BRIEF SUMMARY OF THE DRAWINGS
The structure, operation, and advantages of the present invention will become further apparent upon consideration of the following description taken in conjunction with the accompanying figures (Figs.). The figures are intended to be illustrative, not limiting.
Certain elements in some of the figures may be omitted, or illustrated not-to-scale, for illustrative clarity. The cross-sectional views may be in the form of “slices”, or “near-sighted” cross-sectional views, omitting certain background lines which would otherwise be visible in a “true” cross-sectional view, for illustrative clarity.
In the drawings accompanying the description that follows, often both reference numerals and legends (labels, text descriptions) may be used to identify elements. If legends are provided, they are intended merely as an aid to the reader, and should not in any way be interpreted as limiting.
FIG. 1 is an oblique schematic view of the prior art CMP system.
FIG. 2 is an edge-on schematic view of a wafer in contact with a polishing pad that is being conditioned.
FIG. 3A is an edge-on schematic view of wafer in contact with a polishing pad that is being conditioned, prior to wear away of the asperities.
FIG. 3B is an edge-on schematic view of wafer in contact with a polishing pad that is being conditioned, subsequent to wear away of the asperities.
FIG. 4A is an orthogonal view of the abrasive surface a first embodiment of the present segmented conditioning disk.
FIG. 4B is an edge-on schematic view of the abrasive surface the first embodiment of the present segmented conditioning disk.
FIG. 5A is a generalized, polygonal embodiment of the present segmented conditioning disk invention.
FIG. 5B is a four-sided embodiment of the present segmented conditioning disk invention.
FIG. 6 is an embodiment of the present invention in which the segments are circular.
FIG. 7 is an embodiment of the present invention wherein the independently movable portions are concentric with one another.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Prior Art and State of the Art System
FIG. 1 is an oblique schematic, partially cut-away, view of a polishing system 10 for polishing/planarizing the surface of a semiconductor wafer 12, showing a prior art conditioning disk 14 that is rotationally driven by shaft 14′ which can move radially, according to the double-headed arrow 15, with respect to the center of the polishing pad 16 which is affixed to the rotating platen 18 that is driven by the shaft 18′ about the axis A-A′.
More specifically, the wafer 12 is rotated against the rotating polishing pad 16 (which has a top-most surface 17) by means of the rotating head 18, which is driven by shaft 18′. The head 18 can also move radially with respect to the rotating polishing pad, as indicated by the double-headed arrow 19.
Referring the FIG. 2, which is an orthogonal, edge-on schematic edge view of the top-most portion 17 of the polishing pad 16 and the moving wafer 12, said top-most portion 17 has numerous independent pores 20 that contain a continually refreshed slurry 30 (i.e., indicated by flow arrows 30) consisting of fine abrasive material carried in a liquid mixture that might or might not be chemically reactive with the wafer 12 being polished. The slurry 30 is fed to the polishing surface 16 by means of the supply pipe 21, as shown in FIG. 1.
The pores 20 can be characterized as microscratches that are close enough together to form wall structures 22, portions of which are micro asperities that protrude far enough upward to make intimate contact with the wafer 12. Arrows 27, as shown in FIGS. 3A and 3B, indicate relative motions of the pad surface 17 and the wafer 12. The micro asperities 22 provide contact regions 24, whereat the slurry 30 reacts with and polishes the surface of the wafer 12. One can think of the slurry 30 as an abrasive lubricant that moves between wafer 12 and each asperity peak 24 so as to, in effect, pressurize the abrasive slurry against the wafer surface being polished or planarized. The asperity peaks 24 deform somewhat during abrasively lubricated contact with the wafer 12.
