Claims
- 1. A thermoformable multilayer structure comprising:
- a) a structural layer comprising a styrene based polymer;
- b) an adhesive layer comprising an adhesive copolymer whereby:
- i) about 40 to about 79 weight percent of the copolymer is derived from ethylene,
- ii) about 0.5 to about 30 weight percent of the copolymer is derived from carbon monoxide or sulfur dioxide,
- iii) about 20 to about 50 weight percent of the copolymer is derived from unsaturated carboxylic acid, unsaturated derivatives of carboxylic acids other than anhydrides or alkyl vinyl ethers, and
- iv) about 0.01 to about 5 weight percent of the copolymer is derived from a comonomer having pendant carboxylic acid anhydride functionality; and
- c) a barrier layer comprising a vinyl alcohol polymer, whereby the adhesive layer lies between the structural layer and the barrier layer.
- 2. The multilayer structure of claim 1 wherein the structural layer further comprises virgin styrene based polymer and recycled scrap styrene based polymer.
- 3. The multilayer structure of claim 2 wherein the structural layer comprises a composite structure of a first composite layer and a second composite layer, whereby the first composite layer comprises virgin styrene based polymer and the second composite layer comprises recycled scrap comprising a), b), and c) of claim 46, and whereby the adhesive layer binds the second composite layer to the barrier layer.
- 4. The multilayer structure of claim 1 wherein:
- about 10 to 14 weight percent of the adhesive copolymer is derived from carbon monoxide;
- about 27 to 40 weight percent of the adhesive copolymer is derived from alkyl acrylate of alkyl methacrylate; and
- about 0.1 to about 0.5 weight percent of the adhesive copolymer is derived from itaconic anhydride, maleic anhydride, or dimethyl maleic anhydride.
- 5. The multilayer structure of claim 1 wherein the amount of the adhesive copolymer is 1 to about 500 weight parts per hundred weights parts of vinyl alcohol polymer in the barrier layer and the thickness of the adhesive layer is 1 to 500% of the thickness of the barrier layer.
- 6. The multilayer structure of claim 5 wherein about 87 to 95 percent of the thickness of the structure is the structural layer.
BACKGROUND OF THE INVENTION
This application is a continuation-in-part of U.S. application Ser. No. 07,648,007, filed Jan. 30, 1991 is now abandoned, the disclosure of which is incorporated herein by reference.
US Referenced Citations (11)
Foreign Referenced Citations (4)
Number |
Date |
Country |
266994 |
May 1988 |
EPX |
369604 |
May 1990 |
EPX |
2-35291 |
Feb 1990 |
JPX |
WO8904348 |
May 1989 |
WOX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
648007 |
Jan 1991 |
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