Patent Application
20090034833
The present invention relates to an image processing device and an image drawing apparatus and system, and more particularly, to an image processing device which is connected to a drawing device for directly drawing a wiring pattern represented by a drawing raster data on a board so as to perform a RIP processing of expanding image data in vector form representing an input wiring pattern into drawing raster data, an image drawing apparatus and an image drawing system including the image processing device.
As a drawing method used when a board such as a print wired board (PWB) or a flat panel display (FPD) is produced, conventionally, a method of exposing a wiring pattern to be formed on the board on a film to produce a mask and then drawing the wiring pattern on the board using the mask by area exposure (an analog drawing method) was generally used. Recently, a so-called digital drawing method of directly drawing a wiring pattern on a board on the basis of digital data (drawing raster data) representing a wiring pattern without producing a mask is used (for example, see Japanese Patent Application Laid-Open No. 2004-184921).
In a drawing system using the digital drawing method to perform drawing, a drawing device for drawing on a board and an image processing device connected to the drawing device are provided. The image processing device has a function for inputting image data (data in vector form and with predetermined format representing a wiring pattern to be formed on the board) produced by using computer aided design (CAD)/computer aided manufacturing (CAM), performing a raster image processor (RIP) processing of expanding input image data into drawing raster data, and supplying the drawing raster data obtained by the RIP processing to the drawing device.
However, since the drawing raster data is data representing the wiring pattern to be formed on the board with the same high resolution as drawing the pattern by the drawing device, the amount of data is significantly large and a time consumed for the RIP processing is relatively long. Therefore, in a case where a problem such as an insufficient gap between adjacent patterns is caused in the wiring pattern when the board is actually produced by drawing the wiring pattern on the board using the drawing raster data obtained by the RIP processing, a subsequent process such as the drawing to the board or the RIP processing requiring a long time needs to be performed after image data is corrected so as to solve the problem. Accordingly, a progress of the operation such as the manufacture of the board is significantly affected and the board is wastefully consumed.
The present invention is conceived in view of the above-described issues and it is an object of the present invention to provide an image processing device, an image drawing apparatus, and an image drawing system, which is capable of preventing a problem from occurring in a board manufactured by a drawing process using a drawing device, due to image data.
In order to accomplish the object, according to a first aspect of the present invention, there is provided an image processing device which is connected with a drawing device that directly draws on a board a wiring pattern represented by drawing raster data, and which performs RIP processing that expands image data in vector form representing the input wiring pattern to the drawing raster data, the apparatus comprising: a checking means which checks whether a defect which causes a problem in the board fabricated by a drawing process using the drawing device is present in the image data, before performing the RIP processing with respect to the input image data.
By this configuration, even when the defect which causes the problem in the board fabricated by the drawing process using the drawing device is present in the input image data, this defect is detected by the checking means before performing the RIP processing with respect to the image data and the RIP processing is performed after the image data is corrected on the basis of the detected defect. Accordingly, it is possible to prevent a problem from occurring in the board due to the image data.
Since the defect of the image data which causes the problem can be detected before performing the RIP processing, the process such as the RIP processing or the drawing by the drawing device does not need to be repeated in vain and thus the progress of the operation such as the fabrication of the board can be prevented from being affected by the defect of the input image data or the board can be prevented from being consumed in vain due to the defect.
Occurrence of the problem due to the image data in the board fabricated by the drawing process using the drawing device depends on the drawing condition applied when the drawing device draws the wiring pattern on the board. Accordingly, in the invention described in the first aspect, it is preferred that, as described in a second aspect, the checking means checks whether the defect is present in the image data, by acquiring a drawing condition applied when the drawing device draws the wiring pattern on the board, setting a threshold which is to be used for determination of the defect in the checking according to the acquired drawing condition, and performing the check using the set threshold.
At a time point when the image data is produced and generated by the CAD/CAM system, the drawing condition when the drawing device draws the wiring pattern on the board is indefinite, therefore it is difficult to efficiently reduce the problem even when it is checked whether or not the defect of the image data is present by this process. In contrast, since the RIP processing expands the image data to the drawing raster data according to the drawing condition (for example, resolution or the like) when the drawing device draws the wiring pattern on the board, the drawing condition is defined at the time point when the RIP processing is performed. In the invention described in a second aspect, since the drawing condition is acquired, thresholds which are to be used in the determination of the defect in the check is set according to the acquired drawing condition and the check is performed using the set thresholds, it is possible to determine whether the defect, which causes the problem due to the image data in the board fabricated by the drawing process using the drawing device, is present in the image data with high precision and to improve the precision of the check using the checking means.
As the drawing condition in the invention described in the second aspect, for example, as described in the third aspect, a resolution applied when the wiring pattern is drawn or the type of a photosensitive material provided on the board may be used.
In the invention described in the second aspect or the third aspect, the checking means may perform, for example, as also described in the fourth aspect, as a process of checking whether or not the defect which causes the problem in the fabricated board is present, at least one of processes of: checking whether or not an arc portion having a circumference length of less than a first threshold is included in the wiring pattern represented by the image data, whether or not an arc portion having a radius difference between a starting point position and an ending point position equal to or greater than a second threshold is included in the wiring pattern, whether or not an arc portion having a radius equal to or greater than a third threshold is included in the wiring pattern, whether or not the wiring pattern is present at a coordinate separated from an original point by a distance equal to or greater than a fourth threshold, whether or not a pin-hole region having an area less than a fifth threshold is present in the wiring pattern represented by the image data, whether or not a pattern in which the width of a region overlapping with an adjacent pattern is less than a sixth threshold is present in the wiring pattern, or whether or not a pattern in which a gap between adjacent patterns is less than a seventh threshold is present in the wiring pattern.
In the invention described in any one of the first aspect to the fourth aspect, the checking means is structured to perform, for example, as also described in the fifth aspect, as a process of checking whether or not the defect which causes the problem in the fabricated board is present, at least one of processes of checking whether or not a line using an aperture shape other than a circle is included in the wiring pattern and checking whether or not a self crossing line, which forms a closed curve having a starting point and an ending point positioned at the same position and which crosses itself between the starting point and the ending point, is included in the wiring pattern.
In the invention described in the first aspect, for example, as described in the sixth aspect, it is preferable that it is checked whether the defect which causes the error in the RIP processing is present in the image data. Accordingly, it can be prevented that the RIP processing stops since the error occurs in the RIP processing due to the image data, and is performed again after correcting the image data. As a process of checking whether or not the defect which causes the error in the RIP processing is present in the image data, for example, as described in the seventh aspect, at least one of processes of: checking whether or not a character other than a character type which can be handled in the RIP processing is included in the image data, whether or not the number of peaks of the wiring pattern is equal to or greater than an eighth threshold, and whether or not the number of layers that form the image data is equal to or greater than a ninth threshold may be performed.