FIGS. 3A and 3B are schematic edge-on views of the wafer 12 in contact with the top-most surface 17 of the polishing pad 16, illustrating the effects upon the surface 17 and the asperity peaks 24 and 24′ as the polishing process takes place. That is to say, the asperity peaks 24 become worn down to the condition 24′, with the deleterious effect upon the polishing process being accordingly degraded by the increased surface areas of the worn peaks 24′, which corresponds to reduced pressure between the asperity peaks 24′ and the wafer 12. Deterioration occurs continuously during the polishing/planarizing process. The real contact area increases over time as the asperities make direct push the abrasive slurry 30 against the wafer 12, the effect being a reduction in the real contact pressure, which causes the material removal rate (from the wafer) to decrease. To achieve constant removal rate and uniformity, it is required to maintain a more or less constant contact area and effective pressure of the slurry 30 against the surface of the wafer 12 being polished. Accordingly, the function of the diamond abrasive conditioning disk 14 (FIG. 1) is to regenerate the sharp-pointed asperities 22 (FIG. 2) on the top-most surface 17 of the polishing pad 16.
As material is being removed from the wafer 12 by means of the polishing pad 16 and slurry 30 (in FIG. 2), debris also gets deposited into the voids 30 of the top part 17 of the polishing pad 16. In order to have a consistent pad surface each time a wafer is pressed on the pad, the diamond abrasive conditioner disk 14 (FIG. 1) resurfaces, or conditions or reconditions, the pad 16. The conditioner 14 is typically a plate with diamonds bonded to it creating an abrasive surface (not shown). However, with repeated use, even diamonds become dull and lose their cutting and conditioning effectiveness. Thus it is the case that the conditioning disk 14 has to be replaced periodically in a process that requires stopping the CMP process and a consequent reduction in manufacturing productivity.
First Embodiment of the Invention
Whereas the prior art conditioning disk 14 has a single contiguous abrasive surface, the present invention envisions a segmented condition disk 40, as shown schematically in FIGS. 4A and 4B. The conditioning disk 40 is but one embodiment of the present invention. (Arrows 45 indicate rotary motion and relative motion respectively in FIGS. 4A and 4B.)
FIG. 4A shows the conditioning disk 40 as comprising congruent pie-shaped segments 42, of which the exemplary set of twelve segments shown comprise four subsets labeled A, B, C, and D, each of which comprises three segments. The segments 42 are arranged about a common center or axis of rotation 46 in a plane that is perpendicular to said axis of rotation. Each movable and congruent segment 42 is from radial or tangential motion with respect to said axis of rotation, or shared or common center of rotation, and with respect to one another.
The inventors also envision more or fewer segments 42, as will be discussed in more detail below. Each of the twelve segments 42 of FIG. 4A are independently movable in a vertical direction, as indicated in the schematic edge-on side view of FIG. 4B; more specifically, they the inventors envision, in this example of 12 segments, that a radially symmetrical set of any three of them, such as, for example, all segments labeled ‘B’, might be lowered, as shown in FIG. 4B, to engage the surface 44 of pad 16 that is being abraded during the conditioning process. The remaining segments, i.e., A, C and D in FIG. 4B are disposed above the plane of 44, in a kind of storage position in which they are held in anticipation of future use or when the three segments A have been expended or worn out subsequent to conditioning use.
The inventors envision that the conditioning disk 40 of FIG. 4A might be mounted upon a swiveling drive shaft (not shown) that will automatically adjust the angle of contact of the segments 42 with the plain of abrasion 44 of surface 17 in such a way as to maintain uniform conditioning pressure and action upon the surface 17, even if the set of segments 42 that are in abrading contact with the surface 17 are not necessarily radially disposed with respect to the rotational center 46 of the disk 40. That is to say, the inventors envision that the segmented conditioning disk 40, according to the present invention, can be used in such a way that, say, for example, two of segments 42 labeled ‘A’ might be used in conjunction with two or three segments ‘D’ and/or ‘B’.
The inventors further envision a means 43 for the raising and lowering of individual segments or sets of segments 42, said raising-and-lowering means consisting of such actuators as solenoids, pneumatic or hydraulic pistons, screw drives or the like.
