Fabrication of three dimensional structures by in-flight curing of aerosols

Information

  • Patent Grant
  • 10994473
  • Patent Number
    10,994,473
  • Date Filed
    Wednesday, February 10, 2016
    8 years ago
  • Date Issued
    Tuesday, May 4, 2021
    3 years ago
  • Inventors
  • Original Assignees
  • Examiners
    • Del Sole; Joseph S
    • Cummins, IV; Manley L
    Agents
    • Peacock Law P.C.
    • Askenazy; Philip D.
Abstract
A method for fabricating three-dimensional structures. In-flight heating or UV illumination modifies the properties of aerosol droplets as they are jetted onto a target surface. The UV light at least partially cures photopolymer droplets, or alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, and the resulting increased viscosity of the aerosol droplets facilitates the formation of free standing three-dimensional structures. This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials. The resulting 3D shapes can be free standing, fabricated without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate.
Description
BACKGROUND OF THE INVENTION

Field of the Invention (Technical Field)


The present invention is related to the fabrication of 3D electrical and mechanical structures, microstructures, and nanostructures by in-flight curing of aerosol jetted nanoparticle and polymeric inks.


Background Art


Note that the following discussion may refer to a number of publications and references. Discussion of such publications herein is given for more complete background of the scientific principles and is not to be construed as an admission that such publications are prior art for patentability determination purposes.


Three-dimensional printing is a rapidly evolving technology which promises to revolutionize additive manufacturing. With 3D printing, various structural materials such as plastics and metals can be fabricated into net-shaped structures without the need for subtractive machining or etching steps. There is little materials waste and the reduced processing steps promise to make 3D printing a cost-effective, green technology. Several 3D printing technologies are currently available today and it is useful to briefly compare these technologies to the current invention.


Stereolithography is an additive manufacturing process that works by focusing an ultraviolet (UV) laser on to a vat of photopolymer resin. With the help of computer aided manufacturing or computer aided design (CAM/CAD) software, the UV laser is used to draw a pre-programmed design or shape on to the surface of the photopolymer vat. Because photopolymers are photosensitive under ultraviolet light, the irradiated resin is solidified and forms a single layer of the desired 3D object. This process is repeated for each layer of the design until the 3D object is complete. Layer resolution of 50-150 um is typically with lateral dimension approaching 10 um. The process is generally limited to photopolymer materials and sacrificial structures are required to support overhangs.


Ink jet technologies are typically used to print graphitic and pigmented inks in 2D. Recent materials innovations enable ink jet printers to jet polymeric and metal nanoparticle inks. Generally the inks used in ink jet printing must have relatively low viscosity, meaning the inks will spread substantially after printing, thus limiting the minimum feature size and aspect ratio of the printed features. The ink jetter does not contact the substrate, but it is in close proximity (less than mm).


Extrusion technologies are popular for 3D printing of thermoplastic polymers. In this case, a thermal plastic is heated to the melting point in a nozzle and extruded onto a substrate. The plastic rapidly cools and solidifies on contacting the substrate, and a three-dimensional shape can be maintained. 3D parts are typically fabricated layer wise, with each layer consisting of a raster pattern of extruded filament. Overhangs can be fabricated by extruding a sacrificial support material and later dissolving or mechanically removing the support structure. Typically feature sizes are hundreds of microns, and materials are largely limited to thermoplastics and a few thermoset polymers, as well as conductive pastes. The nScrypt tool is capable of printing on 3D surfaces by robotic CAD/CAM control of the nozzle positioning.


SUMMARY OF THE INVENTION (DISCLOSURE OF THE INVENTION)

The present invention is a method for fabricating a three-dimensional structure on a substrate, the method comprising propelling aerosol droplets from a deposition head toward the substrate, partially modifying a property of the aerosol droplets in-flight, and fully modifying the property of the aerosol droplets once they have been deposited as part of the three-dimensional structure. Modifying a property optionally comprises curing, for example ultraviolet (UV) light curing, or solidifying using electromagnetic radiation. In this embodiment aerosol droplets preferably comprise a photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer. The aerosol droplets optionally comprise solid particles dispersed in the photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer comprising embedded solid particles. The solid particles optionally comprise a ceramic, a metal, a fiber, or silicon. In another embodiment, the aerosol droplets comprise a solvent and modifying a property comprises evaporating the solvent. These aerosol droplets optionally comprise metal nanoparticles, in which case the method preferably further comprises irradiating the aerosol droplets with UV radiation, heating the metal nanoparticles, and heating the aerosol droplets sufficiently to at least partially evaporate the solvent. The method preferably further comprises continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.


The method optionally comprises tilting or translating the deposition head with respect to the substrate. The method optionally comprises fabricating an overhanging structure without requiring a sacrificial support or tilting the deposition head or the substrate. The standoff distance between the deposition head and the substrate is preferably at least 1 mm, and more preferably at least 2 mm. The method preferably comprises increasing the viscosity of the aerosol droplets in-flight, and preferably comprises irradiating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited, optionally from more than one direction in-flight. The method optionally comprises heating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited. The fabricated three-dimensional structure optionally comprises a structure selected from the group consisting of a micron-scale surface texture, a mechanical interposer, a precision spacer, a mechanical interposer comprising embedded electrical connectors, an enclosed, hollow structure, a mechanical scaffold, and a functional electrical wire.


Objects, advantages and novel features, and further scope of applicability of the present invention will be set forth in part in the detailed description to follow, taken in conjunction with the accompanying drawings, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated into and form a part of the specification, illustrate several embodiments of the present invention and, together with the description, serve to explain the principles of the invention. The drawings are only for the purpose of illustrating a preferred embodiment of the invention and are not to be construed as limiting the invention. In the drawings:



FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets.



