Patent Application
20180327542
This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No. 2017-093663 filed in Japan on May 10, 2017, the entire contents of which are hereby incorporated by reference.
This invention relates to a thermosetting epoxy resin composition, and more particularly, to an epoxy resin composition used for encapsulating semiconductor devices such as diodes, transistors, ICs, LSIs and VLSIs.
Epoxy resins are used as semiconductor encapsulant in a wide variety of applications. With the progress toward miniaturization and higher density of semiconductor chips, the encapsulant is desired to have higher reliability. For improving productivity, there is a need for an epoxy resin which quickly cures at low temperature. As a low-temperature quick-curing epoxy resin composition, Patent Document 1 discloses a two-pack epoxy resin composition which cures after mixing of two components, i.e., an epoxy resin and a curing agent. Although the two-pack epoxy resin composition has excellent low-temperature curability, it must be intimately mixed before it can exert the properties fully. Also, since its working life after mixing is limited, there are restrictions on usage.
To solve these problems, Patent Document 2 proposes a one-pack epoxy resin composition using a microcapsule type curing agent. However, since the microcapsule type curing agent is solid or highly viscous liquid, the resin composition may become too viscous to work.
Patent Document 1: JP-A 2016-060826
Patent Document 2: JP-A 2015-113426
An object of the invention is to provide an epoxy resin composition which has low-temperature curability and workability and is improved in adhesion and adhesion retention, and a semiconductor device encapsulated therewith.
The inventors have found that the outstanding problem is solved by an epoxy resin composition comprising (A) an epoxy resin, (B) an aromatic amine-based curing agent, and (C) a curing accelerant in the form of an arylborate salt.
In one aspect, the invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) an aromatic amine-based curing agent, and (C) a curing accelerant, an equivalent ratio of amino groups in the aromatic amine-based curing agent (B) to epoxy groups in the epoxy resin (A) being from 0.7/1 to 1.5/1, and the curing accelerant (C) comprising an arylborate salt.
In a preferred embodiment, component (B) is at least one aromatic amine-based curing agent selected from the formulae (1), (2), (3) and (4):
wherein R1 to R4 which may be the same or different are selected from hydrogen, C1-C6 monovalent hydrocarbon groups, CH3S—, and CH3CH2S—.
In a preferred embodiment, the arylborate salt as component (C) contains at least one member selected from the group consisting of alkali metals, alkyl ammonium compounds, imidazolium compounds, arylphosphonium compounds, and alkylphosphonium compounds. Typically, component (C) is tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate or triphenylphosphine triphenylborane. Preferably, component (C) is blended in an amount of 0.1 to 10 parts by weight per 100 parts by weight components (A) and (B) combined.
In a preferred embodiment, the epoxy resin (A) is a liquid epoxy resin.
The epoxy resin composition may further comprise (D) an inorganic filler.
Most often, the epoxy resin composition is liquid at 25° C.
Also contemplated herein is a semiconductor device encapsulated with the epoxy resin composition in the cured state.
The epoxy resin composition has both low-temperature curability and workability and is also improved in adhesion and adhesion retention. A semiconductor device encapsulated with a cured product of the epoxy resin composition is reliable.
As used herein, the notation (Cn-Cm) means a group containing from n to m carbon atoms per group.
The epoxy resin composition of the invention is defined as comprising (A) an epoxy resin, (B) an aromatic amine-based curing agent, and (C) a curing accelerant.
The epoxy resin used herein as component (A) may be selected from well-known epoxy resins. Examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol A novolac type epoxy resins, bisphenol F novolac type epoxy resins, stilbene type epoxy resins, triazine skeleton-containing epoxy resins, fluorene skeleton-containing epoxy resins, triphenolphenolmethane type epoxy resins, biphenyl type epoxy resins, xylylene type epoxy resins, biphenylaralkyl type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, alicyclic epoxy resins, diglycidyl ether compounds of polyfunctional phenols and polycyclic aromatics such as anthracene, and phosphorus-containing epoxy resins which are obtained by introducing a phosphorus compound to the forgoing resins. These resins may be used alone or in admixture of two or more.
Component (A) is preferably a liquid resin having a viscosity at 25° C. of 0.01 to 100,000 mPa·s, more preferably 0.1 to 10,000 mPa·s. Notably the viscosity is measured according to HS Z-8803: 2011, by a cone-plate rotational viscometer (Type E viscometer) at a temperature of 25° C., after 2 minutes from sample loading.
