This application claims the benefit of Taiwan application Ser. No. 112103533, filed Feb. 1, 2023, the disclosure of which is incorporated by reference herein in its entirety.
TECHNICAL FIELD
The disclosure relates in general to an equipment automatic control method and an electronic device using the same, and more particularly to an equipment automatic alignment method and a process robot device using the same.
BACKGROUND
Semiconductor manufacturing process requires a variety of equipment to perform testing, solder filling, etching and other processes. In some equipment, an alignment process is required. For example, the testing pins of the test equipment need to be aligned with the test pads. The solder outputting pin of the solder filling equipment needs to be aligned with the solder pads.
Traditionally, alignment must be done manually, but human errors often occur in the actual production line, resulting in a decline in product yield.
SUMMARY
The disclosure is directed to an equipment automatic alignment method and a process robot device using the same. The process robot device could automatically generate an operation command through various image analysis and processing programs to automatically control an operation interface of an equipment, so that the equipment can automatically complete an alignment process.
According to one embodiment, an equipment automatic alignment method is provided. The equipment automatic alignment method includes the following steps. An image of an equipment is obtained. The image is enhanced to obtain a plurality of candidate patterns. Each of the candidate patterns is expanded to obtain a first rectangular block and a second rectangular block. A plurality of first target patterns are obtained according to the first rectangular block, and a plurality of second target patterns are obtained according to the second rectangular block. A first base point is obtained from the first target patterns, and a second base point is obtained from the second target patterns. An operation command is generated according to the first base point and the second base point to automatically control an operation interface of the equipment, so that the first base point is aligned with the second base point.
According to another embodiment, a process robot device is provided. The process robot device includes an inputting unit, an enhancing unit, an expanding unit, a target capturing unit, a base analyzing unit and a command generating unit. The inputting unit is configured to obtain an image of an equipment. The enhancing unit is configured to enhance the image to obtain a plurality of candidate patterns. The expanding unit is configured to expand each of the candidate patterns to obtain a first rectangular block and a second rectangular block. The target capturing unit is configured to obtain a plurality of first target patterns according to the first rectangular block, and obtain a plurality of second target patterns according to the second rectangular block. The base analyzing unit is configured to obtain a first base point from the first target patterns, and obtain a second base point from the second target patterns. The command generating unit is configured to generate an operation command according to the first base point and the second base point to automatically control an operation interface of the equipment, so that the first base point is aligned with the second base point.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates the operation of an equipment according to an embodiment.
FIG. 2 illustrates a block diagram of a process robot device according to an embodiment.
FIG. 3 shows a flowchart of an equipment automatic alignment method according to an embodiment.
FIG. 4 illustrates the step S110 with an example.
FIG. 5 illustrates the step S120 with an example.
FIG. 6 illustrates the step S130 with an example.
FIG. 7 illustrates the step S140 with an example.
FIG. 8 illustrates the step S150 with an example.
FIG. 9 illustrates the step S160 with an example.
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
DETAILED DESCRIPTION
Please refer to FIG. 1, which illustrates the operation of an equipment 900 according to an embodiment. The equipment 900 is described by taking the test equipment as an example, but not limited thereto. When testing the wafer 800, it is necessary to accurately align a plurality of testing pins 930 with a plurality of test pads of the wafer 800. In this embodiment, the testing pins 930 and the wafer 800 can be photographed by the image capturing unit 500 to obtain an image IMO. After the image IMO is transmitted to a process robot device (also called Robotic Process Automation (RPA)) 100, the process robot device 100 analyzes and processes the image IMO to automatically generate an operation command CMO. The operation command CMO is used to automatically operate an operation interface 910 of the equipment 900, so that the testing pins 930 are accurately aligned with the test pads of the wafer 800.
In this embodiment, the process robot device 100 can automatically complete the operation of the operation interface 910 without manual judgment or operation, and smoothly make the testing pins 930 accurately align with the test pads of the wafer 800.
Please refer to FIG. 2, which illustrates a block diagram of a process robot device 100 according to an embodiment. The process robot device 100 includes an inputting unit 110, an enhancing unit 120, an expanding unit 130, a target capturing unit 140, a base analyzing unit 150 and a command generating unit 160. The inputting unit 110 is used to input various data, such as a wireless transmission module, a wired transmission module, or a transmission line. The enhancing unit 120, the expanding unit 130, the target capturing unit 140 and the base analyzing unit 150 are used for image analysis and processing, such as a circuit, a chip, a circuit board, a computer program product, or a storage device for storing program codes. The command generating unit 160 is used to generate the operation command CMO to automatically control the operation interface 910 of the equipment 900. The command generating unit 160 is, for example, a circuit, a chip, a circuit board, a computer program product, or a storage device for storing program codes.
In this embodiment, the image capturing unit 500 could take picture of the equipment 900 to input the image IMO to the process robot device 100. The process robot device 100 can automatically generate the operation command CMO through various image analysis and processing programs to automatically control the operation interface 910 of the equipment 900, so that the equipment 900 can automatically complete the alignment process. The operation of the above-mentioned components is described in detail below with a flow chart.
