Information
-
Patent Grant
-
6502918
-
Patent Number
6,502,918
-
Date Filed
Wednesday, August 29, 200123 years ago
-
Date Issued
Tuesday, January 7, 200322 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Hallacher; Craig
- Brooke; Michael S.
-
CPC
-
US Classifications
Field of Search
US
- 347 62
- 347 64
- 347 65
- 347 20
- 347 67
-
International Classifications
-
Abstract
A fluid ejection device has a firing chamber with a feature disposed therewithin.
Description
FIELD OF THE INVENTION
The present invention relates to fluid ejection devices, such as those used in fluid ejection cartridges.
BACKGROUND OF THE INVENTION
When a fluid or ink droplet is ejected from a nozzle or orifice of a printhead, most of the mass of the droplet is contained in the leading head of the droplet. The greatest velocity of the droplet is found in this mass. The remaining tail of the droplet contains a minority of the mass of ink and has a distribution of velocity ranging from nearly the same as the ink droplet head at a location near the ink droplet head to a velocity less than the velocity of the ink found in the ink droplet head and located closest to the orifice aperture. At some time during the transit of the droplet, the ink in the tail is stretched to a point where the tail is broken off from the droplet. A portion of the ink remaining in the tail is pulled back to the printhead orifice plate where it typically forms puddles of ink surrounding the orifice. These ink or fluid puddles, if not controlled, degrade the quality of the printed material by causing misdirection of subsequent ink droplets.
Some parts of the ink droplet tail are absorbed into the ink droplet head prior to the ink droplet being deposited upon the medium. However, other parts of the ink droplet tail neither returns to the printhead nor remains with or is absorbed in the ink droplet, but produces a fine spray of subdroplets spreading in a random direction. Some of this spray reaches the medium upon which printing is occurring thereby producing rough edges to the dots formed by the ink droplet and placing undesired spots on the medium which reduces the clarity of the desired printed material.
It is desirable to minimize fluid droplet tails, as well as the corresponding fluid puddles and spray.
SUMMARY OF THE INVENTION
In an embodiment of the present invention, a fluid ejection device has a firing chamber with a feature disposed therewithin.
Many of the attendant features of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description and considered in connection with the accompanying drawings in which like reference symbols designate like parts throughout.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
illustrates a perspective view of a fluid ejection cartridge of an embodiment of the present invention;
FIG. 2
illustrates an embodiment of the feature of the present invention through section
2
—
2
of
FIG. 1
;
FIGS. 3
to
5
A illustrate alternative embodiments of the feature of the present invention;
FIG. 5B
illustrates a plan view of
FIG. 5A
;
FIG. 6
illustrates an alternative embodiment of the feature of the present invention;
FIGS. 7 through 8
illustrate more alternative embodiments of the feature of the present invention;
FIG. 9A
illustrates a flow chart of one embodiment for forming the feature;
FIGS. 9B and 9C
illustrates the forming of the feature as described in the steps of
FIG. 9A
;
FIG. 10
illustrates a flow chart of another embodiment for forming the feature; and
FIG. 11
illustrates a flow chart of yet another embodiment for forming the feature.
DETAILED DESCRIPTION
FIG. 1
is a perspective view of an inkjet cartridge (or fluid ejection cartridge)
10
with a printhead (or fluid ejection device)
12
of the present invention.
FIG. 2
illustrates a cross-sectional view of the fluid ejection device through section
2
—
2
of FIG.
1
. In
FIG. 2
, a thin film stack (or circuit element)
29
is applied over a substrate
28
. The circuit element
29
includes a plurality of resistors (or heating elements)
70
. The resistors shown in the following embodiments are substantially square or rectangular, however, they are not so limited.
A barrier (or orifice) layer
50
is applied over the thin film stack
29
. Inner walls
61
of the barrier layer
50
form a plurality of firing chambers
60
that are associated with the plurality of heating elements
70
.
A plurality of orifices
18
are formed through a top surface
51
in the barrier or orifice layer
50
and are associated with the firing chambers
60
. As shown more clearly in the printhead
12
of
FIG. 1
, the nozzle orifices
18
are arranged in rows located on both sides of the printhead
12
. The orifices shown in the following embodiments are substantially circular or elliptical, however, they are not so limited. The orifices may be substantially square or rectangular.
A trench or slot
76
is formed in the substrate
28
to fluidically communicate the fluid ejection device
12
with a fluid container or reservoir (not shown) in the fluid ejection cartridge
10
. Fluid flows (as shown by arrow
78
) through the trench
76
through a fluid feed slot
67
in the thin film stack
29
to the firing chamber
60
. The fluid is heated in the firing chamber
60
by the heating element(s)
70
and is ejected out the respective orifice
18
.
