Claims
- 1. A method of fabricating a laminate structure, comprising the steps of:a) depositing a layer of a thermal barrier material onto a substrate using a laser-assisted direct metal deposition process, b) depositing a layer of a thermally conductive material onto the layer of the thermal barrier material, also using a laser-assisted direct metal deposition process; and c) repeating steps a) and b), in sequence, to create a laminate structure having alternating layers of the thermal barrier and thermally conductive materials.
- 2. The method of claim 1, wherein the thermal barrier material is a steel.
- 3. The method of claim 2, wherein the steel is a tool steel.
- 4. The method of claim 1, wherein the thermally conductive material contains copper.
- 5. The method of claim 1, wherein the thermally conductive material is elemental copper.
- 6. The method of claim 1, wherein the ratio of the thermal barrier material to the thermally conductive material is from 2:1 to 4:1.
- 7. The method of claim 1, further including the step of depositing a bond coat material layer between the thermal barrier and thermally conductive material layers.
- 8. The method of claim 7, wherein the bond coat material is a nickel alloy.
- 9. The method of claim 1, wherein the laminate structure forms part of a die or mold.
- 10. The method of claim 9, further including the step of forming one or more cooling channels though the die or mold.
- 11. The method of claim 10, wherein the cooling channels are formed by drilling.
- 12. The method of claim 10, wherein the cooling channels are formed by removing sacrificial material deposited using the same process used to fabricate the laminate structure.
- 13. The method of claim 10, wherein the cooling channels are transversely oriented with respect to the alternating layers of the laminate structure.
Parent Case Info
REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of U.S. patent application Ser. No. 09/570,986, filed May 15, 2000, which is a continuation-in-part of U.S. patent application Ser. No. 09/107,912, filed Jun. 30, 1998, now U.S. Pat. No. 6,122,564, and also claims priority from U.S. provisional application Ser. No. 60/156,202, filed Sep. 27, 1999, the entire contents of all of which are incorporated herein by reference.
US Referenced Citations (9)
Provisional Applications (1)
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Number |
Date |
Country |
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60/156202 |
Sep 1999 |
US |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
09/570986 |
May 2000 |
US |
Child |
09/670670 |
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US |
Parent |
09/107912 |
Jun 1998 |
US |
Child |
09/570986 |
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US |