This relates generally to items with fabric and, more particularly, to items with fabric and electrical components.
It may be desirable to form bags, furniture, clothing, and other items from materials such as fabric. Fabric items generally do not include electrical components. It may be desirable, however, to incorporate electrical components into fabric to provide a user of a fabric item with enhanced functionality.
It can be challenging to incorporate electrical components into fabric. Fabric is flexible, so it can be difficult to mount structures to fabric. Electrical components must be coupled to signal paths (e.g., signal paths that carry data signals, power, etc.), but unless care is taken, signal paths may be damaged, or components may become dislodged as fabric is bent and stretched.
Interlacing equipment (e.g., weaving equipment, knitting equipment, braiding equipment, etc.) may be provided with individually adjustable components. The use of individually adjustable components may allow electrical components to be inserted into and/or embedded in the fabric during the formation of the fabric.
Woven fabric may include warp strands and weft strands. In a Leno weave, a warp strand may include one or more covering strands twisted around a core strand. The covering strands and/or the core strand may be conductive to form a conductive warp strand. The conductive warp strand may form part of a circuit and/or may be connected to an electrical component.
A first electrical connection may couple the electrical component to the core strand and a second electrical connection may couple the electrical component to the covering strand. The two electrical connections may be isolated from one another. To form isolated electrical connections with the core strand and the covering strand, the outer insulating layer of the core strand may have a different melting temperature and/or may be formed from a different material than the outer insulating layer of the covering strand. Arrangements in which different techniques are used to form the two electrical connections such as ultra-violet light curing material in the first electrical connection and soldering material via induction in the second electrical connection may also be used. Heddles may be used to create a gap between the core strand and the covering strand. The first and second electrical connections may be located in first and second respective grooves in the electrical component. The first electrical connection may couple the core strand to a first contact on the electrical component and the second electrical connection may couple the covering strand to a second contact on the electrical component.
A warp strand may include one or more conductive strands and one or more non-conductive strands. The warp strand may include a core and a covering. In some regions of the warp strand, the conductive strand may be located in the core and may be surrounded and insulated by the non-conductive strand. In other regions of the warp strand, the conductive strand may form part of the covering or may be located on an outer surface of the covering to form an electrode and/or to connect to an electrical component.
Electronic devices, enclosures, and other items may be formed from fabric such as woven fabric, knit fabric, braided fabric, and/or other suitable fabric. The fabric may include strands of insulating and conductive material that form circuitry. Conductive strands may form signal paths through the fabric and may be coupled to electrical components such as light-emitting diodes and other light-emitting devices, integrated circuits, sensors, haptic output devices, and other circuitry.
Interlacing equipment (sometimes referred to as intertwining equipment) may include weaving equipment, knitting equipment, braiding equipment, or any other suitable equipment used for crossing, looping, overlapping, or otherwise coupling strands of material together to form a network of strands (e.g., fabric). Interlacing equipment may be provided with individually adjustable members such as warp strand positioning equipment (e.g., heddles or other warp strand positioning equipment), weft strand positioning equipment, a reed, take-down equipment, let off equipment (e.g., devices for individually dispensing and tensioning warp strands), needle beds, feeders, guide bars, strand processing and component insertion equipment, carriers, and other components for forming fabric items with electrical components. The individual adjustability of these components may allow interlacing operations (e.g., weaving operations, knitting operations, braiding operations, and/or other interlacing operations) to be performed without requiring continuous lock-step synchronization of each of these devices, thereby allowing fabric with desired properties to be woven.
Processing operations such as selectively shielding conductive strands, selectively insulating conductive strands, selectively exposing conductive cores of conductive strands (e.g., to form connections with electrical components and/or to form exposed contact pads, electrodes, etc.), forming selective electrical connections (e.g., solder connections) between electrical components and conductive strands, and/or other processing operations may take place while the conductive strands are being interlaced by the interlacing equipment. This type of in-situ processing of conductive strands may take place during weaving, knitting, and/or braiding so that electrical circuits can be formed in the fabric and/or so that electrical components can be incorporated into the fabric during formation of the fabric.