FIGS. 2A-2C are images of an array of polymer posts printed according to an embodiment of the present invention. FIG. 2D is a graph showing the post build rate.



FIG. 3 is an image of an array of composite posts.



FIGS. 4A and 4B are perspective and top views, respectively, of an interposer printed in accordance with an embodiment of the present invention.



FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1. FIG. 5B shows an open cone structure.



FIGS. 6A and 6B show a closed channel having an open interior along the length. FIG. 6C shows ink flowing on the inside of the channel.



FIGS. 7A and 7B show an individual antenna and an array of antennas, respectively, having an L-shape printed post. FIGS. 7C and 7D are images of 3D electrical components printed on a microchip.



FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing. FIG. 8B shows the springs supporting a mass.



FIG. 9A is a graph showing the optical density of silver nanoparticles. FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method.



FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing.





DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The present invention is a method of making three-dimensional structures, such as structures comprising high aspect ratio features, using in-flight curing of aerosols and inks, and direct printing of liquid materials to fabricate three-dimensional, free standing, complex structures. Specifically, embodiments of the present invention combine patented Aerosol Jet dispensing technology, such as that described in U.S. Pat. Nos. 7,674,671, 7,938,079, and 7,987,813, with an in-flight materials processing mechanism that enables liquid droplets to partially solidify before depositing on a surface. After the in-flight processing, the droplets can be deposited to form free standing structures. Some of the advantages of this approach include ultra-high resolution three-dimensional (3D) printing, with features sizes down to 10 microns, lateral feature resolution to 1 micron, and vertical resolution to 100 nm. The aspect ratio of the free standing structures can be more than 100, and the structures can be printed on nearly any surface and surface geometry by manipulating the tilt and location of the print head relative to those surfaces. Overhangs and closed cells can be printed directly, without using sacrificial support materials. Both metal and insulating materials can be processed, which enables the co-deposition of electronic materials for fabricating circuits in 3D. Furthermore, composite materials can be printed, which allow for the tailoring of the mechanical and electrical properties of the 3D structures. Ultraviolet (UV) polymers can be cured in-flight as they are impacting on the target, and low sintering temperatures enable metallization of plastics. Using an Aerosol Jet process, practically any type of material and/or solvent can be printed. The large standoff from the substrate (typically a few millimeters) for this process enables high aspect printing without any z-axis motion. Sub-10 micron focusing of the aerosol jet enables creation of ultrafine features.


Aerosol Jet printing is a non-contact, aerosol-based jetting technology. The starting inks are formulated with low viscosity (0.5 to 1000 cP) and in the typical process they are first aerosolized into a fine droplet dispersion of 1-5 um diameter droplets. Preferably nitrogen gas entrains the droplets and propels them through a fine nozzle (0.1-1 mm inner diameter) to a target substrate for deposition. A co-flowing, preferably nitrogen sheath gas focuses the droplet jet down to a 10 um diameter, which allows features of this size to be printed. The jetting technology is notable for the large standoff distance between the nozzle and substrate (several mm), the fine resolution (feature width 10 um), volumetric dispense accuracy (10 femptoliter), and wide range of material compatibility. Because of the large standoff distance, it is possible to dry and/or otherwise cure the droplets during their flight to the substrate. In doing so, the viscosity of the droplets can be increased much beyond the starting viscosity. With higher viscosity, the printed inks are self supporting and can be built up into free standing columns and other high aspect ratio features. In order to increase the viscosity, UV light from either a lamp or a UV LED is preferably applied to the interstitial region between the nozzle exit and the target substrate, as shown in FIG. 1. If the starting ink comprises a photopolymer with an absorption band overlapping the UV emission spectrum, the UV light can either fully or partially cure the photopolymer droplet in-flight, thereby increasing the viscosity.



FIG. 1 is a schematic illustrating a mechanism for three-dimensional printing with aerosol jets. Micro 3D structures are manufactured preferably by using Aerosol Jet compatible low viscosity photocurable resins, which are preferably printed using Aerosol Jet technology. Electromagnetic radiation, in this case ultraviolet light, illuminates and partially cures the droplets mid-flight. The partial curing increases the viscosity of the droplets, which in turn limits the spreading of the deposit on the substrate. The droplets coalesce on the target substrate and then fully cure. The top schematic shows the droplets stacking vertically. The lower schematic shows the droplets building an overhang structure as the substrate is translated beneath the print head. Up to 45 degree overhangs have been demonstrated, although even greater angles may be achieved.



FIG. 2A is a photograph of vertical polymer posts printed with Loctite 3104 acrylic urethane and simultaneous UV LED curing. The incident UV power was 0.65 mW, the UV wavelength was 385 nm and volumetric print rate was 7.5 nL/s. The posts can extend from the target substrate substantially to the aerosol jet nozzle outlet. FIG. 2B is a magnified image of the post array; the post height is 1.0 mm, the height variation is 1%, the spacing is 0.5 mm, and diameter is 90 μm. FIG. 2C is an image of the top surface of the post array. The top of each post has a rounded, nearly hemispherical shape. FIG. 2D is a graph showing the measured build rate of a single post. The post height was found to be proportional to time when the print nozzle was stationary at a given location. The variation in height is approximately 1%, or alternatively approximately 10 μm for a 1.0 mm tall post.