Preferably component (A) is present in an amount of 30 to 80% by weight, more preferably 40 to 75% by weight, and even more preferably 45 to 70% by weight based on the resin composition.
Component (B) which is a curing agent for component (A) is an aromatic amine-based curing agent, specifically an aromatic ring-containing amine compound having heat resistance and storage stability. Suitable aromatic amine-based curing agents include those having the following formulae (1) to (4).
Herein R1 to R4 which may be the same or different are selected from hydrogen, C1-C6 monovalent hydrocarbon groups, CH3S—, and CH3CH2S—.
Of the aromatic amine-based curing agents having formulae (1), (2), (3) and (4), preferred are aromatic diaminodiphenylmethane compounds such as 3,3′-diethyl-4,4′-diaminodiphenylmethane, 3,3′,5,5′-tetramethyl-4,4′-diaminodiphenylmethane, and 3,3′,5,5′-tetraethyl-4,4′-diaminodiphenylmethane, 2,4-diaminotoluene, 1,4-diaminobenzene, and 1,3-diaminobenzene. They may be used alone or in admixture of two or more.
The aromatic amine-based curing agent which is liquid at normal temperature (20-30° C.) may be blended as such. However, if the aromatic amine-based curing agent which is solid is blended in an epoxy resin as such, the resin builds up its viscosity and thus becomes difficult to work. It is thus preferred that the solid curing agent is previously melt mixed with the liquid epoxy resin. Melt mixing is desirably performed at a specific blending ratio described below at a temperature of 70 to 150° C. for 1 to 2 hours. If the mixing temperature is lower than 70° C., the curing agent may not be fully compatibilized with the epoxy resin. If the mixing temperature exceeds 150° C., the curing agent may react with the liquid epoxy resin, leading to a viscosity buildup. If the mixing time is shorter than 1 hour, the curing agent may not be fully compatibilized with the epoxy resin, inviting a viscosity buildup. If the mixing time exceeds 2 hours, the curing agent may react with the liquid epoxy resin, leading to a viscosity buildup.
The aromatic amine-based curing agent is blended in such an amount that an equivalent ratio of all amino groups in the aromatic amine-based curing agent to all epoxy groups in component (A) ranges from 0.7/1 to 1.5/1, preferably from 0.7/1 to 1.2/1, more preferably from 0.7/1 to 1.1/1, even more preferably from 0.85/1 to 1.05/1. If the equivalent ratio is less than 0.7, some epoxy groups may be left unreacted, resulting in a lowering of glass transition temperature (Tg) or degradation of adhesion. If the equivalent ratio exceeds 1.5, the cured epoxy resin may become hard and brittle, with the risk of cracking during reflow or thermal cycling.
The curing accelerant (C) is an arylborate salt. The resin composition comprising an arylborate salt as curing accelerant (C) has low-temperature curability and improved workability due to no substantial acceleration of viscosity buildup rate, as well as excellent adhesion and adhesion retention after hot humid storage. It is thus successful in attaining the objects and benefits of the invention as desired. Examples of the arylborate of the arylborate salt include tetraphenylborate, tetra-p-methylphenylborate (i.e., tetra-p-tolylborate), tetra-p-fluorophenylborate, tetra-m-fluorophenylborate and tetramethoxyphenylborate, with tetraphenylborate and tetra-p-tolylborate being preferred.
The arylborate salt (C) may contain one member selected from among alkali metals, alkyl ammonium compounds, imidazolium compounds, arylphosphonium compounds, and alkylphosphonium compounds. Of these, arylphosphonium compounds are preferred.
Suitable arylphosphonium compounds include triphenylphosphine, tritolylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, benzyldiphenylphosphine, tetraphenylphosphonium salts, tetratolylphosphonium salts, ethyltriphenylphosphonium salts, butyltriphenylphosphonium salts, and benzyltriphenylphosphonium salts.
Preferred examples of the curing accelerant (C) include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, and triphenylphosphine triphenylborane.
The curing accelerant (C) is preferably blended in an amount of 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight per 100 parts by weight of components (A) and (B) combined.