Items such as item 10 of
Item 10 may include interlaced strands of material such as monofilaments and yarns that form fabric 12. As used herein, “interlaced” strands of material and “intertwined” strands of material may both refer to strands of material that are crossed with one another, looped with one another, overlapping one another, or otherwise coupled together (e.g., as part of a network of strands that make up a fabric). Fabric 12 may form all or part of a housing wall or other layer in an electronic device, may form internal structures in an electronic device, or may form other fabric-based structures. Item 10 may be soft (e.g., item 10 may have a fabric surface that yields to a light touch), may have a rigid feel (e.g., the surface of item 10 may be formed from a stiff fabric), may be coarse, may be smooth, may have ribs or other patterned textures, and/or may be formed as part of a device that has portions formed from non-fabric structures of plastic, metal, glass, crystalline materials, ceramics, or other materials.
The strands of material used in forming fabric 12 may be single-filament strands (sometimes referred to as fibers) or may be threads, yarns, or other strands that have been formed by interlacing multiple filaments of material together. Strands may be formed from polymer, metal, glass, graphite, ceramic, natural materials such as cotton or bamboo, or other organic and/or inorganic materials and combinations of these materials. Conductive coatings such as metal coatings may be formed on non-conductive strands (e.g., plastic cores) to make them conductive. Reflective coatings such as metal coatings may be applied to strands to make them reflective. Strands may also be formed from single-filament metal wire (e.g., bare metal wire), multifilament wire, or combinations of different materials. Strands may be insulating or conductive.
Strands in fabric 12 may be conductive along their entire lengths or may have conductive portions. Strands may have metal portions that are selectively exposed by locally removing insulation (e.g., to form connections with other conductive strand portions and/or to form connections with electrical components). Strands may also be formed by selectively adding a conductive layer to a portion of a non-conductive strand.). Threads and other multifilament yarns that have been formed from interlaced filaments may contain mixtures of conductive strands and insulating strands (e.g., metal strands or metal coated strands with or without exterior insulating layers may be used in combination with solid plastic strands or natural strands that are insulating). In some arrangements, which may sometimes be described herein as an example, fabric 12 may be a woven fabric and the strands that make up fabric 12 may include warp strands and weft strands.
Conductive strands and insulating strands may be woven, knit, or otherwise interlaced to form conductive paths. The conductive paths may be used in forming signal paths (e.g., signal buses, power lines for carrying power, etc.), may be used in forming part of a capacitive touch sensor electrode, a resistive touch sensor electrode, or other input-output device, or may be used in forming other patterned conductive structures. Conductive structures in fabric 12 may be used in carrying electrical current such as power, digital signals, analog signals, sensor signals, control signals, data, input signals, output signals, or other suitable electrical signals.
Item 10 may include additional mechanical structures 14 such as polymer binder to hold strands in fabric 12 together, support structures such as frame members, housing structures (e.g., an electronic device housing), and other mechanical structures.
To enhance mechanical robustness and electrical conductivity at strand-to-strand connections and/or strand-to-component connections, additional structures and materials (e.g., solder, crimped metal connections, welds, conductive adhesive such as anisotropic conductive film and other conductive adhesive, non-conductive adhesive, fasteners, etc.) may be used in fabric 12. Strand-to-strand connections may be formed where strands cross each other perpendicularly or at other strand intersections where connections are desired. Insulating material can be interposed between intersecting conductive yarns at locations in which it is not desired to form a strand-to-strand connection. The insulating material may be plastic or other dielectric, may include an insulating strand or a conductive strand with an insulating coating or insulated conductive monofilaments, etc. Solder connections may be formed between conductive strands and/or between conductive strands and electrical components by melting solder so that the solder flows over conductive strands. The solder may be melted using an inductive soldering head to heat the solder, using hot air to heat the solder, using a reflow oven to heat the solder, using a laser or hot bar to heat the solder, or using other soldering equipment. In some arrangements, outer dielectric coating layers (e.g., outer polymer layers) may be melted away in the presence of molten solder, thereby allowing underlying metal yarns to be soldered together. In other arrangements, outer dielectric coating layers may be removed prior to soldering (e.g., using laser ablation equipment or other coating removal equipment).
