Feedback-controlled body-bias voltage source

Information

  • Patent Grant
  • 8436675
  • Patent Number
    8,436,675
  • Date Filed
    Monday, January 11, 2010
    14 years ago
  • Date Issued
    Tuesday, May 7, 2013
    11 years ago
Abstract
A body-bias voltage source having an output monitor, charge pump, and shunt. a shunt circuit having on/off control is coupled to the output monitor and to the output of the charge pump. Upon sensing that the output voltage of the charge pump is above a desired value, the output monitor may disable the charge pump circuit and may enable the shunt circuit to reduce the voltage at the output of the charge pump. When the voltage output of the charge pump is below the desired value, the output monitor may disable the shunt circuit and may enable the charge pump circuit. A shunt circuit having proportional control may be substituted for the shunt circuit with on/off control.
Description
FIELD OF THE INVENTION

Embodiments of the present invention relate to circuits for providing operational voltages in complementary metal-oxide semiconductor (CMOS) circuits. In particular, embodiments of the present invention relate to circuits for providing a body-bias voltage for CMOS transistors.


BACKGROUND ART

As the operating voltages for CMOS transistor circuits have decreased, variations in the threshold voltages for the transistors have become more significant. Although low operating voltages offer the potential for reduced power consumption, threshold voltage variations due to process and environmental variables often prevent optimum efficiency and performance from being achieved due to increased leakage currents.


Prior Art FIG. 1A shows a conventional CMOS inverter 100. A P-type substrate 105 supports an NFET 110 and a PFET 120. The NFET 110 comprises a gate 112, source 113, and drain 114. The PFET 120 resides in an n-well 115, and comprises a gate 122, drain 123, and a source 124. The substrate 105 and source 113 are coupled by a tie 130 that is connected to ground (GND), while source 124 and N-well 115 are coupled by a tie 135 that is connected to a supply voltage (VDD). The input to the inverter is applied to the gates 112 and 122, with the output taken from the drain contact 125. In this conventional configuration, the transistors are often treated as three terminal devices.


Threshold voltage variations may be compensated for by body-biasing. Body-biasing introduces a reverse bias potential between the bulk and the source of the transistor that allows the threshold voltage of the transistor to be adjusted electrically. The purpose of body-biasing is to compensate for 1) process variations; 2) temperature variations; 3) supply voltage variations; 4) changes in frequency of operation; and 5) changing levels of switching activity.


Prior Art FIG. 1B shows an inverter having connections for body-biasing. Body-bias can provided to the PFET 120 through a direct bias contact 150a, or by a buried n-well 140 using contact 150b. Similarly, body-bias may be provided to the NFET 110 by a surface contact 155a, or by a backside contact 155b. An aperture 145 may be provided in the buried n-well 125 so that the bias potential reaches the NFET 110. In general, a PFET 120 or an NFET 110 may be biased by one of the alternative contacts shown.


Depending upon the environmental and operational conditions, a CMOS circuit may require different levels of bias for the transistors. For example, a microprocessor that is executing a computationally intensive routine for a real-time application will typically be biased for maximum speed, whereas during periods of low activity the bias will be adjusted to minimize leakage current.


For a CMOS integrated circuit, the load presented to a circuit providing a body-bias voltage and the bias circuit itself may vary with the environmental and operational conditions of integrated circuit. Thus, the variations in the required body-bias voltage and the load to which it is applied should be taken into account to achieve optimum performance.


SUMMARY OF INVENTION

Thus, a need exists for a system for providing a body-bias voltage for CMOS transistors that is capable of adapting to varying output voltage requirements and load conditions.


Accordingly, embodiments of the present invention provide a system that uses feedback controlled charge pump to establishing a desired output voltage. The system accepts an input reference voltage that is related to the desired output voltage in order to provide the desired output voltage.


In an embodiment of the present invention, a charge pump having a voltage output and an enable input for on/off control is coupled to an output monitor (e.g., a sense amplifier). The output monitor is coupled to the output of the charge pump and to the enable input of the charge pump. A shunt circuit having on/off control is coupled to the output monitor and to the output of the charge pump. Upon sensing that the output voltage of the charge pump is above a desired value, the output monitor may disable the charge pump circuit and may enable the shunt circuit to reduce the voltage at the output of the charge pump. When the voltage output of the charge pump is below the desired value, the output monitor may disable the shunt circuit and may enable the charge pump circuit.


In another embodiment similar to that described above, a shunt circuit having proportional control is substituted for the shunt circuit with on/off control. Upon sensing a deviation from a desired output value at the output of the charge pump, the output monitor provides a signal to the shunt circuit that is proportional to the deviation at the charge pump output. The effective resistance of the shunt is proportionally reduced in response to a positive deviation and proportionally increased in response to a negative deviation. Proportional control of the shunt circuit may be combined with on/off control of the charge pump circuit to regulate the output voltage.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention:


Prior Art FIG. 1A shows a conventional CMOS inverter without body-bias connections.


Prior Art FIG. 1B shows a conventional CMOS inverter with body-bias connections.



FIG. 2 shows a block diagram of a feedback controlled body-bias circuit in accordance with an embodiment of the present claimed invention.



FIG. 3 shows a circuit diagram of a body-bias supply with a servo loop for NFETs in accordance with an embodiment of the present claimed invention.



FIG. 4 shows a circuit diagram of a body-bias supply with a servo loop for PFETs in accordance with an embodiment of the present claimed invention.





DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following detailed description of the present invention, a feedback-controlled body-bias circuit, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be obvious to one skilled in the art that the present invention may be practiced without these specific details. In other instances well known methods, procedures, components, and circuit elements have not been described in detail as not to unnecessarily obscure aspects of the present invention.



FIG. 2 shows a block diagram 200 of an embodiment of the present invention. A charge pump 210 has an output coupled to Cload that represents a substrate or well. Since body-bias is typically applied as a reverse bias to a p-n junction within a CMOS device, the load seen by the body-bias voltage source is generally a capacitive load; however, there is a certain amount of leakage current, represented by Rleak.


An output monitor 205 has a sense input coupled to the output of the charge pump 210. The output of the charge pump is compared to a reference voltage Vref by the output monitor 205. Upon sensing a positive or negative deviation (overvoltage or undervoltage) that exceeds an allowed value, the output monitor provides a control signal to the charge pump circuit 210 and/or a shunt circuit 215.


For an overvoltage condition with loads having a large Cload and large Rleak (small leakage current), simply turning off the charge pump may not result in a sufficiently fast discharge of Cload to the desired value. Accordingly, the shunt 215 may be enabled to provide a discharge path that allows faster correction of the output voltage Vout.


Upon sensing an undervoltage condition, the output monitor 205 may enable the charge pump circuit 210 and/or disable the shunt circuit 215. In one embodiment, the charge pump is run continuously, with the shunt being cycled between enabled and disabled states to maintain the output voltage.


In determining the voltage deviation that is permitted in the system, a deadband having upper and lower control points may be used, or a single setpoint may be used (no allowable deviation).


In an alternative embodiment, the output monitor 205 provides a proportional signal to the shunt circuit 215 that is proportional instead of the on/off control described above. The effective resistance of the shunt is proportionally reduced in response to a positive deviation and proportionally increased in response to a negative deviation. Proportional control is preferably implemented using analog circuits, and thus is suitable for use in a mixed-signal integrated circuit.



FIG. 3 shows a circuit diagram 300 of a body-bias supply with a servo loop for NFETs in accordance with an embodiment of the present claimed invention. The current source 305 and variable resistor R combine to provide a reference voltage (e.g., Vref of FIG. 2). The comparator 310, shunt 320, and charge pump 315 correspond to the output monitor 205, shunt 215, and charge pump 210 of FIG. 2. The output of charge pump 315 is a negative voltage that may be used to bias a P-type substrate or well to provide a body-bias for NFETs.



FIG. 4 shows a circuit diagram 400 of a body-bias supply with a servo loop for PFETs in accordance with an embodiment of the present claimed invention. The current sink 405 and variable resistor R combine to provide a reference voltage (e.g., Vref of FIG. 2). The comparator 410, shunt 420, and charge pump 415 correspond to the output monitor 205, shunt 215, and charge pump 210 of FIG. 2. The output of charge pump 315 is a positive voltage that may be used to bias an N-type substrate or well to provide a body-bias for PFETs.


A description of the circuits shown in FIG. 3 and FIG. 4 is provided in the previously incorporated copending patent application entitled “Servo Loop for Well Bias Voltage Source” (U.S. Pat. No. 7,129,771). More specifically, descriptions of the variable resistor R and shunt (320, 420) shown in FIG. 3 and FIG. 4 are provided in the previously incorporated copending patent applications entitled “A Precise Control Component for a Substrate Potential Regulation Circuit” and “A Charge Stabilizing Component for a Substrate Potential Regulation Circuit” (U.S. Pat. No. 7,012,461).


The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. For example, an integrated circuit having a P-type substrate and an N-well disposed therein is described. More generally, the invention may be used with a semiconductor substrate of either N-type or P-type having a complementary well disposed therein. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