In addition to components (A) to (C), the epoxy resin composition may further contain (D) an inorganic filler and (E) other additives.
The inorganic filler (D) is optionally added to the epoxy resin composition for the purposes of lowering a coefficient of thermal expansion and improving humidity reliability. Examples of the inorganic filler include silicas such as fused silica, crystalline silica, and cristobalite, alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, glass fibers, and magnesium oxide. The average particle size and shape of the inorganic filler may be selected as appropriate depending on a particular application. Of these, spherical alumina, spherical fused silica and glass fibers are preferred.
The amount of the inorganic filler (D) is preferably 20 to 1,500 parts by weight, more preferably 50 to 1,000 parts by weight per 100 parts by weight of components (A) to (C) combined.
If necessary, other additives as component (E) may be added to the epoxy resin composition as long as the objects and benefits of the invention are not compromised. Exemplary additives include parting agents, flame retardants, ion trapping agents, antioxidants, adhesion promoters, stress reducing agents, and colorants.
The parting agent may be added for the purpose of improving mold release. Examples of the parting agent include well-known parting agents such as carnauba wax, rice wax, candelilla wax, polyethylene, polyethylene oxide, polypropylene, montanic acid, and montan waxes in the form of esters of montanic acid with saturated alcohols, 2-(2-hydroxyethylamino)ethanol, ethylene glycol or glycerol; stearic acid, stearic esters, and stearamides.
The flame retardant may be added for the purpose of imparting flame retardancy. The flame retardant is not particularly limited and any well-known flame retardants may be used. Examples include phosphazene compounds, silicone compounds, zinc molybdate on talc, zinc molybdate on zinc oxide, aluminum hydroxide, magnesium hydroxide, and molybdenum oxide.
The ion trapping agent may be added for the purposes of trapping ion impurities in the resin composition and preventing thermal degradation and moisture degradation. The ion trapping agent is not particularly limited and any well-known ion trapping agents may be used. Examples include hydrotalcites, bismuth hydroxide compounds, and rare earth oxides.
The stress reducing agent may be added for the purposes of preventing the resin from cracking, and reducing elasticity. Examples of the stress reducing agent include liquid silicone resins, liquid acrylic resins, liquid butadiene rubbers, solid silicone resins, solid acrylic resins, and solid butadiene rubbers.
Although the amount of component (E) may vary depending on the intended use of the epoxy resin composition, it is typically up to 10% by weight based on the total weight of the epoxy resin composition. The amount of component (E), if blended, is preferably at least 5% by weight.
The thermosetting epoxy resin composition may be prepared by the following method. For example, a resin mixture of components (A) to (C) may be obtained by mixing, stirring, dissolving and/or dispersing the epoxy resin (A), the aromatic amine-based curing agent (B), and the curing accelerant (C) simultaneously or separately, while heat treating if necessary. Also, a resin mixture of components (A) to (D) may be obtained by adding, stirring, dissolving and/or dispersing the inorganic filler (D) to the mixture of components (A) to (C). In certain applications, at least one additive (E) selected from parting agents, flame retardants, ion trapping agents and stress reducing agents may be added to and mixed with the mixture of components (A) to (C) or the mixture of components (A) to (D). Each of components (A) to (E) may be used alone or in admixture.
The method for preparing the resin mixture and the machine for mixing, stirring and dispersing are not particularly limited. Suitable machines include a mortar grinder, two-roll mill, three-roll mill, ball mill, planetary mixer, and MassColloider, equipped with stirring and heating units. These machines may be used in a suitable combination if desired.
When the epoxy resin composition is used as an encapsulant for semiconductor devices, it is preferably liquid at 25° C. By selecting the type and amount of the components, the viscosity of the epoxy resin composition is preferably controlled to a value of up to 1,000 Pa·s, specifically up to 500 Pa·s at 25° C. as measured by an E type rotational viscometer at 1 rpm. The lower limit of viscosity is typically at least 1 Pa·s, though not critical.
The epoxy resin composition may be molded under standard conditions in accordance with standard methods. Preferably, the composition is molded and cured at 40 to 100° C. and post-cured at 150 to 180° C. for 1 to 3 hours. For example, it is desired to post-cure the composition by heating in an oven at 150° C. for at least 1 hour. If the time of post curing at 150° C. is shorter than 1 hour, the cured product may have insufficient properties.
