Field of the Invention (Technical Field)
The present invention is related to the fabrication of 3D electrical and mechanical structures, microstructures, and nanostructures by in-flight curing of aerosol jetted nanoparticle and polymeric inks.
Background Art
Note that the following discussion may refer to a number of publications and references. Discussion of such publications herein is given for more complete background of the scientific principles and is not to be construed as an admission that such publications are prior art for patentability determination purposes.
Three-dimensional printing is a rapidly evolving technology which promises to revolutionize additive manufacturing. With 3D printing, various structural materials such as plastics and metals can be fabricated into net-shaped structures without the need for subtractive machining or etching steps. There is little materials waste and the reduced processing steps promise to make 3D printing a cost-effective, green technology. Several 3D printing technologies are currently available today and it is useful to briefly compare these technologies to the current invention.
Stereolithography is an additive manufacturing process that works by focusing an ultraviolet (UV) laser on to a vat of photopolymer resin. With the help of computer aided manufacturing or computer aided design (CAM/CAD) software, the UV laser is used to draw a pre-programmed design or shape on to the surface of the photopolymer vat. Because photopolymers are photosensitive under ultraviolet light, the irradiated resin is solidified and forms a single layer of the desired 3D object. This process is repeated for each layer of the design until the 3D object is complete. Layer resolution of 50-150 um is typically with lateral dimension approaching 10 um. The process is generally limited to photopolymer materials and sacrificial structures are required to support overhangs.
Ink jet technologies are typically used to print graphitic and pigmented inks in 2D. Recent materials innovations enable ink jet printers to jet polymeric and metal nanoparticle inks. Generally the inks used in ink jet printing must have relatively low viscosity, meaning the inks will spread substantially after printing, thus limiting the minimum feature size and aspect ratio of the printed features. The ink jetter does not contact the substrate, but it is in close proximity (less than mm).
Extrusion technologies are popular for 3D printing of thermoplastic polymers. In this case, a thermal plastic is heated to the melting point in a nozzle and extruded onto a substrate. The plastic rapidly cools and solidifies on contacting the substrate, and a three-dimensional shape can be maintained. 3D parts are typically fabricated layer wise, with each layer consisting of a raster pattern of extruded filament. Overhangs can be fabricated by extruding a sacrificial support material and later dissolving or mechanically removing the support structure. Typically feature sizes are hundreds of microns, and materials are largely limited to thermoplastics and a few thermoset polymers, as well as conductive pastes. The nScrypt tool is capable of printing on 3D surfaces by robotic CAD/CAM control of the nozzle positioning.
The present invention is a method for fabricating a three-dimensional structure on a substrate, the method comprising propelling aerosol droplets from a deposition head toward the substrate, partially modifying a property of the aerosol droplets in-flight, and fully modifying the property of the aerosol droplets once they have been deposited as part of the three-dimensional structure. Modifying a property optionally comprises curing, for example ultraviolet (UV) light curing, or solidifying using electromagnetic radiation. In this embodiment aerosol droplets preferably comprise a photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer. The aerosol droplets optionally comprise solid particles dispersed in the photocurable polymer, and the fabricated three-dimensional structure comprises a cured polymer comprising embedded solid particles. The solid particles optionally comprise a ceramic, a metal, a fiber, or silicon. In another embodiment, the aerosol droplets comprise a solvent and modifying a property comprises evaporating the solvent. These aerosol droplets optionally comprise metal nanoparticles, in which case the method preferably further comprises irradiating the aerosol droplets with UV radiation, heating the metal nanoparticles, and heating the aerosol droplets sufficiently to at least partially evaporate the solvent. The method preferably further comprises continuing to irradiate the metal nanoparticles after they have been deposited, thereby at least partially sintering the metal nanoparticles.
The method optionally comprises tilting or translating the deposition head with respect to the substrate. The method optionally comprises fabricating an overhanging structure without requiring a sacrificial support or tilting the deposition head or the substrate. The standoff distance between the deposition head and the substrate is preferably at least 1 mm, and more preferably at least 2 mm. The method preferably comprises increasing the viscosity of the aerosol droplets in-flight, and preferably comprises irradiating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited, optionally from more than one direction in-flight. The method optionally comprises heating the aerosol droplets with electromagnetic radiation in-flight and after the aerosol droplets have been deposited. The fabricated three-dimensional structure optionally comprises a structure selected from the group consisting of a micron-scale surface texture, a mechanical interposer, a precision spacer, a mechanical interposer comprising embedded electrical connectors, an enclosed, hollow structure, a mechanical scaffold, and a functional electrical wire.