Claims
  • 1. A system comprising: first circuitry operable for generating an output voltage;second circuitry coupled to said first circuitry and operable for adjusting said output voltage in response to a control signal by providing a discharge path for said output voltage if enabled; andan output monitor coupled to said first circuitry and operable for comparing said output voltage and a reference voltage and operable for generating said control signal based on a result of said comparing, wherein said control signal has a state that is proportional to an amount of difference between said output voltage and said reference voltage, wherein said output monitor is further operable for enabling said first circuitry in response to sensing an undervoltage condition, and wherein further an amount of voltage discharged via said second circuitry is configured to be proportionally controlled according to said state of said control signal.
  • 2. The system of claim 1 wherein said first circuitry comprises a charge pump.
  • 3. The system of claim 1 wherein said second circuitry comprises a shunt circuit.
  • 4. The system of claim 1 wherein an effective resistance of said second circuitry, if enabled, is configured to be proportionally controlled according to said state of said control signal.
  • 5. The system of claim 1 wherein said output monitor is further operable for enabling said second circuitry to provide said discharge path for said output voltage in response to sensing an overvoltage condition.
  • 6. The system of claim 1 wherein said output monitor is further operable for disabling said second circuitry in response to sensing said undervoltage condition.
  • 7. The system of claim 1 wherein said output monitor is further operable for cycling said second circuitry between enabled and disabled states in response to sensing an undervoltage condition if said first circuitry is enabled.
  • 8. The system of claim 1 wherein said first circuitry is coupled to a P-type well, and wherein said output voltage comprises a negative voltage usable as a body bias voltage to bias said P-type well.
  • 9. The system of claim 1 wherein said first circuitry is coupled to an N-type well, and wherein said output voltage comprises a positive voltage usable as a body bias voltage to bias said N-type well.
  • 10. The system of claim 1 further comprising a current source coupled to a variable resistor, wherein said current source and said variable resistor are operable for providing said reference voltage.
  • 11. A device comprising: a well disposed in a substrate;first circuitry operable for generating a body bias voltage for biasing said well;an output monitor coupled to said first circuitry and operable for comparing said body bias voltage and a reference voltage and operable for generating a control signal based on a result of said comparing, wherein said control signal is proportional to an amount of difference between said output voltage and said reference voltage; andsecond circuitry coupled to said first circuitry and operable for adjusting said body bias voltage in response to said control signal, wherein said output monitor is further operable for enabling said first circuitry in response to sensing an undervoltage condition, and wherein further an amount of voltage discharged via said second circuitry is configured to be proportionally controlled according to said state of said control signal.
  • 12. The device of claim 11 wherein said first circuitry comprises a charge pump and said second circuitry comprises a shunt circuit.
  • 13. The device of claim 11 wherein said output monitor is further operable for enabling said second circuitry to provide a discharge path for said body bias voltage in response to sensing an overvoltage condition.
  • 14. The device of claim 11 wherein said output monitor is further operable for disabling said second circuitry in response to sensing said undervoltage condition.
  • 15. The device of claim 11 wherein said output monitor is further operable for cycling said second circuitry between an enabled state and a disabled state in response to sensing an undervoltage condition if said first circuitry is enabled, and wherein said second circuitry, if enabled, provides a discharge path for said body bias voltage.
  • 16. A method comprising: sensing a first voltage at an output monitor coupled to an integrated circuit;sensing a reference second voltage at said output monitor;generating a control signal based on a comparison of said first voltage and said second voltage, wherein said control signal has a state that is proportional to an amount of difference between said first voltage and said second voltage; andadjusting said first voltage in response to said control signal via a discharge path that shunts said first voltage if enabled; andenabling a source of said first voltage in response to sensing an undervoltage condition, and wherein further an amount of voltage discharged via said second circuitry is configured to be proportionally controlled according to said state of said control signal.
  • 17. The method of claim 16 further comprising: enabling said discharge path for said first voltage in response to sensing an overvoltage condition; andvarying an effective resistance of said discharge path according to said state of said control signal.
  • 18. The method of claim 16 further comprising disabling said discharge path for said first voltage in response to sensing an undervoltage condition.
  • 19. The method of claim 16 further comprising cycling said discharge path for said first voltage between an enabled state and a disabled state in response to sensing an undervoltage condition if a source of said first voltage is enabled, and wherein, in said enabled state, an effective resistance of said discharge path is varied according to said state of said control signal.
  • 20. The method of claim 16 wherein said first voltage comprises a negative voltage usable as a body bias voltage to bias a P-type well of said integrated circuit.
  • 21. The method of claim 16 wherein said first voltage comprises a positive voltage usable as a body bias voltage to bias an N-type well of said integrated circuit.
RELATED UNITED STATES PATENT APPLICATIONS

This application is a Continuation Application of the commonly-owned U.S. patent application with Ser. No. 10/747,016, now U.S. Pat. No. 7,649,402, filed Dec. 23, 2003, by Tien-Min Chen, and entitled “Feedback-Controlled Body-Bias Voltage Source,” which is hereby incorporated by reference in its entirety. This Application is related to U.S. patent application, Ser. No. 10/747,015, now U.S. Pat. No. 7,129,771, by Tien-Min Chen, filed on Dec. 23, 2003, entitled “Servo Loop for Well Bias Voltage Source,” and assigned to the assignee of the present invention. This Application is related to U.S. patent application, Ser. No. 10/746,539, now U.S. Pat. No. 7,692,477, by Tien-Min Chen and Robert Fu, filed on Dec. 23, 2003, entitled “A Precise Control Component for a Substrate Potential Regulation Circuit,” and assigned to the assignee of the present invention. This Application is related to U.S. patent application, Ser. No. 10/747,022, now U.S. Pat. No. 7,012,461, by Tien-Min Chen, filed on Dec. 23, 2003, entitled “A Charge Stabilizing Component for a Substrate Potential Regulation Circuit,” and assigned to the assignee of the present invention.