In-flight processing is also possible when solid particles, such as ceramics, metals, or fibers, are dispersed in the photopolymer ink. In this case, the cured photopolymer serves as a 3D mechanical support for the solid particles. The mechanical and electrical properties of this composite material can be optimized by, for example, providing wear and abrasion resistance, as well as forming 3D electrical conductors. FIG. 3 is an image of an array of composite posts. Silicon powder, having a particle size of less than 500 nm, was dispersed in a UV photopolymer resin at a concentration of 7% by volume. The composite dispersion was then printed and cured in-flight to produce solid posts of cured resin with embedded silicon. The post diameter is 120 μm and the height is 1.1 mm. Composite materials are desirable for optimizing mechanical and electrical properties of a 3D structure. In this example the composition material is sufficiently transparent to the UV light that it is fully cured, even with single sided UV illumination. At greater concentrations and with highly absorbing particles, the composite resin may be opaque to the incident light. In that case, it may be necessary to illuminate the printing area from opposite sides, or illuminate the deposit with a ring lamp. As long as the UV resin is curing near the outer surface of the 3D structure, sufficient mechanical support will allow the structure to build vertically. The photopolymer can optionally be removed in a post-processing step, such as by heating the 3D structure to beyond the evaporation or decomposition point of the photopolymer.



FIG. 4 shows images of a printed mechanical interposer, which is an element that provides structural support and precision spacing between two separated components. The interposer was printed by stacking multiple layers of UV resin, as can be seen in the perspective view of FIG. 4A. FIG. 4B shows the top surface grid pattern. In some embodiments an interposer can provide electrical or fluidic routing between one element or connection to another, in which case the interstitial spaces could be filled with conductive material or fluids.



FIG. 5A shows three-dimensional jack-like structures printed using the offset approach shown in FIG. 1. The lower 4 legs were printed while translating the print head in x- and y-directions to a vertex point. The angled post is at an approximate 45 degree angle with respect to the substrate. The top legs were printed by translating the print head away from the vertex. The overall height is 4 mm and the individual post diameters are 60 μm. FIG. 5B shows an open cone structure. This was printed by translating the stage in a repeating circular motion with increasing radius. If desired the cone could be closed by continuing the circular motion and decreasing the radius to zero.



FIGS. 6A and 6B show a closed channel having an open interior along the length. Each sidewall of the channel was printed by stacking lines of photocurable polymer and sequentially offsetting by approximately ½ of a linewidth. This process resulted in a wall tilted at approximately 45 degrees in the direction of the offset. By offsetting in opposite directions, the walls touch at the midpoint. FIG. 6C depicts a drop of pigmented ink placed near the entrance to a channel, which is seen to be pulled through the channel by surface tension forces. This demonstrates that the channel is enclosed along the length but the channel is completely open from end to end.



FIG. 7A shows a photocured post used as a mechanical support for an electrical component. The polymer post was fabricated using the process in FIG. 1 and it is approximately 1 mm tall by 0.1 mm wide. Silver ink was printed on the sidewall of the post and substrate by tilting the print head at 45 degrees with respect to each. The silver ink has low viscosity during printing and consequently will spread slightly on the substrate. By providing a mechanical support, the silver ink can be printed in three dimensions along the surface of the support. After printing, the silver ink was thermally sintered in a box oven at 150° C. for 60 minutes. The resulting conductive pattern serves as a freestanding, millimeter wave dipole antenna. FIG. 7B shows an array of micro-antennas. FIGS. 7C and 7D are images of 3D electrical components printed on a microchip. The process of the present invention eliminates complicated connections and waveguides that would otherwise have to be built into a package. This example shows that functional devices such as 3D electrical components (for example, heaters, antenna, and interconnects) can be printed directly on a driver chip.



FIG. 8A shows freestanding polymer springs fabricated by tilting the print head during printing. The print head was tilted from 0° to −30° and back to 0° during build of each spring. FIG. 8B depicts a demonstration showing that the spring array can support a mechanical mass. In contrast to the vertical posts described previously, the springs provide a flexible interposer connection between two surfaces.


In the case of solvent based inks, such as metal nanoparticle dispersions, the droplet viscosity can be increased by partially or fully drying the droplet during flight. Since metal nanoparticles are known to be highly absorbing to UV light, exposing the droplets to UV illumination will heat the nanoparticles and accelerate the solvent evaporation. FIG. 9 shows such an extension of the in-situ curing process to non-photocurable materials. FIG. 9A is a graph showing the increasing optical density (i.e. absorption spectra) of silver nanoparticles at UV wavelengths as the particle size decreases. The curves are strongly peaked around 410 nm, but the absorption edge extends into the visible, making the in-flight processing possible with common UV LED and Hg lamps. Ink droplets comprising silver nanoparticles dispersed in a solvent can thus be heated by absorbing UV light at wavelengths near 400 nm. If heated in-flight, the solvent will largely evaporate and result in a highly concentrated silver drop when it impacts on a surface. The metal nanoparticle droplets can retain their 3D shape, both because the carrier solvent is evaporated and also because the particles are partially sintered. The now higher viscosity silver droplets can be stacked in 3D, similar to the stacking of the photopolymer. Further illumination after printing, which heats the nanoparticles beyond the level required for evaporating the solvent, will cause the nanoparticles to at least partially sinter and become conductive. FIG. 9B shows a 3D silver wire array printed with the in-situ illumination method. The wire width is 40 μm and the height is 0.8 mm. The wires are slightly bent due to the fact that only single sided illumination was used, which causes the wires to be heated more on the illumination side, leading to asymmetrical shrinkage.



FIGS. 10A-10F are images of various 3D shapes printed using UV polymers and on-the-fly curing. FIG. 10A shows pillars (0.1 mm pitch, 0.25 mm tall). FIG. 10B shows a twisted sheet (0.5 mm width, 2 mm tall). FIG. 10C shows a box (1 mm length, 0.25 mm tall, 0.03 mm wall). FIG. 10D shows a hat (0.5 mm diameter, 0.5 mm tall). FIG. 10E shows a cone (0.5 mm diameter, 0.5 mm tall). FIG. 10F shows a bubble (0.5 mm diameter, 1 mm tall).


