The present disclosure is related to a fan frame having temperature detecting element and a fan having temperature detecting element.
The temperature detecting element of the conventional fan is disposed on the inlet of the conventional fan so as to detect the ambient temperature of the inlet. The detected temperature signal is transmitted to a control system to control the conventional fan. Because the temperature detecting element is mounted on a circuit board, the temperature of the circuit board may influence the detected temperature of the temperature detecting element and may result in big error.
The present invention provides a fan frame having temperature detecting element. The fan frame includes a body and a circuit board. The body is used for accommodating an impeller, and the body includes an inlet. The circuit board is installed around the inlet of the body, the circuit board includes a temperature detecting element, a first contact end, a second contact end, a first external contact terminal, a second external contact terminal, a first wire and a second wire. The first contact end and the second contact end are connected to the temperature detecting element. The temperature detecting element traverses the inlet. The first wire electrically connects the first contact end and the first external contact terminal. The second wire electrically connects the second contact end and the second external contact terminal. At least one of the first wire and the second wire includes a plurality of bending sections.
The present invention provides a fan having temperature detecting element. The fan includes a stator, an impeller and a fan frame. The fan frame includes a body and a circuit board. The body is used for accommodating the impeller and the stator, and the body includes an inlet. The circuit board is installed around the inlet of the body, the circuit board includes a temperature detecting element, a first contact end, a second contact end, a first external contact terminal, a second external contact terminal, a first wire and a second wire. The first contact end and the second contact end are connected to the temperature detecting element. The temperature detecting element traverses the inlet. The first wire electrically connects the first contact end and the first external contact terminal. The second wire electrically connects the second contact end and the second external contact terminal. At least one of the first wire and the second wire includes a plurality of bending sections.
By utilizing the bending sections of the first wire or the second wire, the length of the first wire or the second wire can be increased. Therefore, the influence in the temperature detecting element caused by the circuit board can be lowered and the error of the detecting temperature can be decreased.
The circuit board 42 is installed around the inlet 413 of the body 41. The circuit board 42 includes a temperature detecting element 421, a first contact end 422, a second contact end 423, a first external contact terminal 424, a second external contact terminal 425, a first wire 51 and a second wire 52. In an embodiment, the circuit board 42 can be a FR1 or FR4 substrate, preferably, the circuit board 42 is a FR1 substrate. The temperature detecting element 421 can be a DIP (Dual In-line Package) type temperature detecting element. The first body 411 includes two positioning pillars 414, 415. The circuit board 42 includes two positioning holes 426, 427. The place of the two positioning holes 426, 427 are corresponding to that of the two positioning pillars 414, 415 so that the two positioning holes 426, 427 are installed around the two positioning pillars 414, 415 to position the circuit board 42 on the first body 411. The circuit board 42 is formed as a circular ring shape.
The first contact end 422 and the second contact end 423 are connected to the temperature detecting element 421. The temperature detecting element 421 traverses the inlet 413, and is used for detecting the ambient temperature of the inlet 413. Then, the detected temperature signal is transmitted to a control system (not shown in the drawings) via the first external contact terminal 424 and the second external contact terminal 425. Further, the pins 428 of the temperature detecting element 421 can be covered by an isolation sleeve or a protection sleeve to avoid corrosion due to exposing in the air. Therefore, the lifetime of the temperature detecting element 421 can be extended.
The first wire 51 electrically connects the first contact end 422 and the first external contact terminal 424. The second wire 52 electrically connects the second contact end 423 and the second external contact terminal 425. The first wire 51 and the second wire 52 are mounted on the circuit board 42 in a layout arrangement. Preferably, the first wire 51 and the second wire 52 can be copper foils. At least one of the first wire 51 and the second wire 52 includes a plurality of bending sections. In an embodiment, both the first wire 51 and the second wire 52 include a plurality of bending sections. The first wire 51 includes a plurality of first bending sections 511, and the second wire 52 includes a plurality of second bending sections 521.
In an embodiment, the first bending section 511 includes at least one first curved segment 512, and the second bending section 521 includes at least one second curved segment 522. The first curved segment 512 and the second curved segment 522 are substantially formed as a semicircular shape. The first bending section 511 further includes at least one first straight line 513 for connecting two first curved segments 512. The second bending section 521 further includes at least one second straight line 523 for connecting two second curved segments 522.
A first path 61 (shown in a dashed line) is defined between the first contact end 422 and the first external contact terminal 424, and a second path 62 (shown in a dashed line) is defined between the second contact end 423 and the second external contact terminal 425. The first wire 51 is disposed on the first path 61, and the second wire 52 is disposed on the second path 62. Preferably, a length of the first wire 51 is larger than twice length of the first path 61, and a length of the second wire 52 is larger than twice length of the second path 62.
In an embodiment, the first bending sections 511 are substantially vertical to the first path 61, and the second bending sections 521 are substantially vertical to the second path 62. Preferably, the first wire 51 includes at least ten first bending sections 511, and the second wire 52 includes at least ten second bending sections 521.
By utilizing the first bending sections of the first wire and the second bending sections of the second wire, the length of the first wire and the second wire can be increased. Therefore, the influence in the temperature detecting element caused by the circuit board can be lowered and the error of the detecting temperature can be decreased.
While the embodiment of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and all modifications that maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
102131478 A | Sep 2013 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
6013966 | Fehrenbacher et al. | Jan 2000 | A |
7841541 | Ardelt | Nov 2010 | B2 |
8251655 | Chen et al. | Aug 2012 | B2 |
8253026 | Strauss | Aug 2012 | B2 |
20090016879 | Chen et al. | Jan 2009 | A1 |
Number | Date | Country |
---|---|---|
201165991 | Dec 2008 | CN |
101349284 | Jan 2009 | CN |
2000-283090 | Oct 2000 | JP |
2002-310506 | Oct 2002 | JP |
520150 | Feb 2003 | TW |
200904312 | Jan 2009 | TW |
201135177 | Oct 2011 | TW |
201135177 | Oct 2011 | TW |
Entry |
---|
Office Action and the Search Report issued on Apr. 21, 2016 by SIPO for the corresponding Chinese Patent Application No. 201410123203.X. |
English translation of the Search Report issued on Apr. 21, 2016 by SIPO for the corresponding Chinese Patent Application No. 201410123203.X. |
English abstract translation of CN101349284A. |
English abstract translation of JP 2000-283090A. |
English abstract translation of TW201135177A1. |
English abstract translation of JP 2002-310506A. |
English abstract translation of CN201165991Y. |
Office Action and Search Report issued on Jun. 17, 2015 by TIPO for the corresponding TW Patent Application No. 102131478. |
English translation of the Search Report issued on Jun. 17, 2015 by TIPO for the corresponding TW Patent Application No. 102131478. |
TW200904312 corresponds to US2009/0016879A1. |
English abstract translation of TW 201135177. |
English abstract translation of TW 520150. |
Number | Date | Country | |
---|---|---|---|
20150063979 A1 | Mar 2015 | US |