Objects, advantages and novel features, and further scope of applicability of the present invention will be set forth in part in the detailed description to follow, taken in conjunction with the accompanying drawings, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
The accompanying drawings, which are incorporated into and form a part of the specification, illustrate several embodiments of the present invention and, together with the description, serve to explain the principles of the invention. The drawings are only for the purpose of illustrating a preferred embodiment of the invention and are not to be construed as limiting the invention. In the drawings:
The present invention is a method of making three-dimensional structures, such as structures comprising high aspect ratio features, using in-flight curing of aerosols and inks, and direct printing of liquid materials to fabricate three-dimensional, free standing, complex structures. Specifically, embodiments of the present invention combine patented Aerosol Jet dispensing technology, such as that described in U.S. Pat. Nos. 7,674,671, 7,938,079, and 7,987,813, with an in-flight materials processing mechanism that enables liquid droplets to partially solidify before depositing on a surface. After the in-flight processing, the droplets can be deposited to form free standing structures. Some of the advantages of this approach include ultra-high resolution three-dimensional (3D) printing, with features sizes down to 10 microns, lateral feature resolution to 1 micron, and vertical resolution to 100 nm. The aspect ratio of the free standing structures can be more than 100, and the structures can be printed on nearly any surface and surface geometry by manipulating the tilt and location of the print head relative to those surfaces. Overhangs and closed cells can be printed directly, without using sacrificial support materials. Both metal and insulating materials can be processed, which enables the co-deposition of electronic materials for fabricating circuits in 3D. Furthermore, composite materials can be printed, which allow for the tailoring of the mechanical and electrical properties of the 3D structures. Ultraviolet (UV) polymers can be cured in-flight as they are impacting on the target, and low sintering temperatures enable metallization of plastics. Using an Aerosol Jet process, practically any type of material and/or solvent can be printed. The large standoff from the substrate (typically a few millimeters) for this process enables high aspect printing without any z-axis motion. Sub-10 micron focusing of the aerosol jet enables creation of ultrafine features.
Aerosol Jet printing is a non-contact, aerosol-based jetting technology. The starting inks are formulated with low viscosity (0.5 to 1000 cP) and in the typical process they are first aerosolized into a fine droplet dispersion of 1-5 um diameter droplets. Preferably nitrogen gas entrains the droplets and propels them through a fine nozzle (0.1-1 mm inner diameter) to a target substrate for deposition. A co-flowing, preferably nitrogen sheath gas focuses the droplet jet down to a 10 um diameter, which allows features of this size to be printed. The jetting technology is notable for the large standoff distance between the nozzle and substrate (several mm), the fine resolution (feature width 10 um), volumetric dispense accuracy (10 femptoliter), and wide range of material compatibility. Because of the large standoff distance, it is possible to dry and/or otherwise cure the droplets during their flight to the substrate. In doing so, the viscosity of the droplets can be increased much beyond the starting viscosity. With higher viscosity, the printed inks are self supporting and can be built up into free standing columns and other high aspect ratio features. In order to increase the viscosity, UV light from either a lamp or a UV LED is preferably applied to the interstitial region between the nozzle exit and the target substrate, as shown in
In-flight processing is also possible when solid particles, such as ceramics, metals, or fibers, are dispersed in the photopolymer ink. In this case, the cured photopolymer serves as a 3D mechanical support for the solid particles. The mechanical and electrical properties of this composite material can be optimized by, for example, providing wear and abrasion resistance, as well as forming 3D electrical conductors.
In the case of solvent based inks, such as metal nanoparticle dispersions, the droplet viscosity can be increased by partially or fully drying the droplet during flight. Since metal nanoparticles are known to be highly absorbing to UV light, exposing the droplets to UV illumination will heat the nanoparticles and accelerate the solvent evaporation.
In embodiments of the present invention, UV illumination is being used to modify the properties of aerosol droplets as they are jetted onto a target surface. Specifically, the UV light is at least partially curing photopolymer droplets, and the resulting increased viscosity facilitates the formation of free standing structures. The UV light alternatively causes droplets of solvent-based nanoparticle dispersions to rapidly dry in-flight, likewise enabling 3D fabrication. This 3D fabrication can be performed using a wide variety of photopolymer, nanoparticle dispersion, and composite materials. The resulting 3D shapes can be free standing, without supports, and can attain arbitrary shapes by manipulating the print nozzle relative to the target substrate. The feature size is primarily determined by the jetting process, and can go down to 10 μm or even lower.
Although the invention has been described in detail with particular reference to the disclosed embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover all such modifications and equivalents. The entire disclosures of all patents and publications cited above are hereby incorporated by reference.