Circuitry 16 may be included in item 10. Circuitry 16 may include electrical components that are coupled to fabric 12, electrical components that are housed within an enclosure formed by fabric 12, electrical components that are attached to fabric 12 using welds, solder joints, adhesive bonds (e.g., conductive adhesive bonds such as anisotropic conductive adhesive bonds or other conductive adhesive bonds), crimped connections, or other electrical and/or mechanical bonds. Circuitry 16 may include metal structures for carrying current, electrical components such as integrated circuits, light-emitting diodes, sensors, and other electrical devices. Control circuitry in circuitry 16 may be used to control the operation of item 10 and/or to support communications with item 18 and/or other devices.
Item 10 may interact with electronic equipment or other additional items 18. Items 18 may be attached to item 10 or item 10 and item 18 may be separate items that are configured to operate with each other (e.g., when one item is a case and the other is a device that fits within the case, etc.). Circuitry 16 may include antennas and other structures for supporting wireless communications with item 18. Item 18 may also interact with item 10 using a wired communications link or other connection that allows information to be exchanged.
In some situations, item 18 may be an electronic device such as a cellular telephone, computer, or other portable electronic device and item 10 may form a cover, case, bag, or other structure that receives the electronic device in a pocket, an interior cavity, or other portion of item 10. In other situations, item 18 may be a wrist-watch device or other electronic device and item 10 may be a strap or other fabric item that is attached to item 18 (e.g., item 10 and item 18 may together form a fabric-based item such as a wristwatch with a strap). In still other situations, item 10 may be an electronic device, fabric 12 may be used in forming the electronic device, and additional items 18 may include accessories or other devices that interact with item 10. Signal paths formed from conductive yarns and monofilaments may be used to route signals in item 10 and/or item(s) 18.
The fabric that makes up item 10 may be formed from strands such as yarns (e.g., multifilament strands) and/or monofilaments that are interlaced using any suitable interlacing equipment. With one suitable arrangement, which may sometimes be described herein as an example, fabric 12 may be woven fabric formed using a weaving machine. In this type of illustrative configuration, fabric may have a plain weave, a basket weave, a satin weave, a twill weave, or variations of these weaves, may be a three-dimensional woven fabric, or may be other suitable fabric. This is, however, merely illustrative. If desired, fabric 12 may include knit fabric, warp knit fabric, weft knit fabric, braided fabric, other suitable type of fabric, and/or a combination of any two or more of these types of fabric.
Weft strands 22 may be inserted into one or more sheds 68 during weaving to form woven fabric 12 (e.g., woven fabric 12 of
Weft strand positioning equipment 60 may insert weft strand 22 into shed 68 across fabric 12 and may, if desired, attach weft strand 22 to a binder on an opposing side of fabric 12 (e.g., a strand that stitches the edges of fabric 12). After each pass of weft strand 22 is made through shed 68, a reed (e.g., a reed member with slots or other openings through which respective warp strands 20 pass, not shown in
Fabric 12 that has been woven may be gathered on fabric collection equipment such as take-down rollers or other take-down equipment. If desired, take-down equipment may include multiple independently controlled rollers, which may help protect electrical components in fabric 12 while maintaining an appropriate amount of tension in fabric 12. For example, less tension may be applied to portions of fabric 12 where electrical components 26 are located, while other portions of fabric 12 that do not include electrical components may be held under a higher amount of tension.
Electrical components in item 10 such as illustrative electrical component 26 may include discrete electrical components such as resistors, capacitors, and inductors, may include connectors, may include batteries, may include input-output devices such as switches, buttons, light-emitting components such as light-emitting diodes, audio components such as microphones and speakers, vibrators (e.g., piezoelectric actuators that can vibrate), solenoids, electromechanical actuators, motors, and other electromechanical devices, microelectromechanical systems (MEMs) devices, pressure sensors, light detectors, proximity sensors (light-based proximity sensors, capacitive proximity sensors, etc.), force sensors (e.g., piezoelectric force sensors), strain gauges, moisture sensors, temperature sensors, accelerometers, gyroscopes, compasses, magnetic sensors (e.g., Hall effect sensors and magnetoresistance sensors such as giant magnetoresistance sensors), touch sensors, and other sensors, components that form displays, touch sensors arrays (e.g., arrays of capacitive touch sensor electrodes to form a touch sensor that detects touch events in two dimensions), and other input-output devices, electrical components that form control circuitry such as non-volatile and volatile memory, microprocessors, application-specific integrated circuits, system-on-chip devices, baseband processors, wired and wireless communications circuitry, and other integrated circuits.
