Claims
- 1. A method for correcting the figure of a substrate, comprising:
measuring the figure of a surface of said substrate; applying a figure-correcting layer to a surface of said substrate; locally adjusting the thickness of said figure-correcting layer; and measuring the thickness of said figure-correcting layer.
- 2. The method of claim 1, further comprising iterating between the steps of locally adjusting the thickness of said figure-correcting layer and measuring the thickness of said figure-correcting layer until a desired figure is obtained.
- 3. The method of claim 1, wherein said figure-correcting layer comprises an index of refraction that is nearly the same as the index of refraction of said substrate.
- 4. The method of claim 3, further comprising applying a marker layer to said substrate before applying said figure-correcting layer, wherein said marker layer is located between said substrate and said figure-correcting layer.
- 5. The method of claim 1, wherein the step of measuring the figure of said substrate is carried out with a phase shifting diffraction interferometer.
- 6. The method of claim 1, wherein the thickness of said figure-correcting layer is known.
- 7. The method of claim 1, wherein said figure-correcting layer comprises an index of refraction that is different from the index of refraction of said substrate.
- 8. The method of claim 1, wherein said figure-correcting layer comprises an optical material having embedded material selected from the group consisting of A l, Cr, Co, Ni, Ti, Mo, and Si.
- 9. The method of claim 1, wherein the step of locally adjusting the thickness of said figure-correcting layer is carried out with a beam selected from the group consisting of an electron beam, an ion beam and an electromagnetic beam.
- 10. The method of claim 9, wherein said electromagnetic beam comprises light selected from the group consisting of visible light, ultraviolet light, infrared light and x-ray light.
- 11. The method of claim 1, wherein the step of measuring the thickness of said figure-correcting layer is carried out with an optical method selected from the group consisting of interferometry and reflectance spectroscopy.
- 12. The method of claim 1, wherein the step of measuring the thickness of said figure-correcting layer is carried out with fluorescence.
- 13. The method of claim 1, wherein the step of measuring the thickness of said figure-correcting layer is carried out with ultrasound.
- 14. The method of claim 1, further comprising comparing said thickness of said figure-correcting layer to said figure of said surface of said substrate to determine the figure of the substrate in combination with said figure-correcting layer.
- 15. The method of claim 1, wherein the step of locally adjusting the thickness of said figure-correcting layer comprises adding material to said figure-adjusting layer.
- 16. The method of claim 1, wherein the step of locally adjusting the thickness of said figure-correcting layer comprises removing material from said figure-adjusting layer.
- 17. The method of claim 1, wherein the step of locally adjusting the thickness of said figure-correcting layer comprises adding material to said figure-correcting layer and removing material from said figure-correcting layer.
- 18. The method of claim 1, wherein the step of locally adjusting the thickness of said figure-correcting layer is carried out with a polishing tool.
- 19. The method of claim 1, wherein the step of measuring the thickness of said figure-correcting layer is carried out at a plurality of points simultaneously.
- 20. The method of claim 19, wherein the step of measuring the thickness of said figure-correcting layer at a plurality of points simultaneously is carried out with a two-dimensional detector.
- 21. The method of claim 1, wherein the step of measuring the figure of said surface of said substrate is carried out prior to the step of applying a figure-correcting layer to a surface of said substrate.
- 22. The method of claim 1, wherein the step of measuring the figure of said surface of said substrate is carried out after the step applying a figure-correcting layer to a surface of said substrate.
- 23. A method for correcting the figure of a substrate, comprising:
applying a figure-correcting layer and an interface to a surface of said substrate, wherein said interface is between said substrate and said figure-correcting layer; and locally adjusting the thickness of said figure-correcting layer to produce a desired surface figure.
- 24. The method of claim 23, further comprising measuring the figure of said substrate either before or after the step of applying a figure-correcting layer.
- 25. The method of claim 24, further comprising measuring the thickness of said figure-correcting layer.
- 26. The method of claim 25, further comprising iterating between the steps of locally adjusting the thickness of said figure-correcting layer and measuring the thickness of said figure-correcting layer until a desired figure is obtained.
- 27. The method of claim 23, wherein said figure-correcting layer comprises an index of refraction that is nearly the same as the index of refraction of said substrate, wherein said interface comprises a marker layer.
- 28. The method of claim 23, wherein said figure-correcting layer comprises an index of refraction that is different from the index of refraction of said substrate.
- 29. The method of claim 23, wherein the step of locally adjusting the thickness of said figure-correcting layer is carried out with a beam selected from the group consisting of an electron beam, an ion beam and an electromagnetic beam.
- 30. The method of claim 25, wherein the step of measuring the thickness of said figure-correcting layer is carried out with an optical method selected from the group consisting of interferometry, optical reflectance spectroscopy, ultrasound reflectance spectroscopy and fluorescence measurement.
- 31. The method of claim 23, further comprising comparing said thickness of said figure-correcting layer to said figure of said surface of said substrate to determine the figure of the substrate in combination with said figure-correcting layer.
- 32. The method of claim 23, wherein the step of locally adjusting the thickness of said figure-correcting layer is carried out with a step selected from the group consisting of adding material to said figure-adjusting layer, removing material from said figure-adjusting layer and a combination of adding material to said figure-correcting layer and removing material from said figure-correcting layer.
Government Interests
[0001] The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.