Patent Application
20140020779
1. Field of the Invention
The present invention is directed to fluid delivery systems, and more particularly to extreme flow rate and/or high temperature surface mount fluid delivery systems for use in the semiconductor processing and petrochemical industries.
2. Discussion of the Related Art
Fluid delivery systems are used in many modern industrial processes for conditioning and manipulating fluid flows to provide controlled admittance of desired substances into the processes. Practitioners have developed an entire class of fluid delivery systems which have fluid handling components removably attached to flow substrates containing fluid pathway conduits. The arrangement of such flow substrates establishes the flow sequence by which the fluid handling components provide the desired fluid conditioning and control. The interface between such flow substrates and removable fluid handling components is standardized and of few variations. Such fluid delivery system designs are often described as modular or surface mount systems. Representative applications of surface mount fluid delivery systems include gas panels used in semiconductor manufacturing equipment and sampling systems used in petrochemical refining. The many types of manufacturing equipment used to perform process steps making semiconductors are collectively referred to as tools. Embodiments of the present invention relate generally to fluid delivery systems for semiconductor processing and specifically to surface mount fluid delivery systems that are specifically well suited for use in extreme flow rate and/or high temperature applications where the process fluid is to be heated to a temperature above ambient. Aspects of the present invention are applicable to surface mount fluid delivery system designs whether of a localized nature or distributed around a semiconductor processing tool.
Industrial process fluid delivery systems have fluid pathway conduits fabricated from a material chosen according to its mechanical properties and considerations of potential chemical interaction with the fluid being delivered. Stainless steels are commonly chosen for corrosion resistance and robustness, but aluminum or brass may be suitable in some situations where cost and ease of fabrication are of greater concern. Fluid pathways may also be constructed from polymer materials in applications where possible ionic contamination of the fluid would preclude using metals. The method of sealingly joining the fluid handling components to the flow substrate fluid pathway conduits is usually standardized within a particular surface mount system design in order to minimize the number of distinct part types. Most joining methods use a deformable gasket interposed between the fluid component and the flow substrate to which it is attached. Gaskets may be simple elastomeric O-Rings or specialized metal sealing rings such as seen in U.S. Pat. No. 5,803,507 and U.S. Pat. No. 6,357,760. Providing controlled delivery of high purity fluids in semiconductor manufacturing equipment has been of concern since the beginning of the semiconductor electronics industry and the construction of fluid delivery systems using mostly metallic seals was an early development. One early example of a suitable bellows sealed valve is seen in U.S. Pat. No. 3,278,156, while the widely used VCR® fitting for joining fluid conduits is seen in U.S. Pat. No. 3,521,910, and a typical early diaphragm sealed valve is seen in U.S. Pat. No. 5,730,423 for example. The recent commercial interest in photovoltaic solar cell fabrication, which has less stringent purity requirements than needed for making the newest microprocessor devices, may bring a return to fluid delivery systems using elastomeric seals.
A collection of fluid handling components assembled into a sequence intended for handling a single fluid species is frequently referred to as a gas stick. The equipment subsystem comprised of several gas sticks intended to deliver process fluid to a particular semiconductor processing chamber is often called a gas panel. During the 1990s several inventors attacked problems of gas panel maintainability and size by creating gas sticks wherein the general fluid flow path is comprised of passive metallic structures, containing the conduits through which process fluid moves, with valves and like active (and passive) fluid handling components removably attached thereto. The passive fluid flow path elements have been variously called manifolds, substrates, blocks, and the like, with some inconsistency even within the work of individual inventors. This disclosure chooses to use the terminology flow substrate to indicate fluid delivery system elements which contain passive fluid flow path(s) that may have other fluid handling devices mounted there upon.
Embodiments of the present invention are directed to a surface mount fluid delivery flow substrate that is specifically adapted for use in extreme flow rate and/or high temperature applications where the process fluid is to be heated (or cooled) to a temperature above (or below) that of the ambient environment. As used herein, and in the context of semiconductor process fluid delivery systems, the expression “extreme flow rate” corresponds to gas flow rates above approximately 50 SLM or below approximately 50 SCCM. A significant aspect of the present invention is the ability to fabricate flow substrates having fluid pathway conduits with a cross-sectional area (size) substantially larger or smaller than other surface mount architectures.
Flow substrates in accordance with the present invention may be used to form a portion of a gas stick, or may be used to form an entire gas stick. Certain embodiments of the present invention may be used to implement an entire gas panel using only a single flow substrate. Flow substrates of the present invention may be securely fastened to a standardized stick bracket, such as that described in Applicant's patent application Ser. No. 12/777,327, filed on May 11, 2010 (now U.S. Pat. No. 8,307,854; hereinafter, “Applicant's '854 application”), thereby providing firm mechanical alignment and thereby obviating need for any interlocking flange structures among the flow substrates. In addition, flow substrates of the present invention may be adapted as described in Applicant's '854 application to additionally provide one or more manifold connection ports and thereby allow transverse connections between fluid delivery sticks.
