This non-provisional application claims priority under 35 U.S.C. ยง119(a) on Patent Application No(s). 201210428282.6 filed in China on Oct. 31, 2012, the entire contents of which are hereby incorporated by reference.
1. Technical Field
The disclosure relates to a fan module, and more particularly to a fan module with an adjustable air inlet.
2. Related Art
As the function of electronic products keeps enhancing, the thermal power of electronic components keeps enhancing accordingly. The computing speed of electronic products will reduce or even causes malfunctions if the heat of electronic components cannot be dissipated effectively. Therefore, heat dissipation is becoming more emphasized by people. Furthermore, heat dissipation is especially important for compact electronic products, such as laptops, hand-held computers and communication devices, etc.
Take the heat dissipation for a laptop as an example; a heat dissipation module is usually employed in the industry for dissipating the heat of various electronic components directly. Conventionally, the heat dissipation module in a laptop comprises a fan module, a heat pipe and a fin assembly. An end of the heat pipe is in thermal contact with the electronic components, and another end of the heat pipe is in thermal contact with the fin assembly. The heat produced by the electronic components is transferred by the heat pipe to the fin assembly of the heat dissipation module. Then, the operation of the fan module draws the hot air inside the electronic components and produces an air current to exchange heat with the fin assembly. Afterwards, the heat energy is discharged outside the electronic product. Thereby, the heat dissipation for the heating electronic components is achieved.
Generally, the fan module used inside a laptop is a centrifugal fan module for being disposed inside the laptop. The fan module mainly comprises a fan, an upper cover, a side cover and a lower cover. The fan is disposed between the upper cover and lower cover. The upper cover and the lower cover face an upper case and a lower case of the laptop respectively. The upper cover has an air inlet as well as the side cover between the upper cover and the lower cover has an air outlet. When the fan operates and produces an air current, the fan draws the hot air inside the laptop from the air inlet of the upper cover into the fan module. Then, the air current inside the fan is discharged from the air outlet. Thereby, the above mentioned operation can eliminate the hot air and the heat produced by the electronic components inside the laptop.
However, electronic products nowadays are designed to feature the characteristics of being compact, slim and light. In order to achieve the objectives of being compact, slim and light, a distance between the upper case and the lower case of a laptop has to be reduced. Therefore, the upper case and the lower case inside the laptop are respectively disposed proximate to the upper cover and the lower cover of the fan module. The upper case and the lower case will block an air current passage to the air inlet. When the air current passage is blocked, the amount of air current entering into the fan module is reduced substantially and the heat dissipation efficiency of the fan module is also reduced. When the heat dissipation efficiency of the fan module is reduced, the heat produced by the electronic components inside the laptop cannot be discharged effectively. This increases the temperatures of the electronic components and possibly reduces the computing speed of the laptop or even causes malfunction. Furthermore, fan modules with different designs are required for fitting different laptops when a distance between the upper case and the lower case of a laptop is different. This manufacturing mode for fitting different laptop models will increase the manufacturing cost of fan module substantially.
According to an embodiment of the disclosure, a fan module, for being disposed inside a case of an electronic device, comprises a case body, a blade assembly, a stopping plate and an adjusting element. The case body comprises a first case unit, a sidewall and a second case unit. The sidewall is connected between the first case unit and the second case unit to form an accommodating space together. At least one of the first case unit or the second case unit has an air inlet. The sidewall has an air outlet and an adjusting opening. The blade assembly is disposed inside the accommodating space. The stopping plate is disposed on the sidewall and is used for opening or closing the adjusting opening. The adjusting element is movably disposed on a side of the stopping plate and is used for pressing against the stopping plate. The adjusting element is used for moving between a first position and a second position. When the adjusting element moves from the first position toward the second position, the adjusting element pushes against the stopping plate and makes an end of the stopping plate to be offset toward the blade assembly, and produces a gap between the stopping plate and the sidewall.