In this embodiment, the barrier layer
50
is formed of an organic polymer which is substantially inert to the corrosive action of ink. In one particular embodiment, the barrier layer
50
is formed of PECVD oxide. In yet another embodiment, the barrier layer
50
is a fast cross-linking polymer, such as photoimagable epoxy (such as SU8 developed by IBM), photoimagable polymer or photosensitive silicone dielectrics, such as SINR-3010 manufactured by ShinEtsu™. In an alternative embodiment, an additional layer (a top orifice layer) is applied over the barrier layer
50
and forms the orifices
18
. An example of the physical arrangement of the barrier layer, and thin film substructure is illustrated at page 44 of the Hewlett-Packard Journal of February 1994. Further examples of ink jet printheads are set forth in commonly assigned U.S. Pat. Nos. 4,719,477, 5,317,346, and 6,162,589.
As shown in the embodiment of
FIG. 2
, a feature
62
is disposed within the firing chamber
60
. In the embodiment shown, the feature
62
is a drop-directionality feature in that the feature aids in determining the direction of the fluid drop through the orifice. In another embodiment, the feature
62
substantially and consistently dictates the location of break-off of the tail of the fluid drop in the orifice
18
or barrier layer
50
. In a more particular embodiment, the tail break-off is in substantially the center of the orifice. It is believed that when the tail breaks off in the center of the orifice, it has less of a tendency to displace the straight-ahead trajectory of the main drop. In one embodiment, the height of the feature is at least long enough to influence the tail break-off from the fluid remaining in the firing chamber. In another embodiment, each fluid drop has a main dot and satellite dots. The satellite dots land in a substantially consistent location on the media relative to the main dot using the feature
62
described herein.
In the embodiment shown in
FIG. 2
, the feature
62
is substantially cone-shaped. The shape of the feature is not so limited, and more examples of feature shapes are discussed herein. The feature has a tip (or pointed tip)
63
at one end nearest the orifice
18
, and a base
66
at another end nearest the resistors
70
. The feature has side walls
64
in between the base
66
and tip
63
. In this embodiment, the side walls
64
taper towards the orifice
18
, in that the base is larger in area than the tip. The tip
63
in this embodiment extends to a plane defining the top surface
51
of the barrier layer. In other embodiments, the tip
63
extends to a plane beneath the top surface and within the barrier layer. In this embodiment, the side walls
64
are substantially parallel to the side walls
61
of the chamber. The orientation of the side walls
61
of the chamber is not so limited, and other examples of side wall
61
orientations are described herein.
As shown in the embodiment of
FIG. 3
, the feature
62
is substantially cone-shaped and similar to the embodiment described in FIG.
2
. One of the primary differences between these two embodiments lies with the feature
62
. In this embodiment, the feature
62
has a top surface
65
. In this embodiment, the top surface
65
is substantially flat. Because of the substantially cone-shaped feature, the top surface is substantially circular. The top surface
65
in this embodiment extends to be in substantially the same plane as that which is defined by the top surface
51
of the barrier layer. In other embodiments, the top surface
65
extends to a plane beneath the top surface and within the barrier layer. The chamber walls
61
in this embodiment are substantially straight, more particularly, the walls
61
are substantially perpendicular to the base
66
of the feature
62
.
Another difference between the embodiments shown in
FIGS. 2 and 3
is the structure of the fluid ejection device
12
. In
FIG. 3
, the trench or slot
76
is offset in the substrate
28
with respect to the firing chamber
60
. The fluid
78
flows through the trench
76
in the substrate
28
and through the fluid feed slot
67
. As shown in
FIG. 3
, the fluid then is directed in a substantially perpendicular direction towards the firing chamber. More particularly, the fluid is directed by a channel in the layer
50
towards the firing chamber
60
.
Generally in the embodiment of
FIG. 3
, there is one fluid feed slot
67
and two heating elements
70
associated with each firing chamber
60
. The heating elements (or fluid ejectors)
70
in the embodiment of
FIG. 3
are positioned in a staggered row along the trench
78
. In between pairs of the heating elements is positioned the feature
62
.
The feature
62
of the embodiment shown in
FIG. 4
is substantially shaped as a pyramid. The pyramid illustrated has four (4) sides or side walls
64
. However, the number of side walls is not so limited. For example, in alternative embodiments, the pyramid has three (3) sides or greater than four (4) sides. The pyramid has a base
66
that is shaped substantially square in the embodiment shown. In this embodiment, the pyramid has a tip
63
at the end nearest the orifices. In alternative embodiments, the tip of the pyramid is cut-off to expose a substantially flat top surface similar to that of FIG.
