FAULT MANAGED POWER IN A POWER DISTRIBUTION UNIT

Information

  • Patent Application
  • 20250038494
  • Publication Number
    20250038494
  • Date Filed
    July 27, 2023
    a year ago
  • Date Published
    January 30, 2025
    3 months ago
Abstract
A power distribution unit (PDU) includes a housing configured to be mounted into or on a rack that has a plurality of shelf positions for a variety of computing equipment, networking equipment or data storage equipment. The PDU includes power inputs. The power inputs are configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power. The PDU further includes at least one fault managed power module configured to be contained in the housing, the at least one fault managed power module including a power transmitter configured to generate single-phase or multi-phase fault managed power from the AC power and/or high voltage DC power. The PDU also includes a plurality of connectors on the housing and configured to provide cable connections to one or more of the plurality of shelf positions of the rack.
Description
TECHNICAL FIELD

The present disclosure relates to power distribution devices.


BACKGROUND

Fault Managed Power (FMP) techniques have typically been employed for power transmission on a cable over distances between a power transmitter and a power receiver, typically many meters. There is a desire to provide FMP functionality in industry-accepted form factors that add modular adaptability, and for much more localized distribution, such as in a rack.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a block diagram of a power distribution unit configured to distribute power, including fault managed power, in a rack unit deployment, in accordance with an example embodiment.



FIG. 2 is a diagram depicting the power distribution unit in a horizontal blade-like form factor and deployed in a shelf of a rack, according to an example embodiment.



FIG. 3 is a diagram depicting the power distribution unit in a vertical power strip or bus bar form factor and deployed in a rack, according to an example embodiment.



FIG. 4 is a block diagram of the power distribution unit with a plurality of vertically stacked power processing and other modules, according to an example embodiment.



FIG. 5 is a block diagram of a fault managed power processing module that may be one of several power processing modules in the power distribution unit, according to an example embodiment.



FIG. 6 is a block diagram of a device that may be configured to perform operations of the various embodiments depicted in FIGS. 1-5, according to an example embodiment.





DESCRIPTION OF EXAMPLE EMBODIMENTS
Overview

A power distribution apparatus is presented herein. The power distribution apparatus or power distribution unit (PDU) includes a housing configured to be mounted into or on a rack that has a plurality of shelf positions for a variety of computing equipment, networking equipment or data storage equipment. The PDU includes power inputs. The power inputs are configured to receive one or more of (a) alternating current (AC) power, (b) high voltage direct current (DC) power or (c) single-phase or multi-phase fault managed power. The PDU further includes at least one fault managed power module configured to be contained in the housing, the at least one fault managed power module including a power transmitter configured to generate single-phase or multi-phase fault managed power from the AC power and/or high voltage DC power. The PDU also includes a plurality of connectors on the housing and configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, or single-phase or multi-phase fault managed power.


Example Embodiments

Reference is first made to FIG. 1, which shows a block diagram of a power distribution unit (PDU) 100 in accordance with an example embodiment. The PDU 100 includes a housing 110 that contains various components and supports various ports/connectors. The PDU 100 includes one or more power inputs 120 coupled to/on the housing 110, one or more power processing modules 130(1)-130(N), a power line communication (PLC) module 140, an uplink 150 and a plurality of output ports 160 on the housing 110. The PLC module 140 enables communication of data on a conductor that is also used simultaneously for AC electric power transmission or electric power distribution.


Some of the output ports 160 may be physically proximate the respective power processing modules 130(1)-130(N) and PLC module 140, but for simplicity the output ports 160 are shown aggregated together. As an example, some of the output ports 160 support fault managed power and data (e.g., 10 Mb of data).


The power inputs 120 may be configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power (FMP), or multi-phase FMP. In one example, the power input sources may include the 415/239V AC rack power, at 100 amps and 54 kW, or at 50 amps and 27 kW, where 54 kW and 27 kW are the maximum load for such circuits based on the U.S. National Electrical Code (NEC). Specifically, For 415 VAC at 100 amps, three phase power, 415*100*sqrt (3)=71 kW, but the NEC requires powering to only 80% of the load, which is 57.5 kW (54k W is safely less than that). For 415V at 50 amps, the maximum load allowed on that circuit is 27 kW.