US Referenced Citations (310)
Number Name Date Kind
4246517 Dakroub Jan 1981 A
4335445 Nercessian Jun 1982 A
4471290 Yamaguchi Sep 1984 A
4679130 Moscovici Jul 1987 A
4739252 Malaviya et al. Apr 1988 A
4769784 Doluca et al. Sep 1988 A
4798974 Reczek et al. Jan 1989 A
4893228 Orrick et al. Jan 1990 A
4912347 Morris Mar 1990 A
4929621 Manoury et al. May 1990 A
5029282 Ito Jul 1991 A
5039877 Chern Aug 1991 A
5086501 DeLuca et al. Feb 1992 A
5103110 Housworth et al. Apr 1992 A
5113088 Yamamoto et al. May 1992 A
5124632 Greaves Jun 1992 A
5167024 Smith et al. Nov 1992 A
5201059 Nguyen Apr 1993 A
5204863 Saint-Joigny et al. Apr 1993 A
5218704 Watts, Jr. et al. Jun 1993 A
5230055 Katz et al. Jul 1993 A
5239652 Seibert et al. Aug 1993 A
5254883 Horowitz et al. Oct 1993 A
5336986 Allman Aug 1994 A
5347172 Cordoba et al. Sep 1994 A
5386135 Nakazato et al. Jan 1995 A
5394026 Yu et al. Feb 1995 A
5406212 Hashinaga et al. Apr 1995 A
5410278 Itoh et al. Apr 1995 A
5422591 Rastegar et al. Jun 1995 A
5422806 Chen et al. Jun 1995 A
5440520 Schutz et al. Aug 1995 A
5447876 Moyer et al. Sep 1995 A
5453953 Dhong et al. Sep 1995 A
5461266 Koreeda et al. Oct 1995 A
5483434 Seesink Jan 1996 A
5495184 Des Rosiers et al. Feb 1996 A
5502838 Kikinis Mar 1996 A
5506541 Herndon Apr 1996 A
5511203 Wisor et al. Apr 1996 A
5513152 Cabaniss Apr 1996 A
5519309 Smith May 1996 A
5560020 Nakatani et al. Sep 1996 A
5568103 Nakashima et al. Oct 1996 A
5592173 Lau et al. Jan 1997 A
5594360 Wojciechowski Jan 1997 A
5610533 Arimoto et al. Mar 1997 A
5642072 Miyamoto et al. Jun 1997 A
5680359 Jeong Oct 1997 A
5682093 Kivela Oct 1997 A
5692204 Rawson et al. Nov 1997 A
5694072 Hsiao et al. Dec 1997 A
5717319 Jokinen Feb 1998 A
5719800 Mittal et al. Feb 1998 A
5727208 Brown Mar 1998 A
5744996 Kotzle et al. Apr 1998 A
5745375 Reinhardt et al. Apr 1998 A
5752011 Thomas et al. May 1998 A
5754869 Holzhammer et al. May 1998 A
5757171 Babcock May 1998 A
5764110 Ishibashi Jun 1998 A
5778237 Yamamoto et al. Jul 1998 A
5781060 Sugawara Jul 1998 A
5796313 Eitan Aug 1998 A
5812860 Horden et al. Sep 1998 A
5815724 Mates Sep 1998 A
5815725 Feierbach Sep 1998 A
5818290 Tsukada Oct 1998 A
5821808 Fujima Oct 1998 A
5825674 Jackson Oct 1998 A
5838189 Jeon Nov 1998 A
5842860 Funt Dec 1998 A
5848281 Smalley et al. Dec 1998 A
5859797 Maccarrone et al. Jan 1999 A
5864227 Borden et al. Jan 1999 A
5880620 Gitlin et al. Mar 1999 A
5884049 Atkinson Mar 1999 A
5894577 MacDonald et al. Apr 1999 A
5900773 Susak May 1999 A
5920226 Mimura Jul 1999 A
5923545 Nguyen Jul 1999 A
5929621 Angelici et al. Jul 1999 A
5933649 Lim et al. Aug 1999 A
5940020 Ho Aug 1999 A
5940283 Mihara et al. Aug 1999 A
5940785 Georgiou et al. Aug 1999 A
5940786 Steeby Aug 1999 A
5952871 Jeon Sep 1999 A
5973526 Dabral Oct 1999 A
5974557 Thomas et al. Oct 1999 A
5977763 Loughmiller et al. Nov 1999 A
5986947 Choi et al. Nov 1999 A
5996083 Gupta et al. Nov 1999 A
5996084 Watts Nov 1999 A
5999040 Do et al. Dec 1999 A
6006169 Sandhu et al. Dec 1999 A
6009022 Lee et al. Dec 1999 A
6011403 Gillette Jan 2000 A
6018264 Jin Jan 2000 A
6021500 Wang et al. Feb 2000 A
6035407 Gebara et al. Mar 2000 A
6047248 Georgiou et al. Apr 2000 A
6048746 Burr Apr 2000 A
6055655 Momohara Apr 2000 A
6075404 Shindoh et al. Jun 2000 A
6078084 Nakamura et al. Jun 2000 A
6078319 Bril et al. Jun 2000 A
6087820 Houghton et al. Jul 2000 A
6087892 Burr Jul 2000 A
6091283 Murgula et al. Jul 2000 A
6091300 Setty et al. Jul 2000 A
6097113 Teraoka et al. Aug 2000 A
6097242 Forbes et al. Aug 2000 A
6100751 De et al. Aug 2000 A
6118306 Orton et al. Sep 2000 A
6119241 Michail et al. Sep 2000 A
6141762 Nicol et al. Oct 2000 A
6157092 Hofmann Dec 2000 A
6172943 Yuzuki Jan 2001 B1
6201375 Larson et al. Mar 2001 B1
6202104 Ober Mar 2001 B1
6216235 Thomas et al. Apr 2001 B1
6218708 Burr Apr 2001 B1
6218892 Soumyanath et al. Apr 2001 B1
6218895 De et al. Apr 2001 B1
6226335 Prozorov May 2001 B1
6229379 Okamoto May 2001 B1
6229747 Cho et al. May 2001 B1
6232793 Arimoto et al. May 2001 B1
