Exemplary embodiments pertain to the field of expansion devices. More particularly, the present disclosure relates to an expansion assembly for use with a heat exchanger.
Heat exchangers, such as microchannel heat exchangers, are widely used for heat transfer in heating, ventilation and air conditioning (HVAC) applications. Traditional thermal expansion valves (TXVs) are not conducive to the microchannel distributor and header geometry, causing the TXVs to be under utilized in such applications.
In one embodiment, an expansion assembly for use with a heat exchanger includes a block thermal expansion valve; and a distributor directly connected to the block thermal expansion valve; wherein the distributor comprises a tube having a plurality of openings formed therein.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the distributor is configured for placement within a manifold of the heat exchanger.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein a housing of the block thermal expansion valve and the distributor are made from the same material.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the housing of the block thermal expansion valve and the distributor are made from aluminum.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the distributor is directly connected to the block thermal expansion valve by at least one of press fitting, brazing and adhesives.
In another embodiment, a heat exchanger includes an expansion assembly including a block thermal expansion valve and a distributor directly connected to the block thermal expansion valve; a first manifold, the distributor positioned within the first manifold; a second manifold configured to receive refrigerant from the first manifold; and a conduit fluidly connecting the second manifold to the block thermal expansion valve.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the distributor comprises a tube having a plurality of openings formed therein.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein a housing of the block thermal expansion valve and the distributor are made from the same material.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the housing of the block thermal expansion valve and the distributor are made from aluminum.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the distributor is directly connected to the block thermal expansion valve by at least one of press fitting, brazing and adhesives.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the block thermal expansion valve is directly mounted to first manifold.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the block thermal expansion valve is directly mounted to the first manifold by at least one of press fitting, brazing and adhesives.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein a housing of the block thermal expansion valve, the distributor and the first manifold are made from the same material.
In addition to one or more of the features described herein, or as an alternative, further embodiments may include wherein the housing of the block thermal expansion valve, the distributor and the first manifold are made from aluminum.
Technical effects of embodiments of the present disclosure include providing a block thermal expansion valve and an integrated distributor for use with a heat exchanger, such as a microchannel heat exchanger.
The foregoing features and elements may be combined in various combinations without exclusivity, unless expressly indicated otherwise. These features and elements as well as the operation thereof will become more apparent in light of the following description and the accompanying drawings. It should be understood, however, that the following description and drawings are intended to be illustrative and explanatory in nature and non-limiting.
The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
Referring now to
Within this vapor compression refrigeration cycle 20, the refrigerant flows in a clockwise direction as indicated by the arrows. The compressor 22 receives refrigerant vapor from the heat absorption heat exchanger (e.g., an evaporator) 24 and compresses it to a higher temperature and pressure, with the relatively hot vapor then passing to the heat rejection heat exchanger (e.g., a condenser or gas cooler) 26 where it is cooled by a heat exchange relationship with a cooling medium (not shown) such as air. The refrigerant then passes from the heat rejection heat exchanger 26 to an expansion device 28, wherein the refrigerant is expanded to a low temperature state as it passes to the heat absorption heat exchanger 24. The relatively cold two-phase refrigerant mixture then passing to the heat absorption heat exchanger 24 where it is boiled to a vapor state by a heat exchange relationship with a heating medium (not shown) such as air. The low pressure refrigerant vapor then returns to the compressor 22 where the cycle is repeated.
Referring now to
Referring now to
Fins 50 are positioned between the heat exchange tube segments 36. In some embodiments, the fins 50 are formed from a continuous strip of fin material folded in a ribbon-like serpentine fashion thereby providing a plurality of closely spaced fins 50 that extend generally orthogonally to the heat exchange tube segments 36. Thermal energy exchange between one or more fluids within the heat exchange tube segments 36 and an air flow, A, occurs through the outside surfaces 44, 46 of the heat exchange tube segments 36 collectively forming a primary heat exchange surface, and also through thermal energy exchange with the fins 50, which defines a secondary heat exchange surface.
A drain pan 72 is located vertically below the bend 60 to capture condensation from the heat exchange tube segments 36 and fins 50. The V arrangement of the heat absorption heat exchanger 24 encourages the condensation to run down the first leg 64 and the second leg 66 toward the bend 60, where the condensation falls from the bend 60. Embodiments are not limited to a V arrangement of the heat absorption heat exchanger 24. The heat absorption heat exchanger 24 may be configured in an “A” arrangement, as or one or more slabs, or other configurations.
The distributor 140 may be formed of a tube 142 having a plurality of openings 144 formed therein. Refrigerant from port 2 of the block TXV 110 flows along the interior of tube 142 and is emitted though the openings 144 into the first manifold 32. The distributor 140 may be directly secured to a housing of the block TXV 110 using a variety of techniques, such as press fitting, brazing, adhesives, etc. In an example embodiment, the housing of the block TXV 110 and the distributor 140 are made from a common material, e.g., aluminum.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
This application claims the benefit of U.S. Provisional Application No. 62/969,868, filed Feb. 4, 2020, the contents of which are incorporated by reference herein in their entirety.
Number | Date | Country | |
---|---|---|---|
62969868 | Feb 2020 | US |