This disclosure relates to heat exchangers. More specifically, this disclosure relates to managing the refrigerant charge in the housing of heat exchangers utilized in heating, ventilation, air conditioning, and refrigeration (“HVACR”) systems.
HVACR systems are generally used to provide environmental control of an enclosed space (e.g., an interior space of a commercial building or a residential building, an interior space of a refrigerated transport unit, or the like). An HVACR system may include a heat transfer circuit that utilizes a working fluid for providing cooled or heated air or water to an area. The heat transfer circuit includes an evaporator. The evaporator is configured to evaporate the working fluid to create a vapor stream.
This disclosure relates to heat exchangers. More specifically, this disclosure relates to managing the refrigerant charge in the housing of heat exchangers utilized in heating, ventilation, air conditioning, and refrigeration (“HVACR”) systems.
In some embodiments, an evaporator includes a housing having a first end longitudinally opposing a second end. An inlet is disposed on the housing and configured to receive a fluid. A tube bundle is disposed in the housing and configured to evaporate the fluid to provide a vapor stream arranged to exit through an outlet on the housing. A flow balancer is provided between the tube bundle and the outlet on the housing and is configured to balance refrigerant quality in the evaporator by controlling the vapor stream.
In some embodiments, an HVACR system can include an evaporator arranged to evaporate a fluid to a vapor stream. The evaporator includes a housing having a first end longitudinally opposing a second end. An inlet is disposed on the housing and configured to receive a fluid. A tube bundle is disposed in the housing and configured to evaporate the fluid to provide a vapor stream arranged to exit through an outlet on the housing. A flow balancer is provided between the tube bundle and the outlet on the housing and is configured to balance refrigerant quality in the evaporator by controlling the vapor stream.
In some embodiments, a method of operating an evaporator is disclosed. The method includes receiving a fluid from an inlet disposed on the housing having a first end longitudinally opposing a second end; evaporating the fluid with a tube bundle disposed in the housing, providing a vapor stream of the fluid; balancing refrigerant quality in the evaporator by controlling the vapor stream; and exiting the vapor stream through the outlet.
In the detailed description that follows, embodiments are described as illustrations only since various changes and modifications will become apparent to those skilled in the art from the following detailed description. The use of the same reference numbers in different figures indicates similar or identical items.
In the following detailed description, reference is made to the accompanying drawings, which form a part of the description. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. Furthermore, unless otherwise noted, the description of each successive drawing may reference features from one or more of the previous drawings to provide clearer context and a more substantive explanation of the current example embodiment. Still, the example embodiments described in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that the aspects of the present disclosure, as generally described herein and illustrated in the drawings, may be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are explicitly contemplated herein.
Embodiments described herein are directed to heat exchangers, and preferably, an evaporator, and HVACR systems that include the evaporator, in which the evaporator includes a flow balancer to manage refrigerant charge in the evaporator. Refrigerant charge or working fluid charge can be the amount of fluid disposed in the housing or portions thereof in a segment of the housing of the evaporator at a given time, at a steady state, and or during operating of the evaporator. In some embodiments, the evaporator can be a flooded evaporator, in which the flooded evaporator receives the refrigerant from the bottom of the flooded evaporator to cover at least a portion of the tube bundle with the refrigerant.
An HVACR system can include a heat transfer circuit configured to heat or cool a process fluid (e.g., air, water and/or glycol, or the like). The heat transfer circuit includes an evaporator to evaporate a working fluid (e.g., a refrigerant) in a liquid form or a mixture of liquid and vapor form into a vapor stream. For example, in a cooling mode, the evaporator can be configured to have the working fluid absorb thermal energy from the process fluid to cool the process fluid. In some embodiments, the cooled process fluid can exchange thermal energy with indoor air to condition the indoor air.
The evaporator can include a housing, a tube bundle, an inlet, and an outlet. The inlet receives the working fluid, and the vapor stream formed from the working fluid can exit the evaporator at the outlet. The process fluid can flow through the tube bundle from a first end to a longitudinally opposing second end of the housing to exchange thermal energy with the working fluid, evaporating the working fluid to provide the vapor stream.
The working fluid is a liquid or a mixture of liquid and vapor and can accumulate in a lower portion of the evaporator, e.g., covering at least a portion of the tube bundle. The working fluid can accumulate longitudinally along the housing and be evaporated into the vapor stream.