Electrical components such as component 26 may be bare semiconductor dies (e.g., laser dies, light-emitting diode dies, integrated circuits, etc.) or packaged components (e.g. semiconductor dies or other devices packaged within plastic packages, ceramic packages, or other packaging structures).
As shown in
To increase the robustness of the connection between strands 80C and component 26, component 26 may have one or more recesses for receiving strands 80C. For example, strands 80C may each be threaded through a portion of component 26 to help secure component 26 to fabric 12. Strands 80 may be threaded through recesses, openings, trenches, grooves, holes, and/or other engagement features of component 26.
Electrical components 26 may be inserted into fabric 12 during the formation of fabric 12 using component insertion equipment such as insertion tool 54. Insertion tool 54 may hold component 26 and may align component 26 with conductive strands 80C during interlacing operations. If desired, component 26 may be electrically and mechanically connected to one or more conductive strands 80C in a pocket in fabric 12. For example, weaving equipment 98 may be used to create one or more regions in fabric 12 such as a pocket (sometimes referred to as a gap, space, cavity, void, position, location, etc.) for receiving electrical components. Regions in fabric 12 that receive electrical components may be formed by creating a space or gap between portions of fabric 12. The term “pocket” may be used to refer to a void between fabric portions and/or may be used to refer to a position or location between fabric portions (e.g., a position between strands of material in fabric 12).
Following insertion and attachment of component 26 to conductive strand 80C, weaving equipment 98 may continue weaving operations (which may include closing the pocket to fully enclose component 26, if desired) to continue forming fabric 12.
Processing operations such as selectively shielding conductive strands 80C, selectively insulating conductive strands 80C, selectively exposing conductive cores of conductive strands 80C (e.g., to form connections with electrical components and/or to form exposed contact pads, electrodes, etc.), forming selective electrical connections (e.g., solder connections) between electrical components and conductive strands 80C, and/or other processing operations may take place while the conductive strands are being interlaced by the interlacing equipment. This type of in-situ processing of conductive strands 80C may take place during weaving (e.g., while strands 80 and 80C are located on weaving equipment 98) so that electrical circuits can be formed in fabric 12 and/or so that electrical components 26 can be incorporated into fabric 12 during formation of fabric 12.
In the example of
Covering 30 may include one or more conductive covering strands 80C-2 (e.g., a metal monofilament, a bundle of metal filaments forming a multifilament wire, etc.) that are twisted around, braided around, or otherwise wrapped around core 32. Covering 30 may be a single-layer covering, a double-layer covering (e.g., first and second concentric layers of twisted strands that are twisted in the same direction or that are twisted in opposite directions), and/or may have any other suitable number of layers. Conductive covering strands 80C-2 of cover 30 may be insulated (e.g., may include an outer layer of insulating material such as polymer) or may be bare metal wires. Covering 30 may form a twisted or braided sheath around core 32.
In some arrangements, conductive core strands 80C-1 of core 32 and conductive covering strands 80C-2 of cover 30 may be electrically isolated from one another so that covering 30 forms an electrical shielding layer surrounding some or all of the length of conductive core 32. For example, one or both of conductive strands 80C-1 and 80C-2 may have a cross-section of the type shown in
In the example of
Heddles 64 may avoid crossing one another during weaving, or heddles 64 may be specialized heddles 64 that can rotate and/or otherwise swap positions to create twisted, braided, or otherwise bundled warp strands 20. Heddles may, for example, be used to form a Leno weave in fabric 12. For example, heddles 64 may be configured to twist conductive strand 80C-2 around conductive strand 80C-1 during weaving, if desired. Weft strands 22 may be held in place between the twisted strands (e.g., between strands 80C-1 and 80C-2).