The flow substrate configurations of the present invention may be adjusted for use with valves and other fluid handling components having symmetric port placement (e.g., W-seal™ devices) or asymmetric port placement (e.g., standard “C-Seal” devices) on the valve (or other fluid handling component) mounting face. Only asymmetric designs are shown herein because such devices are most commonly available in the semiconductor equipment marketplace.
In accordance with one aspect of the present invention, a flow substrate is provided. The flow substrate comprises a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each component conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; and at least one cap. The at least one cap is formed from a second material and has a first surface that is constructed to seal at least one fluid pathway of the plurality of fluid pathways, and a second surface opposing the first surface of the at least one cap. At least one of the substrate body and the at least one cap includes a weld formation (also commonly referred to as a “weld preparation”) formed in at least one of the second surface of the substrate body and the second surface of the at least one cap, wherein the weld formation is constructed to surround the at least one fluid pathway and facilitate welding of the at least one cap to the substrate body along the weld formation. As used herein, the term “weld formation” (or alternatively “weld preparation”) refers to a structure formed in one or more pieces of material that are to be welded together that aids in the formation of the welded joint. Weld formations may vary dependent on the types of materials to be welded together, their thicknesses, and the type of welded joint to be formed (e.g., a butt joint, a lap joint, a tee joint, a corner joint, and edge joint, etc.) as known to those skilled in the art.
In accordance with one embodiment, the component conduit ports extend through the substrate body to the second surface of the substrate body, and the first material and the second material are stainless steel of the same alloy type. In another embodiment, the first material may be a stainless steel, and the second material may be a nickel alloy, such as a Hastelloy® corrosion resistant metal alloy, available from Haynes International, Inc.
In accordance with another embodiment, the substrate body includes a first weld formation formed in the second surface of the substrate body and the at least one cap includes a second weld formation formed in the second surface of the at least one cap.
In accordance with yet another embodiment, the at least one cap includes the weld formation, wherein the weld formation includes a groove formed in the second surface of the at least one cap. In accordance with one aspect of this embodiment, the groove facilitates welding of the at least one cap to the substrate body by identifying the location of where the at least one cap is to be welded to the substrate body and by reducing the power needed to weld the at least one cap to the substrate body. In accordance with another aspect of this embodiment, the groove may be formed in the second surface of the at least one cap by chemical etching. In a further aspect of this embodiment, the at least one cap has a thickness of approximately 0.5 mm, and the groove has a depth of approximately 0.25 mm. In accordance with a further aspect of this embodiment, the flow substrate may further comprise a plate formed from a rigid material and constructed to be disposed adjacent the second surface of the at least one cap, and may additionally comprise a sheet heater, wherein the sheet heater is constructed to be disposed between the plate and the second surface of the at least one cap.
In accordance with another embodiment, the at least one cap includes a plurality of weld formations, each weld formation of the plurality of weld formations including a respective groove formed in the second surface of the at least one cap, each respective groove of the plurality of grooves surrounding a respective one of the plurality of fluid pathways.
In accordance with yet another embodiment, the at least one cap includes a plurality of caps corresponding to each of the plurality of fluid pathways, each respective cap of the plurality of caps including a respective groove formed in the second surface of the respective cap.
In accordance with another embodiment, the substrate body includes the weld formation formed in the second surface of the substrate body, the weld formation including a recessed weld wall surface surrounding the at least one fluid pathway. In accordance with one aspect of this embodiment, the weld formation further includes a stress relief groove surrounding the recessed weld wall surface. In accordance with another aspect of this embodiment, the weld formation further includes a swaged lip surrounding the at least one fluid pathway and disposed between the at least one fluid pathway and the recessed weld wall surface, and in a further aspect of this embodiment, the weld formation further includes a stress relief groove surrounding the recessed weld wall surface.
In accordance with another embodiment, the flow substrate forms a portion of a gas stick for conveying one of semiconductor process fluids and sampling fluids and petrochemical fluids, and in another embodiment, the flow substrate forms substantially all of a fluid delivery panel.
In accordance with another aspect of the invention, a flow substrate is provided. The fluid flow substrate comprises a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each component conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; a plurality of seals corresponding to each of the plurality of fluid pathways; and at least one cap. The at least one cap is formed from a second material, the at least one cap having a first surface that is constructed to seal at least one fluid pathway of the plurality of fluid pathways, and a second surface opposing the first surface of the at least one cap. The at least one cap is configured to receive and retain at least one seal of the plurality of seals in registration with the at least one cap and to form a fluid tight seal with the at least one fluid pathway upon compression against the substrate body.
In accordance with one embodiment, the component conduit ports extend through the substrate body to the second surface of the substrate body.
In accordance with one embodiment, the first material and the second material are plastic, and in accordance with another embodiment, the first material is plastic, and the second material is metal.
In accordance with one embodiment, the at least one cap includes a groove formed in the first surface of the at least one cap and dimensioned to retain the at least one seal. In accordance with a further aspect of this embodiment, the groove is formed in the first surface of the at least one cap by one of molding and machining.