More generally, the conditioning disk 40 according to the present invention comprises multiple sections/zones 42, such that specific zones can be activated independently, i.e., moved vertically into or out of contact with the plain of abrasion 44, which is coincident with the top-most surface 17 of the polishing pad 16. The schematic side view of FIG. 4B shows three segments 42, each labeled ‘B’, making contact with the plain of abrasion 44 upon the top-most surface 17 of the CMP pad 16. That is to say, the three segments 42 are independently movable in relation to an active abrasive conditioning surface 17 of a CMP pad 16.
As should be evident to those skilled in the art upon contemplation of FIG. 4A, the segmented conditioning disk 40 according to the present invention can comprise, in general, of n number of segments 42, where n is greater than at least three. Moreover, those skilled in the art might reasonably surmise that the rounded portion 48 of each segment 42 could as well be a chord 49, such that said disk 40 would more accurately be describable as having a regular polygonal shape, rather than an overall circular, shape. Hence, the specific definition given above for the adjective ‘circular’ as referring herein to regular polygonal shapes, even though irregular polygonal shapes might also be contemplated by those skilled in the art.
Thus it is that the object of this invention is concerned with extending the service life and operational consistency of polishing-pad conditioner disks. In its simplest embodiment the individual controlled multiple segment disk 40 (FIG. 4A) allows users to move one or more fresh conditioner surfaces into action by activating fresh segments and deactivating spent segments without having to stop the CMP process. An embodiment that offers further control would continue to use the segments as they wear but activate just enough fresh material from unused segments to compensate for the worn segments. In its most refined form, the present invention allows modulation not only of the number of segments in use at any given time but also the pressure applied to each in order to maintain a far more consistent cut rate of the polishing pad then the prior art conditioner disk can generate. As describe hereinabove, the raising-and-lowering means allows various segments or abrasive zones of the invention to be selectively brought into contact with the polishing pad 16 when needed to improve consistency of conditioning operation and consistency of the CMP process. As some of the abrasive segments/zones on the conditioner wear, others can be brought into or removed from action, thus maintaining the cut rate of the disk 40 and extending the time between tool downs for servicing of this part 40.
This invention would allow better use of conditioning disks by providing more stable conditioning rate. It is worth mentioning that another alternative is to use several zones or segments 42 to start and then slowly ramp the pressure on one or more other zones to maintain the optimal conditioning rate and desired result.
Additional Embodiments of the Invention
Those skilled in the art might easily imagine additional ways to provide a conditioning disk having the properties described hereinabove. For example, a conditioning disk 50, shown in the schematic view of FIG. 5A, is shown comprising a plurality of independently moveable abrasive segments/zones/portions 52 having a collective shape equivalent to a regular polygon of n portions. FIG. 5B is an example of a disk 54 comprising only four portions 56 which add up to a ‘circular’ disk in accordance with the specific definition of ‘circular’ given hereinabove.
FIG. 6 is an embodiment 60 of a conditioning disk comprised of multiple circular portions or segments 62, each of which, either independently or in groups, can be raised or lowered to provide conditioning action of a polishing pad. As should be apparent to those skilled in the art, the segments 62 of the embodiment 60 and which are shown in FIG. 6 as having circular shapes need not be constrained only to circular shapes or to other regular shapes such as triangles or polygons.
FIG. 7 is yet another embodiment of the present invention, wherein a segmented conditioning disk 70 comprises 3 or more or fewer concentric portions/zones 72,74,76 which can be moved into our out of operation independently or in groups. The circular abrasive conditioning disk 70 has vertical movement means (not shown in FIG. 7) that provide for precise movement of at least one of the plurality of independently movable concentric abrasive portions into or out of the plane that defines the active abrasive conditioning surface of a CMP pad.
Although the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character—it being understood that only preferred embodiments have been shown and described, and that all changes and modifications that come within the spirit of the invention are desired to be protected. Undoubtedly, many other “variations” on the “themes” set forth hereinabove will occur to one having ordinary skill in the art to which the present invention most nearly pertains, and such variations are intended to be within the scope of the invention, as disclosed herein.
Patent Application
20070287367
