Claims
- 1. An extruded, open-cell alkenyl aromatic polymer foam, comprising:
- a) an alkenyl aromatic polymer material having 90 percent or more by weight alkenyl aromatic monomeric units; and
- b) a nucleating agent, the foam having an open-cell content of about 30 to about 80 percent, the foam having a minor dimension in cross-section of greater than 0.25 inches, the foam having a density of about 1.5 pcf to about 6 pcf, the foam having an average cell size of about 0.08 mm to about 1.2 mm, the foam being substantially free of polyphenylene oxide polymers and their derivatives.
- 2. The foam of claim 1, wherein the foam has a density of about 2.0 pcf to about 3.5 pcf.
- 3. The foam of claim 1, wherein the foam has an average cell size of about 0.1 mm to about 0.9 mm.
- 4. The foam of claim 1, wherein the foam has a heat distortion temperature of about 175.degree. F. to about 210.degree. F.
- 5. The foam of claim 1, wherein the foam has a heat distortion temperature of about 190.degree. F. to about 205.degree. F.
- 6. The foam of claim 1, wherein the foam is substantially free of rubbery polymer content and thermoset polymer content and polyphenylene oxide polymers and their derivatives.
- 7. The foam of claim 1, wherein the foam has a minor dimension in cross-section of 0.375 inches or more.
- 8. The foam of claim 1, wherein the foam has a heat distortion temperature of about 175.degree. F. to about 210.degree. F., the foam being substantially free of C.sub.4-6 diene monomeric content and thermoset polymer content.
- 9. The foam of claim 1, wherein the foam has a minor dimension in cross-section of 0.375 inches or more, the foam having a density of about 2.0 pcf to about 3.5 pcf, the foam having an average cell size of about 0.1 mm to about 0.9 mm, and the foam having a heat distortion temperature of about 190.degree. F. to about 205.degree. F. the foam being substantially free of C.sub.4-6 diene monomeric content and thermoset polymer content and polyphenylene oxide polymers and their derivatives.
- 10. An extruded, open-cell alkenyl aromatic polymer foam, comprising:
- a) an alkenyl aromatic polymer material consisting essentially of polystyrene; and
- b) a nucleating agent, the foam having an open-cell content of about 30 to about 80 percent, the foam having a minor dimension in cross-section of greater than 0.25 inches, the foam having a density of about 1.5 pcf to about 6 pcf, the foam having an average cell size of about 0.08 mm to about 1.2 mm, the foam being substantially free of polyphenylene oxide and their derivatives.
- 11. The foam of claim 10, wherein the foam has a density of about 2.0 pcf to about 3.5 pcf.
- 12. The foam of claim 10, wherein the foam has an average cell size of about 0.1 mm to about 0.9 mm.
- 13. The foam of claim 10 wherein the foam has a heat distortion temperature of about 175.degree. F. to about 210.degree. F.
- 14. The foam of claim 10, wherein the foam has a heat distortion temperature of about 190.degree. F. to about 205.degree. F.
- 15. The foam of claim 10, wherein the foam is substantially free of rubbery polymer content and thermoset polymer content.
- 16. The foam of claim 10, wherein the foam has a minor dimension in cross-section of 0.375 inches or more.
- 17. The foam of claim 10, wherein the foam has a heat distortion temperature of about 175.degree. F. to about 210.degree. F., the foam being substantially free of C.sub.4-6 diene monomeric content and thermoset polymer content.
- 18. The foam of claim 10, wherein the foam has a minor dimension in cross-section of 0.375 inches or more, the foam having a density of about 2.0 pcf to about 3.5 per, the foam having an average cell size of about 0.1 mm to about 0.9 mm, and the foam having a heat distortion temperature of about 190.degree. F. to about 205.degree. F. the foam being substantially free of C.sub.4-6 diene monomeric content and thermoset polymer content.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of application U.S. patent application Ser. No. 08/346,447, filed Nov. 29, 1994, now U.S. Pat. No. 5,434,195, which is a continuation-in-part of U.S. patent application Ser. No. 08/264,669, filed Jun. 23, 1994, now U.S. Pat. No. 5,411,687.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4532265 |
Park et al. |
Jul 1985 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
0084226 |
Jul 1983 |
EPX |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
346447 |
Nov 1994 |
|
Parent |
264669 |
Jun 1994 |
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