Claims
- 1. A method of fabricating a component having improved properties, comprising the steps of:
a) providing a substrate having a surface; and b) depositing a layer of a material onto at least a portion of the surface of the substrate using a laser-assisted direct metal deposition process, wherein, compared to the substrate, the layer of material exhibits:
improved resistance to wear, corrosion, or oxidation, improved thermal conduction, greater density, or a different phase.
- 2. The method of claim 1, wherein the material of the layer is specifically chosen to promote a phase which is different from that of the substrate.
- 3. The method of claim 1, further including the step of using non-equilibrium synthesis to dissolve a low-solubility material into the layer of material to increase its hardness.
- 4. The method of claim 1, wherein the step of providing a substrate having a surface includes the step of using direct metal deposition to build the substrate on an incremental basis.
- 5. The method of claim 1, wherein the substrate and layer comprise a die, mold or other tool.
- 6. The method of claim 1, further including the step of applying the layer of material using a robotic, closed-loop DMD arrangement.
- 7. A method of fabricating a component having improved properties, comprising the steps of:
a) providing a computer-aided design (CAD) description of the component to be fabricated; b) using a laser-assisted, direct metal deposition (DMD) process in accordance with the CAD description to substantially fabricate the component having an outer surface; and c) depositing a layer of a material having a desired characteristic onto at least a portion of the surface of the component, also using a laser-assisted direct metal deposition process.
- 8. The method of claim 7, wherein the layer of material exhibits improved wear resistance relative to the component.
- 9. The method of claim 7, wherein the layer of material is more thermally conductive than the component itself.
- 10. The method of claim 7, wherein the layer of material is more thermally conductive than the component itself.
- 11. The method of claim 7, wherein the layer of material has a density greater than that of the component itself.
- 12. The method of claim 7, wherein the layer of material is more resistant to corrosion than the component itself.
- 13. The method of claim 7, wherein the layer of material is more resistant to oxidation than the component itself.
- 14. The method of claim 7, wherein the layer of material has a phase which is different from that of the component itself.
- 15. The method of claim 14, further including the step of choosing the material of the layer to promote a phase which is different from that of the substrate.
- 16. The method of claim 7, further including the step of using non-equilibrium synthesis to dissolve low a solubility material into the layer of material to increase hardness.
- 17. The method of claim 7, wherein the component is a die, mold or other tool.
- 18. The method of claim 7, further including the step of applying the layer of material using a robotic closed-loop DMD arrangement.
- 19. The method of claim 7, further including the step of incorporating one or more conformal cooling channels within the component during its fabrication.
- 20. The method of claim 7, further including the step of incorporating one or more conductive heat sinks or thermal barriers during its fabrication.
REFERENCE TO RELATED APPLICATION
[0001] This application claims priority from U.S. provisional patent application Serial No. 60/221,251, filed Jul. 27, 2000, the entire contents of which are incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60221251 |
Jul 2000 |
US |