The invention relates to an equipment and network cabinet according to the preamble of claim 1.
The invention is particularly suitable for server cabinets, in which a plurality of servers as electronic modular units are superimposed or also juxtaposed. Servers, particularly the compact constructions of e.g. a height unit (U), such as a pizzabox and blade server, are subject to significant power dissipations. In order to dissipate the heat it is known to place the electronic modular units in a housing with at least one fan, together with air inlets and air outlets.
It is known to construct equipment and network cabinets, particularly server cabinets, in a largely airtight manner and to provide a closed cooling air circuit and a heat ex-changer for removing the thermal power losses. DE 20 2004 006 552.5 uses an air-water heat exchanger to which is supplied via an outlet air duct the outlet air heated by the electronic modular units. The inlet air cooled in the heat exchanger passes via an inlet air duct to the electronic modular units.
The rising power levels of electronic components, such as process computers and servers are linked with constantly increasing heat losses. As a result of the very high and constantly further increasing thermal power losses within the equipment and net-work cabinets or server cabinets ever higher air mass flows are required. However, the cross-sections of the air ducting cabinet parts can only be increased to a very limited extent, so that there is a rise in the flow rates of the air within the cabinet or housing. With this is associated a considerable increase in the pressure loss of the cooling air which is recirculated.
At the same time the installation space for fans only exists to a limited extent. Also for noise protection reasons fans with increased hydraulic power levels can only be used to a limited extent. Increased pressure differences between the cabinet or housing also leads to higher demands with respect to the airtight construction of the cabinet or housing construction.
The object of the invention is to provide an equipment and network cabinet or a housing for receiving electronic modular units, in which the disadvantages associated with an increased flow rate of the cooling air circuit are largely avoided.
According to the invention the object is achieved by the features of claim 1. Appropriate and advantageous embodiments are given in the subclaims and the specific description relative to the drawings.
It is a fundamental idea of the invention to reduce the increased pressure losses resulting from an increased cooling air flow rate. According to the invention the flow resistance in the cooling air circuit is reduced by flow-correct components. The term flow-correct components is understood to mean all components which are used for optimizing, guiding and deflecting the air flow.
Advantageously as flow-correct components are provided elements for deflecting the air flow which is recirculated. Deflecting elements can e.g. be in the form of air or guide vanes, radii and baffle plates, which are preferably located in areas of the cooling air circuit in which the inlet air and/or outlet air is subject to a significant direction change, e.g. a 90° deflection.
Such deflection areas are formed more particularly upstream and downstream of a heat exchanger. If air vanes and radii are arranged in a defined manner in these deflection areas there is an improvement of the flow through due to reducing the flow resistance.
Advantageously a heat exchanger, e.g. an air-water heat exchanger, is arranged in a bottom-side area of a cabinet or housing and is connected to a substantially vertically oriented inlet air duct for the inlet air cooled in the heat exchanger and with an outlet air duct for the supply of the outlet air heated by the electronic modular units. Appropriately the deflection areas provided upstream and downstream of the heat exchanger are provided with the flow-correct components, particularly air vanes and radii.
It is particularly advantageous that the flow-correct components can be integrated into a deflection device, which can be preassembled. Such a deflection device can then be secured in the cabinet or housing, e.g. on panelling parts such as side walls, front or rear door.
If an outlet air duct is formed in a rear door, the associated deflection device can also be more particularly detachably fastened in the door. The air vanes are preferably arcuate and have an almost identical design and can in particular be arranged in offset super-imposed manner, e.g. on an imaginary diagonal over the entire cross-section of the deflection area.
The radii are appropriately provided for bridging a roughly right-angled corner area of the cabinet or a panelling part and are in particular arcuately designed in the same way as the air vanes.
Particularly in the inlet air duct it is appropriate for the planned supply of individual electronic modular units with cooled inlet air to provide baffle plates as flow-correct components. If said baffle plates can be detachably fixed, it is possible with limited effort to arrange the same in the in each case necessary, predeterminable position.
Appropriately the baffle plates have a spoiler-like construction and are provided with an impact surface for the inlet air, which is formed close to the reception area or the electronic modular units to be cooled.
The invention is described in greater detail hereinafter relative to the attached highly diagrammatic drawings, wherein show:
A server cabinet is shown in highly diagrammatic form in
The heat exchanger 5 is an air-water heat exchanger, which is connected to a vertically oriented inlet air duct 11 and a vertically oriented outlet duct 14. In this embodiment the inlet air duct 11 is constructed over virtually the entire height of cabinet 2 and has, considered in the flow direction, downstream of the heat exchanger 5 a deflection area 12 with flow-correct components 6. Inlet air 13 from the inlet air duct 11 is supplied to the electronic modular units 4 located in the housings and in this embodiment use is made of fans 26. The air flow in the vicinity of the electronic modular units 4 is illustrated by arrows 25 in
To reduce the flow resistance and the pressure losses in the cooling air circuit flow-correct components 6, particularly air vanes 7 and radii 8 (cf. FIGS. 3 to 5) are positioned in the outlet air-side deflection area 15.
Number | Date | Country | Kind |
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20 2004 016 492.2 | Oct 2004 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP05/09298 | 8/29/2005 | WO | 5/11/2007 |