This invention relates to the field of implantable devices and more specifically to a feedthrough connector for an implantable device.
Implantable medical devices are used to treat many conditions. Implantable devices such as pacemakers and defibrillators include electronics mounted within a housing which are typically operatively connected to a lead which is implanted on or in the heart. The leads implanted in or about the heart can be used to reverse certain life threatening arrhythmia, or to stimulate contraction of the heart. Electrical energy is applied to the heart via electrodes on the leads to return the heart to normal rhythm.
An implantable device can include a pulse generator which includes a device housing electrically and mechanically connected to a header. The header is used to couple a conductor of a lead with the electronics of the implantable device. For instance, a connector assembly in the header is used to couple a cardiac stimulator system such as a pacemaker, an anti-tachycardia device, a cardiac heart failure device, a cardioverter or a defibrillator with a lead having an electrode for making contact with a portion of the heart. The header is electrically connected to the device housing by interconnects leading from the header to electrical feedthroughs which pass through the housing to connect to electronic components in the housing. There is a need for less complex manufacturing and more mechanically and electrically robust connections between the housing and the header.
In one example, an implantable device includes a header, a housing, one or more electrical connectors connected to the header, and a feedthrough assembly mounted to the housing. The feedthrough assembly includes a nonconductive base having one or more holes therethrough. The feedthrough assembly further includes one or more feedthrough pins, each feedthrough pin extending through one of the one or more holes, each feedthrough pin including a pin body and an upper contact surface for connecting to one or more of the electrical connectors. The upper contact surface includes a larger surface area than a cross-sectional area of the pin body.
In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that structural changes may be made without departing from the scope of the present invention. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims and their equivalents.
Lead 110 includes a lead body 113 having a proximal end 112, where the lead is coupled at header 104 of pulse generator 105. The lead 110 extends to a distal end 114, which is coupled with a portion of a heart, when implanted. In one embodiment, the distal end 114 of the lead 110 includes one or more electrodes 120, 121 which electrically couple the lead 110 with a heart. In other examples, electrodes can be located medially or at other locations along the lead. At least one electrical conductor is disposed within the lead 110 and extends from the proximal end 112 to the electrode(s) 120, 121. The electrical conductors carry electrical current and pulses between the pulse generator 105 and the electrode(s) 120, 121.
In other embodiments, device 100 is suitable for use with implantable electrical stimulators, such as, but not limited to, pulse generators, neuro-stimulators, skeletal stimulators, central nervous system stimulators, or stimulators for the treatment of pain. The system can also be utilized as a sensor or a receiver. The electrodes can be used, for sensing, pacing, and/or shocking, for example.
Header 104 includes one or more longitudinal bores 140 that are configured to receive a lead terminal of lead 110 (
Referring now also to
Non-conductive base 420 can include a ceramic, for example. Nonconductive base 420 includes one or more holes 510 therethrough. Holes 510 extend through the base 420 and are sized to receive feedthrough pins 245. In one example, feedthrough pins 245 are attached at holes 510 by brazing. Feedthrough assembly 240 further includes the one or more feedthrough pins 245, with each feedthrough pin 245 extending through one of the plurality of holes 510.
Each feedthrough pin 245 is a conductive material, such as Pt—Ir, and includes a shaft or other pin body 430 and a head 431 having an upper contact surface 440 for connecting to one or more of the electrical connectors 235 (
Referring again to
In one example, electrical connectors 235 include wire ribbons that are pre-formed in a curved or bent configuration so that at least a portion of each connector 235 is located on or above the upper contact surface 440 of feedthrough pin 245 when the header 104 is placed onto the housing 103. In other examples, electrical connectors 235 can include round wire connectors or combinations of round wires and/or ribbon connectors. The connectors 235 can be attached to the feedthrough pins 245 by welding, brazing, conductive epoxy or other techniques.