In accordance with another embodiment, the at least one cap includes a plurality of grooves formed in the first surface of the at least one cap, each respective groove of the plurality of grooves being dimensioned to retain a respective seal of the plurality of seals.
In accordance with yet another embodiment, the at least one cap includes a plurality of caps corresponding to each of the plurality of fluid pathways, each respective cap of the plurality of caps being configured to receive and retain a respective seal of the plurality of seals between the first and second surfaces of the respective cap. In accordance with a further aspect of this embodiment, the first and second surfaces of each respective cap are separated by an intermediate portion of the respective cap, the intermediate portion having a smaller cross-sectional extent than either of the first and second surfaces of the respective cap, and in a further aspect of this embodiment, the first and second surfaces of each respective cap are dimensioned to be the same.
In accordance with another embodiment, the flow substrate may further comprise a plate formed from a rigid material and constructed to be disposed adjacent the second surface of the at least one cap and to compress the at least one cap against the substrate body.
In accordance with another aspect of the present invention, a flow substrate is provided comprising a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; and a cap. The cap is formed from a second material and has a first surface to be placed in registration with the second surface of the substrate body, and a second surface opposing the first surface of the cap. The second surface of the cap has a plurality of weld formations formed therein, each respective weld formation of the plurality of weld formations being constructed to surround a respective fluid pathway of the plurality of fluid pathways and define a location where the cap is to be welded to the second surface of the substrate body.
In accordance with one embodiment, the first material and the second material are stainless steel of the same alloy type, the cap has a thickness of approximately 0.5 mm, and each of the plurality of weld formations includes a groove having a depth of approximately 0.25 mm.
In accordance with a further embodiment, the flow substrate may further comprise a plate formed from a rigid material and constructed to be disposed adjacent the second surface of the cap, and a sheet heater constructed to be disposed between the plate and the second surface of the cap.
In accordance with an aspect of the present invention, the flow substrate may form at least a portion a gas stick for conveying one of semiconductor process fluids and sampling fluids and petrochemical fluids.
In accordance with another aspect of the present invention, a flow substrate is provided comprising a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; and a plurality of caps. Each of the plurality of caps are formed from a second material, each respective cap of the plurality of caps having a first surface to seal a respective fluid pathway of the plurality of fluid pathways and a second surface opposing the first surface of the respective cap. Each respective cap of the plurality of caps including a weld formation, formed in the second surface of the respective cap, and constructed to surround a respective fluid pathway of the plurality of fluid pathways and facilitate welding of the respective cap to the substrate body along the weld formation.
In accordance with one aspect of this embodiment, the substrate body may include a plurality of weld formations formed in the second surface of the substrate body and surrounding a respective one of the plurality of fluid pathways.
In accordance with yet another aspect of the present invention, a flow substrate is provided. The flow substrate comprises a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; a plurality of weld formations, formed in the second surface of the substrate body, each respective weld formation of the plurality of weld formations surrounding a respective fluid pathway of the plurality of fluid pathways; and a plurality of caps. Each of the plurality of caps may be formed from a second material, and each respective cap of the plurality of caps is constructed to be welded to the substrate body along a respective weld formation of the plurality of weld formations.
In accordance with one embodiment, each respective weld formation includes a swaged lip surrounding a respective fluid pathway.
In accordance with another embodiment, each respective cap of the plurality of caps includes a first surface constructed to seal a respective fluid pathway of the plurality of fluid pathways and a second surface opposing the first surface, wherein each respective cap includes a weld formation formed in the second surface of the respective cap to facilitate welding of the respective cap to the substrate body.
In accordance with yet another aspect of the present invention, a flow substrate is provided comprising a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; a plurality of seals corresponding to each of the plurality of fluid pathways; and a cap. The cap is formed from a second material and configured to be attached to the second surface of the substrate body. The cap has a first surface that to be disposed in registration with the second surface of the substrate body, and a second surface opposing the first surface of the cap, the cap including a plurality of grooves defined therein. Each respective groove of the plurality of grooves is constructed to surround a respective fluid pathway of the plurality of fluid pathways and to receive a respective seal of the plurality of seals.
In accordance with one aspect of this embodiment, each respective groove of the plurality of grooves is dimensioned to receive and retain a respective seal of the plurality of seals within the respective groove prior to attachment of the cap to second surface of the substrate body.
In accordance with another aspect of the present invention, a flow substrate is provided. The flow substrate comprises a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of pairs of component conduit ports defined in the first surface of the substrate body; a plurality of fluid pathways extending between each respective pair of component conduit ports and in fluid communication with each conduit port of the respective pair of component conduit ports, each respective fluid pathway being formed in the second surface of the substrate body; a plurality of seals corresponding to each of the plurality of fluid pathways; and a plurality of caps formed from a second material and corresponding to each of the plurality of fluid pathways. Each respective cap of the plurality of caps is constructed to receive and retain a respective seal of the plurality of seals and to form a fluid tight seal with a respective fluid pathway of the plurality of fluid pathways upon compression of the respective cap against the substrate body.
