Claims
- 1. An etchant, comprising: an aqueous solution containing hydrogen iodide and ferric chloride, wherein the hydrogen iodide is contained at a concentration of 19-52 wt. %, and the ferric chloride is contained at a concentration of 3-21 wt. %.
- 2. An etchant according to claim 1, wherein the hydrogen iodide is contained at a concentration of 24-48 wt. %, and the ferric chloride is contained at a concentration of 6-18 wt. %.
- 3. An etchant, comprising: an aqueous solution containing hydrogen iodide and ferric chloride, which is a mixture solution of 0.1-1.5 volume of a ferric chloride aqueous solution having an FeCl.sub.3 content of about 35 wt. % with one volume of hydroiodic acid having an HI content of 47-57 wt. %.
- 4. An etchant according to claim 3, which is a mixture solution of 0.2-1 volume of a ferric chloride aqueous solution having an FeCl.sub.3 content of about 35 wt. % with one volume of hydroiodic acid having an HI content of 47-57 wt. %.
- 5. An etchant according to claim 1, which is an etchant for selective etching of an indium tin oxide film in contact with a pattern of molybdenum or molybdenum alloy film formed on the indium tin oxide film.
- 6. An etchant according to claim 3, which is an etchant for selective etching of an indium tin oxide film in contact with a pattern of molybdenum or molybdenum alloy film formed on the indium tin oxide film.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2-211626 |
Aug 1990 |
JPX |
|
3-218071 |
Aug 1991 |
JPX |
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Parent Case Info
This application is a division of application Ser. No. 743,020, filed Aug. 9, 1991, U.S. Pat. No. 5,296,096.
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|
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|
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Feb 1993 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
743020 |
Aug 1991 |
|