In the invention described in the first aspect, for example, as described in the eighth aspect, the image processing device may further include a data generation means which, if it is determined that the defect is present in the image data by the checking means, acquires a coordinate of the wiring pattern at a position where it is determined that the defect is present, and on the basis of the acquired coordinate, generates defect position designating data designating a predetermined mark at the position in the wiring pattern, the mark being overlappingly displayable on the wiring pattern represented by the image data. By this configuration, when the wiring pattern represented by the image data is displayed on the display means of an information processing apparatus (for example, an information processing apparatus for realizing the CAM system) on the basis of the determination that the defect is present in the image data by the checking means, the predetermined mark can be easily designated (overlappingly displayed) at a position where the defect is present in the displayed wiring pattern by using the defect position designating data generated by the data generation means and the operation for specifying and correcting a portion corresponding to the defect in the image data can be easily performed.
In the invention described in any one of the first aspect to the eighth aspect, for example, as described in the ninth aspect, the image processing device may further include a calculation means which acquires a drawing condition applied when the drawing device draws the wiring pattern on the board and, on the basis of the acquired drawing condition and the image data, calculates a drawing range of the wiring pattern on the board when the drawing device draws the wiring pattern represented by the image data under the current drawing condition; and a positional relationship display control means which displays a positional relationship between the board and the drawing range of the wiring pattern on the board on a display means when the drawing device draws the wiring pattern represented by the image data under the current drawing condition on the basis of the drawing range calculated by the calculation means.
The drawing condition when the drawing device draws the wiring pattern on the board includes information defining the drawing range of the wiring pattern on the board. If the contents of the information are not suitable, the drawing range may be deviated from the board and thus the board may be consumed in vain in the drawing process of the wiring pattern using the drawing device. In contrast, in the invention described in the ninth aspect, since the drawing range of the wiring pattern on the board is calculated on the basis of the drawing condition and the image data and the positional relationship between the board and the drawing range of the wiring pattern on the board is displayed on the display means, it can be checked whether the contents of the information defining the drawing range of the wiring pattern on the board in the drawing condition are suitable, before the drawing device actually draws the wiring pattern on the board. Thus, it is possible to prevent the problem such as unnecessary consumption of the board.
In the invention described in any one of the first aspect to the ninth aspect, for example, as described in the tenth aspect, the image processing device may further include a low-resolution image display control means which generates a low-resolution wiring pattern image representing the wiring pattern in low resolution and displays the generated low-resolution wiring pattern image on a display means, on the basis of the image data; an expansion means which, when an enlarged display target region on the low-resolution wiring pattern image displayed on the display means by the low-resolution display control means, is specified via a specifying means, expands data corresponding to the enlarged display target region in the image data to high-resolution raster data and generates a high-resolution wiring pattern image representing the wiring pattern in the enlarged display target region in high resolution; and a high-resolution image display control means which displays the high-resolution wiring pattern image generated by the expansion means on the display means.
In order to prevent the unnecessary consumption of the board due to a problem in the wiring pattern drawn on the board by the drawing device, it is preferable that it is checked what kind of wiring pattern is to be drawn by the naked eyes, before the drawing device draws the wiring pattern on the board. While, in the conventional analog drawing method, the visible check is performed using a mask fabricated by exposing a wiring pattern in a film, but the mask is not fabricated in the digital drawing method, therefore the visible check is performed by displaying the wiring pattern represented by the drawing raster data on the display means. However, since the drawing raster data has an extremely high resolution as compared with the display means, the wiring pattern that can be displayed on the display means at a time is limited to only a small part of the wiring pattern represented by the drawing raster data. Therefore, in the visible check of the wiring pattern in the digital drawing method, the visible check needs to be repeated while properly scrolling a portion, which will be displayed on the display means, in the wiring pattern represented by the drawing raster data. Accordingly, the operation is troublesome and to which portion of the overall wiring pattern represented by the drawing raster data a portion which is currently displayed on the display means corresponds is hard to be checked. If it is detected that the problem is present in the wiring pattern by the visible check, the RIP processing which is time-consuming needs to be performed again after correcting the image data. Accordingly, the progress of the operation such as the fabrication of the board is affected.
In contrast, in the invention described in the tenth aspect, when the low-resolution wiring pattern image representing the wiring pattern in low resolution is generated and displayed on the display means and the enlarged display target region is specified via the specifying means on the low-resolution wiring pattern image displayed on the display means, the data corresponding to the enlarged display target region in the image data is expanded to the high-resolution raster data, the high-resolution wiring pattern image representing the wiring pattern in the enlarged display target region in high resolution is generated and displayed on the display means. Accordingly, by specifying the enlarged display target region via the specifying means on the low-resolution wiring pattern image, it is possible to perform the visible check with respect to a desired portion of the wiring pattern represented by the image data, to simplify the operation, and easily check the position of the portion displayed as the high-resolution wiring pattern image on the overall wiring pattern. Since the data corresponding to the specified enlarged display target region in the image data is expanded to the high-resolution rater data (high-resolution wiring pattern image) and is displayed on the display means, the RIP processing does not need to be performed before displaying the high-resolution wiring pattern image. Even when it is detected that the problem is present in the wiring pattern by the visible check, the RIP processing which is time-consuming does not need to be performed multiple times. Accordingly, the progress of the operation such as the fabrication of the board is prevented from being affected.
In the invention described in the tenth aspect, when the wiring pattern drawn on the board by the drawing device is configured by arranging a plurality of sheets formed from plurally arranged identical unit wiring patterns that correspond to a single circuit pattern, for example, as described in the eleventh aspect, the low-resolution image display control means generates and displays an image representing the overall wiring pattern in low resolution as the low-resolution wiring pattern image, and when a specific sheet is specified as the enlarged display target region on the low-resolution wiring pattern image representing the overall wiring pattern, the expansion means only expands data corresponding to a single specific unit wiring pattern in the specific sheet of the image data to high-resolution raster data, and generates an image as a high-resolution wiring pattern image of the specific sheet, wherein the wiring pattern is displayed with respect to only the specific unit wiring pattern, while only a framing line representing an outer edge is displayed with respect to other unit wiring patterns.