This application claims priority to and the benefit of the filing of U.S. Provisional Patent Application Ser. No. 62/114,354, entitled “MICRO 3D PRINTING”, filed on Feb. 10, 2015, and the specification and claims thereof are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3474971 | Goodrich | Oct 1969 | A |
3590477 | Cheroff et al. | Jul 1971 | A |
3642202 | Angelo | Feb 1972 | A |
3715785 | Brown et al. | Feb 1973 | A |
3777983 | Hibbins | Dec 1973 | A |
3808550 | Ashkin | Mar 1974 | A |
3808432 | Ashkin | Apr 1974 | A |
3816025 | O'Neill | Jun 1974 | A |
3846661 | Brown et al. | Nov 1974 | A |
3854321 | Dahneke | Dec 1974 | A |
3901798 | Peterson | Aug 1975 | A |
3959798 | Hochberg et al. | May 1976 | A |
3974769 | Hochberg et al. | Aug 1976 | A |
3982251 | Hochberg | Sep 1976 | A |
4004733 | Law | Jan 1977 | A |
4016417 | Benton | Apr 1977 | A |
4019188 | Hochberg et al. | Apr 1977 | A |
4034025 | Martner | Jul 1977 | A |
4036434 | Anderson et al. | Jul 1977 | A |
4046073 | Mitchell et al. | Sep 1977 | A |
4046074 | Hochberg et al. | Sep 1977 | A |
4073436 | Behr | Feb 1978 | A |
4092535 | Ashkin et al. | May 1978 | A |
4112437 | Mir et al. | Sep 1978 | A |
4132894 | Yule | Jan 1979 | A |
4171096 | Welsh et al. | Oct 1979 | A |
4200669 | Schaefer et al. | Apr 1980 | A |
4228440 | Horike et al. | Oct 1980 | A |
4235563 | Hine et al. | Nov 1980 | A |
4269868 | Livsey | May 1981 | A |
4323756 | Brown et al. | Apr 1982 | A |
4400408 | Asano et al. | Aug 1983 | A |
4453803 | Hidaka et al. | Jun 1984 | A |
4485387 | Drumheller | Nov 1984 | A |
4497692 | Gelchinski et al. | Feb 1985 | A |
4601921 | Lee | Jul 1986 | A |
4605574 | Yonehara et al. | Aug 1986 | A |
4670135 | Marple et al. | Jun 1987 | A |
4685563 | Cohen et al. | Aug 1987 | A |
4689052 | Ogren et al. | Aug 1987 | A |
4694136 | Kasner et al. | Sep 1987 | A |
4724299 | Hammeke | Feb 1988 | A |
4733018 | Prabhu et al. | Mar 1988 | A |
4823009 | Biemann et al. | Apr 1989 | A |
4825299 | Okada et al. | Apr 1989 | A |
4826583 | Biernaux et al. | May 1989 | A |
4893886 | Ashkin et al. | Jan 1990 | A |
4895735 | Cook | Jan 1990 | A |
4904621 | Loewenstein et al. | Feb 1990 | A |
4911365 | Thiel et al. | Mar 1990 | A |
4917830 | Ortiz et al. | Apr 1990 | A |
4920254 | Decamp et al. | Apr 1990 | A |
4927992 | Whitlow et al. | May 1990 | A |
4947463 | Matsuda et al. | Aug 1990 | A |
4971251 | Dobrick et al. | Nov 1990 | A |
4978067 | Berger et al. | Dec 1990 | A |
4997809 | Gupta | Mar 1991 | A |
5032850 | Andeen et al. | Jul 1991 | A |
5038014 | Pratt et al. | Aug 1991 | A |
5043548 | Whitney et al. | Aug 1991 | A |
5064685 | Kestenbaum et al. | Nov 1991 | A |
5126102 | Takahashi et al. | Jun 1992 | A |
5152462 | Evans | Oct 1992 | A |
5164535 | Leasure | Nov 1992 | A |
5170890 | Wilson et al. | Dec 1992 | A |
5173220 | Reiff et al. | Dec 1992 | A |
5176328 | Alexander | Jan 1993 | A |
5176744 | Muller | Jan 1993 | A |
5182430 | Lagain | Jan 1993 | A |
5194297 | Scheer et al. | Mar 1993 | A |
5208431 | Uchiyama et al. | May 1993 | A |
5245404 | Jannson et al. | Sep 1993 | A |
5250383 | Naruse | Oct 1993 | A |
5254832 | Gartner et al. | Oct 1993 | A |
5270542 | McMurry et al. | Dec 1993 | A |
5292418 | Morita et al. | Mar 1994 | A |
5294459 | Hogan et al. | Mar 1994 | A |
5306447 | Harris et al. | Apr 1994 | A |
5322221 | Anderson | Jun 1994 | A |
5335000 | Stevens | Aug 1994 | A |
5343434 | Noguchi | Aug 1994 | A |
5344676 | Kim et al. | Sep 1994 | A |
5359172 | Kozak et al. | Oct 1994 | A |
5366559 | Periasamy | Nov 1994 | A |
5378505 | Kubota et al. | Jan 1995 | A |