In embodiments of the present invention, UV illumination is being used to modify the properties of aerosol droplets as they are jetted onto a target surface. Specifically, the UV light is at least partially curing photopolymer droplets, and the resulting increased viscosity facilitates the formation of free standing structures. The UV light alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, likewise enabling 3D fabrication. This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials. The resulting 3D shapes can be free standing, without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate. The feature size is primarily determined by the jetting process, and can go down to 10 μm or even lower.


Although the invention has been described in detail with particular reference to the disclosed embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover all such modifications and equivalents. The entire disclosures of all patents and publications cited above are hereby incorporated by reference.

Claims
  • 1. A method for fabricating a three-dimensional structure on a substrate, the method comprising: surrounding aerosol droplets with a sheath gas;propelling the aerosol droplets and the sheath gas from a deposition head toward the substrate;partially curing or solidifying the aerosol droplets in flight by irradiating them with UV light;fully curing or solidifying the aerosol droplets by irradiating them with UV light once they have been deposited as part of the three-dimensional structure; andfabricating a three-dimensional structure, a portion of which is vertically above empty space, without requiring a sacrificial support.
  • 2. The method of claim 1 wherein the aerosol droplets comprise a UV photocurable polymer, and the fabricated three-dimensional structure comprises the UV cured photocurable polymer.
  • 3. The method of claim 2 wherein the aerosol droplets comprise solid particles dispersed in the UV photocurable polymer, and the fabricated three-dimensional structure comprises the cured polymer comprising embedded solid particles.
  • 4. The method of claim 3 wherein the solid particles comprise a ceramic, a metal, a fiber, or silicon.
  • 5. The method of claim 1 wherein the aerosol droplets comprise metal nanoparticles, the method further comprising: irradiating the aerosol droplets with the UV light;heating the metal nanoparticles; andheating the aerosol droplets sufficiently to at least partially evaporate a solvent.
  • 6. The method of claim 5 further comprising continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.
  • 7. The method of claim 1 further comprising tilting or translating the deposition head with respect to the substrate.
  • 8. The method of claim 1 comprising fabricating an overhanging structure without tilting the deposition head or the substrate.
  • 9. The method of claim 1 wherein a standoff distance between the deposition head and the substrate is at least 1 mm.
  • 10. The method of claim 9 wherein the standoff distance between the deposition head and the substrate is at least 2 mm.
  • 11. The method of claim 1 comprising wherein partially curing or solidifying the aerosol droplets in flight increases a viscosity of the aerosol droplets.
  • 12. The method of claim 1 comprising irradiating the aerosol droplets with UV light from more than one direction in flight.
  • 13. The method of claim 1 comprising heating the aerosol droplets with UV light in flight and after the aerosol droplets have been deposited.
  • 14. The method of claim 1 wherein the fabricated three-dimensional structure comprises an enclosed, hollow structure, an overhanging structure, or a mechanical scaffold.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of the filing of U.S. Provisional Patent Application Ser. No. 62/114,354, entitled “MICRO 3D PRINTING”, filed on Feb. 10, 2015, and the specification and claims thereof are incorporated herein by reference.