Please refer to FIG. 3, which shows a flowchart of an equipment automatic alignment method according to an embodiment. In step S110, as shown in FIG. 4, the image IMO of the equipment 900 is obtained by the inputting unit 110. FIG. 4 illustrates the step S110 with an example. The image capturing unit 500 is set up at a predetermined position to take pictures of the parts that need to be aligned. The image capturing unit 500 is set up at a predetermined position to take pictures of the parts that need to be aligned. As shown in FIG. 1, the image capturing unit 500 is installed inside the equipment 900, for example, to capture the testing pins 930 and the wafer 800. The image IMO obtained by the image capturing unit 500 can be directly transmitted to the inputting unit 110 of the process robot device 100.
As shown in FIG. 4, although the human can quickly know the target to be aligned from the image IMO, the computer cannot directly know which objects are the targets to be aligned to the image IMO, and it needs to use the technical means proposed in this disclosure.
Next, in step S120, as shown in FIG. 5, the enhancing unit 120 enhances the image IMO to obtain a plurality of candidate patterns PTi. FIG. 5 illustrates the step S120 with an example. In one embodiment, the enhancing unit 120 can increase the brightness of the image IMO to enhance each of the objects in the image IMO. Alternatively, the enhancing unit 120 can increase the contrast of the image IMO to enhance each of the objects in the image IMO. As shown in FIG. 5, there are several candidate patterns PTi that may need to be aligned in the image IMO.
Then, in step S130, as shown in FIG. 6, the expanding unit 130 expands the candidate patterns PTi to obtain a first rectangular block BK1 and a second rectangular block BK2. FIG. 6 illustrates the step S130 with an example. The expanding unit 130, for example, radially expands each of the candidate patterns PTi. Some adjacent candidate patterns PTi will be connected together after being expanded. As shown in FIG. 6, the candidate patterns PTi are extended to form the first rectangular block BK1, the second rectangular block BK2 and a third rectangular block BK3. In this step, the first rectangular block BK1 and the second rectangular block BK2 selected by the expanding unit 130 satisfy at least one of the following conditions. The first rectangular block BK1 and the second rectangular block BK2 are elongated structures. The length L1 of the first rectangular block BK1 and the length L2 of the second rectangular block BK2 are substantially identical. The first rectangular block BK1 is substantially parallel to the second rectangular block BK2.
In an embodiment, the expanding unit 130 may also consider multiple conditions at the same time, and select the first rectangular block BK1 and the second rectangular block BK2 that satisfy the most conditions.
Next, in step S140, as shown in FIG. 7, the target capturing unit 140 obtains a plurality of first target patterns TG1j according to the first rectangular block BK1, and obtains a plurality of second target patterns TG2j according to the second rectangular block BK2. FIG. 7 illustrates the step S140 with an example. In this step, the target capturing unit 140, for example, selects the first target patterns TG1j from the candidate patterns PTi according to the range of the first rectangular block BK1; the target capturing unit 140, for example, selects the second target patterns TG2j from the candidate patterns PTi according to the range of the second rectangular block BK2. The quantity of first target patterns TG1j and the quantity of the second target patterns TG2j are identical.
Then, in step S150, as shown in FIG. 8, the base analyzing unit 150 obtains a first base point BS1 from the first target patterns TG1j, and obtains a second base point BS2 from the second target patterns TG2j. FIG. 8 illustrates the step S150 with an example. In one embodiment, the base analyzing unit 150, for example, obtains the first base point BS1 at the center of the first rectangular block BK1, and obtains the second base point BS2 at the center of the second rectangular block BK2.
Or, the base analyzing unit 150, for example, obtains the first base point BS1 at a predetermined order of the first target patterns TG1j (for example, the 5th order), and obtains the second base point BS2 at the predetermined order of the second target patterns TG2j (for example, the 5th order).
In addition, in the case that the first target pattern TG1j to be aligned is always fixed (such as a pinhole fixedly set in the equipment 900), the first base point BS1 can also be predefined.
Then, in step S160, as shown in FIG. 9, the command generating unit 160 automatically generates the operation command CMO according to the first base point BS1 and the second base point BS2 to automatically control the operation interface 910 of the equipment 900, so that the first base point BS1 is aligned with the second base point BS2. FIG. 9 illustrates the step S160 with an example. The operation command CMO includes commands for simulating operation interface 910, such as clicking buttons, dragging cursors, and inputting text. As shown in FIG. 2, the operation interface 910 can control the driving unit 920 according to the operation command CMO to move the testing pins 930 so that the testing pins 930 are aligned with the test pads of the wafer 800.
According to the above embodiment, the process robot device 100 could automatically generate the operation command CMO through various image analysis and processing programs to automatically control the operation interface 910 of the equipment 900, so that the equipment 900 can automatically complete the alignment process.
It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments. It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims and their equivalents.
Patent Application
20240260198