5378508 | Castro et al. | Jan 1995 | A |
5393613 | Mackay | Feb 1995 | A |
5398193 | Deangelis | Mar 1995 | A |
5403617 | Haaland | Apr 1995 | A |
5405660 | Psiuk et al. | Apr 1995 | A |
5418350 | Freneaux et al. | May 1995 | A |
5449536 | Funkhouser | Sep 1995 | A |
5472143 | Bartels | Dec 1995 | A |
5477026 | Buongiorno | Dec 1995 | A |
5486676 | Aleshin | Jan 1996 | A |
5491317 | Pirl | Feb 1996 | A |
5495105 | Nishimura et al. | Feb 1996 | A |
5512745 | Finer et al. | Apr 1996 | A |
5518680 | Cima et al. | May 1996 | A |
5524828 | Raterman et al. | Jun 1996 | A |
5529634 | Miyata et al. | Jun 1996 | A |
5547094 | Bartels et al. | Aug 1996 | A |
5578227 | Rabinovich | Nov 1996 | A |
5607730 | Ranalli | Mar 1997 | A |
5609921 | Gitzhofer et al. | Mar 1997 | A |
5612099 | Thaler | Mar 1997 | A |
5614252 | McMillan et al. | Mar 1997 | A |
5634093 | Ashida et al. | May 1997 | A |
5648127 | Turchan et al. | Jul 1997 | A |
5653925 | Batchelder | Aug 1997 | A |
5676719 | Stavropoulos et al. | Oct 1997 | A |
5697046 | Conley | Dec 1997 | A |
5705117 | O'Connor et al. | Jan 1998 | A |
5707715 | Derochemont et al. | Jan 1998 | A |
5732885 | Huffman | Mar 1998 | A |
5733609 | Wang | Mar 1998 | A |
5736195 | Haaland | Apr 1998 | A |
5742050 | Amirav et al. | Apr 1998 | A |
5775402 | Sachs et al. | Apr 1998 | A |
5746844 | Sterett et al. | May 1998 | A |
5770272 | Biemann et al. | Jun 1998 | A |
5772106 | Ayers et al. | Jun 1998 | A |
5772963 | Prevost et al. | Jun 1998 | A |
5772964 | Prevost et al. | Jun 1998 | A |
5779833 | Cawley et al. | Jul 1998 | A |
5795388 | Oudard | Aug 1998 | A |
5814152 | Thaler | Sep 1998 | A |
5837960 | Lewis et al. | Nov 1998 | A |
5844192 | Wright et al. | Dec 1998 | A |
5847357 | Woodmansee et al. | Dec 1998 | A |
5849238 | Schmidt et al. | Dec 1998 | A |
5854311 | Richart | Dec 1998 | A |
5861136 | Glicksman et al. | Jan 1999 | A |
5882722 | Kydd | Mar 1999 | A |
5894403 | Shah et al. | Apr 1999 | A |
5940099 | Karlinski | Aug 1999 | A |
5958268 | Engelsberg et al. | Sep 1999 | A |
5965212 | Dobson et al. | Oct 1999 | A |
5969352 | French | Oct 1999 | A |
5980998 | Sharma et al. | Nov 1999 | A |
5993549 | Kindler et al. | Nov 1999 | A |
5993554 | Keicher et al. | Nov 1999 | A |
5997956 | Hunt et al. | Dec 1999 | A |
6007631 | Prentice et al. | Dec 1999 | A |
6015083 | Hayes et al. | Jan 2000 | A |
6021776 | Allred et al. | Feb 2000 | A |
6025037 | Wadman et al. | Feb 2000 | A |
6036889 | Kydd | Mar 2000 | A |
6040016 | Mitani et al. | Mar 2000 | A |
6046426 | Jeantette et al. | Apr 2000 | A |
6056994 | Paz De Araujo et al. | May 2000 | A |
6110144 | Choh et al. | Aug 2000 | A |
6116718 | Peeters et al. | Sep 2000 | A |
6136442 | Wong | Oct 2000 | A |
6143116 | Hayashi et al. | Nov 2000 | A |
6144008 | Rabinovich | Nov 2000 | A |
6149076 | Riney | Nov 2000 | A |
6151435 | Pilloff | Nov 2000 | A |
6159749 | Liu | Dec 2000 | A |
6169605 | Penn et al. | Jan 2001 | B1 |
6176647 | Itoh | Jan 2001 | B1 |
6182688 | Fabre | Feb 2001 | B1 |
6183690 | Yoo et al. | Feb 2001 | B1 |
6197366 | Takamatsu | Mar 2001 | B1 |
6238614 | Yang | May 2001 | B1 |
6251488 | Miller et al. | Jun 2001 | B1 |
6258733 | Solayappan et al. | Jul 2001 | B1 |
6265050 | Wong et al. | Jul 2001 | B1 |
6267301 | Haruch | Jul 2001 | B1 |
6268584 | Keicher et al. | Jul 2001 | B1 |
6290342 | Vo et al. | Sep 2001 | B1 |
6291088 | Wong | Sep 2001 | B1 |
6293659 | Floyd et al. | Sep 2001 | B1 |
6318642 | Goenka et al. | Nov 2001 | B1 |
6328026 | Wang et al. | Dec 2001 | B1 |
6340216 | Peeters et al. | Jan 2002 | B1 |