6232827 De et al. May 2001 B1
6232830 Fournel May 2001 B1
6242936 Ho et al. Jun 2001 B1
6249455 Kim Jun 2001 B1
6259612 Itoh Jul 2001 B1
6272642 Pole, II et al. Aug 2001 B2
6279048 Fadavi-Ardekani et al. Aug 2001 B1
6281716 Mihara Aug 2001 B1
6303444 Burr Oct 2001 B1
6304824 Bausch et al. Oct 2001 B1
6305407 Selby Oct 2001 B1
6311287 Dischler et al. Oct 2001 B1
6314522 Chu et al. Nov 2001 B1
6320453 Manning Nov 2001 B1
6337593 Mizuno et al. Jan 2002 B1
6341087 Kunikiyo Jan 2002 B1
6345362 Bertin et al. Feb 2002 B1
6345363 Levy-Kendler Feb 2002 B1
6347379 Dai et al. Feb 2002 B1
6370046 Nebrigic et al. Apr 2002 B1
6373323 Kuroda Apr 2002 B2
6373325 Kuriyama Apr 2002 B1
6378081 Hammond Apr 2002 B1
6388302 Galli May 2002 B1
6388432 Uchida May 2002 B2
6392467 Oowaki et al. May 2002 B1
6396312 Shepston et al. May 2002 B1
6407571 Furuya et al. Jun 2002 B1
6411156 Borkar et al. Jun 2002 B1
6415388 Browning et al. Jul 2002 B1
6422746 Weiss et al. Jul 2002 B1
6424203 Bayadroun Jul 2002 B1
6424217 Kwong Jul 2002 B1
6425086 Clark et al. Jul 2002 B1
6426641 Koch et al. Jul 2002 B1
6427211 Watts, Jr. Jul 2002 B2
6442746 James et al. Aug 2002 B1
6456157 Forbes et al. Sep 2002 B1
6457134 Lemke et al. Sep 2002 B1
6457135 Cooper Sep 2002 B1
6466077 Miyazaki et al. Oct 2002 B1
6469573 Kanda et al. Oct 2002 B2
6476632 La Rosa et al. Nov 2002 B1
6477654 Dean et al. Nov 2002 B1
6484265 Borkar et al. Nov 2002 B2
6486729 Imamiya Nov 2002 B2
6487668 Thomas et al. Nov 2002 B2
6489224 Burr Dec 2002 B1
6489796 Tomishima Dec 2002 B2
6496027 Sher et al. Dec 2002 B1
6496057 Wada et al. Dec 2002 B2
6507235 Sher Jan 2003 B1
6510400 Moriyama Jan 2003 B1
6510525 Nookala et al. Jan 2003 B1
6513124 Furuichi et al. Jan 2003 B1
6518826 Zhang Feb 2003 B2
6518828 Seo et al. Feb 2003 B2
6519706 Ogoro Feb 2003 B1
6529421 Marr et al. Mar 2003 B1
6531912 Katou Mar 2003 B2
6563371 Buckley, III et al. May 2003 B2
6570371 Volk May 2003 B1
6574577 Stapleton et al. Jun 2003 B2
6574739 Kung et al. Jun 2003 B1
6577514 Shor et al. Jun 2003 B2
6600346 Macaluso Jul 2003 B1
6614301 Casper et al. Sep 2003 B2
6617656 Lee et al. Sep 2003 B2
6621325 Hart et al. Sep 2003 B2
6642774 Li Nov 2003 B1
6653890 Ono et al. Nov 2003 B2
6657504 Deal et al. Dec 2003 B1
6675360 Cantone et al. Jan 2004 B1
6677643 Iwamoto et al. Jan 2004 B2
6700434 Fujii et al. Mar 2004 B2
6731157 Fulkerson May 2004 B2
6731221 Dioshongh et al. May 2004 B1
6737909 Jaussi et al. May 2004 B2
6741118 Uchikoba et al. May 2004 B2
6771115 Nakano Aug 2004 B2
6774705 Miyazaki et al. Aug 2004 B2
6777978 Hart et al. Aug 2004 B2
6784722 Tang et al. Aug 2004 B2
6791146 Lai et al. Sep 2004 B2
6791157 Casto et al. Sep 2004 B1
6791212 Pulvirenti et al. Sep 2004 B2
6792379 Ando Sep 2004 B2
6794630 Keshavarzi et al. Sep 2004 B2
6803633 Mergens et al. Oct 2004 B2
6809968 Marr et al. Oct 2004 B2
6812758 Gauthier et al. Nov 2004 B2
6815971 Wang et al. Nov 2004 B2
6847252 Ono et al. Jan 2005 B1
6856120 Miyazaki Feb 2005 B2
6858897 Chen Feb 2005 B2
6865116 Kim et al. Mar 2005 B2
6882172 Suzuki et al. Apr 2005 B1
6885210 Suzuki Apr 2005 B1
6889331 Soerensen et al. May 2005 B2
6906582 Kase et al. Jun 2005 B2
6912155 Sakurai et al. Jun 2005 B2
6914474 Yamahira Jul 2005 B2
6917240 Trafton et al. Jul 2005 B2
6922783 Knee et al. Jul 2005 B2
6927620 Senda Aug 2005 B2
6936898 Pelham et al. Aug 2005 B2
6967522 Chandrakasan et al. Nov 2005 B2
6986068 Togawa Jan 2006 B2
6992508 Chow Jan 2006 B2
7012461 Chen et al. Mar 2006 B1
7030681 Yamazaki et al. Apr 2006 B2
7096145 Orenstien et al. Aug 2006 B2
7100061 Halepete et al. Aug 2006 B2
7112978 Koniaris et al. Sep 2006 B1
7119604 Chih Oct 2006 B2
7120804 Tschanz et al. Oct 2006 B2
7129745 Lewis et al. Oct 2006 B2
7129771 Chen Oct 2006 B1
7180322 Koniaris et al. Feb 2007 B1
7188261 Tobias et al. Mar 2007 B1
7228242 Read et al. Jun 2007 B2
7263457 White et al. Aug 2007 B2
7334198 Ditzel et al. Feb 2008 B2
7336090 Koniaris et al. Feb 2008 B1
7336092 Koniaris et al. Feb 2008 B1
7348827 Rahim et al. Mar 2008 B2
7362165 Chen Apr 2008 B1