US Referenced Citations (364)
Number Name Date Kind
3474971 Goodrich Oct 1969 A
3590477 Cheroff et al. Jul 1971 A
3642202 Angelo Feb 1972 A
3715785 Brown et al. Feb 1973 A
3777983 Hibbins Dec 1973 A
3808550 Ashkin Mar 1974 A
3808432 Ashkin Apr 1974 A
3816025 O'Neill Jun 1974 A
3846661 Brown et al. Nov 1974 A
3854321 Dahneke Dec 1974 A
3901798 Peterson Aug 1975 A
3959798 Hochberg et al. May 1976 A
3974769 Hochberg et al. Aug 1976 A
3982251 Hochberg Sep 1976 A
4004733 Law Jan 1977 A
4016417 Benton Apr 1977 A
4019188 Hochberg et al. Apr 1977 A
4034025 Martner Jul 1977 A
4036434 Anderson et al. Jul 1977 A
4046073 Mitchell et al. Sep 1977 A
4046074 Hochberg et al. Sep 1977 A
4073436 Behr Feb 1978 A
4092535 Ashkin et al. May 1978 A
4112437 Mir et al. Sep 1978 A
4132894 Yule Jan 1979 A
4171096 Welsh et al. Oct 1979 A
4200669 Schaefer et al. Apr 1980 A
4228440 Horike et al. Oct 1980 A
4235563 Hine et al. Nov 1980 A
4269868 Livsey May 1981 A
4323756 Brown et al. Apr 1982 A
4400408 Asano et al. Aug 1983 A
4453803 Hidaka et al. Jun 1984 A
4485387 Drumheller Nov 1984 A
4497692 Gelchinski et al. Feb 1985 A
4601921 Lee Jul 1986 A
4605574 Yonehara et al. Aug 1986 A
4670135 Marple et al. Jun 1987 A
4685563 Cohen et al. Aug 1987 A
4689052 Ogren et al. Aug 1987 A
4694136 Kasner et al. Sep 1987 A
4724299 Hammeke Feb 1988 A
4733018 Prabhu et al. Mar 1988 A
4823009 Biemann et al. Apr 1989 A
4825299 Okada et al. Apr 1989 A
4826583 Biernaux et al. May 1989 A
4893886 Ashkin et al. Jan 1990 A
4895735 Cook Jan 1990 A
4904621 Loewenstein et al. Feb 1990 A
4911365 Thiel et al. Mar 1990 A
4917830 Ortiz et al. Apr 1990 A
4920254 Decamp et al. Apr 1990 A
4927992 Whitlow et al. May 1990 A
4947463 Matsuda et al. Aug 1990 A
4971251 Dobrick et al. Nov 1990 A
4978067 Berger et al. Dec 1990 A
4997809 Gupta Mar 1991 A
5032850 Andeen et al. Jul 1991 A
5038014 Pratt et al. Aug 1991 A
5043548 Whitney et al. Aug 1991 A
5064685 Kestenbaum et al. Nov 1991 A
5126102 Takahashi et al. Jun 1992 A
5152462 Evans Oct 1992 A
5164535 Leasure Nov 1992 A
5170890 Wilson et al. Dec 1992 A
5173220 Reiff et al. Dec 1992 A
5176328 Alexander Jan 1993 A
5176744 Muller Jan 1993 A
5182430 Lagain Jan 1993 A
5194297 Scheer et al. Mar 1993 A
5208431 Uchiyama et al. May 1993 A
5245404 Jannson et al. Sep 1993 A
5250383 Naruse Oct 1993 A
5254832 Gartner et al. Oct 1993 A
5270542 McMurry et al. Dec 1993 A
5292418 Morita et al. Mar 1994 A
5294459 Hogan et al. Mar 1994 A
5306447 Harris et al. Apr 1994 A
5322221 Anderson Jun 1994 A
5335000 Stevens Aug 1994 A
5343434 Noguchi Aug 1994 A
5344676 Kim et al. Sep 1994 A
5359172 Kozak et al. Oct 1994 A
5366559 Periasamy Nov 1994 A
5378505 Kubota et al. Jan 1995 A
5378508 Castro et al. Jan 1995 A
5393613 Mackay Feb 1995 A
5398193 Deangelis Mar 1995 A
5403617 Haaland Apr 1995 A
5405660 Psiuk et al. Apr 1995 A
5418350 Freneaux et al. May 1995 A
5449536 Funkhouser Sep 1995 A
5472143 Bartels Dec 1995 A
5477026 Buongiorno Dec 1995 A
5486676 Aleshin Jan 1996 A
5491317 Pirl Feb 1996 A
5495105 Nishimura et al. Feb 1996 A
5512745 Finer et al. Apr 1996 A
5518680 Cima et al. May 1996 A
5524828 Raterman et al. Jun 1996 A
5529634 Miyata et al. Jun 1996 A
5547094 Bartels et al. Aug 1996 A
5578227 Rabinovich Nov 1996 A
5607730 Ranalli Mar 1997 A
5609921 Gitzhofer et al. Mar 1997 A
5612099 Thaler Mar 1997 A
5614252 McMillan et al. Mar 1997 A
5634093 Ashida et al. May 1997 A
5648127 Turchan et al. Jul 1997 A
5653925 Batchelder Aug 1997 A
5676719 Stavropoulos et al. Oct 1997 A
5697046 Conley Dec 1997 A
5705117 O'Connor et al. Jan 1998 A
5707715 Derochemont et al. Jan 1998 A
5732885 Huffman Mar 1998 A
5733609 Wang Mar 1998 A
5736195 Haaland Apr 1998 A
5742050 Amirav et al. Apr 1998 A
5775402 Sachs et al. Apr 1998 A
5746844 Sterett et al. May 1998 A
5770272 Biemann et al. Jun 1998 A
5772106 Ayers et al. Jun 1998 A
5772963 Prevost et al. Jun 1998 A
5772964 Prevost et al. Jun 1998 A
5779833 Cawley et al. Jul 1998 A
5795388 Oudard Aug 1998 A
5814152 Thaler Sep 1998 A
5837960 Lewis et al. Nov 1998 A
5844192 Wright et al. Dec 1998 A
5847357 Woodmansee et al. Dec 1998 A
5849238 Schmidt et al. Dec 1998 A
5854311 Richart Dec 1998 A
5861136 Glicksman et al. Jan 1999 A
5882722 Kydd Mar 1999 A
5894403 Shah et al. Apr 1999 A
5940099 Karlinski Aug 1999 A
5958268 Engelsberg et al. Sep 1999 A
5965212 Dobson et al. Oct 1999 A
5969352 French Oct 1999 A
5980998 Sharma et al. Nov 1999 A
5993549 Kindler et al. Nov 1999 A
5993554 Keicher et al. Nov 1999 A
5997956 Hunt et al. Dec 1999 A