6348687 | Brockmann et al. | Feb 2002 | B1 |
6349668 | Sun et al. | Feb 2002 | B1 |
6355533 | Lee | Mar 2002 | B2 |
6379745 | Kydd et al. | Apr 2002 | B1 |
6384365 | Seth et al. | May 2002 | B1 |
6390115 | Rohwer et al. | May 2002 | B1 |
6391251 | Keicher et al. | May 2002 | B1 |
6391494 | Reitz et al. | May 2002 | B2 |
6405095 | Jang et al. | Jun 2002 | B1 |
6406137 | Okazaki et al. | Jun 2002 | B1 |
6410105 | Mazumder et al. | Jun 2002 | B1 |
6416156 | Noolandi et al. | Jul 2002 | B1 |
6416157 | Peeters et al. | Jul 2002 | B1 |
6416158 | Floyd et al. | Jul 2002 | B1 |
6416159 | Floyd et al. | Jul 2002 | B1 |
6416389 | Perry et al. | Jul 2002 | B1 |
6454384 | Peeters et al. | Sep 2002 | B1 |
6467862 | Peeters et al. | Oct 2002 | B1 |
6471327 | Jagannathan et al. | Oct 2002 | B2 |
6481074 | Karlinski | Nov 2002 | B1 |
6486432 | Colby et al. | Nov 2002 | B1 |
6503831 | Speakman | Jan 2003 | B2 |
6513736 | Skeath et al. | Feb 2003 | B1 |
6520996 | Manasas et al. | Feb 2003 | B1 |
6521297 | McDougall et al. | Feb 2003 | B2 |
6531191 | Notenboom | Mar 2003 | B1 |
6537501 | Holl et al. | Mar 2003 | B1 |
6544599 | Brown et al. | Apr 2003 | B1 |
6548122 | Sharma et al. | Apr 2003 | B1 |
6564038 | Bethea et al. | May 2003 | B1 |
6572033 | Pullagura et al. | Jun 2003 | B1 |
6573491 | Marchitto et al. | Jun 2003 | B1 |
6607597 | James et al. | Aug 2003 | B2 |
6608281 | Ishide et al. | Aug 2003 | B2 |
6636676 | Renn | Oct 2003 | B1 |
6646253 | Rohwer et al. | Nov 2003 | B1 |
6656409 | Keicher et al. | Dec 2003 | B1 |
6697694 | Mogensen | Feb 2004 | B2 |
6772649 | Zimmermann et al. | Aug 2004 | B2 |
6774338 | Baker et al. | Aug 2004 | B2 |
6780377 | Hall et al. | Aug 2004 | B2 |
6811744 | Keicher et al. | Nov 2004 | B2 |
6811805 | Gilliard et al. | Nov 2004 | B2 |
6823124 | Renn et al. | Nov 2004 | B1 |
6855631 | Kirby | Feb 2005 | B2 |
6890624 | Kambe et al. | May 2005 | B1 |
6921626 | Ray et al. | Jul 2005 | B2 |
6998345 | Kirby | Feb 2006 | B2 |
6998785 | Silfvast et al. | Feb 2006 | B1 |
7009137 | Guo et al. | Mar 2006 | B2 |
7045015 | Renn et al. | May 2006 | B2 |
7108894 | Renn | Sep 2006 | B2 |
7164818 | Bryan et al. | Jan 2007 | B2 |
7171093 | Kringlebotn et al. | Jan 2007 | B2 |
7178380 | Shekarriz et al. | Feb 2007 | B2 |
7270844 | Renn | Sep 2007 | B2 |
7294366 | Renn et al. | Nov 2007 | B2 |
7402897 | Leedy | Jul 2008 | B2 |
7469558 | Demaray et al. | Dec 2008 | B2 |
7485345 | Renn et al. | Feb 2009 | B2 |
7658163 | Renn et al. | Feb 2010 | B2 |
7674671 | Renn et al. | Mar 2010 | B2 |
7836922 | Poole et al. | Nov 2010 | B2 |
7938079 | King et al. | May 2011 | B2 |
7987813 | Renn et al. | Aug 2011 | B2 |
8012235 | Takashima et al. | Sep 2011 | B2 |
8383014 | Vandeusden et al. | Feb 2013 | B2 |
8796146 | Renn et al. | Aug 2014 | B2 |
8916084 | Chretien et al. | Dec 2014 | B2 |
8919899 | Essien | Dec 2014 | B2 |
9694389 | Fan et al. | Jul 2017 | B2 |
20010027011 | Hanaoka et al. | Oct 2001 | A1 |
20010046551 | Falck et al. | Nov 2001 | A1 |
20010046833 | Hashish | Nov 2001 | A1 |
20020012743 | Sampath et al. | Jan 2002 | A1 |
20020012752 | McDougall et al. | Jan 2002 | A1 |
20020063117 | Church et al. | May 2002 | A1 |
20020071934 | Marutsuka | Jun 2002 | A1 |
20020082741 | Mazumder et al. | Jun 2002 | A1 |
20020096647 | Moors et al. | Jul 2002 | A1 |
20020100416 | Sun et al. | Aug 2002 | A1 |
20020107140 | Hampden-Smith et al. | Aug 2002 | A1 |
20020128714 | Manasas et al. | Sep 2002 | A1 |
20020132051 | Choy | Sep 2002 | A1 |
20020145213 | Liu et al. | Oct 2002 | A1 |
20020162974 | Orsini et al. | Nov 2002 | A1 |