If the wiring pattern (overall wiring pattern) drawn on the board by the drawing device is the wiring pattern in which a plurality of sheets configured by plurally arranging the identical unit wiring pattern corresponding to a single circuit pattern are arranged, the visible check is performed with respect to only one of the unit wiring patterns in the overall wiring pattern. Accordingly, in the eleventh aspect of the invention, if a specific sheet in which the identical unit wiring pattern is plurally arranged is specified as an enlarged display target region, since a high-resolution wiring pattern image of the specific sheet is generated wherein only a specific unit wiring pattern is displayed and only a framing line representing an outer edge is displayed with respect to other unit wiring patterns, it is possible to generate and display the high-resolution wiring pattern image of the specific sheet specified as the enlarged display target region for a short time.
In the invention described in the tenth aspect, for example, as described in the twelfth aspect, the image processing device may further include a distance calculation and display means which, when two points of a target for distance measuring are specified via the specifying means on the high-resolution wiring pattern image displayed on the display means by the high-resolution image display control means, calculates and displays on the display means a distance between the specified two points.
In the digital drawing method, since the wiring pattern representing the drawing raster data is drawn on the board with predetermined resolution, the positions of portions of the wiring pattern which is actually drawn on the board or the wiring pattern represented by the drawing raster data changes the distance between adjacent pixels in the resolution of the drawing as a maximum with respect to the wiring pattern represented by the image data due to the influence of a rounding error. Accordingly, it is preferable that it is finally checked whether the pin-hole region of which the area is less than the fifth threshold is present in the wiring pattern, whether the pattern in which the width of the region overlapping with the adjacent pattern is less than the sixth threshold is present in the wiring pattern, or whether the pattern of which the gap between the adjacent patterns is less than the seventh threshold is presented in the wiring pattern, on the wiring pattern represented by the high-resolution raster data obtained by expanding the image data.
In the invention described in the twelfth aspect, when the two points for measuring the distance is specified on the high-resolution wiring pattern image, since the distance between the specified two points is calculated and displayed on the display means, in the visible check of the wiring pattern based on the high-resolution wiring pattern image, it is possible to accurately and easily check the presence/absence of the pin-hole region of which the area is less than the fifth threshold, the presence/absence of the pattern in which the width of the region overlapping with the adjacent pattern is less than the sixth threshold, and the presence/absence of the pattern of which the gap between the adjacent patterns is less than the seventh threshold, and to realize laborsaving of the visible check.
According to a thirteenth aspect of the invention, there is provided an image drawing apparatus including: the image processing device according to any one of the first aspect to the twelfth aspect, wherein drawing on a drawing surface is performed on the basis of the drawing raster data obtained by the image processing device. Similar to the first aspect of the invention, it is possible to prevent a problem from occurring in the board fabricated by the drawing process using the drawing device, due to the image data.
According to a fourteenth aspect of the invention, there is provided an image drawing system including: at least one of a computer aided design (CAD) system or a computer aided Manufacturing (CAM) system which generates the image data in vector form; the image processing device according to any one of claims 1 to 13; and an drawing device which performs drawing on a drawing surface on the basis of the drawing raster data obtained by the image processing device. By this configuration, it is possible to prevent a problem from occurring in the board fabricated by the drawing process using the drawing device, due to the image data.
As described above, according to the present invention, since it is checked whether a defect which causes a problem in a board fabricated by a drawing process using a drawing device is present in image data before performing RIP processing with respect to the image data in vector form representing a wiring pattern, it is possible to prevent a problem from occurring in the board fabricated by the drawing process using the drawing device, due to the image data.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The exposure device 12 is connected with an image processing device 14 for supplying the drawing raster data to the exposure device 12. The image processing unit 14 is connected to a plurality of computers 18, which function as a CAD/CAM system, via a network 16 such as a local area network (LAN). Although three computers 18 are, for example, shown in
When the data representing the wiring pattern is input, (the computer 18 functioning as) the CAM system performs an editing process of determining how the wiring pattern represented by the input data is arranged at the time of drawing (layout), determining at which position of the board a punching process is performed, or adding a comment to be drawn together with the wiring pattern. In addition, image data (hereinafter, referred to as Gerber data) representing the overall wiring pattern to be drawn on the board by one drawing process in vector form (data form representing an image as a set of a parameter such as an equation of coordinates of points such as a starting point or an ending point and a line or a surface connecting the points, and drawing information such as painting or special effects) is generated and the Gerber data is transmitted to the image processing device 14 via the network 16. The punching positions in the board determined in the editing process is output to a drill device (not shown) for punching the board as drill hole data.
Meanwhile, the image processing device 14 corresponds to the image processing device according to the present invention and is configured by a personal computer (PC), which includes a central processing unit (CPU), a memory, a HDD 22 (see
Next, as the operation of the present embodiment, a series of processes performed by the image processing device 14 in order to obtain the drawing raster data from the Gerber data will be sequentially described.
In the present embodiment, the Gerber data generated by the CAM system is recorded/stored in a recording medium 54 (for example, a specific folder which is provided in the HDD included in the computer 18 functioning as the CAM system and is set to be accessed by the image processing device 14) which can be accessed by the image processing device 14 via the network. In a screen which can be displayed by the job registration GUI 24 on a display of the image processing device 14, a data acquisition instructing screen for instructing the acquisition of the Gerber data from the recording medium 54 is included. When a user manipulates the keyboard or the mouse to instruct the acquisition of specific Gerber data from the recording medium 54 in a state in which the data acquisition instructing screen is displayed on the display, this instruction is input to the data reception processing portion 26 via the job registration GUI 24 and the data reception processing portion 26 reads and acquires the instructed specific Gerber data from the recording medium 54 via the network 16 and stores the acquired Gerber data in the reception Gerber data folder 44.
The CAD/CAM system which can be realized by the computer 18 includes systems having various specifications/functions. When the Gerber data is acquired from the recording medium 54, the data reception processing portion 26 checks the format of the acquired Gerber data, performs a process of converting the Gerber data to Gerber data having a predetermined format as necessary, and stores the converted Gerber data in the reception Gerber data folder 44.