“FMP” refers to power that is provided in a manner such that it can be interrupted or terminated in the event that a fault is detected on the line over which the power is being transmitted/delivered. In one example implementation of FMP, a power transmitter (in a power processing module of the PDU 100) provides electrical power to a power receiver in a destination device. The power transmitter, power receiver or both the power transmitter and power receive may be configured to detect a fault on the line carrying the power between them, and cause the power to be interrupted or terminated over the line.


At least one of the power processing modules 130(1)-130(N) may be configured to provide fault managed power, as shown in FIG. 1. As will be described below, the at least one fault managed power module, e.g., power processing module 130(N), includes a power transmitter configured to generate single-phase or multi-phase fault managed power from the AC power and/or high voltage DC power that is input to the PDU 100.


As shown in FIG. 1, the output ports 160 are configured to provide cable connections to one or more of the plurality of shelf positions of a rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.


Thus, the PDU 100 may be configured to receive as input AC power and create fault managed power for distribution to various devices in a rack, for example. The space in the PDU 100 that is normally not used is employed to integrate fault managed power capabilities spread that capability throughout the PDU 100.


As alluded to above, the PDU 100 may be configured to distribute fault managed power throughout a rack, which is not heretofore known. FMP has been primarily used for a box-to-box power transmission technology targeted for longer distances (many meters, e.g., 5-15 or more meters) using external cables. Integrating FMP capability in a PDU solves a different problem where the power is for local use. For example, the PDU 100 is configured for distributing power in a server/blade rack there the distances are typically approximately 84 inches in height, 36-42 inches in depth and 19 inches in width.


As explained above, the input to the PDU 100 could be AC power, or high voltage DC power that gets adjusted down inside the box to do FMP. When high(er) voltage DC power is provided as an input to the PDU 100, the one or more power processing modules 130(1)-130(N) include the capability to step/adjust that voltage down, which reduces safety issues. That is, if higher voltage is needed for some applications, providing the higher voltage with FMP allows providing such higher voltage power with safety. Alternatively, or in addition, the input to the PDU 100 may be fault managed power (single-phase or multi-phase) and then one of the power processing modules 130(1)-130(N) in the PDU 100 includes an inverter to output AC power to devices or raw DC power.


The housing 110 of the PDU 100 may be configured to horizontally mount in one of the plurality of shelfs of a rack. To this end, reference is made to FIG. 2. FIG. 2 shows a rack 200 in which a PDU 210 (that is similar in configuration to the PDU 100 shown in FIG. 1) contained within housing 212 is deployed in a shelf of the rack. In one example, the PDU 210 is deployed in a top-of-rack shelf, but that is only an example, and the PDU 210 could be deployed in a middle-of-rack or bottom-of-rack shelf position in the rack 200. The PDU 210 provides power (and optionally data) to devices 220(1)-220(M) in the other shelf positions of the rack 200. For simplicity, the cable connections from the PDU 210 to the devices 220(1)-220(M) are not shown in FIG. 2.


In still another example, the PDU may be deployed as a vertical bar or power strip that is mounted or hung at the rear of a rack, in a so-called zero RU form factor. Reference is now made to FIG. 3, which is a rear view of a rack 300 in which a PDU 310 (having a configuration similar to PDU 100 shown in FIG. 1) is deployed in a vertical bus bar (or power strip) arrangement. The PDU 310 may extend the height of the rack 300 (e.g., 84 inches) and distribute power to less than a 7 foot span. The PDU 310 is contained with a housing 312 along with power processing modules 314(1), 314(2), 314(3), . . . , 314(N). The housing 312 may be embodied as a bus bar to which the power processing modules 314(1)-314(N) removably installed. There are output ports 316 arranged along the housing 312. One or more uplink ports 318 may be deployed at the top of the housing 312 to provide uplink connectivity to the PDU 310. The housing 312 may be attached to the rear of the rack 300 by swing brackets 320 that allow the PDU 310 to swing out to facilitate access to it, as shown by arrows 322. The dimensions of the housing 312 may vary, but in one example, it may be 2-3 inches wide, 6 inches deep, and approximately 80 inches high.