The tube bundle extends longitudinally in the lower portion of the housing to provide the thermal energy to evaporate the working fluid. The working fluid absorbs thermal energy from the process fluid which releases thermal energy, e.g., by lowering its temperature, while flowing through the tube bundle. In an embodiment, the tube bundle has a single-path in the housing. The temperature of the process fluid can be decreasing along the longitudinal direction of the housing from the entrance to the exit of the tube bundle. Decreasing temperature can cause lower temperature differentials between the working fluid and the process fluid along the longitudinal direction inside the housing and reduce the rates of evaporation in longitudinal segments of the housing.
It is appreciated that vapor velocities in a segment can be proportional to evaporation rates. Additionally, higher vapor velocities can more effectively lift liquid droplets than that in other segments. The more effective droplet elevation can draw more refrigerant toward the high evaporation segments. In the prior evaporators, the vapor velocities can be so effective in lifting the liquid droplets such that, in the high evaporation segments, more liquid refrigerant can be available than the amount that can be evaporated by the segment of the tube bundle, which induces liquid refrigerant to leave the tube bundle, the liquid refrigerant reduces the overall efficiency of the refrigeration cycle. Further, the segment(s) having high evaporator rates can have a higher refrigerant charge than that of other segments (e.g., segment(s) with lower evaporation rates) and create an imbalanced refrigerant charge among the segments of the prior evaporators. It is appreciated that the refrigerant stream's ability to lift liquid droplets and/or a mixture liquid and vapor refrigerant can be referred to as the effectiveness of droplets elevation.
In order to control or balance the refrigerant quality in the evaporator, embodiments of an evaporator are disclosed. In some embodiments, the evaporator can include a flow balancer disposed therein. The flow balancer can balance the refrigerant quality by inducing a pressure drop over the longitudinal segment(s) with larger temperature differential (dT) (i.e., larger dT segment(s)). In some embodiments, the larger dT segment may correlate or overlap with segments with higher vapor flow rates.
The pressure drop induced by the flow balancer can control the pressure available to lift liquid refrigerant (e.g., liquid droplets) in the larger dT segment(s) to manage the droplet elevation and/or the refrigerant charge in the larger dT segment(s). It is appreciated that managing the refrigerant charge in the larger dT segment(s) can allow more refrigerant to flow to others segments, balancing the refrigerant charges among the segments of the evaporator housing.
A balanced charge can help provide proper wetting of the tube bundles by the working fluid, e.g., in the segment(s) having lower temperature differentials. Generally, a wetted tube has a higher rate of heat transfer than a dried or insufficiently wetted tube. Accordingly, increasing the portion of sufficiently wetted tubes in the tube bundle (e.g., provide proper wetting in some low dT segments of the housing) can increase the rate of heat transfer of the tube bundle as a whole and increase the heat transfer efficiency of the evaporator, compared to prior evaporators with imbalanced refrigerant charge. In some embodiments, it is appreciated that the efficiency gained from fully wetting, or properly wetting, of the tube bundle can more than offset the pressure drop induced by the flow balancer.
A flow balancer can guide a direction of the flow of the vapor stream in certain segments of the evaporator to align the distribution of the vapor stream. For example, the flow balancer can align the distribution by changing, guiding, and/or adjusting the flow direction of at least a portion of the vapor stream. The alignment can include aligning at least a portion of the vapor stream axially toward the refrigerant outlet of the housing such that the vapor flow can be more uniformly distributed, for example, across the refrigerant outlet of the housing of the evaporator. The alignment can be arranged to occur at a location near, adjacent to, or above a demister or mist eliminator. A more uniformly distributed vapor stream in the evaporator (e.g., uniform flow of vapor stream across the outlet 240 of
Further, by balancing the refrigerant charge, the droplet elevation of larger dT segments of a prior evaporator can be higher than that of an embodiment of the evaporator disclosed herein with the same total refrigerant charge.
The y-axis can be a distance from the bottom of the interior of the evaporator at a central plane disposed longitudinally and/or vertically within the housing of the evaporator. The numbers on the lines indicate the refrigerant quality at the corresponding location in the housing. For example, the line with 0.2 indicates a percentage vapor to be 20% at the locations of the housing of the evaporator corresponding to the line with 0.2. The line with the number 1.0 indicates that the working fluid contains 100% or nearly 100% vapor at the locations in the housing corresponding to the line with 1.0.