In the screen which can be displayed by the job registration GUI 24 on the display of the image processing device 14, a check instructing screen for instructing the check of the Gerber data stored in the reception Gerber data folder 44 is included. Although not shown, in the check instructing screen, a display section for displaying a list of file names of the Gerber data stored in the reception Gerber data folder 44, an input section for inputting a job condition such as the number of boards, on which the wiring pattern is drawn, or a drawing condition (for example, resolution, the type of the exposure device 12 used for the drawing of the wiring pattern, a drawing mode, the size of the board on which the wiring pattern is drawn, the presence/absence of the rotation or reverse (mirror) of the wiring pattern represented by the Gerber data or the direction of the rotation angle or the reverse (mirror), the type of the photosensitive material coated on the board or the like) at the time of drawing of the wiring pattern with respect to the Gerber data selected from the list of the Gerber data displayed in the display section as an object to be processed, and a button for instructing execution of the data check process with respect to the Gerber data selected from the list of the Gerber data displayed in the display section as the object to be processed are provided.
When the user selects Gerber data as an object to be processed from the list of the Gerber data displayed in the display section in the check instructing screen via the keyboard or the mouse in a state in which the check instructing screen is displayed on the display and performs an operation for inputting the job condition of the Gerber data as the object to be processed in the input section in the check instructing screen, the job condition information indicating the input job condition is stored in the job condition information folder 48 as the job condition of the Gerber data as the object to be processed. When the button of the check instructing screen is selected to instruct the execution of the data check process with respect to the Gerber data as the object to be processed, this instruction is input to the data check processing portion 28 via the job registration GUI 24 and data check process shown in
This data check process checks whether or not a defect which causes an error in the RIP processing using the RIP processing portion 36 is present or a defect which causes a problem in a printed wiring board fabricated by drawing the wiring pattern on the board using the exposure device 12 is present, with respect to the Gerber data as the object to be processed. First, in a step 100, the Gerber data as the object to be processed is loaded from the checked Gerber data folder 46 and the job condition information corresponding to this Gerber data is loaded from the job condition information folder 48.
In a step 102, thresholds th1, th2 and th6 which are to be used in the below-described processing are set according to the resolution of the drawing included in the job condition information loaded in the step 100. Although described later in detail, the threshold th1 is a threshold of a circumferential length used when it is checked whether or not a minute arc portion having a extremely small (for example, about several μm) circumference length is present, the threshold th2 is a threshold of a radius difference used when it is checked whether or not an arc portion having a radius difference between the starting point and the ending point is present, and the threshold th6 is a threshold of a width used when it is checked whether or not a pattern having a small overlapping width (overlap region) with an adjacent pattern is present. In the step 102, the thresholds th1, th2 and th6 are set such that the thresholds th1, th2 and th6 are decreased as the resolution of the drawing is increased (that is, an interval between pixels in the wiring pattern drawn on the board by the exposure device 12 is decreased).
In a step 104, thresholds th5 and th7 which are to be used in the below-described process are set according to the type of the photosensitive material coated on the board and the resolution of the drawing included in the job condition information loaded in the step 100. Although described later in detail, the threshold th5 is a threshold of an area used when it is checked whether or not a pin-hole region having a minute area is present and the threshold th7 is a threshold of a gap used when it is checked whether or not a pattern having a small gap between adjacent patterns is present. In the drawing of the wiring pattern on the board by the exposure device 12, clearness of a boundary (edge portion) of an exposure portion and a non-exposure portion in the wiring pattern drawn on the board depends on the magnitude of the tilt of exposure amount and concentration characteristics of the photosensitive material coated on the board, and the position of the edge portion in the wiring pattern formed on the board via an etching process is shifted by a shift amount according to the smallness of the clearness of the edge portion in a direction in which the area of the portion removed by the etching process between the exposure portion and the non-exposure portion is increased. In addition, by the shift of the position of the edge portion, the gap between adjacent patterns or the area of the pin-hole region varies.
The varying direction of the gap between adjacent patterns or the area of the pin-hole region according to the variation in clearness of the edge portion varies depending on whether the exposure portion in the drawing of the wiring pattern becomes a remaining side (pattern portion) or a removed side (gap portion) in the etching process, which can be determined from the type (a negative type or a positive type) of the photosensitive material. In addition, the magnitude of the tilt of the exposure amount and concentration characteristics of the photosensitive material can be determined from the type of the photosensitive material. In the present embodiment, when the wiring pattern is drawn in various types of photosensitive materials to fabricate the printed wiring board, it is measured how much the actual position of the edge portion is shifted from an original position and the measured result is stored in the HDD as a table. In the step 104, after the thresholds th5 and th7 are set according to the resolution of the drawing, the shift amount of the edge portion corresponding to the type of the photosensitive material coated on the board is acquired with reference to the table and the thresholds th5 and th7 are corrected according to the acquired shift amount such that the thresholds th5 and th7 according to the type of the photosensitive material and the resolution of the drawing are set.
Meanwhile, although, in the above-described RIP processing portion 36, the RIP processing of expanding the Gerber data (in more detail, the Gerber data stored in the checked Gerber data folder 46) to the drawing raster data in raster format (bitmap format) is performed, however handleable character types are restricted in the RIP processing, therefore, when the character other than the handleable character types (a half-width kana character or the like) is included in the Gerber data which is subjected to the RIP processing, an error is caused and the RIP processing is stopped when this kind of character is detected. Accordingly, in the next step 106, it is checked whether or not the character other than the character types which can be handled by the RIP processing is included by sequentially referring to the Gerber data as the object to be processed. When the check process of the step 106 is completed, the process progresses to a step 108, in which it is determined whether the corresponding character is detected in the check process of the step 106. If the determination is “no”, the process progresses to a step 112 and, if the determination is “yes”, the process progresses to a step 110, which stores error type information indicating that the detected error (defect) is an error that the character other than the character types which can be handled by the RIP processing is included in the Gerber data as the object to be processed, in the memory and then the process progresses to the step 112.
In a case where the minute arc portion having the extremely small circumference length (for example, about several μm) is included in the wiring pattern, since the minute arc portion causes a problem of the printed wiring board fabricated by the drawing process using the exposure device 12, the minute arc portion is preferably converted to a straight line. Accordingly, in the next step 112, a process of checking whether or not data defining the minute arc portion of which the circumference length is less than the threshold th1 is included in the Gerber data as the object to be processed is performed. Since the threshold th1 is set according to the resolution of the drawing in the above-described step 102, it can be checked whether or not the minute arc portion which causes the problem of the printed wiring board is included in the wiring pattern with high precision. When the check process of the step 112 is completed, the process progresses to a step 114, in which it is determined whether the corresponding data is detected in the check process of the step 112. If the determination is “no”, the process progresses to a step 118 and, if the determination is “yes”, the process progresses to a step 116, which stores the error type information indicating that the detected error (defect) is an error that the data defining the minute arc portion is included in the Gerber data as the object to be processed, and coordinate information indicating the position of the minute arc portion on the wiring pattern represented by the Gerber data in the memory, and then progresses to the step 118.