20030003241 | Suzuki et al. | Jan 2003 | A1 |
20030020768 | Renn | Jan 2003 | A1 |
20030032214 | Huang | Feb 2003 | A1 |
20030048314 | Renn | Mar 2003 | A1 |
20030108511 | Sawhney | Jun 2003 | A1 |
20030108664 | Kodas et al. | Jun 2003 | A1 |
20030117691 | Bi et al. | Jun 2003 | A1 |
20030138967 | Hall et al. | Jul 2003 | A1 |
20030149505 | Mogensen | Aug 2003 | A1 |
20030175411 | Kodas et al. | Sep 2003 | A1 |
20030180451 | Kodas et al. | Sep 2003 | A1 |
20030202043 | Moffat et al. | Oct 2003 | A1 |
20030219923 | Nathan et al. | Nov 2003 | A1 |
20030228124 | Renn et al. | Dec 2003 | A1 |
20040004209 | Matsuba et al. | Jan 2004 | A1 |
20040029706 | Barrera et al. | Feb 2004 | A1 |
20040038808 | Hampden-Smith et al. | Feb 2004 | A1 |
20040080917 | Steddom et al. | Apr 2004 | A1 |
20040151978 | Huang | Aug 2004 | A1 |
20040179808 | Renn | Sep 2004 | A1 |
20040185388 | Hirai | Sep 2004 | A1 |
20040191695 | Ray et al. | Sep 2004 | A1 |
20040197493 | Renn et al. | Oct 2004 | A1 |
20040226929 | Miura | Nov 2004 | A1 |
20040227227 | Imanaka et al. | Nov 2004 | A1 |
20040247782 | Hampden-Smith et al. | Dec 2004 | A1 |
20050002818 | Ichikawa | Jan 2005 | A1 |
20050003658 | Kirby | Jan 2005 | A1 |
20050097987 | Kodas et al. | May 2005 | A1 |
20050101129 | Lirby | May 2005 | A1 |
20050110064 | Duan et al. | May 2005 | A1 |
20050129383 | Renn et al. | Jun 2005 | A1 |
20050133527 | Dullea et al. | Jun 2005 | A1 |
20050139156 | Ahn | Jun 2005 | A1 |
20050145968 | Goela et al. | Jul 2005 | A1 |
20050147749 | Liu et al. | Jul 2005 | A1 |
20050156991 | Renn | Jul 2005 | A1 |
20050163917 | Renn | Jul 2005 | A1 |
20050171237 | Patel | Aug 2005 | A1 |
20050184328 | Uchiyama et al. | Aug 2005 | A1 |
20050205415 | Belousov et al. | Sep 2005 | A1 |
20050205696 | Saito et al. | Sep 2005 | A1 |
20050214480 | Garbar et al. | Sep 2005 | A1 |
20050215689 | Garbar et al. | Sep 2005 | A1 |
20050220994 | Mehta | Oct 2005 | A1 |
20050238804 | Garbar et al. | Oct 2005 | A1 |
20050247681 | Boillot et al. | Nov 2005 | A1 |
20050275143 | Toth | Dec 2005 | A1 |
20060003095 | Bullen et al. | Jan 2006 | A1 |
20060008590 | King et al. | Jan 2006 | A1 |
20060035033 | Tanahashi | Feb 2006 | A1 |
20060043598 | Kirby et al. | Mar 2006 | A1 |
20060046347 | Wood et al. | Mar 2006 | A1 |
20060046461 | Benson et al. | Mar 2006 | A1 |
20060057014 | Oda et al. | Mar 2006 | A1 |
20060116000 | Yamamoto | Jun 2006 | A1 |
20060159899 | Edwards et al. | Jul 2006 | A1 |
20060162424 | Shekarriz et al. | Jul 2006 | A1 |
20060163570 | Renn et al. | Jul 2006 | A1 |
20060163744 | Vanheusden et al. | Jul 2006 | A1 |
20060172073 | Groza et al. | Aug 2006 | A1 |
20060175431 | Renn et al. | Aug 2006 | A1 |
20060189113 | Vanheusden | Aug 2006 | A1 |
20060228465 | Zurecki | Oct 2006 | A1 |
20060233953 | Renn et al. | Oct 2006 | A1 |
20060269673 | Yapel | Nov 2006 | A1 |
20060280866 | Marquez et al. | Dec 2006 | A1 |
20070019028 | Renn et al. | Jan 2007 | A1 |
20070128905 | Speakman | Jun 2007 | A1 |
20070154634 | Renn | Jul 2007 | A1 |
20070160837 | Chikamori | Jul 2007 | A1 |
20070181060 | Renn et al. | Aug 2007 | A1 |
20070227536 | Rivera et al. | Oct 2007 | A1 |
20070240454 | Brown | Oct 2007 | A1 |
20080013299 | Renn | Jan 2008 | A1 |
20080016686 | Lee | Jan 2008 | A1 |
20080099456 | Schwenke et al. | May 2008 | A1 |
20090039249 | Wang et al. | Feb 2009 | A1 |
20090061077 | King et al. | Mar 2009 | A1 |
20090061089 | King et al. | Mar 2009 | A1 |
20090090298 | King et al. | Apr 2009 | A1 |
20090114151 | Renn et al. | May 2009 | A1 |
20090229412 | Takashima et al. | Sep 2009 | A1 |