In accordance with an aspect of this embodiment, the flow substrate may further comprise a plate formed from a rigid material and constructed to be disposed in registration with the second surface of the substrate body and to compress each of the plurality of caps against the substrate body.
In accordance with an aspect of each of the above described embodiments, a first fluid pathway of the plurality of fluid pathways may have a different cross-sectional area than a second fluid pathway of the plurality of fluid pathways. In addition, in accordance with each of the above-described embodiments, the plurality of fluid pathways may be a first plurality of fluid pathways that extend between each respective pair of component conduit ports in a first direction, and wherein the flow substrate further includes at least one second fluid pathway formed in one of the first surface and the second surface of the substrate body that extends in a second direction that is transverse to the first direction.
In accordance with yet another aspect of the disclosure, a flow substrate is provided comprising a substrate body formed from a solid block of a first material, the substrate body having a first surface and a second surface opposing the first surface; a plurality of component conduit ports defined in the first surface of the substrate body; a plurality of apertures defined in the second surface of the substrate body; a plurality of fluid pathways, each fluid pathway of the plurality of fluid pathways including a first segment extending between a respective aperture of the plurality of apertures and a first component conduit port of a respective pair of component conduit ports and a second segment extending between the respective aperture and a second component conduit port of the respective pair of component conduit ports; and at least one cap formed from a second material, the at least one cap having a first surface that is constructed to seal at least one aperture of the plurality of apertures, and a second surface opposing the first surface of the at least one cap. At least one of the substrate body and the at least one cap includes a weld formation formed in at least one of the second surface of the substrate body and the second surface of the at least one cap, wherein the weld formation is constructed to surround the at least one aperture and facilitate welding of the at least one cap to the substrate body along the weld formation.
In accordance with at least one embodiment, the first segment and the second segment each extend at an angle relative to the second surface. In accordance with another aspect of this embodiment, the first segment and the second segment each extend at an angle between 35° and 50° relative to the second surface. In accordance with a further aspect, the first segment extends at a different angle than the second segment. In accordance with another aspect, a first segment and a second segment of a first fluid pathway extends at a different angle than a first segment and a second segment of a second fluid pathway.
In accordance with one embodiment, the first segment has a different cross-sectional area than the second segment.
In accordance with at least one aspect, the respective aperture of the plurality of apertures is formed equidistant between the first component conduit port and the second component conduit port of the respective pair of component conduit ports. In another aspect, the respective aperture of the plurality of apertures is formed asymmetrically between the first component conduit port and the second component conduit port of the respective pair of component conduit ports.
In accordance with various embodiments, the flow substrate further comprises at least one third component conduit port formed in the first surface of the substrate body and at least one fluid pathway extending parallel to the first surface and in fluid communication with the at least one third component conduit port.
In accordance with yet another embodiment, the plurality of fluid pathways extend in a first direction, and the flow substrate further comprises at least one fluid pathway extending in a second direction that is transverse to the first direction. In a further aspect, the at least one fluid pathway extending in the second direction includes at least one segment having a different cross-sectional area than a cross-sectional area of at least one of the first segment and the second segment. According to another aspect, the plurality of fluid pathways that extend in the first direction includes a first plurality of fluid pathways extending in the first direction along a first axis and a second plurality of fluid pathways extending in the first direction along a second axis, the first axis being substantially parallel with the second axis, and the at least one fluid pathway extends in the second direction between the first plurality of fluid pathways and the second plurality of fluid pathways. In a further aspect, the flow substrate further comprises at least one aperture associated with the at least one fluid pathway and positioned between the first plurality of fluid pathways and the second plurality of fluid pathways.
In accordance with certain embodiments, the plurality of component conduit ports are a first plurality of pairs of component conduit ports, the plurality of fluid pathways are a first plurality of fluid pathways that extend in a first direction, and the flow substrate further comprises at least one third component conduit port formed in at least one of the first surface and the second surface of the substrate body and at least one fluid pathway extending in a second direction that is transverse to the first direction and in fluid communication with the at least one third component conduit port. In a further embodiment, the at least one fluid pathway extending in the second direction includes at least one segment having a different cross-sectional area than a cross-sectional area of at least one of the first segment and the second segment.
In accordance with one or more embodiments, at least one aperture of the plurality of apertures has a circular cross-sectional area.
In accordance with other embodiments, the first component conduit port and the second component conduit port of the respective pair of component conduit ports is formed by machining from the first surface into the substrate body, each aperture of the respective plurality of apertures is formed by machining from the second surface into the substrate body, and each fluid pathway of the plurality of fluid pathways is formed by machining from the aperture to at least one of the first component conduit port and the second component conduit port.
In accordance with at least one embodiment, the flow substrate further comprises a third component conduit port extending from the first surface of the substrate body and through the substrate body to the second surface of the substrate body, the third component conduit port being configured to receive a fluid handling component that fluidly couples the third component conduit port with a first component conduit port of a respective first pair of component conduit ports and a second component conduit port of a respective second pair of component conduit ports.