3
.
In the embodiment shown, the chamber walls
61
are substantially perpendicular to the base
66
of the feature. Again, the chamber walls
61
are not so limited, and may be oriented to substantially slope with the pyramidal side walls
64
such that the distance between the feature
62
and the sidewalls
61
remain substantially the same throughout the firing chamber, and the walls of the chamber and the feature are substantially parallel in cross-section.
In the embodiment shown in
FIG. 5A
, the feature
62
is similar to that of FIG.
3
.
FIG. 5A
illustrates a side cross-sectional view of the feature
62
in the firing chamber. In the embodiment shown, the top surface
65
of the feature is substantially flush with the top surface
51
of the barrier layer and/or the orifice layer, if applicable. The chamber walls
61
are oriented to substantially follow the slope of the feature walls
64
.
FIG. 5B
illustrates a plan view of the feature
62
in the firing chamber
60
of FIG.
5
A.
FIG. 5B
illustrates that the feature
62
is substantially elliptical in cross-section, and thus the top surface
65
is substantially elliptical, as the base
66
is substantially elliptical. However, the feature may also have a substantially rectangular cross-section along the top surface
65
and the base
66
. In this embodiment, the orifice
18
is substantially annular with the feature being substantially central to the orifice.
As shown in
FIG. 5B
, the resistors
70
are shown on two opposing sides of the base
66
of the feature, while the fluid feed slots
67
are shown on the other of the two opposing sides of the base
66
. In this embodiment, the fluid feed slots
67
are shown as substantially elliptical, but are not so limited. In another embodiment (not shown), the fluid enters the firing chamber from a channel that is substantially from the side of the firing chamber, rather than from the slots
67
‘underneath’ as shown in FIG.
5
B.
The area of the annular exit (nozzle orifice) determines the drop weight, while the width of the gap between the feature and the exit bore (or the chamber walls) determines the capillary forces acting on the fluid. Thus, in at least one of the embodiments of the present invention, the feature allows the refill speed of the firing chamber to increase without sacrificing drop weight of the fluid to be ejected. A relatively large drop is allowed to be ejected, while maintaining a high capillary force on the fluid, hence a fast refill of the chamber for a given drop weight.
FIG. 6
illustrates another embodiment of the feature
62
having curved walls
64
. In this embodiment, the chamber side walls
61
are substantially concavely curved to correspond with the curved feature walls
64
. In this embodiment, a cross-section of the feature is substantially circular.
FIG. 7A
illustrates a top view of another embodiment of the fluid ejection device. The orifice has a substantially elliptical-annular shape, as the feature
62
is positioned substantially in the center of the orifice
18
. In embodiments such as those shown in
FIGS. 5A
, and
7
A, where the top surface of the feature is substantially flush with the top surface
51
of the barrier layer, the orifice
18
has a substantially annular shape. With numerical modeling, it has been shown that as fluid exits the annular top of the firing chamber in an unstable toroidal shape, the tendency is to pull the fluid towards the center of the toroid, and thereby minimize the aerosol or spray created by the ejection.
FIG. 7B
illustrates the cross-sectional view of the feature
62
in the firing chamber
60
. Fluid feed slots
67
fluidically couple the trench
76
with the firing chamber
60
. In this embodiment, the feature is cone-shaped and substantially elliptical in cross-section. The feature tapers down from the top surface
65
to the base
66
, such that the top surface of the feature has a larger cross-sectional area than the base.
FIG. 7C
illustrates the cross-sectional view of the fluid ejection device taken from near the base
66
of the feature in FIG.
7
B.
The embodiment shown in
FIGS. 8A
to
8
C is substantially similar to the embodiment shown in
FIGS. 7A
to
7
C. The primary difference in this embodiment is that the feature
62
is more particularly substantially circular in cross-section.
The flow charts of
FIGS. 9A
,
10
and
11
illustrate several embodiments of forming the feature
62
. The embodiment of
FIG. 9A
shows that the integrated circuit element
29
(including the heating elements
70
) of the printhead
12
is formed over the substrate
28
at step
100
. In step
110
, a feature material is deposited over the integrated circuit element. In one embodiment, the feature material is preferably ink and/or TMAH etchant resistant. In a more particular embodiment, the feature material is silicon dioxide. In another embodiment, the feature material is a barrier material described herein, such as DOW-Cyclotone 3022-63, or a similar polymer, or a photoimagable polyimide or polymer such as SU8.