7363176 Patel et al. Apr 2008 B2
7502565 Moran Mar 2009 B2
7562233 Sheng et al. Jul 2009 B1
7626409 Koniaris et al. Dec 2009 B1
7649402 Chen Jan 2010 B1
7671621 Koniaris et al. Mar 2010 B2
7692477 Chen Apr 2010 B1
7774625 Sheng et al. Aug 2010 B1
7815725 Reinke et al. Oct 2010 B2
7941675 Burr et al. May 2011 B2
7953990 Stewart et al. May 2011 B2
20010028577 Sung et al. Oct 2001 A1
20020002689 Yeh Jan 2002 A1
20020011650 Nishizawa et al. Jan 2002 A1
20020026597 Dai et al. Feb 2002 A1
20020029352 Borkar et al. Mar 2002 A1
20020032829 Dalrymple Mar 2002 A1
20020067638 Kobayashi et al. Jun 2002 A1
20020073348 Tani Jun 2002 A1
20020083356 Dai Jun 2002 A1
20020087219 Dai Jul 2002 A1
20020087896 Cline et al. Jul 2002 A1
20020113628 Ajit Aug 2002 A1
20020116650 Halepete et al. Aug 2002 A1
20020130701 Kleveland Sep 2002 A1
20020138778 Cole et al. Sep 2002 A1
20020140494 Thomas et al. Oct 2002 A1
20020178390 Lee Nov 2002 A1
20020194509 Plante et al. Dec 2002 A1
20030006590 Aoki et al. Jan 2003 A1
20030036876 Fuller, III et al. Feb 2003 A1
20030041403 Chang Mar 2003 A1
20030065960 Rusu et al. Apr 2003 A1
20030071657 Soerensen et al. Apr 2003 A1
20030074591 McClendon et al. Apr 2003 A1
20030098736 Uchikoba et al. May 2003 A1
20030122610 Zeng et al. Jul 2003 A1
20030189465 Abadeer et al. Oct 2003 A1
20040025061 Lawrence Feb 2004 A1
20040073821 Naveh et al. Apr 2004 A1
20040103330 Bonnett May 2004 A1
20040108881 Bokui et al. Jun 2004 A1
20040123170 Tschanz et al. Jun 2004 A1
20040128631 Ditzel et al. Jul 2004 A1
20040246044 Myono et al. Dec 2004 A1
20050225376 Kin Law Oct 2005 A1
20050231265 Yamahira Oct 2005 A1
20060074576 Patel et al. Apr 2006 A1
20070229054 Dobberpuhl et al. Oct 2007 A1
20070283176 Tobias et al. Dec 2007 A1
20070296440 Takamiya et al. Dec 2007 A1
20080143372 Koniaris et al. Jun 2008 A1
20100077233 Koniaris et al. Mar 2010 A1
20100097092 Koniaris et al. Apr 2010 A1
Foreign Referenced Citations (17)
Number Date Country
0381021 Aug 1990 EP
0501655 Feb 1992 EP
0474963 Mar 1992 EP
0504655 Sep 1992 EP
0624909 Nov 1994 EP
0978781 Apr 2003 EP
1398639 Mar 2004 EP
63233480 Sep 1988 JP
04114365 Apr 1992 JP
9185589 Jul 1997 JP
11118845 Apr 1999 JP
2000172383 Jun 2000 JP
2001345693 Dec 2001 JP
2003324735 Nov 2003 JP
0127728 Apr 2001 WO
0238828 May 2002 WO
2004061634 Jul 2004 WO
Non-Patent Literature Citations (124)
Entry
Oner, H. et al., “A compact monitoring circuit for real-time on-chip diagnosis of hot-carrier induced degradation”, Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings, IEEE International Conference on Monterey, CA, Mar. 17, 1997-Mar. 20, 1997, pp. 72-76.
“Computer Software”, Wikipedia, http://en.wikipedia.org/wiki/software, retrieved May 2, 2007.
“Wafer Burn-In Isolation Circuit”, IBM Technical Disclosure Bulletin, IBM Corp., New York, US, vol. 32, No. 6B, Nov. 1, 1989, pp. 442-443, XP00073858 ISSN:0018-8689 the whole document.
“High Speed Digitally Adjusted Step-Down Controllers for Notebook CPUS”; Max1710/Max1711; MAXIM Manual; p. 11 and p. 21.
“Operation U (Refer to Functional Diagram)”; LTC 1736;, Linear Technology Manual; p. 9.
Baker K. et al., “SHMOO Plotting: The Black Art of IC Testing”, IEEE Design and Test of Computers, IEEE vol, 14, No. 3, Jul. 1, 1997, pp. 90-97, XP000793305 ISSN: 0740-7475 the whole document.
Desai et al., “Sizing of Clock Distribution Networks for High Performance CPU Chips”, Digital Equipment Corporation, Hudson, MA, pp. 389-394, 1996.
Final Office Action Mailed Jan. 12, 2009; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Jun. 24, 2004; Patent No. 7228242.
Notice of Allowance Mailed Jan. 5, 2005; Patent No. 7228242.
Notice of Allowance Mailed Jul. 6, 2005; Patent No. 7228242.
Notice of Allowance Mailed Sep. 22, 2005; Patent No. 7228242.
Notice of Allowance Mailed Aug. 10, 2006; Patent No. 7228242.
Issue Notification Mailed May 16, 2007; Patent No. 7228242.
Non-Final Office Action Mailed Aug. 21, 2007; U.S. Appl. No. 10/951,835.
Restriction Requirement Mailed Mar. 19, 2007; U.S. Appl. No. 10/951,835.
