Claims
- 1. A method for forming a coil-on-keeper assembly such that the coil-on-keeper assembly is used in a magnetic circuit to actuate a microactuator, the method comprising:
forming a keeper substrate; and fabricating an integrated coil-on-keeper assembly upon the keeper substrate.
- 2. A method for fabricating integrated coil-on-keeper assemblies such that each coil-on-keeper assembly is used in a magnetic circuit to actuate a microactuator wherein the magnetic circuit is comprised of the coil-on-keeper assembly that is stationary and a magnet located in the microactuator that moves, the method comprising:
forming a keeper substrate; forming a top insulator layer upon the keeper substrate with a plurality of vias; patterning a plurality of first coils on the keeper substrate with each coil-on-keeper assembly having at least one first coil layer within an assembly region defined by at least one via; forming a bottom insulator layer on the coil layer and the top insulator layer with a portion of the plurality of vias including at least one via defining each assembly region; forming a temporary support within the at least one via defining each assembly region to connect each assembly region during fabrication; patterning and etching the keeper substrate to form a top keeper for each coil-on-keeper assembly; and removing the temporary support and singulating each coil-on-keeper assembly.
- 3. The method of claim 2 wherein the first coil layer is a drive coil.
- 4. The method of claim 2 wherein the plurality of vias comprises a plurality of electrical vias for plating coil wires and a plurality of singulation vias for forming the temporary support.
- 5. The method of claim 2 wherein patterning the coils further comprises:
sputtering a seedlayer upon the top insulator layer and in the vias; patterning a first coil plate mold upon the seedlayer; plating the seedlayer to form the first coils; stripping the first coil plate mold; and etching away the remaining seedlayer.
- 6. The method of claim 2 and further comprising:
forming a middle insulator layer upon the first coils and the top insulator layer with a portion of the plurality of vias including the at least one via defining each assembly region; and patterning a plurality of second coils upon the middle insulator layer with each coil-on-keeper assembly having at least one second coil layer within each assembly region defined by the at least one via such that the coil layer becomes a first coil layer.
- 7. The method of claim 6 wherein the first coil layer is a sense coil and the second coil layer is a drive coil.
- 8. The method of claim 6 wherein patterning the second coils further comprises:
sputtering a seedlayer upon the middle insulator layer and in the vias; patterning a second coil plate mold upon the seedlayer; plating the seedlayer to form the second coils; stripping the second coil plate mold; and etching away the remaining seedlayer.
- 9. The method of claim 6 wherein patterning the first and second coils comprises using a damascene backfill and chemical mechanical planarization process.
- 10. The method of claim 2 wherein the temporary support is a sacrificial support membrane.
- 11. The method of claim 2 wherein the temporary support is a thermal release film.
- 12. The method of claim 2 wherein etching the keeper substrate further comprises exposing the coil layers in contact with the keeper substrate.
- 13. The method of claim 12, and further comprising:
providing electrical contacts to the exposed coil layers.
- 14. The method of claim 13 wherein providing the electrical contacts further comprises connecting a solder pad to each exposed coil layer.
- 15. The method of claim 13 wherein providing the electrical contacts further comprises forming a layer of gold between the keeper substrate and the top insulator layer.
- 16. The method of claim 2, and further comprising:
bonding the coil-on-keeper assembly to a top horizontal surface of the microactuator such that the top keeper of the coil-on-keeper assembly faces opposite the microactuator and there is a space between the magnet and the bottom insulator layer.
- 17. A disc drive having a disc rotatable about an axis, a slider carrying a transducing head for transducing data with a disc, and a dual-stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc, the dual-stage actuation assembly including a movable support structure and a microactuator, the microactuator comprising:
a stator connected to the support structure; a rotor supporting the slider, the rotor operatively connected to the stator such that the rotor is movable with respect to the stator in a first horizontal plane generally parallel to a surface of the disc; and a coil-on-keeper assembly for use in a magnetic circuit to actuate the microactuator, the coil-on-keeper assembly fabricated as an integrated assembly and bonded to the stator.
- 18. The microactuator of claim 17 wherein the coil-on-keeper assembly comprises a top keeper, at least one coil layer and at least two insulator layers vertically arranged in a plurality of planes generally parallel to the first horizontal plane, the coil layer and the insulator layers being formed and patterned upon the top keeper.
- 19. The microactuator of claim 18 wherein the coil-on-keeper assembly comprises the top keeper, a top insulator, a drive coil, a middle insulator, a sense coil and a bottom insulator.
- 20. The microactuator of claim 18 wherein the magnetic circuit comprises the coil-on-keeper assembly and at least one magnet disposed in the rotor, the magnets being operable in response to a current applied to the coil layer to cause movement of the rotor with respect to the stator in the first horizontal plane.
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims priority from Provisional Application No. 60/209,016, filed Jun. 1, 2000 for “Fabrication Method for Integrated Microactuator Coils” by Roger L. Hipwell, Jr., Wayne A. Bonin, Lee Walter, Barry D. Wissman, Zine-Eddine Boutaghou, Barbara J. Ihlow-Mahrer, Peter Crane, and Brian Dufrene.
Provisional Applications (1)
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Number |
Date |
Country |
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60209016 |
Jun 2000 |
US |