20090237449 | Silverbrook | Sep 2009 | A1 |
20100029460 | Shojiya | Feb 2010 | A1 |
20100112234 | Spatz et al. | Jun 2010 | A1 |
20100140811 | Leal | Jun 2010 | A1 |
20100173088 | King | Jul 2010 | A1 |
20100192847 | Renn et al. | Aug 2010 | A1 |
20100255209 | Renn et al. | Oct 2010 | A1 |
20110129615 | Renn et al. | Jun 2011 | A1 |
20120038716 | Hoerteis et al. | Feb 2012 | A1 |
20130029032 | King et al. | Jan 2013 | A1 |
20130260056 | Renn et al. | Oct 2013 | A1 |
20130283700 | Bajaj | Oct 2013 | A1 |
20140027952 | Fan et al. | Jan 2014 | A1 |
20140035975 | Essien | Feb 2014 | A1 |
20140231266 | Sherrer | Aug 2014 | A1 |
20140342082 | Renn | Nov 2014 | A1 |
20160172741 | Panat | Jun 2016 | A1 |
20160193627 | Essien | Jul 2016 | A1 |
20170177319 | Mark et al. | Jun 2017 | A1 |
Number | Date | Country |
---|---|---|
2078199 | Jun 1991 | CN |
1452554 | Oct 2003 | CN |
101111129 | Jan 2008 | CN |
19841401 | Apr 2000 | DE |
0331022 | Sep 1989 | EP |
0444550 | Sep 1991 | EP |
0470911 | Jul 1994 | EP |
1163552 | Dec 2001 | EP |
1258293 | Nov 2002 | EP |
1452326 | Sep 2004 | EP |
14523262 | Sep 2004 | EP |
1507832 | Feb 2005 | EP |
1670610 | Jun 2006 | EP |
2322735 | Sep 1998 | GB |
05318748 | Dec 1993 | JP |
8156106 | Jun 1996 | JP |
08156106 | Jun 1996 | JP |
2001507449 | Jun 2001 | JP |
2002539924 | Nov 2002 | JP |
3425522 | Jul 2003 | JP |
2004122341 | Apr 2004 | JP |
2006051413 | Feb 2006 | JP |
2007507114 | Mar 2007 | JP |
20000013770 | Mar 2000 | KR |
1002846070000 | Aug 2001 | KR |
1020070008614 | Jan 2007 | KR |
1020070008621 | Jan 2007 | KR |
1020070019651 | Feb 2007 | KR |
200636091 | Oct 2006 | TW |
9218323 | Oct 1992 | WO |
9633797 | Oct 1996 | WO |
9738810 | Oct 1997 | WO |
0023825 | Apr 2000 | WO |
0069235 | Nov 2000 | WO |
0183101 | Nov 2001 | WO |
2005075132 | Aug 2005 | WO |
2006041657 | Apr 2006 | WO |
2006065978 | Jun 2006 | WO |
2006076603 | Jul 2006 | WO |
2013010108 | Jan 2013 | WO |
2013162856 | Oct 2013 | WO |
Entry |
---|
O'Reilly, Mike and Jeff Leal (2010) “Jetting Your Way to Fine-pitch 3D Interconnects”, Chip Scale Review, Oct. 2010. (Year: 2010). |
Odde, et al., “Laser-Based Guidance of Cells Through Hollow Optical Fibers”, The American Society for Cell Biology Thirty-Seventh Annual Meeting, Dec. 17, 1997. |
Odde, et al., “Laser-guided direct writing for applications in biotechnology”, Trends in Biotechnology, Oct. 1999, 385-389. |
Rao, et al., “Aerodynamic Focusing of Particles in Viscous Jets”, J. Aerosol Sci., 1993, 879-892. |
Renn, et al., “Evanescent-wave guiding of atoms in hollow optical fibers”, Physical Review A, Feb. 1996, R648-R651. |
Renn, et al., “Flow- and Laser-Guided Direct Write of Electronic and Biological Components”, Direct-Write Technologies for Rapid Prototyping Applications, 2002, 475-492. |
Renn, et al., “Laser-Guidance and Trapping of Mesoscale Particles in Hollow-Core Optical Fibers”, Physical Review Letters, Feb. 15, 1999, 1574-1577. |
Renn, et al., “Laser-Guided Atoms in Hollow-Core Optical Fibers”, Physical Review Letters, Oct. 30, 1995, 3253-3256. |
Renn, et al., “Optical-dipole-force fiber guiding and heating of atoms”, Physical Review A, May 1997, 3684-3696. |
Renn, et al., “Particle Manipulation and Surface Patterning by Laser Guidance”, Submitted to EIPBN '98, Session AM4, 1998. |
Renn, et al., “Particle manipulation and surface patterning by laser guidance”, Journal of Vacuum Science & Technology B, Nov./Dec. 1998, 3859-3863. |
Sobeck, et al., Technical Digest: 1994 Solid-State Sensor and Actuator Workshop, 1994, 647. |