In one form, the housing 312 has a plurality of module positions 313(1), 313(2), 313(3), . . . , 313(N). Each module position is configured to removably receive one of the power processing modules 314(1)-314(N), such as by a plug-in connection arrangement. Examples of such suitable plug-in connection technologies that may be used for the power processing modules 314(1)-314(N) include any suitable plug-in technologies. The power processing modules 314(1)-314(N) may be factory or field programmable according to a desired power processing function, e.g., to generate single-phase or multi-phase fault managed power, to generate high voltage DC power, to generate AC power, etc. That is, the power processing modules 314(1)-314(N) may do various conversions, such AC-to-DC, AC-to-AC, FMP-to-DC, FMP-to-AC, FMP-to-FMP, FMP-to-POE, AC-to-PoE, as well as DC-to-FMP, DC-to-AC, and DC-to-DC. The housing 312 may expose power inputs 330 where input power is supplied to the PDU 310. In one example, the power inputs 330 may be positioned at the bottom of the housing 312 as shown in FIG. 3. The PDU 310 may be configured to provide output power in the aforementioned various forms in any suitable number, such as 36 ports of FMP, for example.



FIG. 3 also shows that there are connections between the PDU 310 and the devices mounted in the rack. For example, there is a device 340 on a shelf of the rack 300 and there are cable connections 342 between the output ports 316 on the PDU 310 and ports 344 on the back-panel of the device 340. In addition, there is a device 350 mounted on another shelf of the rack 300. There are wire loop connections 352 between output ports 316 and ports 354 on the back-panel of the device 350.


Reference is now made to FIG. 4. FIG. 4 shows a depiction of an example arrangement of power processing modules and other functional blocks of a PDU 400, according to the techniques presented here. The PDU 400 has a vertically stacked arrangement of modules and blocks, such as an arrangement useful in the deployment of FIG. 3. The PDU 400 includes power inputs 410, a PoE power processing module 412, a power supply unit (PSU) 414, an FMP power processing module 416, a PSU 418, an AC and/or PLC module 420, a PSU 422, and an uplink module 424. Input power is coupled into the power inputs 410. The PoE power processing module 412 generates PoE power for transmission (with data), which may be useful for sensors and controllers. The PSUs 414, 418 and 422 provide PSU power. The FMP power processing module 416 provides fault managed power. The AC and/or PLC module provides AC or PLC communications. The uplink module 424 provides data uplink functions for the PDU 400.


Reference is now made to FIG. 5, which shows a block diagram of an FMP power processing module 500, according to an example embodiment. The FMP power processing module 500 may be configured to serve as a power transmitter, a power receiver, or both a power transmitter and power receiver. The FMP power processing module 500 includes an AC/DC converter 510 (which is optional or may be selectively invoked), a power transmitter 520, a power receiver 530, a controller 540, a switch 550 coupled between the power transmitter 520 and a send line 560, and a switch 570 coupled between a receive line 580 and the power transmitter 520. One or more sensors 585 are coupled to the send and/or receive lines 560 and 580 to sense voltage and/or current on the send line 560 and/or receive line 580. The controller 540 is coupled to the sensors 585 and to each of the switches 550 and 570. The controller 540 may be a microprocessor or microcontroller that is programmed to analyze the output of the sensor(s) 585 to detect conditions on the send line 560 and/or receive line 580 that are indicative of a fault.


In operation, when the input power is AC power, then the AC/DC converter 510 is invoked to convert the AC power to DC power. The power transmitter 520 generates a power waveform to transmit the power, via switch 550 over send line 560. In one example, the power transmitter 520 may include one or more switches to modulate the DC power into current or voltage pulses. The sensor(s) 585 monitor conditions on the send line 560 and/or receive line 580 to detect voltage or current conditions. The controller 540 obtains the output from the sensor(s) 585 and evaluates the output(s) of the sensor(s) 585 to determine if the voltage or current changes indicate a fault caused by a human touch or contact event, which could potentially harmful. When the controller 540 detects a fault, the controller 540 may cause switch 550 (and optionally switch 560) to open, and thereby disconnect power from the power transmitter from being applied to the send line 560. The power receiver 530 may receive power supplied by a remote device via the send line 560.


