The present invention relates to a fan device of which the I/O terminal is connected by a modular method to reduce the possibility of wire trimming, and to provide the fan with a characteristic of linking multiple fans through a modular method.
When a heat dissipation device, such as a fan is installed, they are typically connected with electrical wires. The wiring becomes more complex when the number fans are added. Referring to conventional fans 100, 200 and 300 in
However, when the number of the above-mentioned fans 100, 200 and 300 are increased, the electric wires 102 and 202 will become more complicated. Further, the electric wires 102 and 202 can only be installed successfully after neatly integrating all wires. Therefore, the installation will become difficult and more time consuming. Besides, the above-mentioned fans 100, 200 and 300 do not have the functionality of linked modular connection.
The primary objective of the present invention is to provide a fan device of which the dedicated I/O modular connecting wires are linked respectively in the input end and the output end of the fan. The modular functionality can reduce the possibility of wire trimming, and provide the present invention with the functionality of modularization; therefore, the efficiency of the products can be improved.
To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.
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In conclusion, the output/input terminal are modularized to achieve a simple effect of wire integration of the I/O modularized connecting wires, and to apply to fans to improve the appearance and product efficiency.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by person's skill level in the art without departing from the spirit and scope of the invention as set forth in the following claims.