For example, as shown in
In addition, since an arc portion having a significantly large radius (for example, about one thousand hundreds mm) is not generally used in the wiring pattern, if the arc portion having the significantly large radius is included in the wiring pattern, this arc portion may cause a problem of the printed wiring board fabricated by the drawing process using the exposure device 12. Accordingly, in the next step 124, a process of checking whether or not data defining the arc portion of which the radius is equal to or greater than the threshold th3 is included in the Gerber data as the object to be processed is performed. When the check process of the step 124 is completed, the process progresses to a step 126, in which it is determined whether the corresponding data is detected in the check process of the step 124. If the determination is “no”, the process progresses to a step 130 and, if the determination is “yes”, the process progresses to a step 128, which stores the error type information indicating that the detected error (defect) is an error that the data defining the arc portion having the significantly large radius is included in the Gerber data as the object to be processed, and coordinate information indicating the position of the arc portion having the significantly large radius on the wiring pattern represented by the Gerber data in the memory, and then progresses to the step 130.
For example, as shown in
For example, as shown in
In addition, in the RIP processing, there is an upper limit (for example, 2048) in the number of peaks included in the Gerber data which is subjected to the RIP processing, when the peaks whose number exceeds the upper limit are included in the Gerber data which is subjected to the RIP processing, an error may be caused in the step of detecting the number of the peaks which exceeds the upper limit and thus the RIP processing is stopped. Accordingly, in the step 142, a process of checking whether the number of peaks included in the Gerber data as the object to be processed is equal to or greater than the threshold th8 (=the upper limit in the RIP processing) is performed. When the check process of the step 142 is completed, the process progresses to a step 144, in which it is determined whether the number of peaks is equal to or greater than the threshold th8 in the check process of the step 142. If the determination is “no”, the process progresses to a step 148 and, if the determination is “yes”, the process progresses to a step 146, which stores the error type information indicating that the detected error (defect) is an error that the peaks whose number exceeds the upper limit is included in the Gerber data as the object to be processed in the memory, and then progresses to the step 148.
For example, as shown in
In addition, when a portion of which the distance from the original point of the Gerber data is significantly large (for example, about one thousand hundreds mm) is included in the wiring pattern, the drawing position of the portion of which the distance from the original point is significantly large is deviated from the board in the drawing process using the exposure device 12, therefore a possibility that a proper printed wiring board is not fabricated is high. Accordingly, in the step 154, a process of checking whether or not the portion of which the distance from the original point of the Gerber data is equal to or greater than the threshold th4 is included in the wiring pattern represented by the Gerber data as the object to be processed is performed. When the check process of the step 154 is completed, the process progresses to a step 156, in which it is determined whether the corresponding data is detected in the check process of the step 154. If the determination is “no”, the process progresses to a step 160 and, if the determination is “yes”, the process progresses to a step 158, which stores the error type information indicating that the detected error (defect) is an error that the portion of which the distance from the original point of the Gerber data is significantly large is included in the wiring pattern represented by the Gerber data as the object to be processed, and coordinate information indicating the position of the portion, of which the distance from the original point is significantly large, on the wiring pattern represented by the Gerber data in the memory, and then progresses to the step 160.
In addition, although a pin-hole region having a minute area is not generally used in the wiring pattern, in a case where the pin-hole region having the minute area is included in the wiring pattern, a problem may be caused in the printed wiring board fabricated by the drawing process using the exposure device 12. Accordingly, in the step 160, a process of checking whether or not data defining the pin-hole region of which the area is less than the threshold th5 is included in the Gerber data as the object to be processed is performed. Since the threshold th5 is set according to the type of the photosensitive material coated on the board and the resolution of the drawing in the above-described step 104, it can be checked whether or not the pin-hole region having the minute area, which causes the problem of the printed wiring board, is included in the wiring pattern, with high precision. When the check process of the step 160 is completed, the process progresses to a step 162, in which it is determined whether the corresponding data is detected in the check process of the step 160. If the determination is “no”, the process progresses to a step 166 and, if the determination is “yes”, the process progresses to a step 164, which stores the error type information indicating that the detected error (defect) is an error that the data defining the pin-hole region having the minute area is included in the Gerber data as the object to be processed, and coordinate information indicating the position of the pin-hole region having the minute area on the wiring pattern represented by the Gerber data in the memory, and then progresses to the step 166.
In the Gerber data, in a case any region of the objective image (wiring pattern) is painted, instead of using a command for instructing painting, for example, as shown in
Accordingly, in the step 166, a process of checking whether or not data defining a pattern (a line or the like) in which the width of the overlap region is less than the threshold th6 is included in the Gerber data as the object to be processed is performed. Since the threshold th6 is set according to the resolution of the drawing in the above-described step 102, it can be checked whether the pattern having an overlap region with an insufficient width, which causes the problem of the printed wiring board, is included in the wiring pattern, with high precision. When the check process of the step 166 is completed, the process progresses to a step 168, in which it is determined whether the corresponding data is detected in the check process of the step 166. If the determination is “no”, the process progresses to a step 172 and, if the determination is “yes”, the process progresses to a step 170, which stores the error type information indicating that the detected error (defect) is an error that the data defining the pattern in which the width of the overlap region is insufficient is included in the Gerber data as the object to be processed, and coordinate information indicating the position of the pattern, in which the width of the overlap region is insufficient, on the wiring pattern represented by the Gerber data in the memory, and then progresses to the step 172.
For example, as shown in
In the step 178, it is determined whether any error (defect) is detected in the Gerber data as the object to be processed by the above-mentioned check processes, on the basis of whether or not error information such as the error type information is stored in the memory. If the determination is “no” (if no error is detected), the process progresses to a step 180, which stores the Gerber data as the object to be processed in the checked Gerber data folder 46, and then the data check process is completed.
Meanwhile, if the determination in the step 178 is “yes” (if at least one error is detected), the process progresses to a step 182, which loads the error information stored in the memory and determines whether the coordinate information is included in the loaded error information. If the coordinate information is included in the error information, that is, if an error which can designate the error position is detected on the wiring pattern represented by the Gerber data as the object to be processed, a Gerber error file for designating the error position on the wiring pattern represented by the Gerber data as the object to be processed is generated on the basis of the loaded error information (error type information and the coordinate information) and the generated Gerber error file is added to the Gerber data as the object to be processed. The step 182 corresponds to data generation means according to the present invention and the data check processing portion 28 for performing the process of the step 182 also corresponds to the data generation means according to the present invention.