Thus, as depicted in FIGS. 1-5, a PDU is provided with field or factory installable variant processing subsystems that enable PoE ports (for environmental monitoring or security), FMP ports (for high efficiency powering of large loads in the rack), or traditional AC power, with optional PLC or single pair Ethernet communications to power legacy loads that do not support FMP/PoE. The FMP configuration could be as a transmitter, or a receiver, or both in the case where a PDU receives FMP and then retransmits FMP to downstream devices.



FIG. 6 illustrates a hardware block diagram of a device 600 that may perform functions associated with operations discussed herein in connection with the techniques depicted in FIGS. 1-5.


In at least one embodiment, the device 600 may be any apparatus that may include one or more processor(s) 602, one or more memory element(s) 604, storage 606, a bus 608, one or more network processor unit(s) 610 interconnected with one or more network input/output (I/O) interface(s) 612, one or more I/O interface(s) 614, and control logic 620. In various embodiments, instructions associated with logic for device 600 can overlap in any manner and are not limited to the specific allocation of instructions and/or operations described herein.


In at least one embodiment, processor(s) 602 is/are at least one hardware processor configured to execute various tasks, operations and/or functions for device 600 as described herein according to software and/or instructions configured for device 600. Processor(s) 602 (e.g., a hardware processor) can execute any type of instructions associated with data to achieve the operations detailed herein. In one example, processor(s) 602 can transform an element or an article (e.g., data, information) from one state or thing to another state or thing. Any of potential processing elements, microprocessors, digital signal processor, baseband signal processor, modem, PHY, controllers, systems, managers, logic, and/or machines described herein can be construed as being encompassed within the broad term ‘processor’.


In at least one embodiment, memory element(s) 604 and/or storage 606 is/are configured to store data, information, software, and/or instructions associated with device 600, and/or logic configured for memory element(s) 604 and/or storage 606. For example, any logic described herein (e.g., control logic 620) can, in various embodiments, be stored for device 600 using any combination of memory element(s) 604 and/or storage 606. Note that in some embodiments, storage 606 can be consolidated with memory element(s) 604 (or vice versa), or can overlap/exist in any other suitable manner.


In at least one embodiment, bus 608 can be configured as an interface that enables one or more elements of device 600 to communicate in order to exchange information and/or data. Bus 608 can be implemented with any architecture designed for passing control, data and/or information between processors, memory elements/storage, peripheral devices, and/or any other hardware and/or software components that may be configured for device 600. In at least one embodiment, bus 608 may be implemented as a fast kernel-hosted interconnect, potentially using shared memory between processes (e.g., logic), which can enable efficient communication paths between the processes.


In various embodiments, network processor unit(s) 610 may enable communication between device 600 and other systems, entities, etc., via network I/O interface(s) 612 (wired and/or wireless) to facilitate operations discussed for various embodiments described herein. In various embodiments, network processor unit(s) 610 can be configured as a combination of hardware and/or software, such as one or more Ethernet driver(s) and/or controller(s) or interface cards, Fibre Channel (e.g., optical) driver(s) and/or controller(s), wireless receivers/transmitters/transceivers, baseband processor(s)/modem(s), and/or other similar network interface driver(s) and/or controller(s) now known or hereafter developed to enable communications between device 600 and other systems, entities, etc. to facilitate operations for various embodiments described herein. In various embodiments, network I/O interface(s) 612 can be configured as one or more Ethernet port(s), Fibre Channel ports, any other I/O port(s), and/or antenna(s)/antenna array(s) now known or hereafter developed. Thus, the network processor unit(s) 610 and/or network I/O interface(s) 612 may include suitable interfaces for receiving, transmitting, and/or otherwise communicating data and/or information in a network environment.