In accordance with at least one embodiment, the at least one cap is constructed to seal at least two of the plurality of apertures.
In accordance with some embodiments the flow substrate forms substantially all of a fluid delivery panel.
The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:
This invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
It should be appreciated that the fluid materials manipulated in the fluid delivery flow substrates of the present invention may be a gaseous, liquid, or vaporous substance that may change between liquid and gas phase dependent upon the specific temperature and pressure of the substance. Representative fluid substances may be a pure element such as argon (Ar), a vaporous compound such as boron trichloride (BCl3), a mixture of normally liquid silicon tetrachloride (SiCl4) in carrier gas, or an aqueous reagent.
As shown, the flow substrate 100 includes a substrate body 101 formed from a solid block of material and an associated cap 195 (see
Component conduit ports 120c and 120d and component conduit ports 120e and 120f would each be respectively connected to the inlet and outlet of a respective fluid handling component and illustrate how the flow substrate 100 is specifically suited to fluid handling components having asymmetric port placement. Component port 120g would typically be associated with the inlet or outlet port of a device, such as a mass flow controller, that might be used to communicate the flow of process fluid between flow substrates of a fluid delivery stick.
Associated with component conduit ports 120a and 120b are a plurality of internally threaded component mounting apertures 110a, 110b, 110c, and 110d, each of which would receive the threaded end of a fastener (not shown) that is used to sealingly mount a fluid handling component to the flow substrate 100. Associated with conduit port 120g are a pair of internally threaded component mounting apertures 110y, 110z, each of which would receive the threaded end of a fastener (not shown) to sealingly mount a port of a fluid handling component, such as a mass flow controller to the flow substrate 100. It should be appreciated that an adjacent flow substrate in the fluid delivery stick would typically provide an additional pair of mounting apertures needed to sealingly mount the other port of the fluid handling component to the adjacent flow substrate. Associated with each pair of component conduit ports is a leak port 125a (for component conduit ports 120a and 120b), and 125b (for component conduit ports 120c and 120d) that permits any leakage between the conduit ports and the respective fluid handling component to be detected.
The flow substrate 100 includes a number of fluid pathways 175a, 175b, 175c, and 175d that are used to convey fluid in a longitudinal direction (i.e., from left to right in
A plurality of dowel pin apertures 150a through 150h are formed in the flow substrate 100 that extend from the component attachment surface 105 through to a connection attachment surface 115 on a side of the flow substrate opposing the component attachment surface 105. The connection attachment surface 115 may be used to connect the substrate 100 to a fluid delivery stick bracket, to a manifold, or both, such as described in Applicant's '854 application. Each of these dowel pin apertures 150a-150h can receive a dowel pin (not shown) that may be used to perform different functions. A first function is to align the cap 195 with the body 101 of the flow substrate 100, and a second is to align the flow substrate with a fluid delivery stick bracket in a manner similar to that described in Applicant's '854 application. It should be appreciated that in certain installations, only the first of these functions may be performed, such that after alignment (and welding as described further in detail below), the dowel pin may be removed and re-used with another flow substrate body and cap. In accordance with a further aspect of the present invention, the location of the dowel pin may be backwards compatible with existing modular flow substrate systems, for example, the K1s system.
As can be seen in the figures, component conduit ports 120 and fluid pathways 175 are all machined in a cost-effective manner. Thus, component conduit ports 120a-120g may each be formed by machining from the component attachment surface 105 into a first or top surface of the body 101 of the flow substrate 100, fluid pathways 175b, 175c, and 175d may each be respectively formed by machining from a second or bottom surface of the body 101 of the flow substrate as shown in
In accordance with one aspect of the present invention, the sheet of stainless steel may be chemically etched to form grooves 123 that surround and define the fluid pathways 175b, 175c, and 175d. Such chemical etching may be accurately performed, and can be less expensive than other method of forming grooves, such as by machining, which may alternatively be used. The grooves 123 may define weld formations (i.e., weld preparations) in a surface of the cap 195. In accordance with one embodiment, the grooves may be etched to a thickness of approximately 0.01 inches (0.25 mm). The presence of the grooves 123 surrounding and defining each fluid pathway 175b, 175c, and 175d serves a number of purposes. For example, the thinness of the grooves permits the cap to be welded to the body 101 of the flow substrate, for example, by electron beam welding, using less time and energy than if the grooves 123 were not present. The welding would be performed by tracing around each fluid pathway defined by the groove, thereby forming a fluid tight seal. The electron beam welding may be performed in a vacuum environment to minimize any contamination. Where the materials being used for the flow substrate body 101 and cap 195 are high purity metals, such as stainless steel, the vacuum welding environment acts to further eliminate contaminants (such as Carbon, Sulfur, Manganese, etc.) at the point of the weld. Although electron beam welding is generally preferred, it should be appreciated that other types of welding, such as laser welding may also be used.