As shown in
Grooves 50-1 and 50-2 may expose conductive pads on component 26. Strands 80C-1 and 80C-2 may be threaded through grooves 50-1 and 50-2 in component 26. A first electrical connection 82-1 (e.g., solder or other suitable conductive material) may be used to electrically and mechanically couple strand 80C-1 to a first contact on component 26 in groove 50-1, and a second electrical connection 82-2 (e.g., solder or other suitable conductive material) may be used to electrically and mechanically couple strand 80C-2 to a second contact on component 26 in groove 50-2.
If desired, electrical connections 82-1 and 82-2 may be electrically isolated form one another. Component 26 may, for example, include terminals such as positive and negative electrodes (e.g., an anode and a cathode), each located in a respective one of grooves 50-1 and 50-2. Conductive strand 80C-1 may be coupled to a first contact (e.g., a first electrode, bond pad, terminal, etc.) in groove 50-1 using solder 82-1, while solder 82-1 remains electrically insulated from conductive strand 80C-2. Conductive strand 80C-2 may be coupled to a second contact (e.g., a second electrode, bond pad, terminal, etc.) in groove 50-2 using solder 82-2, while solder 82-2 remains electrically insulated from conductive strand 80C-1. This may be achieved by using different materials for solder 82-1 and solder 82-2 (e.g., materials with different soldering temperatures), by using different insulation materials for conductive strands 80C-1 and 80C-2, by using different techniques for connections 82-1 and 82-2 (e.g., connection 82-1 may include ultraviolet-light-cured material whereas connection 82-2 may be solder material that is reflowed using induction or other techniques).
While strands 80C-1 and 80C-2 are being held in place by heddles 64, first electrical connection 82-1 may be made selectively between strand 80C-1 and component 26, and second electrical connection 82-2 may be made selectively between strand 80C-2 and component 26. Due to the use of different solder materials, different insulation materials, and/or different connection techniques, connection 82-1 may be electrically insulated from conductive strand 80C-2 and connection 82-2 may be electrically insulated from conductive strand 80C-1. For example, conductive strands 80C-1 and 80C-2 may include outer insulating layers 36 (
In the example of
As shown in
As shown in
In the examples of
Warp strand positioning structures 126 may be coupled to one or more actuators such as actuators 116 and 118 (e.g., servomotors or other suitable actuators). Actuator 116 may be configured to adjust the position of rotating member 124 in directions 78 (to thereby adjust the position of cover strands 80C-2), whereas actuator 118 may be configured to adjust the position of heddle 64 in directions 106 (to thereby adjust the position of core strand 80C-1). Actuators 116 and 118 may move strands 80C-1 and 80C-2 in unison and/or may move strands 80C-1 and 80C-2 independently one of another.
Weft strands 22 may be inserted into one or more sheds (e.g., shed 68 of
During weft strand insertion, actuators 116 and 118 may adjust the respective positions of both core strand 80C-1 and cover strand 80C-2 to create a shed through which a given weft strand 22 can be inserted.
To accommodate component insertion and/or strand processing operations (e.g., adding and/or removing coatings such as insulating coatings and/or conductive coatings, applying encapsulation material, forming solder connections and/or exposed contact pads, etc.), actuator 118 and/or actuator 116 may be used to position core strand 80C-1 away from cover strands 80C-2, as shown in
As shown in
It may be desirable to selectively expose a conductive core of a conductive strand. For example, a conductive core strand may have a segment that is moved to an outer surface of the strand to form a connection with an electrical component and/or to form an electrode on the conductive strand. Illustrative examples of this type of arrangement are shown in
In the example of
In region 88, conductive strand 80C swaps places with the given strand 80D at the core of strand 80. All three strands 80D are twisted around conductive strand 80C in direction 92 in region 88. This causes conductive strand 80C to form a core strand while the remaining strands 80D form covering strands in region 88. This allows conductive strand 80C to form an exposed outer layer of strand 80 in region 86, while remaining covered (e.g., insulated and/or shielded) in region 88. Conductive strands 80C may form electrodes and/or electrical connections with electrical components in regions 86.