I/O interface(s) 614 allow for input and output of data and/or information with other entities that may be connected to device 600. For example, I/O interface(s) 614 may provide a connection to external devices such as a keyboard, keypad, a touch screen, and/or any other suitable input and/or output device now known or hereafter developed. In some instances, external devices can also include portable computer readable (non-transitory) storage media such as database systems, thumb drives, portable optical or magnetic disks, and memory cards. In still some instances, external devices can be a mechanism to display data to a user, such as, for example, a computer monitor, a display screen, or the like.


In various embodiments, control logic 620 can include instructions that, when executed, cause processor(s) 602 to perform operations, which can include, but not be limited to, providing overall control operations of computing device; interacting with other entities, systems, etc. described herein; maintaining and/or interacting with stored data, information, parameters, etc. (e.g., memory element(s), storage, data structures, databases, tables, etc.); combinations thereof; and/or the like to facilitate various operations for embodiments described herein.


The programs described herein (e.g., control logic 620) may be identified based upon application(s) for which they are implemented in a specific embodiment. However, it should be appreciated that any particular program nomenclature herein is used merely for convenience; thus, embodiments herein should not be limited to use(s) solely described in any specific application(s) identified and/or implied by such nomenclature.


In various embodiments, any entity or apparatus as described herein may store data/information in any suitable volatile and/or non-volatile memory item (e.g., magnetic hard disk drive, solid state hard drive, semiconductor storage device, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM), application specific integrated circuit (ASIC), etc.), software, logic (fixed logic, hardware logic, programmable logic, analog logic, digital logic), hardware, and/or in any other suitable component, device, element, and/or object as may be appropriate. Any of the memory items discussed herein should be construed as being encompassed within the broad term ‘memory element’. Data/information being tracked and/or sent to one or more entities as discussed herein could be provided in any database, table, register, list, cache, storage, and/or storage structure: all of which can be referenced at any suitable timeframe. Any such storage options may also be included within the broad term ‘memory element’ as used herein.


Note that in certain example implementations, operations as set forth herein may be implemented by logic encoded in one or more tangible media that is capable of storing instructions and/or digital information and may be inclusive of non-transitory tangible media and/or non-transitory computer readable storage media (e.g., embedded logic provided in: an ASIC, digital signal processing (DSP) instructions, software [potentially inclusive of object code and source code], etc.) for execution by one or more processor(s), and/or other similar machine, etc. Generally, memory element(s) 604 and/or storage 606 can store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, and/or the like used for operations described herein. This includes memory element(s) 604 and/or storage 606 being able to store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, or the like that are executed to carry out operations in accordance with teachings of the present disclosure.


In some instances, software of the present embodiments may be available via a non-transitory computer useable medium (e.g., magnetic or optical mediums, magneto-optic mediums, CD-ROM, DVD, memory devices, etc.) of a stationary or portable program product apparatus, downloadable file(s), file wrapper(s), object(s), package(s), container(s), and/or the like. In some instances, non-transitory computer readable storage media may also be removable. For example, a removable hard drive may be used for memory/storage in some implementations. Other examples may include optical and magnetic disks, thumb drives, and smart cards that can be inserted and/or otherwise connected to a computing device for transfer onto another computer readable storage medium.


In some aspects, the techniques described herein relate to a power distribution apparatus including: a housing configured to be mounted into or on a rack that has a plurality of shelf positions; power inputs coupled to the housing, the power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power; at least one fault managed power module configured to be contained in the housing, the at least one fault managed power module including a power transmitter configured to generate single-phase fault managed power or multi-phase fault managed power from the AC power, the high voltage DC power, the single-phase fault managed power or the multi-phase fault managed power; and a plurality of connectors on the housing and configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the housing is configured to horizontally mount in one of the plurality of shelf positions of the rack.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the housing is configured to vertically mount to the rack.


In some aspects, the techniques described herein relate to a power distribution apparatus, further including a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein further including a bus bar configured to mount inside the housing and having a plurality of module positions, each module position configured to removably receive a power processing module, wherein the power processing module is configured to generate or output one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, or AC power.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the power processing module is factory or field configurable to generate one of a plurality of power types.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.


In some aspects, the techniques described herein relate to a power distribution apparatus, further including a data uplink.


In some aspects, the techniques described herein relate to a power distribution apparatus, further including a power module configured to provide AC power and data communications over AC power.


