The present invention relates to a fastening structure and, more particularly, to a fastening structure for fastening a member having a high thermal conductivity.
It is common to fasten a member by heat staking in cameras, mobile phones, or other various pieces of equipment. Japanese Patent Application No. 2003-264025A, for example, shows a fastening structure for heat staking in an electrical connector.
In an automobile application, a metal member having a high thermal conductivity is fastened by resin heat staking in a piece of equipment installed in the automobile. In the case of a piece of equipment installed in an engine compartment of an automobile, it is necessary to ensure the operation of the equipment in a wide temperature range, for example, from −40 to 150° C. The thermal conductivity and the coefficient of thermal expansion, however, is significantly different between metal and resin. Accordingly, for the fastening structure, a diameter of a passageway formed in a metal material through which a protrusion for heat staking, provided on a resin material, penetrates must be larger than the diameter of the protrusion; a gap between a wall face of the passageway and the protrusion is necessary to absorb a dimensional change due to the difference in coefficient of thermal expansion and prevent distortion.
Heat staking, however, requires heating and melting the protrusion. During melting of the protrusion, molten resin can flow into the gap between the protrusion and the wall face of the passageway, filling the gap. Japanese Patent Application No. 2008-162125A discloses a fastening structure having a gap between the protrusion and the passageway, but ensures that the gap is filled. When the gap is filled, the dimensional change due to the coefficient of thermal expansion is no longer absorbed, which can lead to distortion of the fastening structure.
A fastening structure comprises a first plate, a second plate, and a sheet member. The first plate has a first passageway with a first diameter. The second plate has a protrusion with a second diameter smaller than the first diameter. The sheet member is disposed on the first plate such that a second passageway of the sheet member communicates with the first passageway of the first plate and the first plate is interposed between the sheet member and the second plate. A portion of the protrusion extends through the first passageway and the second passageway. The first plate is fastened to the second plate by thermal deformation of the portion of the protrusion extending through the first passageway and the second passageway or by overmolding to the portion of the protrusion extending through the first passageway and the second passageway.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
Exemplary embodiments of the present invention will be described hereinafter in detail with reference to the attached drawings, wherein like reference numerals refer to like elements. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the concept of the disclosure to those skilled in the art.
A component 100 according to an embodiment is shown in
A plurality of head portions 22 for fastening an upper first plate 10 of the pair of first plates 10, 10 to the second plate 20 by heat-staking are shown in
The second plate 20 is formed of a thermoplastic resin and, as shown in
The first plate 10 is formed of a metal material and, as shown in
As shown in
During heat staking, as shown in
The sheet member 30 has a lower thermal conductivity than the second plate 20; in various embodiments, the sheet member 30 is a fluorine-based sheet having a thermal conductivity of approximately 0.2 W/mK or a polyimide-based sheet. A heatproof temperature of the sheet member 30 is higher than the melting point of the second plate 20. In an embodiment in which the second plate 20 is made of PBT, the sheet member 30 is required to withstand 223° C.
After the sheet member 30 is placed, as shown in
The first plate 10 and the second plate 20 are also significantly different in coefficient of thermal expansion. Accordingly, if the environmental temperature becomes high without the gap secured, a distortion occurs at the gap, deforming the component and leading to operation difficulties. In the component 100, a dimensional change due to the difference in coefficient of thermal expansion is absorbed by the gap while the sheet member 30, having a low thermal conductivity, prevents a melted portion of the heat-staking protrusion 21 from entering the gap. Deformation of the component 100 is thereby prevented even in a high-temperature environment.
A fastening structure for fastening the first plate 10 to the second plate 20 by heat staking by heating and melting the heat staking protrusion 21 has been described. However, the fastening structure of the present invention is not limited to fastening by heat staking. In other embodiments a fastening method using overmolding in which molten resin or the like is poured in as to cover a protrusion equivalent to the heat-staking protrusion 21 in the embodiment described above may also be used. In addition, the present invention is not limited to the first plate 10 and the second plate 20. The fastening structure of the present invention is applicable in a wide range of applications in which a member having a high thermal conductivity is fastened by heat staking or overmolding.
Number | Date | Country | Kind |
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2015-215422 | Nov 2015 | JP | national |
This application is a continuation of PCT International Application No. PCT/JP2016/081684, filed on Oct. 26, 2016, which claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. 2015-215422, filed on Nov. 2, 2015.
Number | Date | Country | |
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Parent | PCT/JP2016/081684 | Oct 2016 | US |
Child | 15968923 | US |