A process fluid (e.g., water) can flow through an inside of the tubes of a tube bundle to exchange thermal energy with the working fluid (e.g., a refrigerant). As shown in
At least in part due to the large temperature differential, e.g., at location 810A, liquid droplet elevation can be highly effective while the evaporation rate has decreased. This causes a large portion of the liquid working fluid to be lifted and a large amount of liquid working fluid may exit the tube bundle. The location 810A can be about 20% along the length of the evaporator from the left end where the water enters.
Additionally, as illustrated in
According to an embodiment, a flow balancer (e.g. 250 of
It is appreciated that the tube(s) can be wetted from being submerged in the liquid stream of the working fluid, for example in the area lower than the line 0.2. With tubes located in the location with higher refrigerant quality (e.g., 0.6, 0.8, or the like), the working fluid can be a mixture of vapor and fluid or in which the vapor can carry droplets of the working fluid to flow around the tube bundle and cause the tube bundle to exchange thermal energy with liquid working fluid.
With the charge of working fluid in the housing being equalized or balanced, low qualities persist higher in region 810B than in prior evaporators, reducing the portion of the tube bundle exposed to the vapor stream. It is appreciated that it is not required to raise the liquid level (e.g., at 810B) so much as to submerge the tube bundle entirely into the liquid stream. A sufficiently lowered refrigerant quality having a higher percentage of liquid contacting the tube bundle can improve the overall heat transfer and improve the efficiency of the evaporator.
Similar to the liquid carryover of the working fluid seen in
The working fluid or refrigerant outlet of the evaporator can often be disposed at or near the location 810A above the demister, which can further reduce the vapor pressure at this location, e.g., due to compressor suction. Lower vapor pressure can correlate with lower saturation temperature, more effective droplet elevation, and/or even more rapid evaporation. The entrained droplets can be created by a large volume of refrigerant bubbles rapidly rising in the liquid stream, and further drawing charge of working fluid to the segment and away from other segments of the evaporator housing.
The process fluid (e.g., water) can be arranged to be cooled by the working fluid and to heat/evaporate the working fluid (e.g., a refrigerant). It is appreciated that, at the top right corner 820A, the process fluid temperature does not change, indicating that if the liquid working fluid were present, the process fluid could potentially be provided to increase the rate of thermal exchange. It is appreciated that 820A and 820B can be the location corresponding to the location under 810B as shown in
It is appreciated that the high droplet elevation at location 810A as shown in
Generally, pressure variance from axial flow can be caused by the mass flow exiting the tube bundle and/or the location of the refrigerant outlet. A larger pressure variance allows low quality (i.e., liquid dense) flow to climb higher in the tube bundle such that more entrained droplets are carried by the vapor stream. Pressures just above far segments of the tube bundle can be higher than at 810A suppressing low quality flow in these segments.
According to some embodiments, an evaporator that includes a flow balancer can add an additional pressure loss mechanism which can be selectively applied to suppress low quality refrigerant flow. This can reduce the amount of entrained droplets in the vapor stream at the refrigerant outlet of the evaporator (e.g., compared to a prior evaporator with the same refrigerant charge). The pressure loss mechanism can be further configured to beneficially align the flow of the vapor stream to reduce frictional loss as the vapor exits the housing of the evaporator, for example, via the refrigerant outlet.
In order to help understand pressure variances along the evaporator,
According to some embodiments, in order to control or balance the quality of refrigerant in the evaporator, a flow balancer can be used in an evaporator, for example, for the HVACR system. The flow balancer can induce a pressure drop over the segment(s) with excessively low bundle exit qualities (e.g., larger dT segments) to suppress refrigerant mass in these segments. The pressure drop required to shift the working fluid is generally not substantial enough to negatively impact heat transfer rates in the larger dT segments of the evaporator. Accordingly, the working fluid can migrate to other segments of the housing, thus, balancing and/or optimizing the charge of refrigerant disposed in the segments of the evaporator housing, as further discussed below.
The heat transfer circuit 100 can be configured as a cooling system (e.g., a water chiller, a fluid chiller of an HVACR, an air conditioning system, or the like) that can be operated in a cooling mode. The heat transfer circuit 100 can be configured to operate as a heat pump system that can run in a cooling mode and a heating mode.
