Claims
- 1. An alkylated hydroxy aromatic compound product having improved viscosity properties, formed by the alkylation of (i) at least one hydroxy aromatic compound having the formula H-Ar-(OH).sub.c, wherein Ar is ##STR27## a is 1 or 2; R" is a halogen radical; b is an integer from 0 to 2; and c is an integer from 1 to 2; with (ii) at least one ethylene alpha-olefin polymer of 300 to 20,000 number average molecular weight, wherein at least 30% of said polymer's chains contain terminal ethenylidene unsaturation.
- 2. The aromatic compound of claim 1 wherein said polymer comprises ethylene-propylene copolymer.
- 3. The aromatic compound of claim 2 wherein said polymer has a number average molecular weight of between about 700 and about 15,000.
- 4. The aromatic compound of claim 3 wherein said number average molecular weight is between about 1,500 and 5,000.
- 5. The aromatic compound of claim 1 wherein said polymer has a VR value of less than 4.1.
- 6. The aromatic compound of claim 1 wherein said polymer has a molar ethylene content of between about 20.degree. and about 80 percent.
- 7. The aromatic compound of claim 2 wherein said polymer has a molar ethylene content of between about 45.degree. and about 65.degree. percent.
- 8. A process for forming an ethylene alpha-olefin polymer-substituted hydroxyaromatic compound product in high conversion which comprises contacting in an alkylation zone at a temperature of from about 20.degree. to 250.degree. C. in the presence of an effective amount of at least one acidic alkylation catalyst (i) at least one hydroxy aromatic compound having the formula H-Ar-(OH).sub.c, wherein Ar is ##STR28## a is 1 or 2; R" is a halogen radical; b is an integer from 0 to 2; and c is an integer from 1 to 2, and (ii) at least one ethylene alpha-olefin polymer of 300 to 20,000 number average molecular weight, wherein at least 30% of said polymer's chains contain terminal ethenylidene unsaturation, to form an alkylation product mixture containing said product formed at a conversion of at least about 70%, based on the polymer charged to said zone.
- 9. The process of claim 8 wherein said polymer comprises an ethylene-propylene copolymer.
- 10. The process of claim 8 wherein said copolymer has a number average molecular weight of from about 300 to about 15,000.
- 11. The process of claim 10 wherein said number average molecular weight is between about 300 and 5,000.
- 12. The process of claim 8 wherein said polymer has a molar ethylene content of between about 20.degree. and about 80.degree. percent.
- 13. The process of claim 9 wherein said polymer has a molar ethylene content of between about 45 and about 65.degree. percent.
- 14. The process of claim 8 wherein said polymer number average molecular weight is from 1,500 to 10,000.
- 15. The process of any of claims 8-14 wherein said polymer and hydroxy aromatic compound are charged to said alkylation zone in a ratio of from about 0.1 to 10 moles of said hydroxy aromatic compound per mole of said polymer.
- 16. The process of claim 15 wherein said alkylation catalyst comprises at least one member selected from the group consisting of H.sub.3 PO.sub.4, H.sub.2 SO.sub.4, HF, BF.sub.3, HF-BF.sub.3, acidic ion exchange resin, and complexes of any of the foregoing members with C.sub.2 to C.sub.10 ethers, C.sub.1 to C.sub.10 alcohols, C.sub.2 to C.sub.10 ketones and phenols.
- 17. The process of claim 16 wherein the acid catalyst comprises an inorganic catalyst and is charged to said alkylation zone in an amount of from about 0.01 to 0.5 moles of said catalyst per mole of said hydroxy aromatic compound charged to said zone.
- 18. The process of claim 8 wherein said alkylation reaction is effected at temperatures of from 30.degree. to 150.degree. C.
- 19. The process of claim 18 wherein said conversion is from about 70 to 98%.
Parent Case Info
This application is a Rule 60 Continuation of U.S. patent application Ser. No. 788,907 filed Nov. 7, 1991 abandoned which is a Rule 60 Divisional of U.S. patent application Ser. No. 473,625 filed Feb. 1, 1990 which is a continuation-in-part of U.S. patent application Ser. No. 226,604 filed Aug. 1, 1988, now U.S. Pat. No. 5,017,299.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
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0128046 |
May 1984 |
EPX |
Divisions (1)
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Number |
Date |
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Parent |
473625 |
Feb 1990 |
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Continuations (1)
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Number |
Date |
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Parent |
788907 |
Nov 1991 |
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Continuation in Parts (1)
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226604 |
Aug 1988 |
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