Claims
- 1. A process for producing a semiconductor device which comprises bonding a semiconductor chip to a metallic layer with an adhesive composition; said composition comprising an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
- 2. A process according to claim 1, wherein an epoxy compound having one epoxy group and the epoxy compound having two or more epoxy groups are reacted with the 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane.
- 3. A semiconductor device comprising a lead frame, an adhesive composition coated on an island of the lead frame, a semiconductor element placed on the adhesive composition and bonded to the island of the lead frame via the adhesive composition, wires connecting the semiconductor element and the lead frame, and a molded resin encapsulating the whole of the lead frame and the semiconductor element; wherein said adhesive composition comprises an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups.
Priority Claims (4)
Number |
Date |
Country |
Kind |
2-106293 |
Apr 1990 |
JPX |
|
2-156456 |
Jun 1990 |
JPX |
|
2-200186 |
Jul 1990 |
JPX |
|
3-071183 |
Apr 1991 |
JPX |
|
Parent Case Info
This application is a divisional application of application Ser. No. 687,639, filed Apr. 19, 1991 now U.S. Pat. No. 5,258,139.
US Referenced Citations (8)
Foreign Referenced Citations (3)
Number |
Date |
Country |
320211 |
Jun 1989 |
EPX |
3-079624 |
Apr 1991 |
JPX |
810284 |
Mar 1959 |
GBX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
687639 |
Apr 1991 |
|