The Gerber error file according to the present embodiment is data which can be handled as the Gerber data. For example, as shown in
In the step 184, a predetermined message is displayed on the display via the job registration GUI 24 to notify that the error is detected in the Gerber data as the object to be processed, the contents of the detected error is displayed on the display via the job registration GUI 24, and then the data check process is completed. In the display of the contents of the error, a message for notifying the contents of the error is simply displayed on the display if the detected error is an error in which the error position is hard to be designated (the coordinate information is not stored at the time of detecting the error), such as an error in which the number of the layers configuring the Gerber data as the object to be processed exceeds the upper limit, and the contents of the error are designated by displaying an error position designating image, wherein the marks defined by the mark data at the error positions represented by the coordinate data of the Gerber error file in the wiring pattern represented by the Gerber data as the object to be processed are overlappingly displayed, as shown in
In the error position designating image shown in
Accordingly, by performing the above-described data check process, it is possible to prevent a problem from occurring in the printed wiring board fabricated by the drawing process using the exposure device 12 due to the Gerber data and to detect the defect of the Gerber data, which causes the problem, before performing the RIP process. Thus, the process such as the RIP processing or the drawing using the exposure device 12 does not need to be repeatedly performed, and thus the progress of the operation such as the fabrication of the board can be prevented from being affected by the defect of the Gerber data or the board can be prevented from being consumed in vain due to the defect.
Meanwhile, in the screen which can be displayed on the display of the image processing device 14 by the layout checking GUI 30, a layout check instructing screen for instructing the check of the layout of the wiring pattern represented by the Gerber data (Gerber data after the data check process) stored in the checked Gerber data folder 46 is included. Although not shown, in the layout check instructing screen, a display section for displaying a list of file names of the Gerber data stored in the checked Gerber data folder 46 and a button for instructing the execution of the layout checking process with respect to the Gerber data selected from the Gerber data listed and displayed in the display section as an object to be processed are provided.
With respect to the wiring pattern represented by the Gerber data after the data check process, if the layout (the position of the drawing range of the wiring pattern with respect to the board or the angle of the wiring pattern in the horizontal surface, or the front or rear orientation) is desired to be checked, the user manipulates the keyboard or the mouse to instruct the display of the layout check instructing screen on the display with respect to the layout check GUI 30, selects the Gerber data as the object to be processed from the Gerber data listed and displayed in the display section in a state in which the layout check instructing screen is displayed on the display, and selects the button in the layout check instructing screen to instruct the execution of the layout check process for the Gerber data as the object to be processed. This instruction is input to the layout display processing portion 32 via the layout check GUI 30 and the layout check process shown in
In the layout check process, first, in a step 200, the specified Gerber data as the object to be processed is loaded from the checked Gerber data folder 46 and the job condition information corresponding to the Gerber data as the object to be processed is loaded from the job condition information folder 48. In a step 202, the layout check screen (see
In a step 204, a message for requesting the specification of the position of the original point on the board to the user is displayed on the display and it is determined whether the position of the original point on the board is specified on by the user. The step 204 is repeated until the determination becomes “yes”. When the user specifies the position of the original point on the board (generally, the central position of the board) according to the message displayed on the display, the determination of the step 204 becomes “yes” and the process progresses to a step 206, which generates a wiring pattern image in which the wiring pattern represented by the Gerber data as the object to be processed is reduced and displayed according to the size of the framing line displayed in the image display region of the layout check screen, on the basis of the Gerber data as the object to be processed which is loaded in the step 200.
In a step 208, the position of the drawing range, the rotation angle, and the presence/absence and the direction of the reverse of the wiring pattern relative to the original point on the board when the wiring pattern represented by the Gerber data as the object to be processed is drawn on the board according to the current job condition information are calculated, on the basis of a positional relationship between the original point of the Gerber data included in the Gerber data as the object to be processed and the original point on the board, the presence/absence of the rotation or the reverse (mirror), the direction of the rotation angle and the reverse (mirror) of the wiring pattern represented by the Gerber data which are included in the job condition information corresponding to the Gerber data as the object to be processed, and the position of the original point on the board specified by the user. The steps 200 and 208 are the processes corresponding to calculation means according to the present invention and the layout display processing portion 32 for performing the processes of the steps 200 and 208 corresponds to the calculation means according to the present invention.
In a step 210, the wiring pattern image generated in the step 206 is rotated in the horizontal surface or is reversed in the front or rear orientation as necessary on the basis of the calculated result of the step 208 and is then displayed at the position calculated in the step 208 in the image display region of the layout check screen (the state shown in
As shown in
When the wiring pattern image is displayed in the image display region of the layout check screen, the user checks whether the position of the displayed wiring pattern image relative to the board, the angle of the wiring pattern image in the horizontal surface and the front or rear orientation of the wiring pattern image are proper with respect to the framing line representing the outer edge of the board. Here, if it is determined that the position of the wiring pattern image is not proper with respect to the board, the user completes the display of the layout check screen and then corrects the data defining the positional relationship between the original point of the Gerber data included in the Gerber data as the object to be processed and the original point on the board such that the position of the drawing range of the wiring pattern relative to the original point on the board when the wiring pattern represented by the Gerber data as the object to be processed is drawn on the board is corrected.
If it is determined that the angle of the wiring pattern image in the horizontal surface is not proper, the user selects the rotation instructing button to instruct the rotation of the wiring pattern. In the layout check screen, a plurality of buttons for rotating the wiring pattern by different rotation angles (for example, 90°, 180°, 270°) are provided as the rotation instructing button and a rotation instructing button corresponding to a desired rotation angle is selected. When the rotation instructing button is selected, the determination of the step 212 becomes “yes” and the process progresses to a step 214, which rotates the wiring pattern image displayed in the image display region of the layout check screen by the rotation angle corresponding to the selected rotation instructing button, and then progresses to a step 216. For example, if the 90° rotation of the wiring pattern image shown in
If it is determined that the front or rear orientation of the wiring pattern image is not proper, the user selects the mirror instructing button to instruct the reverse (mirror) of the front or rear orientation of the wiring pattern. In the layout check screen, as a mirror instructing button, a plurality of buttons for reversing the wiring pattern in different directions (for example, an X direction and a y direction) are provided and a mirror instructing button corresponding to a desired reverse direction is selected. When the mirror instructing button is selected, the determination of the step 216 becomes “yes” and the process progresses to a step 218, which reverses the front or rear orientation of the wiring pattern image displayed in the image display region of the layout check screen in the reverse direction corresponding to the selected mirror instructing button, and then progresses to a step 220. For example, if the reverse of the front or rear orientation of the wiring pattern image shown in
When the completion of the display of the layout check screen is instructed, the determination of the step 220 becomes “yes” and the process progresses to a step 222, which determines whether the change of the layout of the wiring pattern (rotation in the horizontal surface or the reverse of the front or rear orientation) in the above-described process is instructed. If the determination is “no”, the layout check process is completed without performing any process and, if the determination of the step 222 is “yes”, the process progresses to a step 224, which corrects corresponding data of the data such as the presence/absence of the rotation or the reverse of the wiring pattern included in the job condition information of the Gerber data as the object to be processed or the direction of the rotation angle and the reverse of the wiring pattern according to the rotation of the wiring pattern in the horizontal surface or the reverse of the front or rear orientation of the wiring pattern and overwrites the corrected job condition information in the job condition information folder 48, and the layout check process is completed.