In some aspects, the techniques described herein relate to a power distribution apparatus including: power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power; a bus bar configured to mount to a rack that has a plurality of shelf positions, the bus bar having a plurality of module positions, each module position configured to removably receive a power processing module, wherein the power processing module is configured to generate or output one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, or AC power; and a plurality of connectors configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.


In some aspects, the techniques described herein relate to a power distribution apparatus, further including a housing that contains the bus bar and is configured to be mounted into or on a rack.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the housing is configured to vertically mount to the rack, and further including a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the power processing module is factory or field configurable to generate one of a plurality of power types.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.


In some aspects, the techniques described herein relate to a power distribution apparatus including: power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power; a bus bar configured to mount to a rack that has a plurality of shelf positions, the bus bar having a plurality of module positions; a plurality of power processing modules, each power processing module of the plurality of power processing modules configured to generate or output at least one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, lower voltage DC power or AC power; and a plurality of connectors configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.


In some aspects, the techniques described herein relate to a power distribution apparatus, further including a housing that contains the bus bar and is configured to be mounted into or on a rack.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the housing is configured to horizontally mount in one of the plurality of shelf positions of the rack.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein the housing is configured to vertically mount to the rack, and further including a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein at least one of the plurality of power processing modules is factory or field configurable to generate one of a plurality of power types.


In some aspects, the techniques described herein relate to a power distribution apparatus, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.


Variations and Implementations

Embodiments described herein may include one or more networks, which can represent a series of points and/or network elements of interconnected communication paths for receiving and/or transmitting messages (e.g., packets of information) that propagate through the one or more networks. These network elements offer communicative interfaces that facilitate communications between the network elements. A network can include any number of hardware and/or software elements coupled to (and in communication with) each other through a communication medium. Such networks can include, but are not limited to, any local area network (LAN), virtual LAN (VLAN), wide area network (WAN) (e.g., the Internet), software defined WAN (SD-WAN), wireless local area (WLA) access network, wireless wide area (WWA) access network, metropolitan area network (MAN), Intranet, Extranet, virtual private network (VPN), Low Power Network (LPN), Low Power Wide Area Network (LPWAN), Machine to Machine (M2M) network, Internet of Things (IoT) network, Ethernet network/switching system, any other appropriate architecture and/or system that facilitates communications in a network environment, and/or any suitable combination thereof.


Networks through which communications propagate can use any suitable technologies for communications including wireless communications (e.g., 4G/5G/nG, IEEE 802.11 (e.g., Wi-Fi®/Wi-Fi6®), IEEE 802.16 (e.g., Worldwide Interoperability for Microwave Access (WiMAX)), Radio-Frequency Identification (RFID), Near Field Communication (NFC), Bluetooth™, mm.wave, Ultra-Wideband (UWB), etc.), and/or wired communications (e.g., T1 lines, T3 lines, digital subscriber lines (DSL), Ethernet, Fibre Channel, etc.). Generally, any suitable means of communications may be used such as electric, sound, light, infrared, and/or radio to facilitate communications through one or more networks in accordance with embodiments herein. Communications, interactions, operations, etc. as discussed for various embodiments described herein may be performed among entities that may directly or indirectly connected utilizing any algorithms, communication protocols, interfaces, etc. (proprietary and/or non-proprietary) that allow for the exchange of data and/or information.


In various example implementations, any entity or apparatus for various embodiments described herein can encompass network elements (which can include virtualized network elements, functions, etc.) such as, for example, network appliances, forwarders, routers, servers, switches, gateways, bridges, loadbalancers, firewalls, processors, modules, radio receivers/transmitters, or any other suitable device, component, element, or object operable to exchange information that facilitates or otherwise helps to facilitate various operations in a network environment as described for various embodiments herein. Note that with the examples provided herein, interaction may be described in terms of one, two, three, or four entities. However, this has been done for purposes of clarity, simplicity and example only. The examples provided should not limit the scope or inhibit the broad teachings of systems, networks, etc. described herein as potentially applied to a myriad of other architectures.