A fan module disclosed in an embodiment of the present disclosure is used for disposing inside a case of an electronic device. The fan module comprises a case body, a blade assembly, a stopping plate and an adjusting element. The case body comprises a first case unit, a sidewall and a second case unit. The sidewall is connected between the first case unit and the second case unit in order to form an accommodating space together. At least the first case unit or the second case unit has an air inlet. The sidewall has an air outlet and an adjusting opening. The blade assembly is disposed inside the accommodating space. The stopping plate is disposed on the sidewall and is used for opening or closing the adjusting opening. The adjusting element is movably disposed on a side of the stopping plate and is used for pressing against the stopping plate. The adjusting element moves between a first position and a second position. When the adjusting element moves from the first position toward the second position, the adjusting element pushes against the stopping plate and makes an end of the stopping plate to offset toward the blade assembly. Thereby, a gap is produced between the stopping plate and the sidewall.
The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus is not limitative of the disclosure, and wherein:
The detailed characteristics and advantages of the disclosure are described in the following embodiments in details, the techniques of the disclosure can be easily understood and embodied by a person skilled in the art, and the related objects and advantages of the disclosure can be easily understood by a person skilled in the art by referring to the contents, the claims and the accompanying drawings disclosed in the specifications. The embodiments below are further used for explaining the disclosure rather than limiting the scope of the disclosure.
A fan module provided by the disclosure is disposed inside a case of an electronic device and used for eliminating hot air heated by the electronic device. In this embodiment, the fan module is a centrifugal fan module and the electronic device is a laptop, but they should not be construed as limitations to the disclosure. In other embodiments, the electronic device is a personal digital assistant (PDA), a tablet computer, a home gaming console or a computing device with compact and slim design.
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A fan module 10 of this embodiment comprises a case body 100, a blade assembly 200, a stopping plate 300 and an adjusting element 400. The case body 100 is used for protecting the elements inside the fan module 10 in order to prevent the elements inside the fan module 10 from being exposed to outside conditions. The case body 100 comprises a first case unit 110, a sidewall 120 and a second case unit 130. The first case unit 110 and the second case unit 130 are disposed oppositely to each other and kept away from each other at a distance. The first case unit 110 has an air inlet 111 and the air inlet 111 passes through the first case unit 110. In this embodiment and some of other embodiments, the second case unit 130 can also have another air inlet 131 and the air inlet 131 passes through the second case unit 130. The sidewall 120 is connected between the first case unit 110 and the second unit 130 in order so an accommodating space 140 is formed by the first case unit 110, the second case unit 130 and the sidewall 120 together. The sidewall 120 has an air outlet 121 and an adjusting opening 122. The air outlet 121 is disposed at a side of the sidewall 120. In this embodiment and some of other embodiments, the adjusting opening 122 has a first end 1221 and a second end 1222 disposed oppositely to each other. In this embodiment and some other embodiments, the sidewall 120 further comprises a socket 123. The socket 123 extends from the first case unit 110 toward the second case unit 130. The socket 123 has a hole 1231 and an opening 1232. The hole 1231 faces the outside of the case body 100 and the opening 1232 faces the accommodating space 140. However, the disposing position of the socket 123 should not be construed as a limitation to the disclosure. Please refer to
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The stopping plate 300 is disposed on the sidewall 120 and is used for opening or closing the adjusting opening 122. More specifically, the stopping plate 300 has a fixed end 310 and a free end 320. The fixed end 310 and the free end 320 are disposed oppositely to each other. The fixed end 310 is fixed on the sidewall 120 and is adjacent to the first end 1221 of the adjusting opening 122. The fixed end 310 can be fixed on the sidewall 120 by adhering or locking. But the means for fixing the fixed end 310 should not be construed as a limitation to the disclosure. In other embodiments, the fixed end 310 can be affixed to the sidewall 120 by employing other means. Furthermore, in this embodiment, the free end 320 extends from the fixed end 310 to the second end 1222. The free end 320 can be moved in relative to the sidewall 120 by an external force. Furthermore, the stopping plate 300 is disposed between the adjusting opening 122 and the blade assembly 200. But the disposing position of the stopping plate 300 should not be construed as a limitation to the disclosure. In other embodiments (not shown in the drawings), the stopping plate 300 can be disposed outside the case body 100. That means the stopping plate 300 is disposed between the adjusting opening 122 and an external space, and the fixed end 310 can be affixed to the outer side of the sidewall 120. The effects of the disclosure can also be achieved. Therefore, by employing the structure of the movable stopping plate 300, a size of a sectional area of an air current passage, which an external air enters into the accommodating space 140 through the adjusting opening 122, can be adjusted.