Restriction Requirement Mailed May 28, 2009; U.S. Appl. No. 11/810,516.
Non-Final Office Action Mailed Dec. 23, 2004; Patent No. 7129771.
Final Office Action Mailed Apr. 13, 2005; Patent No. 7129771.
Non-Final Office Action Mailed Jul. 29, 2005; Patent No. 7129771.
Final Office Action Mailed Dec. 2, 2005; Patent No. 7129771.
Non-Final Office Action Mailed Apr. 18, 2006; Patent No. 7129771.
Notice of Allowance Mailed Jun. 21, 2006; Patent No. 7129771.
Non-Final Office Action Mailed Aug. 1, 2007; U.S. Appl. No. 11/591,431.
Notice of Allowance Mailed Nov. 23, 2007; U.S. Appl. No. 11/591,431.
Notice of Allowance Mailed Dec. 13, 2007; U.S. Appl. No. 11/591,431.
Issue Notification Mailed Apr. 2, 2008; U.S. Appl. No. 11/591,431.
Non-Final Office Action Mailed Sep. 26, 2008; U.S. Appl. No. 12/107,733.
Final Office Action Mailed Mar. 9, 2009; U.S. Appl. No. 12/107,733.
Non-Final Office Action Mailed May 21, 2009; U.S. Appl. No. 12/107,733.
Non-Final Office Action Mailed Sep. 6, 2006; U.S. Appl. No. 10/874,772.
Final Office Action Mailed Feb. 28, 2007; U.S. Appl. No. 10/874,772.
Non-Final Office Action Mailed Jun. 20, 2007; U.S. Appl. No. 10/874,772.
Notice of Allowance Mailed Nov. 20, 2007; U.S. Appl. No. 10/874,772.
Notice of Allowance Mailed Apr. 2, 2008; U.S. Appl. No. 10/874,772.
Non-Final Office Action Mailed Aug. 9, 2006; U.S. Appl. No. 10/874,407.
Notice of Allowance Mailed Oct. 1, 2008; U.S. Appl. No. 10/874,407.
Non-Final Office Action Mailed Feb. 3, 2009; U.S. Appl. No. 10/874,407.
Non-Final Office Action Mailed Dec. 10, 2004; U.S. Appl. No. 10/746,539.
Final Office Action Mailed Apr. 11, 2005; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Aug. 11, 2005; U.S. Appl. No. 10/746,539.
Final Office Action Mailed Dec. 19, 2005; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Apr. 11, 2006; U.S. Appl. No. 10/746,539.
Final Office Action Mailed Aug. 31, 2006; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Jan. 23, 2007; U.S. Appl. No. 10/746,539.
Final Office Action Mailed Jun. 15, 2007; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Nov. 30, 2007; U.S. Appl. No. 10/746,539.
Final Office Action Mailed Apr. 2, 2008; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Aug. 25, 2008; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Jun. 2, 2009; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Apr. 4, 2007; U.S. Appl. No. 11/358,482.
Final Office Action Mailed Aug. 23, 2007; U.S. Appl. No. 11/358,482.
Non-Final Office Action Mailed Dec. 26, 2007; U.S. Appl. No. 11/358,482.
Final Office Action Mailed May 23, 2008; U.S. Appl. No. 11/358,482.
Non-Final Office Action Mailed Oct. 14, 2008; U.S. Appl. No. 11/358,482.
Final Office Action Mailed Feb. 23, 2009; U.S. Appl. No. 11/358,482.
Non-Final Office Action Mailed Dec. 22, 2004; U.S. Appl. No. 10/747,022.
Notice of Allowance Mailed Sep. 28, 2005; U.S. Appl. No. 10/747,022.
Non-Final Office Action Mailed Jun. 13, 2005; U.S. Appl. No. 10/334,919.
Final Office Action Mailed Mar. 9, 2006; U.S. Appl. No. 10/334,919.
Non-Final Office Action Mailed Aug. 7, 2006; U.S. Appl. No. 10/334,919.
Final Office Action Mailed Feb. 21, 2007; U.S. Appl. No. 10/334,919.
Non-Final Office Action Mailed May 15, 2007; U.S. Appl. No. 10/334,919.
Non-Final Office Action Mailed Nov. 23, 2007; U.S. Appl. No. 10/334,919.
Non-Final Office Action Mailed Jan. 6, 2009; U.S. Appl. No. 10/334,919.
Non-Final Office Action Mailed May 28, 2009; U.S. Appl. No. 10/334,919.
Notice of Allowance Dated Jul. 13, 2009; U.S. Appl. No. 10/874,407.
Non Final Office Action Dated Jul. 23, 2009; U.S. Appl. No. 11/358,482.
R. Jacob Baker, Hary W. Li, DAvid E. Boyce; CMOS Circuit Design, Layout Simulation; IEEE Press; 1998.
Hsu, Jui Ching, “Fabrication of Single Walled Carbon Nanotube (SW-CNT) Cantilevers for Chemical Sensing”, M. Sc Thesis, Louisiana State University, Dec. 2007.
Merriam-webster's Collegiate Dictionary, tenth edition, pp. 252 and 603 (Merriam-Webster Inc., Springfield, Mass, USA).