The technique of swapping core strands and cover strands may be applied to strands with multiple core strands, as shown in the example of
Strand 80 may include core 32 and covering 30. In regions 102, non-conductive strand 80N may form covering 30 that twists around strands 80D and 80C of core 32. In other words, non-conductive strand 80N may be a covering strand in regions 102 and strands 80D and 80C may be core strands in regions 102.
In region 104, conductive strand 80C swaps places with non-conductive strand 80N. Non-conductive strand 80N moves from a covering location to a core location to become a core strand in core 32 in region 104. Conductive strand 80C moves from a core location to a covering location to become a covering strand in covering 30 in region 104. If desired, strands 80D may form part of covering 30 in other regions along the length of strand 80. This allows conductive strands such as strand 80C and/or other strands 80D to form an exposed outer layer of strand 80 in regions such as regions 104, while remaining covered (e.g., insulated and/or shielded) by non-conductive strand 80N in regions 102. Conductive strands 80C may form electrodes and/or electrical connections with electrical components in regions 104.
In the example of
Strand 80 may include core 32 and covering 30. In regions 94, non-conductive strand 80N may form covering 30 that twists around strands 80D and 80C of core 32. In other words, non-conductive strand 80N may be a covering strand in regions 94 and strands 80D and 80C may be core strands in regions 94.
In region 96, conductive strand 80C is pulled outside of non-conductive strand 80N while non-conductive strand 80N keeps twisting around core 32. Non-conductive strand 80N may be interposed between conductive strand 80C and core 32 in region 96. Conductive strand 80C moves from a core location to a location outside of covering 30 to form an exposed conductor on covering 30 in region 96. If desired, strands 80D may form exposed conductors on the outside covering 30 in other regions along the length of strand 80. This allows conductive strands such as strand 80C and/or other strands 80D to form an exposed outer layer of strand 80 in regions such as regions 96, while remaining covered (e.g., insulated and/or shielded) by non-conductive strand 80N in regions 94. Conductive strands 80C may form electrodes and/or electrical connections with electrical components in regions 96.
In the example of
Strand 80 may include core 32 and covering 30. In regions 94, non-conductive strand 80N may form covering 30 that twists around strands 80D, 80C-1, and 80C-2 of core 32. In other words, non-conductive strand 80N may be a covering strand in regions 94 and strands 80D, 80C-1, and 80C-2 may be core strands in regions 94.
In region 96-1, conductive strand 80C-1 is pulled outside of non-conductive strand 80N while non-conductive strand 80N keeps twisting around strands 80D and 80C-2 of core 32. Conductive strand 80C-1 moves from a core location to a location outside of covering 30 to form an exposed conductor on covering 30 in region 96-1.
In region 96-2, conductive strand 80C-2 is pulled outside of non-conductive strand 80N while non-conductive strand 80N keeps twisting around strands 80D and 80C-1 of core 32. Conductive strand 80C-2 moves from a core location to a location outside of covering 30 to form an exposed conductor on covering 30 in region 96-2.
If desired, strands 80D may form exposed conductors on the outside covering 30 in other regions along the length of strand 80. This allows conductive strands such as strand 80C and/or other strands 80D to form an exposed outer layer of strand 80 in regions such as regions 96-1 and 96-2, while remaining covered (e.g., insulated and/or shielded) by non-conductive strand 80N in regions 94. Conductive strands 80C-1 and 80C-2 may form electrodes and/or electrical connections with electrical components in regions 96-1 and 96-2.
Core 32 may be formed from one or more conductive strands such as conductive strand 80C. Covering 30 may be formed from strands 80D, which may be insulating or conductive. Using spreading tool 110 (e.g., first and second needles or other elongated members), covering 30 may be pulled in directions 112 to expose segment 114 of conductive strand 80C of core 32. While spreading tool 110 is separating covering 30 in directions 112, an electrical component such as component 26 (
The foregoing is merely illustrative and various modifications can be made by those skilled in the art without departing from the scope and spirit of the described embodiments. The foregoing embodiments may be implemented individually or in any combination.
This application claims the benefit of U.S. provisional patent application No. 63/512,477, filed Jul. 7, 2023, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | |
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63512477 | Jul 2023 | US |