Claims
- 1. A packaged adhesive/sealant composition comprising:a) an aluminum or aluminum-lined package; and b) a one-part, moisture-curable silylated polymer-based adhesive/sealant composition comprising a moisture-curable silylated polymer and an amount of a hydrophilic solvent effective to accelerate the cure-through rate of said adhesive/sealant composition, wherein said composition is sealed within the package, is substantially free of alcohols, and is non-reactive with the aluminum of the package.
- 2. The packaged adhesive/sealant composition of claim 1 wherein the package is an aluminum or aluminum-lined cartridge suitable for direct application of the composition.
- 3. The packaged adhesive/sealant composition of claim 1 wherein said hydrophilic solvent is present in an amount of about 0.1 to about 10 weight percent, based on the total weight of the composition.
- 4. The packaged adhesive/sealant composition of claim 1 wherein said hydrophilic solvent is selected from the group consisting of oxygen and nitrogen containing organic solvents and mixtures thereof, and has a flash point of less than about 45° C. (open cup) and an evaporation rate of at least 1, with n-butyl acetate defined as having an evaporation rate of 1.
- 5. A packaged adhesive/sealant composition comprising:a) an aluminum or aluminum-lined package; and b) an adhesive/sealant composition comprising a moisture-curable silylated polymer selected from the group consisting of silylated polyurethanes, silylated polyethers, and combinations thereof, and from about 0.1 to about 10 weight percent of a hydrophilic solvent; wherein said composition is sealed within said package, is substantially free of alcohols, and is non-reactive with the aluminum of said package.
- 6. The packaged adhesive/sealant composition of claim 5 wherein said hydrophilic solvent comprises one or more esters selected from the group consisting of amyl formate, ethyl acetate, isopropyl acetate, n-propyl acetate, ethyl propionate, isobutyl acetate and n-butyl acetate.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a division of U.S. patent application Ser. No. 09/218,573, now U.S. Pat. No. 6,124,387 filed Dec. 22, 1998.
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