The epoxy resin composition is useful as an encapsulant, adhesive, and underfill material for semiconductor members. In particular, the composition may be advantageously used for encapsulating semiconductor devices such as diodes, transistors, ICs, LSIs, and VLSIs.
Examples of the invention are given below by way of illustration and not by way of limitation.
In Examples 1 to 13 and Comparative Examples 1 to 6, thermosetting epoxy resin compositions were prepared by blending components as shown below in accordance with the formulations in Tables 1 and 2. In Tables 1 and 2, the amounts of components are expressed in parts by weight (pbw) and (B)/(A) ratio represents equivalents of amino groups in component (B) per equivalent of epoxy groups in component (A).
(1) Epoxy resin (A1): bisphenol A type epoxy resin
(2) Epoxy resin (A2): bisphenol A type epoxy resin/bisphenol F type epoxy resin
(3) Epoxy resin (A3): aminophenol type trifunctional epoxy resin
(1) Aromatic amine-based curing agent (B1):
(2) Aromatic amine-based curing agent (B2):
(3) Alicyclic amine-based curing agent (B3):
(1) Tetraphenylphosphonium tetraphenylborate (C1):
(2) Tetraphenylphosphonium tetra-p-tolylborate (C2):
(3) Triphenylphosphine triphenylborane (C3):
(4) Triphenylphosphine (C4): (TPP from Hokko Chemical Industry Co., Ltd.)
(5) 2-Ethyl-4-methylimidazole (Shikoku Chemicals Corporation)
(6) Salicylic acid (Tokyo Chemical Industry Co., Ltd.)
(1) Spherical silica having an average particle size of 2 μm
(2) Spherical silica having an average particle size of 13 μm
The compositions were evaluated by the methods described below, with the results shown in Tables 1 and 2.
For curability evaluation, the resin compositions prepared in Examples 1 to 13 and Comparative Examples 1 to 6 were each cast into a mold of 1 mm thick, allowed to stand in an oven at 120° C. for 10 minutes, taken out of the oven, and cooled to room temperature. The sample was rated good “0” when no surface tack was observed and poor “X” when surface tack was observed or the sample was uncured. The results are shown in Tables 1 and 2.
The resin compositions (samples) of Examples 1 to 13 and Comparative Examples 1 to 6 immediately after preparation were measured for viscosity by a cone-plate rotational viscometer (Type E viscometer) at a temperature of 25° C., after 2 minutes from sample loading, according to JIS Z-8803: 2011. This viscosity is referred to as initial viscosity (mPa·s). Also the resin compositions were held at 25° C. for 8 hours and similarly measured for viscosity. A viscosity buildup rate (%) was computed from the following equation.
Viscosity buildup rate (%)=[(viscosity after 8 hr)−(initial viscosity)]/(initial viscosity)×100
The sample was rated good “O” when the viscosity buildup rate was within the range of 100% to 200% and poor “X” when the rate was more than 200%. The results are shown in Tables 1 and 2.
The epoxy resin compositions of Examples 1 to 13 and Comparative Examples 1 to 6 were liquid at 25° C. before curing. Then test pieces (i.e., cured samples) subject to the following tests were prepared by molding and curing the compositions at 120° C. for 1 hour.
A test piece was prepared by molding the composition over an area of 4 mm2 on a silicon chip of 10 mm×10 mm under the above conditions. For adhesion evaluation, the test piece was measured for shear bond strength at 150° C. by a bond tester DAGE Series 4000PXY (DAGE). The bonded area between the test piece frame and the resin was 10 mm2. The results are shown in Tables 1 and 2.
Adhesion Retentivity after Hot Humid Storage
The test piece (after 120° C./1 hr curing) was stored at 85° C./85% RH for 24 hours, then cooled to room temperature, and measured for shear bond strength by the same method as the initial adhesion. The adhesion retentivity (%) after hot humid storage was computed from the following equation.
Adhesion retentivity (%)=(shear bond strength after 85° C./85% RH/24 hr storage)/(initial shear bond strength)×100
The results are shown in Tables 1 and 2.
Japanese Patent Application No. 2017-093663 is incorporated herein by reference.
Although some preferred embodiments have been described, many modifications and variations may be made thereto in light of the above teachings. It is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2017-093663 | May 2017 | JP | national |