Communications in a network environment can be referred to herein as ‘messages’, ‘messaging’, ‘signaling’, ‘data’, ‘content’, ‘objects’, ‘requests’, ‘queries’, ‘responses’, ‘replies’, etc. which may be inclusive of packets. As referred to herein and in the claims, the term ‘packet’ may be used in a generic sense to include packets, frames, segments, datagrams, and/or any other generic units that may be used to transmit communications in a network environment. Generally, a packet is a formatted unit of data that can contain control or routing information (e.g., source and destination address, source and destination port, etc.) and data, which is also sometimes referred to as a ‘payload’, ‘data payload’, and variations thereof. In some embodiments, control or routing information, management information, or the like can be included in packet fields, such as within header(s) and/or trailer(s) of packets. Internet Protocol (IP) addresses discussed herein and in the claims can include any IP version 4 (IPv4) and/or IP version 6 (IPv6) addresses.


To the extent that embodiments presented herein relate to the storage of data, the embodiments may employ any number of any conventional or other databases, data stores or storage structures (e.g., files, databases, data structures, data or other repositories, etc.) to store information.


Note that in this Specification, references to various features (e.g., elements, structures, nodes, modules, components, engines, logic, steps, operations, functions, characteristics, etc.) included in ‘one embodiment’, ‘example embodiment’, ‘an embodiment’, ‘another embodiment’, ‘certain embodiments’, ‘some embodiments’, ‘various embodiments’, ‘other embodiments’, ‘alternative embodiment’, and the like are intended to mean that any such features are included in one or more embodiments of the present disclosure, but may or may not necessarily be combined in the same embodiments. Note also that a module, engine, client, controller, function, logic or the like as used herein in this Specification, can be inclusive of an executable file comprising instructions that can be understood and processed on a server, computer, processor, machine, compute node, combinations thereof, or the like and may further include library modules loaded during execution, object files, system files, hardware logic, software logic, or any other executable modules.


It is also noted that the operations and steps described with reference to the preceding figures illustrate only some of the possible scenarios that may be executed by one or more entities discussed herein. Some of these operations may be deleted or removed where appropriate, or these steps may be modified or changed considerably without departing from the scope of the presented concepts. In addition, the timing and sequence of these operations may be altered considerably and still achieve the results taught in this disclosure. The preceding operational flows have been offered for purposes of example and discussion. Substantial flexibility is provided by the embodiments in that any suitable arrangements, chronologies, configurations, and timing mechanisms may be provided without departing from the teachings of the discussed concepts.


As used herein, unless expressly stated to the contrary, use of the phrase ‘at least one of’, ‘one or more of’, ‘and/or’, variations thereof, or the like are open-ended expressions that are both conjunctive and disjunctive in operation for any and all possible combination of the associated listed items. For example, each of the expressions ‘at least one of X, Y and Z’, ‘at least one of X, Y or Z’, ‘one or more of X, Y and Z’. ‘one or more of X. Y or Z’ and ‘X, Y and/or Z’ can mean any of the following: 1) X, but not Y and not Z; 2) Y, but not X and not Z; 3) Z, but not X and not Y; 4) X and Y, but not Z; 5) X and Z, but not Y; 6) Y and Z, but not X; or 7) X, Y, and Z.


Each example embodiment disclosed herein has been included to present one or more different features. However, all disclosed example embodiments are designed to work together as part of a single larger system or method. This disclosure explicitly envisions compound embodiments that combine multiple previously-discussed features in different example embodiments into a single system or method.


Additionally, unless expressly stated to the contrary, the terms ‘first’, ‘second’, ‘third’, etc., are intended to distinguish the particular nouns they modify (e.g., element, condition, node, module, activity, operation, etc.). Unless expressly stated to the contrary, the use of these terms is not intended to indicate any type of order, rank, importance, temporal sequence, or hierarchy of the modified noun. For example, ‘first X’ and ‘second X’ are intended to designate two ‘X’ elements that are not necessarily limited by any order, rank, importance, temporal sequence, or hierarchy of the two elements. Further as referred to herein, ‘at least one of’ and ‘one or more of’ can be represented using the ‘(s)’ nomenclature (e.g., one or more element(s)).