The heat transfer circuit 100 applies known principles of a vapor-compression refrigeration cycle. The heat transfer circuit 100 can be configured to heat or cool a process fluid such as water, glycol, gas, air, or the like. In an embodiment, the heat transfer circuit 100 may represent a chiller system that cools any process fluids such as water, glycol, gas, air, or the like. In an embodiment, the heat transfer circuit 100 may represent an air conditioner and/or a heat pump that cools and/or heats a process fluid such as air, water, or the like.
During the operation of the heat transfer circuit 100, a vapor stream of a working fluid at a relatively low pressure of (e.g., refrigerant, refrigerant mixture, or the like) can flow into the compressor 110 from the evaporator 140. The vapor stream can be the working fluid in a vapor form or predominately vapor form. The compressor 110 compresses the vapor stream into a high pressure state having a relatively high pressure, which can also increase the temperature of the vapor stream to have a relatively high temperature. After being compressed, the vapor stream flows from the compressor 110 to the condenser 120. In addition to the vapor stream of the working fluid flowing through the condenser 120, a first process fluid 150 (e.g., external air, external water, chiller water, heat transfer fluid, or the like) also separately flows through the condenser 120. The first process fluid 150 exchanges thermal energy with the working fluid as the first process fluid 150 flows through the condenser 120, cooling the working fluid as it flows through the condenser 120. The vapor stream of the working fluid condenses to a liquid form or predominately liquid form, providing a liquid stream. The liquid stream then flows into the expander 130.
The expander 130 allows the working fluid to expand, lowering the pressure of the working fluid. In an embodiment, the expander 130 can be any expansion devices such as an expansion valve, expansion plate, expansion vessel, orifice, or the like. It should be appreciated that the expander may be any type of expander used in the field of expanding a working fluid to cause the working fluid to decrease in pressure and/or temperature.
The liquid stream of relatively lower pressure working fluid then flows into the evaporator 140, for example, via a conduit 135. A second process fluid 160 (e.g., external air, external water, chiller water, heat transfer fluid, or the like) also flows through the evaporator 140. The working fluid exchanges thermal energy with the second process fluid 160 as it flows through the evaporator 140, cooling the second process fluid 160. As the working fluid exchanges thermal energy (e.g., absorb heat), the working fluid evaporates to a vapor, or a predominately vapor form, providing the vapor stream. The vapor stream of the working fluid then returns to the compressor 110 from the evaporator 140, for example, via a conduit 145.
As illustrated in
The housing 210 can be a shell having an interior 205, containing components such as the tube bundle 230, the flow balancer 250, or the like. The housing 210 can have an elongated body with the first end 211 and the second end 212 opposing each other in the longitudinal direction of the elongated body.
The inlet 220 is disposed on the housing 210. The inlet 220 can be an opening on the housing 210 to receive the working fluid. In some embodiments, a conduit 222 can fluidly connect to the interior 205 of the housing 210 via the inlet 220 to provide the working fluid, for example, from an expander (e.g., the expander 130 of
In some embodiments, the working fluid received in the evaporator 200 can be a liquid stream of a refrigerant in liquid form or predominantly liquid form. In some embodiments, the liquid stream can include a percentage of weight, volume, or the like of the refrigerant vapor in the liquid stream, for example, as bubbles flowing with in the liquid stream. For example, the liquid stream with no (e.g., 0% or nearly 0%) vapor can have a refrigerant quality of 0; and the liquid stream with no or nearly no liquid can have a refrigerant quality of 1.
The inlet 220 can optionally connect to a distributor 224 that extends in the longitudinal direction in the interior 205 of the housing 210. The distributor 224 can be one or more tube or channels to distribute the working fluid to flow in the longitudinal direction in the interior 205 of the housing 210. It is appreciated that the inlet 220 is illustrated to be located in the middle between the first end 211 and the second end 212 of the housing 210. However, the inlet 220 can be located anywhere on the housing 210 for receiving the working fluid. In some embodiments, the inlet 220 is located in a lower portion 213 (shown in
The tube bundle 230 can include a plurality of tubes configured to receive a second fluid to evaporate the working fluid. The second fluid can be a process fluid (e.g., air, water, glycol, a mixture glycol and/or water mixture, etc.) that flow through interiors of the tubes of the tube bundle 230.
