Fabrication method and structure of an ITO anode containing nickel points for an OLED to selectively light

Abstract
A fabrication method of an indium tin oxide (ITO) anode containing point nickel for an organic light emitting diode (OLED) to selectively light includes various processes of preparing an ITO substrate with an anode having plural point grooves, of forming a nickel film on the anode, and of grinding the nickel film to leave the point grooves fitted with nickel. Therefore, the nickel spots of the ITO anode are lit up earlier than the pure ITO anode when the OLED is turn on. Because the nickel spots have a lower resistance, current can aggregate in these spots collectively, reducing demerit of cross-talk happening often in a conventional passive OLED panel circuit. The structure of the OLED includes an ITO substrate with an anode provided point grooves deposited with nickel, a hole transport layer on the anode, and an electron transport layer on the hole transport layer.
Description

BRIEF DESCRIPTION OF DRAWINGS

This invention is better understood by referring to the accompanying drawings, wherein:



FIG. 1 is an illustrating perspective view of a conventional multi-layer OLED device; and



FIG. 2 is a flow chart of a preferred embodiment of a fabrication method and a structure of an indium tin oxide (ITO) anode containing point nickel for an organic light emitting diode (OLED) to selectively light in the present invention.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A preferred embodiment of a fabrication method of an indium tin oxide (ITO) anode containing point nickel for an organic light emitting diode (OLED) to selectively light is shown in FIG. 2, a flow chart.


First of all, an ITO substrate provided with an anode surface is deposited with a pure ITO film via direct current magnetron sputtering. Next, the surface of the pure ITO film is created with plural cavities by standard optical lithography. Then a nickel film is deposited on the pure ITO film by RF magnetron sputtering. Finally, the nickel film is to be ground off entirely but those filled in the cavities, forming an ITO film with point nickel, employed as an anode layer of OLED device.


Of course, an ITO film containing point nickel and formed by the process mentioned above should further include at least a hole transport layer lying on the anode of the ITO substrate and an electron transport layer formed on the hole transport layer if applied for an OLED. But these processes are well known art used in the conventional OLED, not to be describes here.


It has been proved experimentally that the work function of the anode of the ITO film containing nickel points is higher than that of a traditional pure ITO film (approx. 4.6 eV). So far, the work function of the anode of the ITO film containing nickel points is as high as 5.0 eV, able to tremendously lessen a potential barrier between the anode of the ITO and the hole transport layer, reducing about 2.3V of threshold voltage and turn-on voltage of an OLED device, advancing a hole injection efficiency.


Therefore, because the turn-on voltage is dropped greatly, the nickel spots of the ITO anode are lit up earlier than the pure ITO anode when the OLED is turn on. That is so-called “selective lighting” for an OLED.


Moreover, because the nickel spots of the ITO anode have a lower resistance, current can aggregate in these spots collectively, able to reduce cross-talk happening often in a conventional passive OLED panel circuit.


In addition, the roughness of the ITO anode with or without nickel is improved owing to the employment of grounding, able to effectively reduce productivity of black pixel after having the OLED device driven, relatively lengthening the service life of the OLED.


The substrate mentioned previously can be replaced with glass, plastics and the like, as long as able to obtain the same or similar effects.


Next, the structure of an OLED that is provided with an ITO anode mingled with nickel spots to selectably light includes a substrate provided with an anode having plural nickel spots, a hole transport layer formed on the anode of the ITO substrate, and an electron transport layer formed on the hole transport layer.


While the preferred embodiment of the invention has been described above, it will be recognized and understood that various modifications may be made there in and the appended claims are intended to cover all such modifications that may fall within the spirit and scope of the invention.

Claims
  • 1. A method of fabricating an indium tin oxide (ITO) anode containing point nickel for an organic light emitting diode (OLED) to selectively light, said method comprising: a first process of preparing an ITO substrate provided with an anode;a second process of forming plural point grooves on said anode;a third process of depositing a nickel film on said anode with said point grooves; and.a fourth process of grinding said nickel film off said anode, leaving said point grooves fitted with nickel.
  • 2. A method of fabricating an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light as claimed in claim 1, wherein said ITO substrate is first deposited with an pure ITO film by direct current magnetron sputtering.
  • 3. A method of fabricating an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light as claimed in claim 1, wherein said point grooves of said ITO anode are formed by optical lithography.
  • 4. A method of fabricating an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light as claimed in claim 1, wherein said nickel film is deposited on said anode by RF magnetron sputtering.
  • 5. A method of fabricating an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light as claimed in claim 1, wherein said ITO substrate is controlled between 25˜200° C. during said RF magnetron spluttering process.
  • 6. A structure of an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light, said structure at least comprising: a substrate provided with an anode having plural point grooves for depositing nickel therein;a hole transport layer formed on said anode of said substrate; andan electron transport layer formed on said hole transport layer.
  • 7. A structure of an indium tin oxide (ITO) anode containing point nickel for an organic light emitting diode (OLED) to selectively light as claimed in claim 6, wherein said substrate is glass.
  • 8. A structure of an indium tin oxide (ITO) anode containing nickel points for an organic light emitting diode (OLED) to selectively light as claimed in claim 6, wherein said substrate is plastics.