forming second portions in the layer characterized by a second chemical bond, and
- positioning the second portions adjacent the first portions at the electron emission site so as to define an interfacial region in which properties of the two portions are blended to create an enhanced electron emission structure at the electron emission site;
- positioning a conductive layer adjacent the electron emitter and in electrical communication with the enhanced electron emission structure; and
- connecting a source to the conductive layer so as to cause a current flow through the conductive layer and emission current from the enhanced electron emission structure.
Parent Case Info
This is a continuation of application Ser. No. 08/011,595, filed Feb. 1, 1993 now U.S. Pat. No. 5,619,092.
US Referenced Citations (3)
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5129850 |
Kane et al. |
Jul 1992 |
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5141460 |
Jaskie et al. |
Aug 1992 |
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5449970 |
Kumar et al. |
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Continuations (1)
|
Number |
Date |
Country |
| Parent |
11595 |
Feb 1993 |
|