The process fluid can enter the interiors of the tubes of the tube bundles 230 from a first end of the tube 231 and exit the tube from a second end of the tube 232. In some embodiments, the first end of the tube 231 can be an inlet end and the second end of the tube 232 can be an exit end. In a cooling mode, after the process fluid being cooled by the working fluid, the process fluid can be provided to a conditioned space to directly or indirectly provide cooling in the conditioned space.
The tube bundle 230 can receive the process fluid from a process fluid supply disposed on, for example, the first end 211 and/or the second end 212 of the housing 210. The process fluid supply can include, for example, a water box (not shown) fluidly connecting a process fluid source (e.g., water source) to distribute the process fluid into the entering ends the tubes in the tube bundle 230. In some embodiments, the process fluid can enter the interior of the tubes via a tube inlet 231. In some embodiments, the tube inlet(s) 231 receiving the process fluid is disposed on the first end of the housing 210. The process fluid can exit the interior of the tubes of the tube bundle 230 via a tube outlet 232. In some embodiments, the tube outlet(s) 232 can be disposed on at the second end 212 of the housing 210.
It is appreciated that the tube bundle can have a single-path or more than one path. In the illustrated example, the tube bundle 230 has a single path including straight tubes that extend from the first end 211 to the second end 212 such that the tube inlet(s) 231 is disposed at the first end 211 and the tube outlet(s) 232 can be disposed at the second end 212 of the housing 210. In some embodiments, the tube bundle can include bent tubes or multi-pass arrangements in the ends to create one or more forward paths and one or more return paths. For example, the tubes can be bent 180 degrees at or near the second end 212 such that both the tube inlet(s) 231 and the tube outlet(s) 232 are disposed on the first end 211 of the housing 210.
The outlet 240 is disposed on the housing 210. The outlet 240 can be an opening on the housing 210 to allow the vapor stream of the working fluid to exit from the housing 210. The vapor stream can exit the housing 210 and flow to the compressor 110 via the conduit 145 as shown in
In some embodiments, the vapor stream of the working fluid can be a refrigerant in vapor form or in predominantly vapor form. In some embodiments, the vapor stream can be superheated vapor stream to reduce providing, or carryover, liquid droplets to downstream equipment. For example, a compressor (e.g., 110 of
It is appreciated that the evaporator 200 can be a shell and tube evaporator, such as a flooded evaporator or a flooded-type evaporator used in a refrigeration system. In some embodiments, a working fluid can accumulate in a lower portion of the housing 210 to wet the tube bundle 230.
It is appreciated that the tube can be wetted by being submerged in liquid working fluid and/or by refrigerant vapor bringing liquid droplets to be in contact with the tubes, or a portion of the tubes, in the tube bundle. For example, the refrigerant quality can be balanced or controlled such that, at the location of the threshold (e.g., 215 discussed below), the refrigerant quality is within a preferred range. In some embodiments, the preferred range can be 0.5-0.8, 0.6-0.8, or the like. With tubes located in the location with higher refrigerant quality (e.g., 0.6, 0.8, or the like), the working fluid vapor can carry droplets of the working fluid to flow through and contact the tube bundles, causing the tube bundle to exchange thermal energy with the liquid working fluid. At or above certain refrigerant quality (e.g., 0.8 or 0.9) the flowing working fluid can contain so little liquid that the upper tubes in the tube bundle exchange little thermal energy with predominately vaporized working fluid, since vapor generally has a lower rate of heat transfer.
The flow balancer 250 can be disposed in the interior 205 of the housing 210 and in the vapor stream of the working fluid to optimize, or balance, the pressure drop of the vapor stream evaporated by the tube bundle 230 and/or the refrigerant charge in the evaporator. Optimizing or balancing the vapor stream pressure drop can include causing the vapor speed, the differential pressure, or the like, to be electively induced across the longitudinal segments of the housing 210, or the like, e.g., substantially different across the longitudinal segments. It is appreciated that the velocity vector of the vapor flow departing the flow balancer 250 may be directed to present a more uniformly distributed flow, and/or a more uniformly distributed vapor stream, to the outlet 240 of the evaporator 200. The uniform flow distribution reduces local separation and/or flow recirculation zones. Local high velocity zones and associated frictional pressure losses are thus reduced or eliminated.