Since, by the above-described layout check process, before the wiring pattern is actually drawn on the board, it can be determined whether the layout of the wiring pattern (the position of the drawing range of the wiring pattern relative to the board, the angle of the wiring pattern in the horizontal plane, and the front or rear orientation) when the wiring pattern represented by the Gerber data as the object to be processed is drawn on the board according to the current job condition information, therefore it is possible to prevent the board from being consumed in vain.
In the screen which can be displayed on the display of the image processing device 14 by the raster display GUI 34, a raster display instructing screen for instructing the expansion of a portion of specific Gerber data stored in the checked Gerber data folder 46 to raster data and the display of the raster data on the display is included. Although not shown, in the raster display instructing screen, a display section for displaying a list of file names of Gerber data stored in the checked Gerber data folder 46 and a button for instructing the execution of the raster display of Gerber data selected from the Gerber data listed and displayed in the display section as an object to be processed are provided.
When the visible check is desired to be performed with respect to the wiring pattern represented by the Gerber data stored in the checked Gerber data folder 46, the user manipulates the keyboard or the mouse to instruct the display of the raster display instructing screen on the display to the raster display GUI 34, selects the Gerber data as the object to be processed from the Gerber data listed and displayed in the display section in a state in which the raster display instructing screen is displayed on the display, and selects the button in the raster display instructing screen to instruct the execution of the raster display process to the Gerber data as the object to be processed. This instruction is input to the RIP processing portion 36 via the raster display GUI 34 and the raster display process shown in
In the raster display process, first, in a step 230, the specified Gerber data as the object to be processed is loaded from the checked Gerber data folder 46 and the job condition information corresponding to the Gerber data as the object to be processed is loaded from the job condition information folder 48. In a step 232, the overall Gerber data as the object to be processed is expanded to the raster data (overall image) of low resolution. The expansion from the Gerber data to the raster data can be, for example, performed by ensuring a drawing region having a size according to the resolution of the raster data for output on the memory and repeatedly drawing a line or the like in the drawing region while sequentially referring to the Gerber data from the lead. Accordingly, it is possible to obtain the overall image representing the overall wiring pattern represented by the Gerber data as the object to be processed in low resolution.
In a next step 234, the raster display screen (see
Although a drawing unit of the wiring pattern on the board (overall wiring pattern which is drawn on the board by the exposure device 12 by one drawing process) is called a panel (or a work), if the printed wiring board as a final product is a printed wiring board which is mounted in a small apparatus such as a mobile telephone or a personal digital assistant (PDA), the size thereof is significantly smaller than that of the panel and thus, for example, as shown in
In a next step 236, it is determined whether the detailed display range to be displayed as the detailed display image is specified in the detailed display region, by drawing a frame (see
When the operation for instructing the detailed display by any one of the above-described specifying methods is performed by the user, the determination of the step 236 or the step 238 becomes “yes” and then the process progresses to a step 240, which allows the user to recognize the specified detailed display range. That is, the inside of the drawn frame is recognized as the detailed display range in a case where the frame representing the detailed display range is drawn on the overall image, an overall specific piece selected on the overall image is recognized as the detailed display range if the detailed display of the piece unit is instructed, and an overall specific sheet selected on the overall image is recognized as the detailed display range if the detailed display of the sheet unit is instructed.
In a next step 242, it is determined whether the same wiring pattern (the piece representing the same wiring pattern) is plurally included in the detailed display range recognized in the step 240, and a range for expanding the Gerber data to the raster data is set in the detailed display range on the basis of the determined result. For example, if the detailed display of the piece unit is instructed, since the same wiring pattern is not plurally included in the detailed display range, the detailed display range recognized in the step 240 is set to be the raster expansion range. In contrast, if the detailed display of the sheet unit is instructed or if the detailed display of the range drawn on the overall image is instructed, a plurality of pieces representing the same wiring pattern may be included in the detailed display range. If the plurality of pieces representing the same wiring pattern are not included in the detailed display range, the detailed display range is set to be the raster expansion range, but if the plurality of pieces representing the same wiring pattern are included in the detailed display range, the range excluding the pieces other than any one piece is set to be the raster expansion range.
In a next step 244, Gerber data corresponding to the raster expansion range is extracted from the Gerber data as the object to be processed and the extracted Gerber data is expanded to the high-resolution raster data. The resolution of the raster data is preferably equal to the resolution of the drawing in consideration of the below-described calculation and the display of the distance, but the resolution may be adjusted such that the overall detailed display image representing the wiring pattern in the detailed display range falls into the detailed display region of the raster display screen. If the raster expansion range set in the step 242 is equal to the detailed display range recognized in the step 240, the raster data correspond with the detailed display image representing the wiring pattern in the detailed display range. However, since the plurality of pieces representing the same wiring pattern are included in the detailed display range, if a portion of the detailed display range is set to be the raster expansion range, the detailed display image representing the wiring pattern in the detailed display range is generated by adding framing line data representing the outer edge of the pieces excluded from the raster expansion range to the raster data. In a next step 246, the detailed display image obtained by the process of the step 244 is displayed in the detailed display region of the raster display screen by the raster display GUI 34.
The steps 242 and 244 are processes corresponding to expansion means according to the present invention, the step 246 is a process corresponding to high-resolution image display control means according to the present invention, and the RIP processing portion 36 performing the processes of the steps 242 to 246 corresponds to the expansion means and the high-resolution image display control means according to the present invention.