The presence of the grooves 123 also serves as a guide during welding, since the grooves define the periphery of the fluid pathway. Dowel pin holes 150a, 150b in the body 101 of the flow substrate and corresponding dowel pin holes 150a′, 150b′ in the cap 195 receive a dowel pin that permits the cap 195 to be aligned with and held in registration with the body of the flow substrate 100 during welding. The dowel pins may be removed and re used after welding is complete, or kept in place as an aid for aligning the flow substrate with a mounting surface.
It should be appreciated that although only four fluid pathways are illustrated in the figures, the ease and low cost of manufacturing embodiments of the present invention readily permits any number of fluid pathways and component ports to be defined in the flow substrate. In this regard, all of the fluid pathways and component connection ports for an entire fluid delivery stick may be formed in a single flow substrate. Alternatively, a fluid delivery stick may be formed by using two or more flow substrates such as the flow substrate 100 described above.
As shown, the flow substrate 400 includes a substrate body 401 formed from a solid block of material and an associated cap 495 (see
As in the first embodiment, flow substrate 400 includes a component attachment surface 105 to which a fluid handling component (such as a valve, pressure transducer, filter, regulator, mass flow controller, etc.) is attached. Formed in the component attachment surface 105 of the flow substrate 400 are one or more component conduit ports 120, having similar functionality as that described with respect to the first embodiment. Associated with each of the component conduit ports 120 are a plurality of internally threaded component mounting apertures 110a, 110b, 110c, 110d, 110y, and 110z, each of which would receive the threaded end of a fastener (not shown) that is used to sealingly mount a fluid handling component (not shown) to the flow substrate 400 in a manner similar to that described previously. Associated with each pair of component conduit ports is a leak port 125a (for component conduit ports 120a and 120b), and 125b (for component conduit ports 120c and 120d) that permits any leakage between the conduit ports and the respective fluid handling component to be detected.
As in the first embodiment, the flow substrate 400 includes a number of fluid pathways 175a, 175b, 175c, and 175d that are used to convey fluid in a longitudinal direction (i.e., from left to right in
As in the first embodiment, a plurality of dowel pin apertures 150a through 150h are formed in the flow substrate 400 that extend from the component attachment surface 105 through to a connection attachment surface 115 on a side of the flow substrate opposing the component attachment surface. The connection attachment surface 115 may be used to connect the substrate 400 to a fluid delivery stick bracket, to a manifold, or both, such as described in Applicant's '854 application.
As described previously, each of these dowel pin apertures 150a-150h can receive a dowel pin (not shown) that may be used to perform different functions. A first function is to align the cap 495 with the body 401 of the flow substrate 400, and a second is to align the flow substrate with a fluid delivery stick bracket in a manner similar to that described in Applicant's '854 application. It should be appreciated that in certain installations, only the first of these functions may be performed. For example, depending on the length of the dowel pin used, the dowel pin may protrude through the cap 495 and extend beyond connection attachment surface 115, such that the dowel pins may be used to align the flow substrate with corresponding apertures in the fluid delivery stick bracket or other mounting surface. Where the dowel pins extend beyond the connection attachment surface 115, the locations of the dowel pins may be backwards compatible with existing modular flow substrate systems. Alternatively, the length of the dowel pin may be such that it does not extend beyond the connection attachment surface, but still engages the cap 495 to ensure alignment.
As can be seen in
It should be appreciated that because the cap 495 is not welded to the body 401 of the flow substrate 400, the cap 495, and the associated elastomeric seals 455 may later be removed with a minimal amount of effort. Thus, for example, where it is desired to clean or otherwise service a fluid pathway 175b, 175c, or 175d, the cap 495 may be easily removed to expose and/or clean the fluid pathways, to replace one or more of the elastomeric seals 455, etc.
It should be appreciated that although only four fluid pathways are illustrated in the figures associated with this second embodiment, the ease and low cost of manufacturing embodiments of the present invention readily permits any number of fluid pathways and component ports to be defined in the flow substrate. In this regard, all of the fluid pathways and component connection ports for an entire fluid delivery stick or chemical or biological delivery system may be formed (by machining, by molding, or a combination of molding and machining) in a single flow substrate.
Although the embodiment depicted in
Although not specifically illustrated, it should be appreciated that other aspects described in Applicant's '854 application may be adapted for use with the flow substrate described herein. For example, in addition to fluid pathways oriented in a longitudinal direction, the flow substrate may include a manifold fluid pathway oriented in a transverse direction. In such an embodiment, a tube stub connection similar to the tube stub connection 135 could extend from a lateral side surface of the body 101 (401) of the flow substrate, with the manifold fluid pathway being formed in a manner similar to that described with respect to fluid pathway 175a.