6007631 Prentice et al. Dec 1999 A
6015083 Hayes et al. Jan 2000 A
6021776 Allred et al. Feb 2000 A
6025037 Wadman et al. Feb 2000 A
6036889 Kydd Mar 2000 A
6040016 Mitani et al. Mar 2000 A
6046426 Jeantette et al. Apr 2000 A
6056994 Paz De Araujo et al. May 2000 A
6110144 Choh et al. Aug 2000 A
6116718 Peeters et al. Sep 2000 A
6136442 Wong Oct 2000 A
6143116 Hayashi et al. Nov 2000 A
6144008 Rabinovich Nov 2000 A
6149076 Riney Nov 2000 A
6151435 Pilloff Nov 2000 A
6159749 Liu Dec 2000 A
6169605 Penn et al. Jan 2001 B1
6176647 Itoh Jan 2001 B1
6182688 Fabre Feb 2001 B1
6183690 Yoo et al. Feb 2001 B1
6197366 Takamatsu Mar 2001 B1
6238614 Yang May 2001 B1
6251488 Miller et al. Jun 2001 B1
6258733 Solayappan et al. Jul 2001 B1
6265050 Wong et al. Jul 2001 B1
6267301 Haruch Jul 2001 B1
6268584 Keicher et al. Jul 2001 B1
6290342 Vo et al. Sep 2001 B1
6291088 Wong Sep 2001 B1
6293659 Floyd et al. Sep 2001 B1
6318642 Goenka et al. Nov 2001 B1
6328026 Wang et al. Dec 2001 B1
6340216 Peeters et al. Jan 2002 B1
6348687 Brockmann et al. Feb 2002 B1
6349668 Sun et al. Feb 2002 B1
6355533 Lee Mar 2002 B2
6379745 Kydd et al. Apr 2002 B1
6384365 Seth et al. May 2002 B1
6390115 Rohwer et al. May 2002 B1
6391251 Keicher et al. May 2002 B1
6391494 Reitz et al. May 2002 B2
6405095 Jang et al. Jun 2002 B1
6406137 Okazaki et al. Jun 2002 B1
6410105 Mazumder et al. Jun 2002 B1
6416156 Noolandi et al. Jul 2002 B1
6416157 Peeters et al. Jul 2002 B1
6416158 Floyd et al. Jul 2002 B1
6416159 Floyd et al. Jul 2002 B1
6416389 Perry et al. Jul 2002 B1
6454384 Peeters et al. Sep 2002 B1
6467862 Peeters et al. Oct 2002 B1
6471327 Jagannathan et al. Oct 2002 B2
6481074 Karlinski Nov 2002 B1
6486432 Colby et al. Nov 2002 B1
6503831 Speakman Jan 2003 B2
6513736 Skeath et al. Feb 2003 B1
6520996 Manasas et al. Feb 2003 B1
6521297 McDougall et al. Feb 2003 B2
6531191 Notenboom Mar 2003 B1
6537501 Holl et al. Mar 2003 B1
6544599 Brown et al. Apr 2003 B1
6548122 Sharma et al. Apr 2003 B1
6564038 Bethea et al. May 2003 B1
6572033 Pullagura et al. Jun 2003 B1
6573491 Marchitto et al. Jun 2003 B1
6607597 James et al. Aug 2003 B2
6608281 Ishide et al. Aug 2003 B2
6636676 Renn Oct 2003 B1
6646253 Rohwer et al. Nov 2003 B1
6656409 Keicher et al. Dec 2003 B1
6697694 Mogensen Feb 2004 B2
6772649 Zimmermann et al. Aug 2004 B2
6774338 Baker et al. Aug 2004 B2
6780377 Hall et al. Aug 2004 B2
6811744 Keicher et al. Nov 2004 B2
6811805 Gilliard et al. Nov 2004 B2
6823124 Renn et al. Nov 2004 B1
6855631 Kirby Feb 2005 B2
6890624 Kambe et al. May 2005 B1
6921626 Ray et al. Jul 2005 B2
6998345 Kirby Feb 2006 B2
6998785 Silfvast et al. Feb 2006 B1
7009137 Guo et al. Mar 2006 B2
7045015 Renn et al. May 2006 B2
7108894 Renn Sep 2006 B2
7164818 Bryan et al. Jan 2007 B2
7171093 Kringlebotn et al. Jan 2007 B2
7178380 Shekarriz et al. Feb 2007 B2
7270844 Renn Sep 2007 B2
7294366 Renn et al. Nov 2007 B2
7402897 Leedy Jul 2008 B2
7469558 Demaray et al. Dec 2008 B2
7485345 Renn et al. Feb 2009 B2
7658163 Renn et al. Feb 2010 B2
7674671 Renn et al. Mar 2010 B2
7836922 Poole et al. Nov 2010 B2
7938079 King et al. May 2011 B2
7987813 Renn et al. Aug 2011 B2
8012235 Takashima et al. Sep 2011 B2
8383014 Vandeusden et al. Feb 2013 B2
8796146 Renn et al. Aug 2014 B2
8916084 Chretien et al. Dec 2014 B2
8919899 Essien Dec 2014 B2
9694389 Fan et al. Jul 2017 B2
20010027011 Hanaoka et al. Oct 2001 A1
20010046551 Falck et al. Nov 2001 A1
20010046833 Hashish Nov 2001 A1
20020012743 Sampath et al. Jan 2002 A1
20020012752 McDougall et al. Jan 2002 A1
20020063117 Church et al. May 2002 A1
20020071934 Marutsuka Jun 2002 A1
20020082741 Mazumder et al. Jun 2002 A1
20020096647 Moors et al. Jul 2002 A1
20020100416 Sun et al. Aug 2002 A1
20020107140 Hampden-Smith et al. Aug 2002 A1
20020128714 Manasas et al. Sep 2002 A1
20020132051 Choy Sep 2002 A1
20020145213 Liu et al. Oct 2002 A1
20020162974 Orsini et al. Nov 2002 A1
20030003241 Suzuki et al. Jan 2003 A1
20030020768 Renn Jan 2003 A1
20030032214 Huang Feb 2003 A1
20030048314 Renn Mar 2003 A1
20030108511 Sawhney Jun 2003 A1
20030108664 Kodas et al. Jun 2003 A1
20030117691 Bi et al. Jun 2003 A1
20030138967 Hall et al. Jul 2003 A1
20030149505 Mogensen Aug 2003 A1
20030175411 Kodas et al. Sep 2003 A1
20030180451 Kodas et al. Sep 2003 A1
20030202043 Moffat et al. Oct 2003 A1
20030219923 Nathan et al. Nov 2003 A1
20030228124 Renn et al. Dec 2003 A1
20040004209 Matsuba et al. Jan 2004 A1
20040029706 Barrera et al. Feb 2004 A1
20040038808 Hampden-Smith et al. Feb 2004 A1