Final Office Action; Mail Date Jan. 12, 2009; U.S. Appl. No. 10/746,539.
Non-Final Office Action Mailed Jun. 6, 2011; U.S. Appl. No. 11/810,516.
Final Office Action Mailed May 4, 2011; U.S. Appl. No. 12/709,421.
Notice of Allowance Mailed Jul. 11, 2011; U.S. Appl. No. 12/709,421.
Notice of Restriction Mailed May 12, 2011; U.S. Appl. No. 12/502,902.
Advisory Action; Mail Date May 7, 2007; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Jan. 31, 2007; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Feb. 15, 2006; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Jul. 19, 2010; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Aug. 4, 2009; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Oct. 30, 2006; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Nov. 26, 2008; U.S. Appl. No. 10/334,918.
Interview Summary; Mail Date Oct. 8, 2009; U.S. Appl. No. 10/334,918.
Non Final Office Action; Mail Date Feb. 18, 2009; U.S. Appl. No. 10/334,918.
Non Final Office Action; Mail Date May 13, 2008; U.S. Appl. No. 10/334,918.
Non Final Office Action; Mail Date May 15, 2006; U.S. Appl. No. 10/334,918.
Non Final Office Action; Mail Date Jun. 13, 2005; U.S. Appl. No. 10/334,918.
Notice of Allowance; Mail Date Jan. 3, 2011; U.S. Appl. No. 10/334,918.
Non Final Office Action; Mail Date Feb. 4, 2010; U.S. Appl. No. 10/334,918.
Final Office Action; Mail Date Jul. 8, 2010; U.S. Appl. No. 10/334,919.
Non Final Office Action; Mail Date Jan. 5, 2010; U.S. Appl. No. 10/334,919.
Notice of Allowance; Mail Date Jan. 20, 2011; U.S. Appl. No. 10/334,919.
Non Final Office Action; Mail Date Aug. 21, 2007; U.S. Appl. No. 10/951,835.
Non Final Office Action; Mail Date Mar. 29, 2010; U.S. Appl. No. 11/810,516.
Final Office Action; Mail Date Mar. 16, 2011; U.S. Appl. No. 11/810,516.
Non Final Office Action; Mail Date Oct. 7, 2010; U.S. Appl. No. 11/810,516.
Advisory Action; Mail Date Jan. 11, 2010; U.S. Appl. No. 12/107,733.
Final Office Action; Mail Date Nov. 12, 2009; U.S. Appl. No. 12/107,733.
Non Final Office Action; Mail Date Feb. 24, 2010; U.S. Appl. No. 12/107,733.
Notice of Allowance; Mail Date Jul. 28, 2010; U.S. Appl. No. 12/107,733.
Final Office Action; Mail Date Apr. 22, 2005; U.S. Appl. No. 10/747,016.
Final Office Action; Mail Date Oct. 30, 2007; U.S. Appl. No. 10/747,016.
Final Office Action; Mail Date Dec. 7, 2006; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date Mar. 20, 2008; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date May 16, 2007; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date Jun. 23, 2006; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date Nov. 18, 2005; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date Dec. 22, 2004; U.S. Appl. No. 10/747,016.
Notice of Allowance; Mail Date Mar. 13, 2009; U.S. Appl. No. 10/747,016.
Notice of Allowance; Mail Date Aug. 20, 2009; U.S. Appl. No. 10/747,016.
Notice of Allowance; Mail Date Aug. 27, 2008; U.S. Appl. No. 10/747,016.
Notice of Allowance; Mail Date Dec. 18, 2008; U.S. Appl. No. 10/747,016.
Non Final Office Action; Mail Date Jun. 2, 2009; U.S. Appl. No. 10/746,539.
Notice of Allowance; Mail Date Nov. 18, 2009; U.S. Appl. No. 10/746,539.
Non Final Office Action; Mail Date Aug. 6, 2010; U.S. Appl. No. 12/709,421.
Non Final Office Action; Mail Date Jul. 23, 2009; U.S. Appl. No. 11/358,482.
Non Final Office Action; Mail Date Nov. 17, 2009; U.S. Appl. No. 10/874,407.
Examiner Interview Summary; Mail Date Feb. 23, 2010; U.S. Appl. No. 10/874,407.
Notice of Allowance; Mail Date: Mar. 24, 2010; U.S. Appl. No. 10/874,407.
Notice of Allowance; U.S. Appl. No. 12/709,421; Mailed Date: Jan. 26, 2012.
Non-Final Office Action; U.S. Appl. No.: 12/502,902; Mailed Date: Nov. 9, 2011.
Non-Final Rejection; U.S. Appl. No.: 11/810,516; Mailed Date: Nov. 15, 2011.
Non-Final Office Action; U.S. Appl. No.: 13/118,762; Mailed Date: Oct. 6, 2011.
Related Publications (1)
Number Date Country
20100109758 A1 May 2010 US
Continuations (1)
Number Date Country
Parent 10747016 Dec 2003 US
Child 12685452 US