The flow balancer 250 can induce a pressure drop in the vapor stream, for example by reducing an overall cross-sectional area in the flow path through the flow balancer 250, changing flow directions of the vapor stream, or the like, and/or increasing the pressure in the evaporator, especially at certain segments. The magnitude of the pressure drop created by the flow balancer 250 in a given segment can generally correspond to the vapor velocity in the corresponding segment of the housing 210, which can affect the liquid level, and/or refrigerant charge, of the refrigerant in the different segments of the housing 210. Accordingly, the flow balancer 250 can create a larger pressure drop in the segments of higher flow rate, higher liquid level, and/or more effective droplet elevation. In some embodiments, the flow balancer 250 does not remove or reduce entrained droplets from the vapor stream.
A demister 260 can be disposed in the housing 210. The demister 260 can be disposed in the vapor stream in the interior 205 of the housing 210 to remove or reduce entrained droplets from the vapor stream. In some embodiments, the demister 260 can be disposed between the liquid level and the flow balancer 250. In some embodiments, the flow balancer 250 can be disposed between the demister 260 and the outlet 240 of the housing 210.
The demister 260 can have a porous structure to allow vapor in the vapor stream to pass through voids in the porous structure. Any liquid droplets entrained in the vapor stream can be removed by the porous structure before exiting the demister 260, e.g., due to friction and/or inducing the entrained droplets to collide with each other and/or with the porous structure and creating larger droplets that are more likely to fall out from the vapor stream.
It is appreciated that the demister 260 can be any porous structure, finned structure, filter, or the like, such as, a mesh, a stack of mesh having the same or different structures, finned plate(s), wired mesh(es), filter(s), or the like, or a combination thereof. The demister 260 can be actively heated or cooled utilizing a power source (e.g., an electric heater or a heat transfer fluid stream) to remove or reduce entrained droplets. It is further appreciated that the demister 260 is configured to induce little to no pressure drop for the vapor stream while providing a large surface area for removing droplets from the vapor stream. For example, the surface area for a demister can be 100-5000 m2 per m3 such that droplets in the vapor stream passing through the demister 260 can more likely collide with the surface for the demister 260 and be removed from the vapor stream. A demister is further configured to capture nearly all droplets as small as 5-10 microns. A demister typically includes large amounts of open area to allow efficient drainage and to minimize pressure losses. Pressure losses are often maintained at less than 0.01 psi but may increase to 0.03 psi under heavy liquid loads.
The liquid stream 270 can be the working fluid (e.g., a refrigerant) in liquid form or predominately liquid form that contains a portion of vapor bubbles 271 flowing with the liquid stream. As the liquid stream 270 accumulates in the lower portion 213 of the housing 210, the tube bundle 230 can evaporate the working fluid to create more bubbles that contain pockets of vapor of the working fluid 275. At the threshold 215 between the liquid space and the vapor space, all or nearly all the liquid from working fluid 275 are evaporated into vapor. In some embodiments, the threshold 215 represents the location within the housing 210 of the minimum quality threshold. If working fluid qualities below this were to enter the mist eliminator they would overwhelm it and pass liquid working fluid out of the evaporator tube bundle. The threshold 215 may also represent where the amount of liquid refrigerant available is insufficient to support the full potential of evaporation from the tubes. It is appreciated that the working fluid evaporated into a vapor form can include a vapor stream with entrained droplets 281 that flow with the vapor stream 280. It is appreciated that tubes in a tube bundle of a flooded evaporator is generally wetted by the flowing droplets in the vapor stream, submersion, or a combination of both. Tubes disposed in an upper portion of the tube bundle 230 (i.e., upper tubes) can be wetted primarily by liquid droplets carried by flowing vapor. The droplets contact the tube and cover the outer surface of the tube so that the tube is exchanging thermal energy with a liquid film formed by the droplets. Tubes disposed in a lower portion of the tube bundle (i.e., lower tubes) can be wetted by pooled or accumulated liquid.
The flow balancer 250 can be disposed in the vapor stream 280, above the threshold 215 to induce pressure drop in the vapor stream 280 and/or in the housing 210. In an embodiment, the flow balancer 250 can be disposed above the demister 260 in the flow direction of the vapor stream 280. In the illustrated example of
The flow balancer 250 can be disposed at the first end 211 of the housing above the demister 260 (not shown). The outlet 240 is disposed above the flow balancer 250. It is appreciated that the flow balancer 250 can be adjacent, connected, in contact with, or spaced away from, any or all of the end panel 216, end panel 217, side wall 218, and/or side wall 219 of the housing 210 of the evaporator 200. In some embodiments, the flow balancer 250 can be extended along the entirety of the length of the tube bundle 230 to be connected with or adjacent to all of the end panels 216, 217 and side wall 218, 219 such that forcing all or nearly all of the vapor stream 280 through the flow balancer 250. In some embodiments, the flow balancer 250 is provided along certain segments of the tube bundle 230 to control the refrigerant charge in the evaporator 200.