One or more advantages described herein are not meant to suggest that any one of the embodiments described herein necessarily provides all of the described advantages or that all the embodiments of the present disclosure necessarily provide any one of the described advantages. Numerous other changes, substitutions, variations, alterations, and/or modifications may be ascertained to one skilled in the art and it is intended that the present disclosure encompass all such changes, substitutions, variations, alterations, and/or modifications as falling within the scope of the appended claims.

Claims
  • 1. A power distribution apparatus comprising: a housing configured to be mounted into or on a rack that has a plurality of shelf positions;power inputs coupled to the housing, the power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power;at least one fault managed power module configured to be contained in the housing, the at least one fault managed power module including a power transmitter configured to generate single-phase fault managed power or multi-phase fault managed power from the AC power, the high voltage DC power, the single-phase fault managed power or the multi-phase fault managed power; anda plurality of connectors on the housing and configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.
  • 2. The power distribution apparatus of claim 1, wherein the housing is configured to horizontally mount in one of the plurality of shelf positions of the rack.
  • 3. The power distribution apparatus of claim 1, wherein the housing is configured to vertically mount to the rack.
  • 4. The power distribution apparatus of claim 3, further comprising a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.
  • 5. The power distribution apparatus of claim 1, wherein further including a bus bar configured to mount inside the housing and having a plurality of module positions, each module position configured to removably receive a power processing module, wherein the power processing module is configured to generate or output one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, or AC power.
  • 6. The power distribution apparatus of claim 5, wherein the power processing module is factory or field configurable to generate one of a plurality of power types.
  • 7. The power distribution apparatus of claim 5, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.
  • 8. The power distribution apparatus of claim 1, further comprising a data uplink.
  • 9. The power distribution apparatus of claim 1, further comprising a power module configured to provide AC power and data communications over AC power.
  • 10. A power distribution apparatus comprising: power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power;a bus bar configured to mount to a rack that has a plurality of shelf positions, the bus bar having a plurality of module positions, each module position configured to removably receive a power processing module, wherein the power processing module is configured to generate or output one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, or AC power; anda plurality of connectors configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.
  • 11. The power distribution apparatus of claim 10, further comprising a housing that contains the bus bar and is configured to be mounted into or on a rack.
  • 12. The power distribution apparatus of claim 11, wherein the housing is configured to vertically mount to the rack, and further comprising a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.
  • 13. The power distribution apparatus of claim 10, wherein the power processing module is factory or field configurable to generate one of a plurality of power types.
  • 14. The power distribution apparatus of claim 10, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.
  • 15. A power distribution apparatus comprising: power inputs configured to receive one or more of: alternating current (AC) power, high voltage direct current (DC) power, single-phase fault managed power, or multi-phase fault managed power;a bus bar configured to mount to a rack that has a plurality of shelf positions, the bus bar having a plurality of module positions;a plurality of power processing modules, each power processing module of the plurality of power processing modules configured to generate or output at least one of: single-phase fault managed power, multi-phase fault managed power, Power-over-Ethernet power and data, high voltage DC power, lower voltage DC power or AC power; anda plurality of connectors configured to provide cable connections to one or more of the plurality of shelf positions of the rack for one or more of: AC power, high voltage DC power, lower voltage DC power, single-phase fault managed power, or multi-phase fault managed power.
  • 16. The power distribution apparatus of claim 15, further comprising a housing that contains the bus bar and is configured to be mounted into or on a rack.
  • 17. The power distribution apparatus of claim 16, wherein the housing is configured to horizontally mount in one of the plurality of shelf positions of the rack.
  • 18. The power distribution apparatus of claim 16, wherein the housing is configured to vertically mount to the rack, and further comprising a bracket configured to attach the housing to the rack, wherein the bracket is configured to rotate or swing outward from the housing.
  • 19. The power distribution apparatus of claim 15, wherein at least one of the plurality of power processing modules is factory or field configurable to generate one of a plurality of power types.
  • 20. The power distribution apparatus of claim 15, wherein at least one power processing module is configured to reduce the high voltage DC power to the lower voltage DC power.