Although embodiments of the present invention have been described primarily with respect to the use of fluid handling components having two ports, it should be appreciated that embodiment of Applicant's invention could be modified for use with a three-port component, such as a 3-port valve as illustrated in
The embodiments of
As can best be seen in
As best illustrated in
As best illustrated in
As best illustrated in
As shown in
As shown most clearly in
It should be appreciated that the back-up plate shown in
As discussed previously, the flow substrate 1300 may include a number of fluid pathways 1375a, 1375b, 1375d, 1375e, and 1375f that are used to convey fluid in a longitudinal direction (i.e., from left to right in
As noted above, the flow substrate 1300 may also include one or more apertures 1370 formed in the second or bottom surface 1306 of the flow substrate 1300. The apertures may be in fluid communication with one or more fluid pathways and one or more component conduit ports. For example, aperture 1370b may be in fluid communication with fluid pathway 1375b and component conduit ports 1320b and 1320c. In a similar manner, aperture 1370d may be in fluid communication with fluid pathway 1375d and component conduit ports 1320e and 1320f, aperture 1370e may be in fluid communication with fluid pathway 1375e and component conduit ports 1320g and 1320h, and aperture 1370f may be in fluid communication with fluid pathway 1375f and component conduit ports 1320i and 1320j. One or more of the apertures 1370 may have a circular cross-sectional area. As discussed above, a tube stub connection 1335 may be fluidly connected to a source or sink of process fluid.
In one or more embodiments, the flow substrate may include a plurality of component conduit ports that are associated with a plurality of apertures and a plurality of fluid pathways, where each fluid pathway of the plurality of fluid pathways includes a first segment extending between a respective aperture of the plurality of apertures and a first component conduit port of a respective pair of component conduit ports, and a second segment extending between the respective aperture and a second component conduit port of the respective pair of component conduit ports. In various embodiments, the fluid pathway may include one or more segments. For example, a fluid pathway may include one, two, three, or four segments. In some embodiments, one or more segments of a fluid pathway may share a common aperture. In a further embodiment, one or more segments of a fluid pathway may extend in a different direction than one or more other segments of the fluid pathway. For example, a first and second segment of a fluid pathway may extend longitudinally in a first direction, and a third segment may extend in a second direction that is different than the first direction, such as transverse to the first direction. Further, a third and fourth segment may extend in a second direction that is different than the first direction. Each segment of the fluid pathway may be associated with a respective component conduit port. In some embodiments, the flow substrate may further comprise at least one third component conduit port formed in the first surface of the substrate body and at least one fluid pathway extending parallel to the first surface and in fluid communication with the at least one third component conduit port.
The flow substrate 1300 may also include one or more fluid pathways oriented in a transverse direction. For example, the plurality of fluid pathways may form a first plurality of fluid pathways that extend in a first direction. The flow substrate may further comprise at least one fluid pathway that extends in a second direction transverse to the first direction. In certain instances, the at least one fluid pathway extending in the second direction may include at least one segment that has a different cross-sectional area than a cross-sectional area of at least one of the first segment and second segment of the first plurality of fluid pathways. In another embodiment, the plurality of component conduit ports may form a first plurality of component conduit ports and the plurality of fluid pathways may form a first plurality of fluid pathways that extend in a first direction. The flow substrate may further comprise at least one third component conduit port formed in at least one of the first surface and second surface of the substrate body and at least one fluid pathway that extends in a second direction that is transverse to the first direction and is in fluid communication with the at least one third component conduit port. In a further aspect, the at least one fluid pathway extending in the second direction includes at least one segment having a different cross-sectional area than a cross-sectional area of at least one of the first segment and second segment of the first plurality of fluid pathways. As will be appreciated by one of ordinary skill in the art, the at least one fluid pathway extending in a second direction may include one or more segments and may be associated with one or more component conduit ports and a respective aperture.
According to one or more aspects, and as discussed further below, the flow substrate may further comprise a third component conduit port that extends from the first surface of the substrate body and through the substrate body to the second surface of the substrate body. The third component conduit port may be configured to receive a fluid handling component that fluidly couples the third component conduit port with a first component conduit port of a respective first pair of component conduit ports and a second component conduit port of a respective second pair of component conduit ports.