Stratasys, “FDM Technology”, http://www.stratasys.com/3d-printers/technologies/fdm-technology, 2015. |
Stratasys, “PolyJet Technology”, http://www.stratasys.com/3d-printers/technologies/polyjet-technology, 2015. |
TSI Incorporated, “Flow a Virtual Impactor Works”, www.tsi.com, Sep. 21, 2001. |
Vanheusden, et al., “Direct Printing of Interconnect Materials for Organic Electronics”, IMAPS ATW Printing for an Intelligent Future, Mar. 8-10, 2002, 1-5. |
Vanheusden, et al., “Direct Printing of Interconnect Materials for Organic Electronics”, IMAPS ATW, Printing an Intelligent Future, Mar. 8-10, 2002, 1-5. |
Wikipedia, “Continuous Liquid Interface Production”, https://www.en.wikipedia.org/wiki/Continuous_Liquid_Interface_Production, Sep. 29, 2015. |
Wikipedia, “Selective laser sintering”, https://en.wikipedia.org/wiki/Selective_laser_sintering, Nov. 23, 2015. |
Wikipedia, “Stereolithography”, https://en/wikipedia/org/wiki/Stereolithography, Feb. 4, 2016. |
Zhang, et al., “A Numerical Characterization of Particle Beam Collimation by an Aerodynamic Lens-Nozzle System: Part I. An Individual Lens or Nozzle”, Aerosol Science and Technology, 2002, 617-631. |
Websters Ninth New Collegiate Dictionary, 1990, 744. |
Ashkin, “Acceleration and Trapping of Particles by Radiation Pressure”, Physical Review Letters, Jan. 26, 1970, 156-159. |
Ashkin, “Optical trapping and manipulation of single cells using infrared laser beams”, Nature, Dec. 1987, 769-771. |
Dykhuizen, “Impact of High Velocity Cold Spray Particles”, May 13, 2000, 1-18. |
Fernandez De La Mora, et al., “Aerodynamic focusing of particles in a carrier gas”, J. Fluid Mech., 1988, 1-21. |
Gladman, et al., “Biomimetic 4D printing”, Nature Materials, vol. 15, Macmillan Publishers Limited, Jan. 25, 2016, 413-418. |
Harris, et al., “Marangoni Effects on Evaporative Lithographic Patterning of Colloidal Films”, Langmuir, Vo. 24, No. 8, American Chemical Society, Mar. 4, 2008, 3681-3685. |
King, et al., “M3D TM Technology: Maskless Mesoscale TM Materials Deposition”, Optomec pamphlet, 2001. |
Krassenstein, “Carbon3D Unveils Breakthrough Clip 3D Printing Technology, 25-100X Faster”, http://3dprint.com/51566/carbon3d-clip-3d-printing, Mar. 16, 2015. |
Lewandowski, et al., “Laser Guiding of Microscopic Particles in Hollow Optical Fibers”, Announcer 27, Summer Meeting—Invited and Contributed Abstracts, Jul. 1997, 89. |
Lewis, “Novel Inks for Direct-Write Assembly of 3-D Periodic Structures”, Material Matters, vol. 3, No. 1, Aldrich Chemistry Company, 2008, 4-9. |
Marple, et al., “Inertial, Gravitational, Centrifugal, and Thermal Collection Techniques”, Aerosol Measurement: Principles, Techniques and Applications, 2001, 229-260. |
Miller, et al., “Maskless Mesoscale Materials Deposition”, HDI, Sep. 2001, 1-3. |
Nanodimension, “The DragonFly 2020 3D Printer”, http://www.nano-di.com/3d-printer, 2015. |
Nordson, “Fluid Dispensing Systems and Equipment”, http://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems?nor_division_facet_b=f65ab511444f4ce087bae3fb19491a82, 2015. |
Nscrypt, “3D Printing”, http://nscrypt.com/3d-printing, 2015. |
Nscrypt, “3DN HP Series”, http://www.nscrypt.com/3d-printing, 2015. |
Nscrypt, “3DN Series”, http://www.nscrypt.com/3d-printing, 2015. |
Nscrypt, “nFD Specification Sheet”, http://www.nscrypt.com/3d-printing, 2015. |
Nscrypt, “SmartPump 100 Specification Sheet”, http://www.nscrypt.com/3d-printing, 2015. |
Number | Date | Country | |
---|---|---|---|
20160229119 A1 | Aug 2016 | US |
Number | Date | Country | |
---|---|---|---|
62114354 | Feb 2015 | US |