To assemble an implantable device 100 in accordance with one embodiment, header 104 sub-assembly is formed such that connectors 235 extend from the header 104 in a predetermined configuration. The header 104 is positioned over the housing 103 so that the connectors 235 are above or contact the upper surfaces 440 of feedthrough pins 245. If the connectors 235 are above the surface 440, then they are pressed down before connecting. The connectors 235 are then electrically and mechanically attached to the feedthrough pins 245 by welding, soldering, brazing, or conductive epoxy, for example. As noted, this eliminates the need for manually routing each individual connector from the header to the feedthrough to perform a connection. Moreover, since the pins 245 have a low profile relative to an upper surface of the support base 420 (See
In other examples, the header discussed herein can include an antennae and/or electronic components that are used to electrically communicate outside the device.
It is understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
Number | Name | Date | Kind |
---|---|---|---|
4352951 | Kyle | Oct 1982 | A |
4399819 | Cowdery | Aug 1983 | A |
5235742 | Szyszkowski | Aug 1993 | A |
5660177 | Faupel et al. | Aug 1997 | A |
5679026 | Fain et al. | Oct 1997 | A |
5755743 | Volz et al. | May 1998 | A |
5759197 | Sawchuk et al. | Jun 1998 | A |
5782891 | Hassler et al. | Jul 1998 | A |
5871515 | Wiklund et al. | Feb 1999 | A |
5942842 | Fogle, Jr. | Aug 1999 | A |
5951595 | Moberg et al. | Sep 1999 | A |
6026325 | Weinberg et al. | Feb 2000 | A |
6044302 | Persuitti et al. | Mar 2000 | A |
6052623 | Fenner et al. | Apr 2000 | A |
6205358 | Haeg et al. | Mar 2001 | B1 |
6414835 | Wolf et al. | Jul 2002 | B1 |
6428368 | Hawkins et al. | Aug 2002 | B1 |
6456256 | Amundson et al. | Sep 2002 | B1 |
6459935 | Piersma | Oct 2002 | B1 |
6519133 | Eck et al. | Feb 2003 | B1 |
6566978 | Stevenson et al. | May 2003 | B2 |
6622046 | Fraley et al. | Sep 2003 | B2 |
6765780 | Brendel et al. | Jul 2004 | B2 |
6817905 | Zart et al. | Nov 2004 | B2 |
6882248 | Stevenson et al. | Apr 2005 | B2 |
7035077 | Brendel | Apr 2006 | B2 |
7108711 | Vogel et al. | Sep 2006 | B2 |
7274963 | Spadgenske | Sep 2007 | B2 |
7803014 | Sprain et al. | Sep 2010 | B2 |
20020027484 | Stevenson et al. | Mar 2002 | A1 |
20030040780 | Haeg et al. | Feb 2003 | A1 |
20030139096 | Stevenson et al. | Jul 2003 | A1 |
20040012462 | Kim | Jan 2004 | A1 |
20040078062 | Spadgenske | Apr 2004 | A1 |
20040116976 | Spadgenske | Jun 2004 | A1 |
20040215280 | Dublin et al. | Oct 2004 | A1 |
20040215281 | O'Phelan et al. | Oct 2004 | A1 |
20050060003 | Taylor et al. | Mar 2005 | A1 |
20050118887 | Hoffer et al. | Jun 2005 | A1 |
20050247475 | Stevenson et al. | Nov 2005 | A1 |
20060282126 | Fischbach et al. | Dec 2006 | A1 |
20070202728 | Olson et al. | Aug 2007 | A1 |
20070232119 | Sprain et al. | Oct 2007 | A1 |
Number | Date | Country |
---|---|---|
0405838 | Jan 1991 | EP |
0916364 | May 1999 | EP |
2127629 | Apr 1984 | GB |
WO-03073450 | Sep 2003 | WO |
WO-2004105572 | Dec 2004 | WO |
WO-2007114993 | Oct 2007 | WO |
WO-2007117812 | Oct 2007 | WO |
WO-2007114993 | Oct 2007 | WO |
WO-2007117812 | Oct 2007 | WO |
Number | Date | Country | |
---|---|---|---|
20070239222 A1 | Oct 2007 | US |