In this embodiment, the adjusting element 400 is movably disposed on a side of the stopping plate 300 and is used for pressing against the stopping plate 300. In other words, in this embodiment, the adjusting element 400 is inserted into the socket 123 from the hole 1231 in a movable manner such that the adjusting element 400 is pressed against the stopping plate 300 next to the socket 123. Please refer to
The way of how the adjusting element 400 adjusts a size of the adjusting opening 122 will be described hereinafter. Relative to the socket 123, the adjusting element 400 has a first position, a second position and a third position. Firstly, please refer to
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In the conventional techniques, the thinner a thickness between the upper case and the lower case of the electronic device, the more possibility for the upper case and the lower case of the electronic device to block the air current passages of the air inlet 111 of the first case unit 110 and the air inlet 131 of the second case unit 130, and the heat dissipation efficiency of the fan module 10 is therefore reduced. Therefore, in order to solve the problem of heat dissipation efficiency of the fan module 10, the fan module 10 according to the disclosure is disposed inside the case of the electronic device. During assembling, based on a distance between the upper case (not shown in the drawings) and the lower case (not shown in the drawings) of the electronic device, the upper case can be pressed against the adjusting element 400 in order to make the adjusting element 400 to move toward a direction of inserting into the socket 123. Thereby, the gap between the free end 320 of the stopping plate 300 and the sidewall 120 is increased in order to increase an amount of air current entering into the case body 100 from the adjusting opening 122. Therefore, when a thickness between the upper case and the lower case of the electronic device is thin, the gap between the free end 320 and the sidewall 120 can be enlarged in order to increase the inlet air amount and thereby enhancing the heat dissipation efficiency of the fan module 10.
According to the embodiments disclosed by the disclosure, the first position, the second position and the third position of the adjusting element 400 are used for describing the positions of the adjusting element 400 relatively to the socket 123, and for describing the operation of how the adjusting element 400 pushes against the stopping plate 300. Nevertheless, the positions mentioned are not used for defining the first position, the second position and the third position specifically.
According to the fan module disclosed in the above embodiments of the disclosure; the adjusting opening is disposed on the sidewall of the fan module; the adjusting element and the socket are disposed adjacent to the adjusting opening; the fixed end of the stopping plate is affixed to the sidewall and adjacent to the first end; and the free end of the stopping plate is disposed adjacent to adjusting opening. By embedding the adjusting element into a socket, the stopping plate is pressed against by the adjusting element and moves. Thereby, the gap is enlarged between one of the ends (the free end) of the stopping plate and the sidewall for adjusting an amount of inlet air of the adjusting opening. Thus, in comparing with the conventional technique, the fan module disclosed in the above embodiment of the disclosure can enlarge the gap between one of the ends (the free end) of the stopping plate and the sidewall based on the extent of the adjusting element embedding into the socket. Thereby, the amount of inlet air of the adjusting opening can be increased and the heat dissipation efficiency of the fan module can be enhanced. Furthermore, an amount of inlet air to the fan module of the disclosure can be adjusted for fitting electronic devices with different thicknesses of the casing. Therefore, the fan module of the disclosure can be used in various electronic devices so the designing and manufacturing of different models of fan modules are not required. Thereby, the fan module of the disclosure can solve the problem of conventional fan modules not being able to fit various models of electronic devices and can reduce the manufacturing cost.
Note that the specifications relating to the above embodiments should be construed as exemplary rather than as limitative of the disclosure, with many variations and modifications being readily attainable by a person skilled in the art without departing from the spirit or scope thereof as defined by the appended claims and their legal equivalents.
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2012 1 0428282 | Oct 2012 | CN | national |
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