In step
120
of
FIG. 9A
, the feature material is etched to form the desired feature shape over the circuit element
29
. In step
130
, polysilicon
80
is deposited over the etched feature. In step
140
, photoresist material is deposited over the polysilicon and areas surrounding the feature. The photoresist is masked and etched. In step
150
, the polysilicon
80
is etched to form a protective bubble over the feature and heating elements, as shown in FIG.
9
B. The remaining photoresist is stripped in step
160
. In step
170
, barrier layer material is deposited over the polysilicon
80
bubble, as illustrated in the embodiment shown in FIG.
9
C.
In step
180
, chemical-mechanical planarization is employed to the barrier layer material and the polysilicon
80
until the top surface
51
of the barrier layer
50
is substantially flush with the top surface
65
of the feature
62
. After step
180
, the cross-section is substantially similar to
FIG. 5A
except that the firing chambers
60
are filled with the polysilicon material
80
. In step
190
, the polysilicon
80
is removed by etching, such as using a TMAH etch.
FIG. 10
describes an embodiment that is similar to FIG.
9
A.
FIG. 10
uses SU8 or another photoimagable material as the barrier material in this embodiment. Steps
100
to
120
are employed in this embodiment as in that of FIG.
9
. In one embodiment, the feature is formed of silicon dioxide, and in another embodiment, the feature is formed of a photoimagable material.
After the feature is formed in step
120
, the barrier layer material is deposited over the feature
62
. The barrier layer material is then masked to form the firing chambers and orifices in step
210
. In one embodiment, a chrome mask is used in the masking step. The barrier layer materials are then UV exposed to form the firing chamber and corresponding orifices. An example of the masked and UV exposure of the barrier layer material to form barrier layers, firing chambers, and/or orifices, etc. is illustrated in commonly assigned U.S. Pat. No. 6,162,589 issued Dec. 19, 2000. In step
220
of this embodiment, the unexposed areas are developed and thereby removed to form the firing chambers.
In step
100
of the embodiment of
FIG. 11
, the integrated circuit element is formed over the substrate, as in the previous embodiments. Step
230
is to deposit the material for the barrier layer
50
over the integrated circuit element. This embodiment uses SU8 or another photoimagable material as the barrier layer material. In step
240
, the barrier layer is masked and exposed to UV radiation to form the firing chamber, the feature, as well as the orifices, as discussed above. In this embodiment, the feature and firing chamber are formed of the same photoimagable material. In step
250
, the unexposed areas of the barrier layer are removed, as discussed above.
While the present invention has been disclosed with reference to the foregoing specification and the preferred embodiment shown in the drawings and described above, it will be apparent to those skilled in the art that changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. For instance, the feature may be shaped substantially as a rectangular box. In addition, each feature shape, top surface formation, feature tip, feature wall formation, and chamber wall formation are interchangable with each other, and are not limited to the specifically described embodiments.
Claims
- 1. A fluid ejection device comprising:a firing chamber having an orifice; and a feature disposed in the firing chamber extending towards the orifice, wherein the feature has a substantially conical shape; and a heating element disposed about a base of the feature.
- 2. The fluid ejection device of claim 1 wherein the feature tapers toward the orifice.
- 3. The fluid ejection device of claim 1 wherein the orifice has a substantially annular shape.
- 4. The fluid ejection device of claim 1 wherein the feature has a substantially circular cross-section.
- 5. The fluid ejection device of claim 1 wherein the firing chamber has side walls that are substantially parallel to side walls of the feature.
- 6. A fluid ejection device comprising:a firing chamber having an orifice; and a feature disposed in the firing chamber extending towards the orifice, wherein the orifice is formed in an orifice layer having a top surface, wherein the feature has a pointed tip, and the pointed tip is substantially flush with the top surface of the orifice layer; and a heating element disposed about a base of the feature.
- 7. The fluid ejection device of claim 6 wherein the heating element includes at least two resistors surrounding the base of the feature.
- 8. The fluid ejection device of claim 6 wherein the feature is formed of a polymer.
- 9. The fluid ejection device of claim 6 wherein the feature is formed of an oxide.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4596994 |
Matsuda et al. |
Jun 1986 |
A |
4914562 |
Abe et al. |
Apr 1990 |
A |
4965594 |
Komuro |
Oct 1990 |
A |
Foreign Referenced Citations (1)
Number |
Date |
Country |
403213355 |
Sep 1991 |
JP |