This application claims priority to German Patent Application DE102010027588.3 filed Jul. 19, 2010, the entirety of which is incorporated by reference herein.
This invention relates to fan downstream guide vanes for a turbofan engine which extend in one vane height between an inner and an outer sidewall in the bypass duct and whose shape is established by a plurality of aerodynamic profiles radially stacked on top of each other and determined by a skeleton line angle distribution with appertaining, superimposed thickness distribution over a chord length.
On a turbofan engine, downstream guide vanes are arranged downstream of the fan in the bypass duct in circumferentially equal distribution to deswirl the airflow in the bypass duct. The shape of the downstream guide vanes is established by a plurality of aerodynamically favorable profiles representing a horizontal section of the downstream guide vane and being radially stacked on top of each other. All downstream guide vanes arranged circumferentially in the bypass duct have the same maximum profile thickness and the same axial length, i.e. a corresponding chord length extending from the vane leading edge to the vane trailing edge.
The profile of the downstream guide vanes is determined by its skeleton line and a thickness distribution superimposed on the skeleton line. The thickness distribution is defined as the course of the dimensionless thickness over the dimensionless chord length (0 to 100 percent), with the thickness being made dimensionless with the maximum profile thickness.
The skeleton line is described as the course of the dimensionless skeleton line angle distribution along the chord length. The respective skeleton line angle α over the chord length results from:
α(l)=(αi(l)−BIA)/(BOA−BIA)[%],
with αi being the local angle of the skeleton line, BIA being the inlet angle and BOA the outlet angle, each measured relatively to the engine axis.
The profile of the downstream guide vanes finally results from the addition of each half of the thickness on each side of the skeleton line.
The hitherto known profiles—determined by the combination of skeleton line distributions and thickness distributions—are not optimally conceived in that, when they are flown in the bypass duct, neither the lowest profile pressure loss nor the maximum possible working range are ensured, as a result of which engine operating stability is reduced and fuel consumption increased.
In a broad aspect, the present invention provides for a design of the profile of fan downstream guide vanes such that pressure losses are minimized and eventually fuel consumption is reduced.
It is a particular object of the present invention to provide solution to the above problems by a vane profile designed in accordance with the features described herein, which is variable within an upper and a lower limitation.
Advantageous developments and embodiments of the present invention will also be apparent from the present description.
The present invention, in essence, provides for a novel, optimized form of the skeleton line angle distribution in an area situated between an upper and a lower limitation, as well as a specific thickness distribution superimposed on the respective skeleton line angle distribution to provide fan downstream guide vane profiles characterized by lower pressure losses and a larger working range than the known downstream guide vanes, thereby reducing the fuel consumption of the engine and increasing the operating stability thereof.
The novel vane profiling includes an upper and a lower profile forming an upper and a lower limitation determined by specified supporting points along the chord at 0, 9, 14, 22, 35, 46, 60, 89 and 100% respectively assigned dimensionless values of an upper skeleton line angle of 0, 0.2, 0.4, 0.6, 0.8, 0.9, 0.9, 0.95 and 1 and an upper thickness of 0, 0.85, 0.95, 1, 0.95, 0.875, 0.7, 0.2 and 0 as upper limitation of the skeleton line angle distribution and the thickness distribution as well as a lower skeleton line angle of 0, 0.05, 0.1, 0.25, 0.45, 0.6, 0.725, 0.85 and 1 and a lower thickness of 0, 0.4, 0.55, 0.75, 0.95, 1, 0.9, 0.35, and 0 as lower limitation of the skeleton line angle distribution and the thickness distribution. The novel vane profiling further includes a majority of intermediate profiles situated between the upper and the lower limitation and determined by interpolation at the specified supporting points.
When determining the profiles of the upper and the lower limitation, the thickness distribution is related to the respective skeleton line angle distribution in such a manner that the respective supporting point with the appertaining maximum value of the thickness distribution in each case corresponds to the supporting point (St) at which the skeleton line angle distribution of the upper and the lower limitation has the value 0.6.
In a further development of the present invention, the intermediate profiles situated between the profiles of the upper and the lower limitation are the result of an interpolated skeleton line angle distribution and an interpolated thickness distribution and the superposition thereof. Interpolation is made at the specified supporting points between the respective value of the upper and the lower limitation. The supporting point along the chord is determined with the appertaining value 0.6 of the skeleton line angle distribution by linear interpolation between the 0.6 values of the skeleton line angle distribution of the upper and the lower limitation.
In development of the present invention, the profiles of the upper limitation are provided in the mid of the vane height or, respectively, the bypass duct, and the profiles of the lower limitation are provided at the upper and the lower sidewall of the bypass duct, while interpolated intermediate profiles are provided in the intermediate areas situated between the profiles of the upper and the lower limitation.
In principle, the profiles of the upper and/or lower limitation and/or the interpolated intermediate profiles can however be provided at any vane height.
The present invention is more fully described in light of the accompanying drawings showing an exemplary embodiment. In the drawings,
As shown in
Superposition of the upper limiting curves of the skeleton line and thickness distribution 1Smax and 1Dmax and the lower limiting curves of the skeleton line and thickness distribution 2Smin and 2Dmin results in the—upper and lower—profiles 1max (upper limitation) and 2min (lower limitation) of fan downstream guide vanes shown in
By linear interpolation between the upper and lower limiting curves of the skeleton line distribution and the thickness distribution 1Smax and 1Smin as well as 1Dmax and 1Dmin, further curves of an interpolated skeleton line and thickness distribution are obtained between the two upper and lower profiles 1max (upper limitation) and 2min (lower limitation), here for example 3Sint and 3Dint (see
Interpolation is made at each of the supporting points of the chord specified above as per the equation:
Interpolated value=lower value+(upper value−lower value)·x,
with x being a factor ranging between 0 and 1.
By means of the following equation:
Position chord length [%]=22+(0.6 value skeleton line angle at 22%)/[value skeleton line angle at 46%−value skeleton line angle at 22%)/24]
the position along the profile chord at which the value of the skeleton line angle distribution is 0.6 is calculated by interpolation between the values at 22% and 46% of the chord length. In this position, the value of the thickness distribution is just 1.
The upper and lower profiles and the intermediate profiles so defined can be provided at any vane section along the vane height. Preferably, the upper profile 1max will however be situated in vane mid and the lower profile 2min at the inner and outer sidewall of the bypass duct, while an interpolated intermediate profile 3int is situated between the inner or the outer sidewall, respectively, and the vane mid.
Number | Date | Country | Kind |
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10 2010 027 588 | Jul 2010 | DE | national |
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Entry |
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German Search Report dated Apr. 5, 2011 from counterpart application. |
Number | Date | Country | |
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20120014780 A1 | Jan 2012 | US |