The fluid handling components may have two ports, to mate with conduit ports, such as those illustrated by 1320a and 1320b, or in the alternative, may have three ports to mate with conduit ports, such as those illustrated by 1320c-1320e. This alternative arrangement may be useful for use with a three-way valve. For example, an inert gas or purge may be fluidly connected to a manifold port 1322 and provided through fluid pathway 1375c to the fluid handling component associated with one or more conduit ports, such as 1320c-e. The manifold port 1322 may be constructed in a similar manner as the component conduit ports 1320 discussed above. Associated with the manifold port 1322 may be one or more leak test channels 1385 that function to detect any leakage between the manifold port 1332 and a manifold (not shown) fluidly connected thereto. A plurality of through holes extend from the component attachment surface 1305 of the substrate 1300, into the body 1301 of the substrate and through to the opposing surface of the substrate body 1301, each to receive a fastener that mounts a manifold to the substrate body 1301 from below. As shown, each of the through holes can include a counter-bore 1374 formed in the component attachment surface 1305 of the substrate that is dimensioned to receive the head of a threaded fastener (not shown) and recess the head of the fastener below the component attachment surface 1305 of the substrate. The threaded end of each fastener can extend through a respective aperture 1380 and mate with threaded holes formed in a mating surface of the manifold to pull the manifold into sealing engagement with the manifold port 1322. The counter-bores 1374 thus permit a fluid handling component to be mounted to the component attachment surface 1305 of the substrate without interference from the head of the fasteners. Although the flow substrates illustrated in
In accordance with one or more embodiments, the fluid pathways may be circular in cross-section. For example,
Fluid pathways 1375b, 1375d, 1375e, and 1375f may each be formed by first machining vertically (i.e., perpendicular to the bottom surface of the substrate) from the bottom surface 1306 of the body 1301 of the flow substrate 1300 (to form the apertures 1370). As can be seen in the figures, one or more segments of the fluid pathway 1375 that extend from the aperture 1370 to a component conduit port 1320 may each be formed by machining further into the body 1301 at an angle through the aperture. For example, fluid pathway 1375b may be formed by first drilling into the bottom surface 1306 of the substrate 1300 at a point in between corresponding conduit ports 1320b and 1320c. In some instances, the first drilling point may be equidistant from corresponding conduit ports 1320b and 1320c. In other aspects, the first drilling point may be formed asymmetrically between the corresponding conduit ports. The initial cut extends in a vertical direction to a predetermined point in the body 1301 of the substrate 1300. This serves to form the aperture 1370.
One or more angled cuts may then be made further into the body 1301 of the substrate using the cavity of the aperture 1370 as the starting point and the corresponding conduit port 1320 as the ending point. For example, in
In one or more embodiments, the angular segments of the fluid pathways may be formed by machining into the body of the substrate 1301 through the opening created by the conduit port 1320, i.e., through the top of the substrate 1305. In some embodiments, the apertures 1370 and fluid pathways 1375 may be formed first, before the machining of the corresponding conduit ports 1320.
The component conduit ports 1320, apertures 1370, and fluid pathways 1375 may each be formed by using any one of a number of different machining processes, including turning, boring, milling, and drilling techniques. For example, in some embodiments, a drill press may be used. The circular flow path created by the drill bit may be subjected to further processing, such as polishing. In addition, one or more surfaces may be treated to enhance corrosion resistance. As discussed above, the dimensions of the fluid pathways 1375 may be particularly well suited for very high flow rates, and may be scaled down for lower flow applications. It should be appreciated that although the cross-section for the flow paths and apertures is illustrated in the figures as being circular, other shapes are also within the scope of this disclosure.
The flow substrate 1300 may include a plurality of associated caps 1395b, 1395d, 1395e, and 1395f, with each cap being associated with a respective aperture 1370b, 1370d, 1370e, and 1370f. The caps may be similar in structure to the caps shown in
In accordance with certain aspects of this disclosure, the round caps may be used with a flow substrate forming multiple gas sticks, such as substrates comprising all or substantially all of a gas panel, such as the substrates illustrated in
As previously discussed with respect to
In other embodiments, the plurality of apertures formed within the substrate body 1300 may be sealed by a common or integrated cap, such as described above with respect to
The use of the plurality of apertures, fluid pathways, and circular or round caps featured in
Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.
This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application Ser. No. 61/842,460 titled “EXTREME FLOW RATE AND/OR HIGH TEMPERATURE FLUID DELIVERY SUBSTRATES,” filed on Jul. 3, 2013, and claims the benefit of priority under 35 U.S.C. §120 as a continuation-in-part of U.S. patent application Ser. No. 13/923,939 titled “EXTREME FLOW RATE AND/OR HIGH TEMPERATURE FLUID DELIVERY SUBSTRATES,” filed on Jun. 21, 2013. U.S. patent application Ser. No. 13/923,939 is a division under 35 U.S.C. §120 of U.S. patent application Ser. No. 12/796,979, titled “EXTREME FLOW RATE AND/OR HIGH TEMPERATURE FLUID DELIVERY SUBSTRATES,” filed on Jun. 9, 2010, (now U.S. Pat. No. 8,496,029), which claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application Ser. No. 61/185,829, titled “HIGH FLOW RATE AND/OR HIGH TEMPERATURE FLUID DELIVERY SUBSTRATES,” filed on Jun. 10, 2009, and to U.S. Provisional Patent Application Ser. No. 61/303,460, titled “EXTREME FLOW RATE AND/OR HIGH TEMPERATURE FLUID DELIVERY SUBSTRATES,” filed on Feb. 11, 2010. This application is related to U.S. patent application Ser. No. 12/777,327, titled “FLUID DELIVERY SUBSTRATES FOR BUILDING REMOVABLE STANDARD FLUID DELIVERY STICKS, filed May 11, 2010 (now U.S. Pat. No. 8,307,854). The contents of the aforementioned applications are hereby incorporated by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61185829 | Jun 2009 | US | |
| 61303460 | Feb 2010 | US | |
| 61842460 | Jul 2013 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12796979 | Jun 2010 | US |
| Child | 13923939 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13923939 | Jun 2013 | US |
| Child | 14037854 | US |