20040080917 Steddom et al. Apr 2004 A1
20040151978 Huang Aug 2004 A1
20040179808 Renn Sep 2004 A1
20040185388 Hirai Sep 2004 A1
20040191695 Ray et al. Sep 2004 A1
20040197493 Renn et al. Oct 2004 A1
20040226929 Miura Nov 2004 A1
20040227227 Imanaka et al. Nov 2004 A1
20040247782 Hampden-Smith et al. Dec 2004 A1
20050002818 Ichikawa Jan 2005 A1
20050003658 Kirby Jan 2005 A1
20050097987 Kodas et al. May 2005 A1
20050101129 Lirby May 2005 A1
20050110064 Duan et al. May 2005 A1
20050129383 Renn et al. Jun 2005 A1
20050133527 Dullea et al. Jun 2005 A1
20050139156 Ahn Jun 2005 A1
20050145968 Goela et al. Jul 2005 A1
20050147749 Liu et al. Jul 2005 A1
20050156991 Renn Jul 2005 A1
20050163917 Renn Jul 2005 A1
20050171237 Patel Aug 2005 A1
20050184328 Uchiyama et al. Aug 2005 A1
20050205415 Belousov et al. Sep 2005 A1
20050205696 Saito et al. Sep 2005 A1
20050214480 Garbar et al. Sep 2005 A1
20050215689 Garbar et al. Sep 2005 A1
20050220994 Mehta Oct 2005 A1
20050238804 Garbar et al. Oct 2005 A1
20050247681 Boillot et al. Nov 2005 A1
20050275143 Toth Dec 2005 A1
20060003095 Bullen et al. Jan 2006 A1
20060008590 King et al. Jan 2006 A1
20060035033 Tanahashi Feb 2006 A1
20060043598 Kirby et al. Mar 2006 A1
20060046347 Wood et al. Mar 2006 A1
20060046461 Benson et al. Mar 2006 A1
20060057014 Oda et al. Mar 2006 A1
20060116000 Yamamoto Jun 2006 A1
20060159899 Edwards et al. Jul 2006 A1
20060162424 Shekarriz et al. Jul 2006 A1
20060163570 Renn et al. Jul 2006 A1
20060163744 Vanheusden et al. Jul 2006 A1
20060172073 Groza et al. Aug 2006 A1
20060175431 Renn et al. Aug 2006 A1
20060189113 Vanheusden Aug 2006 A1
20060228465 Zurecki Oct 2006 A1
20060233953 Renn et al. Oct 2006 A1
20060269673 Yapel Nov 2006 A1
20060280866 Marquez et al. Dec 2006 A1
20070019028 Renn et al. Jan 2007 A1
20070128905 Speakman Jun 2007 A1
20070154634 Renn Jul 2007 A1
20070160837 Chikamori Jul 2007 A1
20070181060 Renn et al. Aug 2007 A1
20070227536 Rivera et al. Oct 2007 A1
20070240454 Brown Oct 2007 A1
20080013299 Renn Jan 2008 A1
20080016686 Lee Jan 2008 A1
20080099456 Schwenke et al. May 2008 A1
20090039249 Wang et al. Feb 2009 A1
20090061077 King et al. Mar 2009 A1
20090061089 King et al. Mar 2009 A1
20090090298 King et al. Apr 2009 A1
20090114151 Renn et al. May 2009 A1
20090229412 Takashima et al. Sep 2009 A1
20090237449 Silverbrook Sep 2009 A1
20100029460 Shojiya Feb 2010 A1
20100112234 Spatz et al. Jun 2010 A1
20100140811 Leal Jun 2010 A1
20100173088 King Jul 2010 A1
20100192847 Renn et al. Aug 2010 A1
20100255209 Renn et al. Oct 2010 A1
20110129615 Renn et al. Jun 2011 A1
20120038716 Hoerteis et al. Feb 2012 A1
20130029032 King et al. Jan 2013 A1
20130260056 Renn et al. Oct 2013 A1
20130283700 Bajaj Oct 2013 A1
20140027952 Fan et al. Jan 2014 A1
20140035975 Essien Feb 2014 A1
20140231266 Sherrer Aug 2014 A1
20140342082 Renn Nov 2014 A1
20160172741 Panat Jun 2016 A1
20160193627 Essien Jul 2016 A1
20170177319 Mark et al. Jun 2017 A1
Foreign Referenced Citations (41)
Number Date Country
2078199 Jun 1991 CN
1452554 Oct 2003 CN
101111129 Jan 2008 CN
19841401 Apr 2000 DE
0331022 Sep 1989 EP
0444550 Sep 1991 EP
0470911 Jul 1994 EP
1163552 Dec 2001 EP
1258293 Nov 2002 EP
1452326 Sep 2004 EP
14523262 Sep 2004 EP
1507832 Feb 2005 EP
1670610 Jun 2006 EP
2322735 Sep 1998 GB
05318748 Dec 1993 JP
8156106 Jun 1996 JP
08156106 Jun 1996 JP
2001507449 Jun 2001 JP
2002539924 Nov 2002 JP
3425522 Jul 2003 JP
2004122341 Apr 2004 JP
2006051413 Feb 2006 JP
2007507114 Mar 2007 JP
20000013770 Mar 2000 KR
1002846070000 Aug 2001 KR
1020070008614 Jan 2007 KR
1020070008621 Jan 2007 KR
1020070019651 Feb 2007 KR
200636091 Oct 2006 TW
9218323 Oct 1992 WO
9633797 Oct 1996 WO
9738810 Oct 1997 WO
0023825 Apr 2000 WO
0069235 Nov 2000 WO
0183101 Nov 2001 WO
2005075132 Aug 2005 WO
2006041657 Apr 2006 WO
2006065978 Jun 2006 WO
2006076603 Jul 2006 WO
2013010108 Jan 2013 WO
2013162856 Oct 2013 WO
Non-Patent Literature Citations (41)
Entry
O'Reilly, Mike and Jeff Leal (2010) “Jetting Your Way to Fine-pitch 3D Interconnects”, Chip Scale Review, Oct. 2010. (Year: 2010).
Odde, et al., “Laser-Based Guidance of Cells Through Hollow Optical Fibers”, The American Society for Cell Biology Thirty-Seventh Annual Meeting, Dec. 17, 1997.
Odde, et al., “Laser-guided direct writing for applications in biotechnology”, Trends in Biotechnology, Oct. 1999, 385-389.
Rao, et al., “Aerodynamic Focusing of Particles in Viscous Jets”, J. Aerosol Sci., 1993, 879-892.
Renn, et al., “Evanescent-wave guiding of atoms in hollow optical fibers”, Physical Review A, Feb. 1996, R648-R651.