Accordingly, if the detailed display of the piece unit is instructed, for example, as shown in
In the raster display process, the high-resolution raster data are generated and displayed with respect to only a portion displayed in the detailed display region of the raster display screen in the wiring pattern represented by the Gerber data as the object to be processed, therefore after the overall Gerber data as the object to be processed is expanded to the drawing raster data by the RIP processing, the raster display of the wiring pattern can be performed at a high speed, when compared with the case where the wiring pattern is raster-displayed using the drawing raster data. Even when a problem is found by the visible check with respect to the raster-displayed wiring pattern, the RIP processing which is time-consuming does not need to be performed several times.
In a case where the panel (overall wiring pattern) in which a plurality of pieces representing the same wiring pattern are arranged is drawn, the Gerber data defines the overall wiring pattern by data defining the wiring pattern with respect to only a single piece and data for instructing the copy of the wiring pattern represented by the data to the positions corresponding to the respective pieces, therefore the visible check does not need to be performed with respect to all the plurality of pieces arranged in the panel even at the time of the visible check of the wiring pattern represented by the Gerber data and the visible check is performed with respect to only any one of the plurality of pieces representing the same wiring pattern. Accordingly, when the plurality of pieces representing the same wiring pattern are included in the detailed display range, there is no difficulty in the visible check even when the wiring pattern is displayed in detail with respect to only the single piece as described above. Accordingly, by performing the process of expanding only the single piece to the high-resolution raster data, it is possible to perform the display of the detailed display image in the detailed display region of the raster display screen in a short time.
In a case where the resolution of the raster data is equal to the resolution of the drawing, in the detailed display region of the raster display screen, for example, as shown in
In a next step 248, it is determined whether the calculation and the display of the distance between the two points on the wiring pattern are instructed, by performing the above-described operation. If the determination of the step 248 is “no”, the process progresses to a step 252, which determines whether the switching of the display of the wiring pattern image displayed in the detailed display region in the raster display screen is instructed. If the determination of the step 252 is also “no”, the process progresses to a step 254, which determines whether the completion of the display of the raster display screen is instructed. If the determination of the step 254 is also “no”, the process returns to the step 248 and the steps 248, 252 and 254 are repeated until the determination of any one of the steps 248, 252 and 254 becomes “yes”.
Here, in a case where the calculation and the display of the distance between the any two points specified on the wiring pattern is instructed by performing the above-described operation, the determination of the step 248 becomes “yes” and the process progresses to a step 250, which calculates and displays the distance between the specified two points. Since the pixel interval on the board at the time of the drawing process using the exposure device 12 is previously known by the resolution of the drawing, the distance between the specified two points can be calculated by counting the X-direction pixel number and the Y-direction pixel number between the specified two points and multiplying the counted pixel numbers by the pixel interval on the board to so as obtain the X-direction distance and the Y-direction distance on the board between the specified two points and performing the calculation from the X-direction distance and the Y-direction distance.
In the digital drawing method, since the wiring pattern represented by the drawing raster data is drawn on the board with predetermined resolution, the position of the boundary between the exposure portion and the non-exposure portion in the wiring pattern represented by the drawing raster data changes with a distance between adjacent pixels in the resolution of the drawing as a maximum with respect to the wiring pattern represented by the Gerber data due to the influence of a rounding error and, along with this change, the position of the boundary between the exposure portion and the non-exposure portion in the wiring pattern which is actually drawn on the board changes. Accordingly, it is preferable that the size of the gap between the adjacent patterns is finally checked by performing the visible check with respect to the wiring pattern represented by the drawing raster data. In the raster display process according to the present embodiment, when the calculation and the display of the distance between the any two points specified on the wiring pattern (detailed display image) displayed in the detailed display region of the raster display screen are instructed, the distance between the specified two points (the distance reflecting the rounding error) is calculated and displayed. Accordingly, it is possible to accurately and easily check the size of the gap between the adjacent patterns and to reduce the burden of the user who performs the visible check.
If the switching of the display (the change of the detailed display range or the like) of the wiring pattern image displayed in the detailed display region of the raster display screen is instructed, the determination of the step 252 becomes “yes”, the process returns to the step 236, and the processes after the step 236 are repeated according to the instruction of the user. If the completion of the display of the raster display screen is instructed, the determination of the step 254 becomes “yes” and the raster display process is completed. In the visible check performed by the user while the raster display process is executed, if a problem such as an insufficient gap between the adjacent patterns or the like is detected in the wiring pattern, in the computer 18 functioning as the CAM system, the operation of correcting the Gerber data as the object to be processed so as to solve the detected problem is performed and the raster display process (visible check) is performed again.
If the problem of the wiring pattern is not detected in the visible check, the user instructs the execution of the RIP processing to the Gerber data as the object to be processed. Accordingly, the RIP processing portion 36 loads the Gerber data, which is subjected to the RIP processing, from the checked Gerber data folder 46, performs the RIP processing of expanding the loaded overall Gerber data as the object to be processed to the drawing raster data in high resolution, and stores the drawing raster data obtained by the RIP process in the drawing raster data folder 50. When the RIP processing is completed, the user instructs the drawing of the wiring pattern represented by the drawing raster data on the board. Accordingly, the exposure device control portion 40 reads corresponding job condition information from the job condition information folder 48 and outputs the job condition information to the exposure device 12, and sequentially reads drawing raster data from the drawing raster data folder 50 and outputs the drawing raster data to the exposure device 12. Thus, the wiring pattern represented by the drawing raster data is drawn on the board using the exposure device 12 according to the job condition information.
As a data check process, the checking process performed by the checking means according to the present invention is not limited to the check processes shown in
Although, in the present embodiment, the exposure device 12 is, for example, described as the drawing device connected with the image processing device according to the present invention, the drawing device which can be connected to the image processing device according to the present invention is not limited to this and a drawing device for drawing a wiring pattern on a board by adhering metal particles or a precursor of metal particles to the board using an inkjet type and liquid ejection type drawing head. As such a drawing device, there are drawing devices described in Japanese Patent Application Laid-Open No. 2005-40665, Japanese Patent Application Laid-Open No. 2005-47073, Japanese Patent Application Laid-Open No. 2005-47085, Japanese Patent Application Laid-Open No. 2005-81710, Japanese Patent Application Laid-Open No. 2005-81711, Japanese Patent Application Laid-Open No. 2005-81716, Japanese Patent Application Laid-Open No. 2005-96332, Japanese Patent Application Laid-Open No. 2005-96338 and Japanese Patent Application Laid-Open No. 2005-96345.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-176461 | Jun 2005 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2006/311721 | 6/12/2006 | WO | 00 | 3/31/2008 |
