External electrode forming method

Abstract

A method of forming an external electrode of an electronic component involves a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. The first step is to prepare a jig with a groove into which an element forming the electronic component can be inserted. The groove of the jig includes at least a first wall surface inclined outward in a direction from an interior toward an aperture. The paste preparation step is to fill a conductive paste in the groove. The removal step is to remove the filled conductive paste so as to leave the conductive paste along the first wall surface and remove the rest. The ealement preparation step is to locate the element immediately above the groove. The contact step is to insert the element into the groove and to move the element toward the first wall surface to bring a ridgeline of the element into contact with the first wall surface. The formation step is to move the element along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and to move the element away from the first wall surface so as to separate the ridgeline from the first wall surface.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a drawing showing an outline of an external electrode forming method as a first embodiment of the present invention.

FIG. 2 is a drawing showing the external electrode forming method as the first embodiment of the present invention.

FIGS. 3 to 7 are views for explaining the external electrode forming method as the first embodiment of the present invention.

FIGS. 8 to 10 are views for explaining an external electrode forming method as a second embodiment of the present invention.

Claims

1. A method of forming an external electrode of an electronic component, comprising: a step of preparing a jig with a groove in which an element forming the electronic component can be inserted, wherein the groove includes at least a first wall surface inclined outward in a direction from an interior toward an aperture;a paste preparation step of filling a conductive paste in the groove;a removal step of removing the filled conductive paste so as to leave the conductive paste at least along the first wall surface and remove the rest;an element preparation step of locating the element immediately above the groove;a contact step of inserting the element into the groove and moving the element toward the first wall surface to bring a ridgeline of the element into contact with the first wall surface; anda formation step of moving the element in a state of the contact along the first wall surface of the groove and toward the aperture and moving the element away from the first wall surface so as to separate the ridgeline at least from the first wall surface.

2. A method according to claim 1, comprising: an inclining step of further moving the element toward the first wall surface and inclining the element so as to follow the first wall surface, after the contact step.

3. A method of forming external electrodes of an electronic component, comprising: a step of preparing a jig in which a plurality of platelike members, each being provided with a groove into which an element forming the electronic component can be inserted, are arranged along each other, wherein each of the grooves includes at least a first wall surface inclined outward in a direction from an interior toward an aperture;a preparation step of filling a conductive paste in each of the grooves so as to cover across the grooves of the respective platelike members;a removal step of removing the conductive paste existing between the platelike members and thereby leaving the conductive paste in each of the grooves, at least along the first wall surface of each groove;an element preparation step of locating the element forming the electronic component, immediately above the grooves;a contact step of inserting the element into the grooves so as to extend across the grooves, and moving the element toward the first wall surfaces of the respective grooves to bring a ridgeline of the element into contact with the first wall surfaces; anda formation step of moving the element in a state of the contact. along the first wall surfaces of the respective grooves and toward the aperture and moving the element away from the first wall surfaces so as to separate the ridgeline at least from the first wall surfaces of the respective grooves.