It is appreciated that, during the evaporating of the working fluid in the housing 210, the threshold 215 can obtain a higher level in some longitudinal segments and lower level in other longitudinal segments of the housing 210. The height of the threshold 215 can be a vertical distance, in the D direction, between a bottom 210D of the housing 210. The bottom 210D can be located on a centerline of the lower potion 213 of the housing 210. At the first end 211 of the housing 210 the threshold at the segment 210A the threshold can be lower, at the segment 210B the liquid level can be higher, and at the segment 210C the liquid level can be lower.
As shown in the illustrated example of
The flow balancer 250 can be a device that is configured to balance refrigerant quality by restraining, aligning, and/or changing a direction of a flow path of the vapor stream 280 to create a pressure drop or increased pressure at a certain segment of the tube bundle. The magnitude of pressure drop can be proportional or correlated with the vapor flow speed or flow rate of the vapor stream, such that the segment with higher vapor flow can correlated with higher pressure drop created by the flow balancer 250.
In some embodiments, the flow balancer 250 can be a louver or louver panel that includes a plurality of slats. The vapor stream 280 flows through the clearance between the slats which creates pressure drop, for example, from friction, directional changes, or the like. In some embodiments, the louver panel can be a frameless panel that includes a plurality of slats or angled plates, angled relative to a longitudinal direction of the housing 210, the tube bundle 230, or the like. The angled plates can attach to the housing 210 of the evaporator 200. In some embodiments, the flow balancer 250 can be a perforated plate. In some embodiments, the perforated plate can have angled perforation to direct or angle the flow direction of the vapor stream to align the flow to balance the refrigerant quality.
It is appreciated that demisters are generally designed to remove droplets while minimizing pressure drop in the vapor stream 280. Typically, the pressure drop created by a wire mesh demister can be around 0.01-0.03 psi and tends to vary with the amount of liquid entering the demister or mist eliminator. In contrast, according to an embodiment, a flow balancer 259 (e.g., a louver panel) can selectively induce a pressure drop an order of magnitude larger than that of the demister. In some examples, the flow balancer 250 can selectively induce a pressure drop of 0.05-0.3 psi. In some embodiments, the flow balancer 250 induced pressure drop can be unaffected by the liquid load. Further, the effect of the pressure drop induced by the flow balancer 250 can be localized and concentrated over the segments where the vapor speed is high. In some embodiments, the flow balancer 250 balances the liquid level in the longitudinal direction of the housing. Increasing the liquid level, for example, in the segments 210A and 210C can reduce the portion of the tube bundle 230 in the vapor stream 280 thereby increasing the overall heat transfer rate of the evaporator 200 and/or proper wetting of the tube bundles.
It is appreciated that, as shown in
As illustrated in
In some embodiments, the slats 610 are arranged to have an angle 630 or 640 relative to the frame 620. The angle 630 or 640 can manage the vapor stream 680 to flow toward certain directions within the housing (e.g., housing 210) such that a vapor flow pattern and or vapor speed at the outlet 240 is more even, as further shown and described with respect to
It is appreciated that the angle 630 or 640 can be any degrees suitable for guiding the vapor stream 680 to exit from the housing (e.g., 210 of
It is also appreciated that the flow of the vapor stream can result in a recirculation flow region (e.g., at 1240) in the conduit (e.g., 242 of
As such, comparing
In some embodiments, as shown by comparing
Similarly,
In
In
It is appreciated that the static pressure at 1020 is shown to be lower than that at 1030. Accordingly, by including the flow balancer 250 that aligns the flow of the vapor stream, the static pressure at 1020 can be reduced to increase the heat exchange between the working fluid and the process fluid. For example, as compared with the evaporator of
It is noted that any of aspects 1-9 can be combined with any of aspects 10-18 and any of aspects 19-20.
Aspect 1. An evaporator, comprising:
The examples disclosed in this application are to be considered in all respects as illustrative and not limitative. The scope of the invention is indicated by the appended claims rather than by the foregoing description; and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.
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