Renn, et al., “Flow- and Laser-Guided Direct Write of Electronic and Biological Components”, Direct-Write Technologies for Rapid Prototyping Applications, 2002, 475-492.
Renn, et al., “Laser-Guidance and Trapping of Mesoscale Particles in Hollow-Core Optical Fibers”, Physical Review Letters, Feb. 15, 1999, 1574-1577.
Renn, et al., “Laser-Guided Atoms in Hollow-Core Optical Fibers”, Physical Review Letters, Oct. 30, 1995, 3253-3256.
Renn, et al., “Optical-dipole-force fiber guiding and heating of atoms”, Physical Review A, May 1997, 3684-3696.
Renn, et al., “Particle Manipulation and Surface Patterning by Laser Guidance”, Submitted to EIPBN '98, Session AM4, 1998.
Renn, et al., “Particle manipulation and surface patterning by laser guidance”, Journal of Vacuum Science & Technology B, Nov./Dec. 1998, 3859-3863.
Sobeck, et al., Technical Digest: 1994 Solid-State Sensor and Actuator Workshop, 1994, 647.
Stratasys, “FDM Technology”, http://www.stratasys.com/3d-printers/technologies/fdm-technology, 2015.
Stratasys, “PolyJet Technology”, http://www.stratasys.com/3d-printers/technologies/polyjet-technology, 2015.
TSI Incorporated, “Flow a Virtual Impactor Works”, www.tsi.com, Sep. 21, 2001.
Vanheusden, et al., “Direct Printing of Interconnect Materials for Organic Electronics”, IMAPS ATW Printing for an Intelligent Future, Mar. 8-10, 2002, 1-5.
Vanheusden, et al., “Direct Printing of Interconnect Materials for Organic Electronics”, IMAPS ATW, Printing an Intelligent Future, Mar. 8-10, 2002, 1-5.
Wikipedia, “Continuous Liquid Interface Production”, https://www.en.wikipedia.org/wiki/Continuous_Liquid_Interface_Production, Sep. 29, 2015.
Wikipedia, “Selective laser sintering”, https://en.wikipedia.org/wiki/Selective_laser_sintering, Nov. 23, 2015.
Wikipedia, “Stereolithography”, https://en/wikipedia/org/wiki/Stereolithography, Feb. 4, 2016.
Zhang, et al., “A Numerical Characterization of Particle Beam Collimation by an Aerodynamic Lens-Nozzle System: Part I. An Individual Lens or Nozzle”, Aerosol Science and Technology, 2002, 617-631.
Websters Ninth New Collegiate Dictionary, 1990, 744.
Ashkin, “Acceleration and Trapping of Particles by Radiation Pressure”, Physical Review Letters, Jan. 26, 1970, 156-159.
Ashkin, “Optical trapping and manipulation of single cells using infrared laser beams”, Nature, Dec. 1987, 769-771.
Dykhuizen, “Impact of High Velocity Cold Spray Particles”, May 13, 2000, 1-18.
Fernandez De La Mora, et al., “Aerodynamic focusing of particles in a carrier gas”, J. Fluid Mech., 1988, 1-21.
Gladman, et al., “Biomimetic 4D printing”, Nature Materials, vol. 15, Macmillan Publishers Limited, Jan. 25, 2016, 413-418.
Harris, et al., “Marangoni Effects on Evaporative Lithographic Patterning of Colloidal Films”, Langmuir, Vo. 24, No. 8, American Chemical Society, Mar. 4, 2008, 3681-3685.
King, et al., “M3D TM Technology: Maskless Mesoscale TM Materials Deposition”, Optomec pamphlet, 2001.
Krassenstein, “Carbon3D Unveils Breakthrough Clip 3D Printing Technology, 25-100X Faster”, http://3dprint.com/51566/carbon3d-clip-3d-printing, Mar. 16, 2015.
Lewandowski, et al., “Laser Guiding of Microscopic Particles in Hollow Optical Fibers”, Announcer 27, Summer Meeting—Invited and Contributed Abstracts, Jul. 1997, 89.
Lewis, “Novel Inks for Direct-Write Assembly of 3-D Periodic Structures”, Material Matters, vol. 3, No. 1, Aldrich Chemistry Company, 2008, 4-9.
Marple, et al., “Inertial, Gravitational, Centrifugal, and Thermal Collection Techniques”, Aerosol Measurement: Principles, Techniques and Applications, 2001, 229-260.
Miller, et al., “Maskless Mesoscale Materials Deposition”, HDI, Sep. 2001, 1-3.
Nanodimension, “The DragonFly 2020 3D Printer”, http://www.nano-di.com/3d-printer, 2015.
Nordson, “Fluid Dispensing Systems and Equipment”, http://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems?nor_division_facet_b=f65ab511444f4ce087bae3fb19491a82, 2015.
Nscrypt, “3D Printing”, http://nscrypt.com/3d-printing, 2015.
Nscrypt, “3DN HP Series”, http://www.nscrypt.com/3d-printing, 2015.
Nscrypt, “3DN Series”, http://www.nscrypt.com/3d-printing, 2015.
Nscrypt, “nFD Specification Sheet”, http://www.nscrypt.com/3d-printing, 2015.
Nscrypt, “SmartPump 100 Specification Sheet”, http://www.nscrypt.com/3d-printing, 2015.
Related Publications (1)
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20160229119 A1 Aug 2016 US
Provisional Applications (1)
Number Date Country
62114354 Feb 2015 US